TWI660816B - 具有精確成型特徵之硏磨元件，由彼等製得之硏磨物件，及彼等之製造方法 - Google Patents
具有精確成型特徵之硏磨元件，由彼等製得之硏磨物件，及彼等之製造方法 Download PDFInfo
- Publication number
- TWI660816B TWI660816B TW102127669A TW102127669A TWI660816B TW I660816 B TWI660816 B TW I660816B TW 102127669 A TW102127669 A TW 102127669A TW 102127669 A TW102127669 A TW 102127669A TW I660816 B TWI660816 B TW I660816B
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- Prior art keywords
- abrasive
- diamond
- features
- carbide
- less
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 52
- 239000000919 ceramic Substances 0.000 claims abstract description 64
- 239000010432 diamond Substances 0.000 claims description 62
- 229910003460 diamond Inorganic materials 0.000 claims description 57
- 238000000227 grinding Methods 0.000 claims description 54
- 238000000465 moulding Methods 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 18
- 238000013461 design Methods 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 15
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052580 B4C Inorganic materials 0.000 claims description 4
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 229910026551 ZrC Inorganic materials 0.000 claims description 3
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 claims description 3
- 230000002950 deficient Effects 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 230000002209 hydrophobic effect Effects 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- 239000010942 ceramic carbide Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 54
- 238000005498 polishing Methods 0.000 description 45
- 230000008569 process Effects 0.000 description 31
- 238000012360 testing method Methods 0.000 description 30
- 239000002002 slurry Substances 0.000 description 26
- 238000010998 test method Methods 0.000 description 25
- 239000000463 material Substances 0.000 description 21
- 239000010949 copper Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000011230 binding agent Substances 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000000843 powder Substances 0.000 description 14
- 230000007547 defect Effects 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000002131 composite material Substances 0.000 description 8
- -1 stainless steel) Chemical class 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 229920001169 thermoplastic Polymers 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 239000004416 thermosoftening plastic Substances 0.000 description 6
- 239000010954 inorganic particle Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005323 electroforming Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000012417 linear regression Methods 0.000 description 4
- 238000013507 mapping Methods 0.000 description 4
- 238000000399 optical microscopy Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000010226 confocal imaging Methods 0.000 description 3
- 238000007516 diamond turning Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000005459 micromachining Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 230000010076 replication Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000004621 scanning probe microscopy Methods 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 101150038746 bcp1 gene Proteins 0.000 description 2
- 101150023633 bcpB gene Proteins 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000010438 granite Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 101710134395 Carboxy-terminal domain RNA polymerase II polypeptide A small phosphatase 1 Proteins 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 102100025483 Retinoid-inducible serine carboxypeptidase Human genes 0.000 description 1
- 235000011449 Rosa Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 101150058790 bcp gene Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000004050 hot filament vapor deposition Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- PUPNJSIFIXXJCH-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-(1,1,3-trioxo-1,2-benzothiazol-2-yl)acetamide Chemical compound C1=CC(O)=CC=C1NC(=O)CN1S(=O)(=O)C2=CC=CC=C2C1=O PUPNJSIFIXXJCH-UHFFFAOYSA-N 0.000 description 1
- 239000002113 nanodiamond Substances 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 235000000346 sugar Nutrition 0.000 description 1
- 150000008163 sugars Chemical class 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/18—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261678665P | 2012-08-02 | 2012-08-02 | |
| US61/678,665 | 2012-08-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201410391A TW201410391A (zh) | 2014-03-16 |
| TWI660816B true TWI660816B (zh) | 2019-06-01 |
Family
ID=50028490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102127669A TWI660816B (zh) | 2012-08-02 | 2013-08-01 | 具有精確成型特徵之硏磨元件，由彼等製得之硏磨物件，及彼等之製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150224625A1 (enExample) |
| EP (1) | EP2879836B1 (enExample) |
| JP (2) | JP2015530265A (enExample) |
| KR (1) | KR20150039795A (enExample) |
| CN (2) | CN115625629A (enExample) |
| SG (1) | SG11201500713PA (enExample) |
| TW (1) | TWI660816B (enExample) |
| WO (1) | WO2014022462A1 (enExample) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2658680B1 (en) | 2010-12-31 | 2020-12-09 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles comprising abrasive particles having particular shapes and methods of forming such articles |
| WO2013003830A2 (en) | 2011-06-30 | 2013-01-03 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles including abrasive particles of silicon nitride |
| WO2013003831A2 (en) | 2011-06-30 | 2013-01-03 | Saint-Gobain Ceramics & Plastics, Inc. | Liquid phase sintered silicon carbide abrasive particles |
| US9517546B2 (en) | 2011-09-26 | 2016-12-13 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming |
| KR102074138B1 (ko) | 2011-12-30 | 2020-02-07 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자 및 이의 형성방법 |
| PL2797716T3 (pl) | 2011-12-30 | 2021-07-05 | Saint-Gobain Ceramics & Plastics, Inc. | Kompozytowe ukształtowane cząstki ścierne i sposób ich formowania |
| US8840696B2 (en) | 2012-01-10 | 2014-09-23 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| EP2802436B1 (en) | 2012-01-10 | 2019-09-25 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having complex shapes |
| WO2013149209A1 (en) | 2012-03-30 | 2013-10-03 | Saint-Gobain Abrasives, Inc. | Abrasive products having fibrillated fibers |
| KR101813466B1 (ko) | 2012-05-23 | 2017-12-29 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자들 및 이의 형성방법 |
| WO2014005120A1 (en) | 2012-06-29 | 2014-01-03 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| US10710211B2 (en) | 2012-08-02 | 2020-07-14 | 3M Innovative Properties Company | Abrasive articles with precisely shaped features and method of making thereof |
| EP2879837B1 (en) | 2012-08-02 | 2018-09-19 | 3M Innovative Properties Company | Abrasive element precursor with precisely shaped features and method of making thereof |
| EP2906392B1 (en) | 2012-10-15 | 2025-04-16 | Saint-Gobain Abrasives, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| CN104994995B (zh) | 2012-12-31 | 2018-12-14 | 圣戈本陶瓷及塑料股份有限公司 | 颗粒材料及其形成方法 |
| CN105050770B (zh) * | 2013-03-12 | 2018-08-17 | 3M创新有限公司 | 粘结磨料制品 |
| WO2014161001A1 (en) | 2013-03-29 | 2014-10-02 | Saint-Gobain Abrasives, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| TW201502263A (zh) | 2013-06-28 | 2015-01-16 | Saint Gobain Ceramics | 包含成形研磨粒子之研磨物品 |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2879836A4 (en) | 2016-05-25 |
| JP2015530265A (ja) | 2015-10-15 |
| TW201410391A (zh) | 2014-03-16 |
| WO2014022462A1 (en) | 2014-02-06 |
| SG11201500713PA (en) | 2015-02-27 |
| EP2879836B1 (en) | 2019-11-13 |
| CN104684686A (zh) | 2015-06-03 |
| JP2019063989A (ja) | 2019-04-25 |
| EP2879836A1 (en) | 2015-06-10 |
| CN115625629A (zh) | 2023-01-20 |
| US20150224625A1 (en) | 2015-08-13 |
| KR20150039795A (ko) | 2015-04-13 |
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