TWI657547B - 功率模組及其製造方法 - Google Patents

功率模組及其製造方法 Download PDF

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Publication number
TWI657547B
TWI657547B TW104103482A TW104103482A TWI657547B TW I657547 B TWI657547 B TW I657547B TW 104103482 A TW104103482 A TW 104103482A TW 104103482 A TW104103482 A TW 104103482A TW I657547 B TWI657547 B TW I657547B
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Taiwan
Prior art keywords
heat dissipating
organic heat
substrate
power module
organic
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TW104103482A
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English (en)
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TW201622083A (zh
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洪守玉
陳彥霖
趙振清
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台達電子工業股份有限公司
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Publication of TW201622083A publication Critical patent/TW201622083A/zh
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    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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Abstract

本發明提出一種功率模組及其製造方法，功率模組包括：基板、至少一個功率器件及有機散熱機構。基板具有上表面和下表面。有機散熱機構包括多個有機散熱凸起部，有機散熱機構位於基板的上表面一側或基板的下表面一側，以將功率器件產生的熱量傳導至外界。由於有機散熱機構可加工出更高的表面積，因此，能夠大幅降低其和環境之間的換熱熱阻，進而提高其與環境交換的散熱性能。因此，本申請能夠在保證功率模組正常散熱的前提下，降低有機散熱機構自身高度，減小佔用空間，在實現功率模組小型化方面具有重要意義。

Description

功率模組及其製造方法
本發明與功率模組有關，特別涉及具有散熱機構的功率模組。
高效率、高功率密度及高可靠性一直是業界對功率模組，特別是電源變換器的要求。高效率意味著減少能耗，利於節能減排、保護環境，並減少使用成本。高功率密度則意味著體積小、重量輕，減少運輸成本和空間需求，從而減少建設成本。高可靠性意味著更長的使用壽命以及維護成本。
但這三個被業界追求的指標都和良好的熱管理息息相關。首先，在較低的工作溫度下，功率模組如金氧半場效電晶體(Metal-Oxide-Semiconductor Field-Effect Transistor,MOSFET)的通態損耗會降低，這樣有利於系統效率的提升。
