TWI659453B - 壓印裝置及物品的製造方法 - Google Patents

壓印裝置及物品的製造方法 Download PDF

Info

Publication number
TWI659453B
TWI659453B TW106143493A TW106143493A TWI659453B TW I659453 B TWI659453 B TW I659453B TW 106143493 A TW106143493 A TW 106143493A TW 106143493 A TW106143493 A TW 106143493A TW I659453 B TWI659453 B TW I659453B
Authority
TW
Taiwan
Prior art keywords
pattern
substrate
stage
area
facing
Prior art date
Application number
TW106143493A
Other languages
English (en)
Chinese (zh)
Other versions
TW201822252A (zh
Inventor
Yousuke Kondo
近藤陽介
Original Assignee
Canon Kabushiki Kaisha
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kabushiki Kaisha, 日商佳能股份有限公司 filed Critical Canon Kabushiki Kaisha
Publication of TW201822252A publication Critical patent/TW201822252A/zh
Application granted granted Critical
Publication of TWI659453B publication Critical patent/TWI659453B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • B29C37/0028—In-mould coating, e.g. by introducing the coating material into the mould after forming the article
    • B29C2037/0046—In-mould printing, in-mould transfer printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106143493A 2016-12-13 2017-12-12 壓印裝置及物品的製造方法 TWI659453B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-241685 2016-12-13
JP2016241685A JP6821414B2 (ja) 2016-12-13 2016-12-13 インプリント装置、及び物品の製造方法

Publications (2)

Publication Number Publication Date
TW201822252A TW201822252A (zh) 2018-06-16
TWI659453B true TWI659453B (zh) 2019-05-11

Family

ID=62558597

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106143493A TWI659453B (zh) 2016-12-13 2017-12-12 壓印裝置及物品的製造方法

Country Status (6)

Country Link
US (1) US11524429B2 (https=)
JP (1) JP6821414B2 (https=)
KR (1) KR102239964B1 (https=)
CN (1) CN110383423B (https=)
TW (1) TWI659453B (https=)
WO (1) WO2018110517A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7118712B2 (ja) * 2018-04-13 2022-08-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7149870B2 (ja) * 2019-02-08 2022-10-07 キヤノン株式会社 インプリント装置および物品製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130241096A1 (en) * 2012-03-19 2013-09-19 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
US20150123300A1 (en) * 2013-11-06 2015-05-07 Canon Kabushiki Kaisha Method for determining pattern of mold for imprint, imprint method, and apparatus
US20150352776A1 (en) * 2014-06-10 2015-12-10 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method
US20160023380A1 (en) * 2014-07-22 2016-01-28 Canon Kabushiki Kaisha Imprint method, imprint apparatus, and article manufacturing method
TW201613740A (en) * 2014-10-03 2016-04-16 Canon Kk Imprint apparatus, imprint method and article manufacturing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080630A (ja) * 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法
JP5697345B2 (ja) * 2010-02-17 2015-04-08 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP5850717B2 (ja) * 2010-12-02 2016-02-03 キヤノン株式会社 インプリント装置、及びそれを用いた物品の製造方法
JP2015231036A (ja) * 2014-06-06 2015-12-21 キヤノン株式会社 リソグラフィ装置、および物品製造方法
JP6450105B2 (ja) * 2014-07-31 2019-01-09 キヤノン株式会社 インプリント装置及び物品製造方法
JP2016051862A (ja) * 2014-09-02 2016-04-11 キヤノン株式会社 インプリント装置、および物品の製造方法
WO2016052345A1 (ja) * 2014-10-01 2016-04-07 大日本印刷株式会社 インプリント装置、インプリント方法およびインプリント装置の制御方法
JP6525567B2 (ja) * 2014-12-02 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6512840B2 (ja) * 2015-01-22 2019-05-15 キヤノン株式会社 インプリント装置及び方法、並びに物品の製造方法
US20160288378A1 (en) * 2015-04-03 2016-10-06 Canon Kabushiki Kaisha Imprint material discharging device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130241096A1 (en) * 2012-03-19 2013-09-19 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
US20150123300A1 (en) * 2013-11-06 2015-05-07 Canon Kabushiki Kaisha Method for determining pattern of mold for imprint, imprint method, and apparatus
US20150352776A1 (en) * 2014-06-10 2015-12-10 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method
US20160023380A1 (en) * 2014-07-22 2016-01-28 Canon Kabushiki Kaisha Imprint method, imprint apparatus, and article manufacturing method
TW201613740A (en) * 2014-10-03 2016-04-16 Canon Kk Imprint apparatus, imprint method and article manufacturing method

Also Published As

Publication number Publication date
JP2018098366A (ja) 2018-06-21
US20190291309A1 (en) 2019-09-26
CN110383423B (zh) 2023-06-30
KR102239964B1 (ko) 2021-04-14
US11524429B2 (en) 2022-12-13
TW201822252A (zh) 2018-06-16
CN110383423A (zh) 2019-10-25
WO2018110517A1 (ja) 2018-06-21
JP6821414B2 (ja) 2021-01-27
KR20190094396A (ko) 2019-08-13

Similar Documents

Publication Publication Date Title
JP6611450B2 (ja) インプリント装置、インプリント方法、及び物品の製造方法
TWI603376B (zh) 壓印設備及製造物品的方法
JP7210155B2 (ja) 装置、方法、および物品製造方法
CN105487335A (zh) 压印方法、压印装置和物品制造方法
JP2015233100A (ja) インプリント装置、および物品製造方法
TWI659453B (zh) 壓印裝置及物品的製造方法
US10112324B2 (en) Imprint method, imprint apparatus, and production method for article
JP7710313B2 (ja) モールド、インプリント装置、および物品の製造方法
JP2018098366A5 (https=)
KR102537179B1 (ko) 임프린트 장치, 임프린트 방법 및 물품의 제조 방법
JP2017147277A (ja) インプリント装置、インプリント方法、および物品の製造方法
JP6898785B2 (ja) インプリント装置および物品製造方法
KR102316054B1 (ko) 거푸집, 임프린트 장치, 및 물품의 제조 방법
JP2018006554A (ja) パターン形成装置、インプリント装置および物品の製造方法
JP2024077432A (ja) 膜形成装置および物品製造方法
JP7057844B2 (ja) メサ側壁をクリーニングするためのシステムおよび方法
JP7154839B2 (ja) インプリント装置、インプリント方法および、物品製造方法
JP7693415B2 (ja) 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法
TWI631599B (zh) 壓印裝置，測量方法，壓印方法，及物品製造方法
KR20170054455A (ko) 임프린트 장치, 임프린트 방법, 및 물품 제조 방법
JP2020136347A (ja) 成形装置、成形方法および、物品製造方法
KR102590769B1 (ko) 반송 장치, 반송 방법, 리소그래피 장치, 리소그래피 시스템, 및 물품 제조 방법
JP7441037B2 (ja) インプリント装置、情報処理装置、インプリント方法及び物品の製造方法
CN106502048A (zh) 压印装置以及物品制造方法
JP2022091479A (ja) 形成装置、形成方法及び物品の製造方法