SG10201804964TA - Target and process sensitivity analysis to requirements - Google Patents

Target and process sensitivity analysis to requirements

Info

Publication number
SG10201804964TA
SG10201804964TA SG10201804964TA SG10201804964TA SG10201804964TA SG 10201804964T A SG10201804964T A SG 10201804964TA SG 10201804964T A SG10201804964T A SG 10201804964TA SG 10201804964T A SG10201804964T A SG 10201804964TA SG 10201804964T A SG10201804964T A SG 10201804964TA
Authority
SG
Singapore
Prior art keywords
target
metrology
parameters
data
module
Prior art date
Application number
SG10201804964TA
Inventor
Michael E Adel
Nuriel Amir
Mark Ghinovker
Tal Shusterman
David Gready
Sergey Borodyansky
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG10201804964TA publication Critical patent/SG10201804964TA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PROCESS PARAMETERS 110-, \ INPUT MODULE CURRENT LAYER (SIMULATION OR DATA) PREVIOUS LAYER {SIMULATION OR DATA) WAFER PRODUCER 49 - \"\" OR TARGET DESIGNER 94- 1 TARGET PARAMETERS 96-. P ETROLOGY CONDITIDNS 4 h\"NRESHOLD 132 ,>c •1 2 92 P I40, TARGET OPI1MIZATION MODULE ORMAICF MORN i -129 7 123-- UROLOGY METMCS MODULE P 124-z- METROLOGY NEIRCS PROCESS ERIC'S 13°- \ SENSITNITY ANALYSIS MODULE 11 \ 20 \ - tRAW DATA METROLOGY SIMUALTION 78. \"\ t COARSE TARGET FILTDRING ure 1 TARGET AND PROCESS SENSITIVITY ANALYSIS TO REQUIREMENTS . Systems and method are provided for analyzing target, process and metrology configuration sensitivities to a wide range of parameters, according to external requirements or inner development and verification neals. Systems comprise the follow- ing elements. An input module is arranged to receive parameters relating to targets, target metrology conditions and production pro- cesses, to generate target data. A metrology simulation unit is arranged to simulate metrology measurements of targets from the tar- get data and to generate multiple metrics that quantify the simulated target measurements. A sensitivity analysis module is arranged to derive functional dependencies of the metrics on the parameters and to define required uncertainties of the parameters with respect to the derived functional dependencies. Finally, a target optimization module is arranged to rank targets and target metrology condi- tions with respect to the simulated target measurements. 90, 25
SG10201804964TA 2013-12-11 2014-12-10 Target and process sensitivity analysis to requirements SG10201804964TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201361914950P 2013-12-11 2013-12-11

Publications (1)

Publication Number Publication Date
SG10201804964TA true SG10201804964TA (en) 2018-07-30

Family

ID=53371817

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201804964TA SG10201804964TA (en) 2013-12-11 2014-12-10 Target and process sensitivity analysis to requirements

Country Status (7)

Country Link
US (1) US10726169B2 (en)
JP (1) JP6509225B2 (en)
KR (1) KR102265868B1 (en)
CN (1) CN105830069B (en)
SG (1) SG10201804964TA (en)
TW (1) TWI661324B (en)
WO (1) WO2015089231A1 (en)

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US10962886B2 (en) * 2015-12-31 2021-03-30 Asml Netherlands B.V. Selection of measurement locations for patterning processes
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KR102293144B1 (en) * 2016-09-01 2021-08-26 에이에스엠엘 네델란즈 비.브이. Automatic selection of measurement target measurement recipes
DE112017005258A5 (en) * 2016-10-18 2019-06-27 Reifenhäuser GmbH & Co. KG Maschinenfabrik METHOD FOR INDIRECTLY LEADING A SYSTEMATIC DEPENDENCE BETWEEN AN ADJUSTMENT SIZE AND A OPTICAL PROPERTY OF A FOIL RAILWAY AND FOR ADAPTING THE QUALITY
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KR102370347B1 (en) 2017-02-02 2022-03-04 에이에스엠엘 네델란즈 비.브이. Metrology methods and devices and associated computer products
WO2019045780A1 (en) * 2017-08-30 2019-03-07 Kla-Tencor Corporation Quick adjustment of metrology measurement parameters according to process variation
US10699969B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corporation Quick adjustment of metrology measurement parameters according to process variation
EP3624068A1 (en) * 2018-09-14 2020-03-18 Covestro Deutschland AG Method for improving prediction relating to the production of a polymer-ic produc
DE102018128254A1 (en) * 2018-11-12 2020-05-14 Endress+Hauser SE+Co. KG Method for improving the measurement performance of a field device to be configured in automation technology
CN109933854B (en) * 2019-02-15 2023-07-07 中国北方车辆研究所 Mobile robot design method based on situation demands
DE102019207059A1 (en) * 2019-05-15 2020-11-19 Siemens Aktiengesellschaft Method for validating system parameters of an energy system, method for operating an energy system and energy management system for an energy system
US11727159B2 (en) * 2019-05-15 2023-08-15 Lawrence Livermore National Security, Llc Mission-driven design methodology for optical systems
US11360397B2 (en) * 2019-09-17 2022-06-14 Kla Corporation System and method for application of harmonic detectivity as a quality indicator for imaging-based overlay measurements
CN110991101B (en) * 2019-11-15 2022-08-02 湖南城市学院 Optimization design method for compression type piezoelectric accelerometer structure
CN111160489A (en) * 2020-01-02 2020-05-15 中冶赛迪重庆信息技术有限公司 Multi-dimensional benchmarking analysis server, system and method based on big data and electronic terminal
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Also Published As

Publication number Publication date
TWI661324B (en) 2019-06-01
US20160042105A1 (en) 2016-02-11
JP6509225B2 (en) 2019-05-08
JP2017508273A (en) 2017-03-23
KR20160096118A (en) 2016-08-12
TW201535137A (en) 2015-09-16
CN105830069B (en) 2021-04-20
CN105830069A (en) 2016-08-03
WO2015089231A1 (en) 2015-06-18
US10726169B2 (en) 2020-07-28
KR102265868B1 (en) 2021-06-16

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