其次，在很多場合下，功率器件的熱量直接影響其功率密度。以電源變化器為例，因為電源變化器是用於處理功率轉換的系統，通常半導體器件是損耗比較多的器件，因此，半導體器件是決定電源變化器效率的重要因素之一。而半導體器件能夠耐受的溫度是有一定限制的，超過這一限制，器件 將喪失工作能力或者性能急劇惡化，因此，一個可以將半導體晶片的溫度控制在可接受範圍內的高效的散熱系統就顯得至關重要。
再次，半導體器件的壽命和溫度息息相關，更低的工作溫度可以有效延長器件的使用壽命，在電子領域通常有這樣的工程經驗，即溫度每上升10度其壽命就會降低一半。由上可知，一個良好的熱管理對於提高器件的轉換效率，功率密度以及可靠性均至關重要。
目前，以一個採用DBC(Direct Bonded Copper，直接敷銅陶瓷基板)作為基板的半導體器件為例，如圖1所示，功率器件(chip)1通過晶片鍵合材料(die bonding material)被安裝至基板2之上，並通過晶片鍵合材料實現和基板的走線(trace)(未示出)之間的電性、機械以及熱連接。在功率器件1的上表面，將需要保護的區域使用封料(molding component)包覆，以便起到機械，防塵，防潮，絕緣保護的功用。由於功率器件1的熱量主要經由其下表面及部分曝露在外側的基板2傳遞，形成向外傳熱的較優通道，因此，通常在功率器件1的下表面安裝一個散熱器3。散熱器3由使用熱導率較高的材料製成，例如銅的熱導率高於300W/m.K。為了保證功率器件1的下表面和散熱器3表面具有良好的熱傳導路徑，在兩個表面之間通常會設置導熱介面材料，如導熱矽脂4(grease)，該導熱矽脂4可以有效填充功率器件1與散熱器3之間存在的縫隙，從而實現比空氣更好的熱傳導效果。另外，為了用戶安裝散熱器，需設置彈簧夾片(clip)5實現功率器件1和散熱器3之間的機械固定。
然而，目前的散熱器具有以下缺陷：
1.由於散熱器通常是如銅等金屬由擠壓成型形成，重量大，加工困難，難以加工的較短、較密，比表面積難以做得非常大，因此，比較適合體 積、高度大的模組，不利於產品的小型化。並且，由於散熱器的鰭片較長，因此容易與其他電子元件接觸，造成短路。
2.功率元件與散熱器通過彈簧夾片結合，由於彈簧夾片的使用導致器件的空間利用率變得極低，不符合我們對功率密度的要求。並且，為了可靠的固定連接，功率模組通常設計成具有較厚的封料，以及功率器件本身有較高的表面平整度，以允許承受較大應力，由此增加了整體厚度，也增加了設計成本和模具成本。
3.典型的熱介面材料，如矽脂，在長期高溫服役過程中會有一些劣化，如小分子材料揮發導致的導熱能力降低。再次，模組在工作過程中由於內部發熱的交替變化，或者外部環境的改變，由於材料在不同溫度下會發生膨脹或收縮，亦即會引起功率器件以及散熱器尺寸的改變，相對應會牽扯矽脂移動，甚至會將矽脂推出半導體器件的外面，由此引起熱性能的急劇惡化。
因此，需要一種具有散熱機構的功率模組，使得功率模組具有更加高效及高功率密度。
在所述先前技術部分揭露的上述資訊僅用於加強對本申請的背景的理解，因此它可以包括不構成對本發明所屬技術領域中具有通常知識者已知的習知技術的資訊。
為解決上述先前技術存在的問題，本發明提供一種功率模組及其製造方法，提高功率模組的散熱機構的散熱性能，並能降低散熱機構所需空間高度，利於產品的小型化。
本申請的其他方面和優點將部分地在下面的描述中闡述，並且部分地將從描述中變得顯然，或者可以通過本申請的實踐而習得。
根據本申請的一個方面，提供一種功率模組，其包括：基板、至少一個功率器件及有機散熱機構。基板具有上表面和下表面；至少一個功率器件，鍵合至基板的上表面；有機散熱機構包括多個有機散熱凸起部，該有機散熱機構位於基板的上表面一側或基板的下表面一側，以將功率器件產生的熱量傳導至外界。
根據本申請的另一方面，提供一種功率模組的製造方法，其中，包括：提供一基板，該基板具有上表面和下表面；提供至少一個功率器件；將至少一個功率器件鍵合至基板的上表面；提供有機散熱機構，其包括多個有機散熱凸起部，有機散熱機構位於基板的上表面一側或基板的下表面一側，以將功率器件產生的熱量傳導至外界。
1‧‧‧功率器件
2‧‧‧基板
3‧‧‧散熱器
4‧‧‧熱導矽脂
5‧‧‧彈簧夾片
Rjm、Rma‧‧‧熱阻
Ta、Tj、Tm‧‧‧溫度
100‧‧‧功率模組
110‧‧‧功率器件
120‧‧‧有機散熱機構
121‧‧‧有機散熱凸起部
123‧‧‧金屬散熱部
124‧‧‧散熱鰭片
125‧‧‧平面層
120’‧‧‧高熱導率散熱機構
130‧‧‧基板
131‧‧‧上表面
132‧‧‧下表面
140‧‧‧塑封結構
150‧‧‧導熱膠
160‧‧‧均溫塊
170‧‧‧銅塊
圖1示出現有的功率模組的示意圖。
圖2示出散熱路徑上的熱阻及溫度分佈圖。
圖3為根據第一實施例的功率模組的示意圖。
圖4A、4B分別示出了根據第一實施例與現有的功率模組的對比示意圖。
圖5為根據第一實施例的功率模組的有機散熱機構的示意圖。
圖6為根據第二實施例的功率模組的示意圖。
圖7為根據第三實施例的功率模組的示意圖。
圖8為根據第四實施例的功率模組的示意圖。
圖9為根據第五實施例的功率模組的示意圖。
現在將參考圖式更全面地描述示例實施方式。然而，示例實施方式能夠以多種形式實施，且不應被理解為限於在此闡述的實施方式；相反，提供這些實施方式使得本申請將全面和完整，並將示例實施方式的構思全面地傳達給本領域的技術人員。在圖中，為了清晰，誇大了區域和層的厚度。在圖中相同的圖式標記表示相同或類似的結構，因而將省略它們的詳細描述。
所描述的特徵、結構或特性可以以任何合適的方式結合在一個或更多實施方式中。在下面的描述中，提供許多具體細節從而給出對本申請的實施方式的充分理解。然而，本領域技術人員將意識到，可以實踐本申請的技術方案而沒有所述特定細節中的一個或更多，或者可以採用其它的方法、組元、材料等。在其它情況下，不詳細示出或描述公知結構、材料或者操作以避免模糊本申請的各方面。
首先說明功率模組的散熱情況。以在風冷系統裡的功率半導體器件的散熱情況為例，功率半導體器件產生的熱量經由兩個路徑向環境散失，路徑一：熱通過DBC基板傳導至散熱器上，並自散熱器的內部傳導至和環境換熱的各個表面，最後熱量通過散熱器的這些表面被環境帶走。路徑二：熱首先通過封料傳導到封料表面，並通過封料表面實現向環境的散發。為了說明各個路徑對散熱的影響，業界通常會對散熱的節點位置做如下定義，定義功率半導體器件位置為junction，簡寫為j；定義功率半導體器件正中心對應的基板的外表面的點為case，簡寫為c；定義散熱器為heatsink，簡寫為h；定義環境為ambient，簡寫為a；定義功率半導體器件正中心上方封料表面點為molding，簡寫為m。相對應的每部分的熱阻被簡寫為Rjc--從junction至case的熱阻，Rch--從case 至heatsink表面的熱阻，Rha--從heatsink表面至ambient的熱阻，Rjm--從junction至molding表面的熱阻，Rma--從molding表面至ambient的熱阻。同理，各點的溫度亦以Tx的方式定義，如Tj為junction的溫度。如此，可以將散熱路徑上的熱阻及溫度分佈表達成圖2。為了體現散熱器的散熱作用，下面僅就Tj通過基板向散熱器傳熱的路徑進行分析。
參照圖1所示的採用DBC(Direct Bonding Copper，直接覆銅)基板的半導體器件為例，Rjc歸一化為1K/W；Rch包含兩個部分，即TIM(熱介面材料，例如圖1中所用的導熱矽脂4)層熱阻(RTIM)以及散熱器自身的傳導熱阻(Rh)，RTIM採用普通導熱矽脂時亦約1K/W，散熱器通常由銅等導熱極佳的材料製成，因此Rh值會相對較小，約0.1K/W。Rha為散熱器與環境之間的換熱熱阻，換熱熱阻為在對流換熱過程中，物體表面與流體之間的熱阻，影響換熱熱阻的因素與物體內部的導熱熱阻的因素不同，換熱熱阻其與換熱表面的形狀、流體的流速等有密切關係。物體表面附近的流體的流速越大，其表面對流換熱係數也愈大，換熱熱阻越小；換熱表面積越大，其換熱熱阻越小。因此，為了降低換熱熱阻，主要從增大換熱表面積以及增大流體的流速這兩方面考慮。由於散熱器是由銅等金屬擠壓成型形成，故其表面積難以做得非常大。因此，傳統技術中，為了盡可能降低熱阻，只能採取增大流體的流速的手段，例如，將功率模組，例如電源系統內風速設計的較高。然而，此手段產生的效果也並不理想，其熱阻值依然相對較高，比如約5K/W。由此看出，如何有效降低散熱器和環境之間的換熱熱阻是長期以來存在的難題和瓶頸。
本申請人提出一種散熱機構，以針對上述瓶頸從另一方面降低散熱器和環境之間的換熱熱阻。
第一實施例
請參照圖3所示，本實施例提供一種功率模組100，功率模組例如為電源變換器，其包括基板130、功率器件110及有機散熱機構120。基板130具有相對的上表面131和下表面132，功率器件110可為MOSFET(諸如普通的Si MOSFET，氮化鎵MOSFET等)，二極體，IGBT等，本實施例中，功率器件110為一功率晶片，功率器件110鍵合至基板130的上表面131。其中：有機散熱機構120包括多個有機散熱凸起部(fin)121，有機散熱機構120位於基板130的上表面131一側或基板130的下表面132一側，以將功率器件110產生的熱量經由基板130和有機散熱機構120傳導至外界。
其中，功率器件110與基板130的外部可通過塑封結構包覆，功率器件110可通過貼片(die bonding)材料，例如：焊料，導電膠，導電燒結漿料，導熱膠等)鍵合到基板130上，基板130可以是PCB，DBC，引線框架(Lead Frame)，金屬化陶瓷板，金屬基板等。在一些實施例，功率器件110的背面(即靠近基板130的一側)具有電極的晶片，如垂直型器件，倒裝型平面型器件等，貼片材料通常需要具備導電性，且在基板130上通常會有佈線墊(未示出)與之對應，而實現晶片和基板之間的機械及電/熱連接。在一些實施例，對於僅在正面(即遠離基板130的一側)設有電極的平面型功率器件而言，其與基板之間的貼片材料僅需具備導熱性能即可，並不一定需要導電性能。功率器件正面的電極可以通過引線鍵合(wire bonding)工藝實現和基板或者引出端子的電性連接，在本實施例圖式中被省略。
在某些場合下，由於功率晶片比較脆弱，容易受濕氣、污染物、機械衝擊等影響，為了提升可靠性，可以通過封料進行保護。如圖3所示，塑封結構(molding component)140可僅僅保護基板130的上表面131，有機散熱機構120設置於基板130的下表面132，功率器件110產生的熱量依次透過基板130和有 機散熱機構120傳導至外界。在其他實施例中，塑封結構也可將基板的上下表面均保護起來，有機散熱機構設置於塑封結構的表面。
本實施例中，是以有機散熱器應用於以DBC基板為基板的半導體功率器件的結構(外部引腳、內部引線等細節在圖中被省略)為例來進一步說明本申請的優點，當然，本申請的適用條件並不以此為限。
以下通過一組比較例說明本申請功率模組100的有機散熱機構120的散熱效果。
參照圖4A、4B所示，為了簡化分析，在一上表面均勻發熱的2mm厚度的銅塊170的下方分別設置兩種不同的散熱機構，即如圖4A所示的有機散熱機構120，及如圖4B所示的現有的高熱導率散熱機構120’。有機散熱機構120的材料為熱導率為2W/m.K的樹脂，高熱導率散熱機構120’的材料為熱導率為380W/m.K的銅。以10m/s的風平行於銅塊170的表面進行散熱。歸一化表面未設置散熱器的部分的熱阻為1K/W，經測試發現：A部分的熱阻為0.82K/W，B部分的熱阻為0.75K/W。由此可以看到，儘管有機散熱機構120本身的熱導率遠低於高熱導率散熱機構120’，但是，由於有機材料，例如樹脂材料的成型性能遠比金屬高，即在有限的空間裡可以獲得更高的散熱面積，因此，可以大幅降低散熱器和空氣之間的對流換熱熱阻，而在散熱路徑上，內部的導熱熱阻不占主導地位，熱阻的主要部分集中在對流換熱熱阻，因此，在整體上，有機散熱機構120與高熱導率散熱機構120’的散熱性能基本相當。並且，在功率模組的有限體積內，有機散熱機構120還可加工出更高的表面積，因此，有機散熱機構120的散熱性能有進一步提升的空間。
圖5示出了有機散熱凸起部121，其為圓柱形式，有機散熱凸起部121為多排均勻分佈，且相鄰兩排有機散熱凸起部交錯分佈，由此便於加工，且可更進一步增大與氣流接觸的面積，利於散熱。有機散熱凸起部的形式不限 於此，在其他實施例中，可為均勻或非均勻分佈的凸點或鰭片，排布方式可為交錯或對齊的。
儘管有機散熱凸起部的排布密度大，但有機散熱凸起部之間存在允許空氣流動的間隙，應在保證通風的前提下，盡可能增大有機散熱凸起部的面積，提高散熱效率。
其中，有機散熱凸起部121包括有機導熱材料，有機導熱材料的熱導率在0.2w/m.K至20w/m.K之間。例如，該有機材料是以環氧樹脂，丙烯酸，有機矽等有機材料作為絕緣性的基體，且可以在基體內部混入具有高熱導率的絕緣顆粒材料(如三氧化二鋁陶瓷，二氧化矽，氮化鋁陶瓷，石墨顆粒，金屬氧化物顆粒等)。此時，該有機散熱凸起部為電絕緣體，並不會出現與其他電子元件相接觸而造成的短路情形，可避免現有設計中由銅等高熱導率製成的散熱器因鰭片較長而造成短路的故障現象。在不需要絕緣的場合亦可以在有機材料為基體的條件下，在內部混入具有高導熱的金屬顆粒。
有機散熱凸起部121可通過絲網或鋼絲印刷工藝，亦可以通過直接噴塗、種植(如超聲鍵合等)形成在功率模組的上表面和/或下表面。
可選擇的，有機散熱凸起部121可通過壓膜工藝形成在功率器件或基板的表面，具體為：先在功率器件或基板的表面設置一導熱樹脂，導熱樹脂可以是熱固性的樹脂材料作為基體，內部含有高導熱填料以提高其導熱率，該導熱樹脂可以以液態或者B階段(B-stage，熱固性樹脂反應的中間階段)狀態的形式存在，隨後採用模具加溫加壓的方式形成希望的形狀，加熱後導熱樹脂轉化為固體。
因此，本申請的功率器件與有機散熱機構之間可省略彈簧夾片等機械固定結構，避免額外佔用空間，並且，降低對於功率器件表面平整度的 要求，也無需熱介面材料，從而避免由於熱介面材料在長期高溫服役過程中導熱性能降級導致惡劣影響。
第二實施例
參閱圖6，本實施例的功率模組的散熱機構與第一實施例的不同之處在於：基板130的下表面132採用導熱膠(thermal adhesive)150粘貼一均溫塊(thermal spread)160，均溫塊160通常可以採用金屬(銅/鋁等)，石墨，陶瓷等材料製作，並在均溫塊160的迎風面(遠離基板130的一側)設置有機散熱機構120。該第二實施例的其它部分與第一實施例大致相同，這裡不再贅述。
第三實施例
參閱圖7，本實施例的功率模組的散熱機構與第一實施例的不同之處在於：有機散熱機構120還包括金屬散熱部123，其通過導熱膠150粘貼在基板的下表面132，有機散熱凸起部121形成在金屬散熱部123的下表面。本實施例中，金屬散熱部123可為現有的散熱器(如heatsink)，其包括多個散熱鰭片124。散熱鰭片124的下表面例如以點膠工藝形成有機散熱凸起部121。金屬散熱部123可進一步起到拓展散熱面積的作用。通過在現有的普通散熱器的下方局部地設置有機散熱凸起部121，可以充分使用空間。再者，現有的普通散熱器通常具有導電性，必須和周圍的零件隔開一定的距離以進行電氣絕緣，這會導致空間浪費。相比之下，在該實施例中，本申請的有機散熱機構將電絕緣的有機散熱凸起部121設置於散熱鰭片124的表面，並不會出現與其他電子元件相接觸而造成的短路情形，因而可避免現有設計中的、具有導電性的普通散熱器因鰭片較長而造成短路的故障現象。此外，本申請的散熱機構尤其適合體積小、高度低的功率模組使用，例如空間越來越緊湊的電源系統內。
該第三實施例的其它部分與第一實施例大致相同，這裡不再贅述。
第四實施例
參閱圖8，本實施例的功率模組的散熱機構與第一實施例的不同之處在於：功率器件110與基板130的外部通過塑封結構(molding component)140包覆，有機散熱機構120設置在塑封結構140的表面，功率器件110產生的熱量依次透過塑封結構140和有機散熱機構120傳導至外界。在圖8中，有機散熱機構120設置於塑封結構140的上側。然而，在其他實施例中，可將基板130放置位於功率器件110的上方(例如，將圖8的擺放位置旋轉180度)，則有機散熱機構120設置在塑封結構140的下側。在實際應用中，有機散熱機構120、塑封結構140的位置可根據功率模組的需要任意改變。
該第四實施例的其它部分與第一實施例大致相同，這裡不再贅述。
第五實施例
參閱圖9，本實施例的功率模組的散熱機構與第一實施例的不同之處在於本實施例中，有機散熱機構120還包括平面層125，其設置在基板130與有機散熱凸起部121之間。從製成材料上講，例如，該平面層125的製成材料可以與有機散熱凸起部121的製成材料不同，亦即，在該實施例中，包括有機散熱凸起部121和平面層125的有機散熱機構120包括兩種或兩種以上的材料。例如，平面層125採用較低的介面熱阻性的材料，以進一步提高散熱效果。或者，平面層125為易於與有機散熱凸起部121結合的材料。而有機散熱凸起部121採用與平面層125不同的材料製成。又如，該平面層125與有機散熱凸起部121也可以採用同一種材料製成，此時，有機散熱機構120僅包括一種材料。從工藝流程上講，可以先在基板130上例如以固化工藝形成平面層125，完成固化後再通過印刷，壓鑄等方法在平面層125的下表面形成有機散熱凸起部121。例如，平面層125與基板130以及有機散熱凸起部121均具備良好的粘結性能，因此，亦可以先將有 機散熱凸起部121獨立成型後再通過具有粘結性的平面層125粘附至基板130上。更可以將有機散熱機構120(含有機散熱凸起部121及平面層125)隨後通過另一粘結材料(圖中未標示)粘結至功率模組的一個散熱面。
該第五實施例的其它部分與第一實施例大致相同，這裡不再贅述。
綜上所述，本申請的功率模組的有機散熱機構可加工出更高的表面積，因此，能夠大幅降低其和環境之間的換熱熱阻，進而提高其與環境交換的散熱性能。此外，本申請的功率模組的有機散熱機構在保證功率模組正常散熱的前提下，可降低有機散熱機構自身高度，減小佔用空間，尤其是隨著電源領域對功率密度的不斷追求，對散熱器體積降低的要求亦越來越迫切，與現有的金屬散熱器相比，本申請的功率模組的有機散熱機構易於製造、在有限體積內能夠具有儘量高的表面積，因此，本申請的功率模組的有機散熱機構在實現功率模組小型化方面具有重要意義。
此外，本申請的功率模組中，無需彈簧夾片等機械固定機構對有機散熱機構與功率器件進行固定，且無需矽脂等導熱介面材料，因此，可避免出現現有技術中由此導致的整體厚度、設計成本增加、導熱介面材料變形等問題。
以上具體地示出和描述了本申請的示例性實施方式。應該理解，本申請不限於所揭露的實施方式，相反，本申請意圖涵蓋包含在所附申請專利範圍的精神和範圍內的各種修改和等效佈置。

Claims (26)

  1. 一種功率模組，包括：基板，具有一上表面和一下表面；至少一個功率器件，鍵合至基板的上表面；及有機散熱機構，包括多個有機散熱凸起部，該有機散熱機構位於基板的上表面一側或基板的下表面一側，以將功率器件產生的熱量傳導至外界。
  2. 如申請專利範圍第1項所述之功率模組，其中，功率器件與基板的外部通過塑封結構包覆，有機散熱機構設置於基板的下表面，功率器件產生的熱量依次透過基板和有機散熱機構傳導至外界。
  3. 如申請專利範圍第1項所述之功率模組，其中，功率器件與基板的外部通過塑封結構包覆，有機散熱機構設置於塑封結構的表面，功率器件產生的熱量依次透過塑封結構和有機散熱機構傳導至外界。
  4. 如申請專利範圍第1項所述之功率模組，其中，有機散熱凸起部為凸點、圓柱或鰭片。
  5. 如申請專利範圍第4項所述之功率模組，其中，有機散熱凸起部為均勻或非均勻分佈。
  6. 如申請專利範圍第5項所述之功率模組，其中，有機散熱機構設有多排有機散熱凸起部，相鄰兩排有機散熱凸起部交錯或對齊分佈。
  7. 如申請專利範圍第1項所述之功率模組，其中，有機散熱凸起部包括有機導熱材料，有機導熱材料的熱導率在0.2w/m.K至20w/m.K之間。
  8. 如申請專利範圍第1項所述之功率模組，其中，有機散熱凸起部包括有機導熱材料，該有機導熱材料是以有機材料作為基體且摻雜高熱導率顆粒的填充材料。
  9. 如申請專利範圍第8項所述之功率模組，其中，有機材料為環氧樹脂、丙烯酸或有機矽，該高熱導率顆粒為電性絕緣的三氧化二鋁陶瓷、二氧化矽、氮化鋁陶瓷、石墨顆粒或金屬氧化物顆粒。
  10. 如申請專利範圍第8項所述之功率模組，其中，該高熱導率顆粒為電性導電的金屬顆粒。
  11. 如申請專利範圍第1項所述之功率模組，其中，有機散熱凸起部通過絲網或鋼絲印刷工藝、壓印工藝、噴塗或種植工藝形成。
  12. 如申請專利範圍第1項所述之功率模組，其中，基板的下表面採用導熱膠粘貼一均溫塊，該均溫塊由具有高熱導率的材料製成，有機散熱機構設置於均溫塊的迎風面。
  13. 如申請專利範圍第1項所述之功率模組，其中，有機散熱機構還包括金屬散熱部，其通過導熱膠粘貼在基板的下表面，有機散熱凸起部形成在金屬散熱部的下表面。
  14. 如申請專利範圍第13項所述之功率模組，其中，該金屬散熱部包括多個散熱鰭片，該有機散熱凸起部設置於該散熱鰭片的表面。
  15. 如申請專利範圍第1項所述之功率模組，其中，有機散熱機構還包括平面層，其設置在基板與該有機散熱凸起部之間，該平面層的製成材料與該有機散熱凸起部的製成材料不同。
  16. 如申請專利範圍第1項所述之功率模組，其中，有機散熱機構還包括平面層，其設置在基板與該有機散熱凸起部之間，該平面層與該有機散熱凸起部採用同一種材料製成。
  17. 一種功率模組的製造方法，包括：提供一基板，該基板具有上表面和下表面；提供至少一個功率器件；將至少一個功率器件鍵合至基板的上表面；提供有機散熱機構，其包括多個有機散熱凸起部，有機散熱機構位於基板的上表面一側或基板的下表面一側，以將功率器件產生的熱量傳導至外界。
  18. 如申請專利範圍第17項所述之功率模組的製造方法，其中，該製造方法還包括：形成有機散熱機構於基板的下表面；以及提供塑封結構包覆功率器件與基板的外部，功率器件產生的熱量依次透過基板和有機散熱機構傳導至外界。
  19. 如申請專利範圍第17項所述之功率模組的製造方法，其中，該製造方法還包括：提供塑封結構包覆功率器件與基板的外部；以及形成有機散熱機構於塑封結構的表面，功率器件產生的熱量依次透過塑封結構和有機散熱機構傳導至外界。
  20. 如申請專利範圍第17項所述之功率模組的製造方法，其中，提供有機散熱機構的步驟包括：以固化工藝在基板的下表面形成有平面層，完成固化後再通過印刷或壓鑄工藝在平面層的下表面形成有機散熱凸起部。
  21. 如申請專利範圍第17項所述之功率模組的製造方法，其中，提供有機散熱機構的步驟包括：先將有機散熱凸起部獨立成型，接著通過平面層粘附至基板的下表面。
  22. 如申請專利範圍第17項所述之功率模組的製造方法，其中，提供有機散熱機構的步驟包括：通過絲網或鋼絲印刷工藝、壓印工藝、噴塗或種植工藝形成有機散熱凸起部。
  23. 如申請專利範圍第17項所述之功率模組的製造方法，其中，提供有機散熱機構的步驟包括：通過壓膜工藝形成有機散熱凸起部。
  24. 如申請專利範圍第23項所述之功率模組的製造方法，其中，通過壓膜工藝形成有機散熱凸起部的步驟包括：先在基板的下表面設置一導熱樹脂，導熱樹脂是熱固性的有機材料作為基體，內部含有具有高熱導率的填料，該導熱樹脂以液態或者B階段狀態的形式存在，隨後採用模具加溫加壓的方式形成所需的有機散熱凸起部的形狀，加熱後導熱樹脂轉化為固體。
  25. 如申請專利範圍第17項所述之功率模組的製造方法，其中，提供有機散熱機構的步驟包括：在基板的下表面形成散熱器，並在散熱器的下表面形成有機散熱凸起部。
  26. 如申請專利範圍第25項所述之功率模組的製造方法，其中，散熱器包括多個散熱鰭片，散熱鰭片的表面以點膠工藝形成有機散熱凸起部。
TW104103482A 2014-12-09 2015-02-02 功率模組及其製造方法 TWI657547B (zh)

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