TWI656977B - 用於積層製程之粉末及其用途及藉助積層製造生產組件之方法 - Google Patents
用於積層製程之粉末及其用途及藉助積層製造生產組件之方法 Download PDFInfo
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- TWI656977B TWI656977B TW107102313A TW107102313A TWI656977B TW I656977 B TWI656977 B TW I656977B TW 107102313 A TW107102313 A TW 107102313A TW 107102313 A TW107102313 A TW 107102313A TW I656977 B TWI656977 B TW I656977B
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- 239000000843 powder Substances 0.000 title claims abstract description 155
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000654 additive Substances 0.000 title 2
- 230000000996 additive effect Effects 0.000 title 2
- 239000002245 particle Substances 0.000 claims abstract description 41
- 238000003475 lamination Methods 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000005300 metallic glass Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000000110 selective laser sintering Methods 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 229910000851 Alloy steel Inorganic materials 0.000 claims 1
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 27
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 238000012216 screening Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 229910001092 metal group alloy Inorganic materials 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 229910052791 calcium Inorganic materials 0.000 description 4
- 239000011575 calcium Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 229910000923 precious metal alloy Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000010955 niobium Substances 0.000 description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 238000005381 potential energy Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000002050 diffraction method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 229910052762 osmium Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- 239000011224 oxide ceramic Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000007873 sieving Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
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- 230000003746 surface roughness Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000009690 centrifugal atomisation Methods 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 239000002182 crystalline inorganic material Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000011496 digital image analysis Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003921 particle size analysis Methods 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 platinum metals Chemical class 0.000 description 1
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 1
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical compound [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/08—Metallic powder characterised by particles having an amorphous microstructure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
- B23K15/0086—Welding welding for purposes other than joining, e.g. built-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/653—Processes involving a melting step
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/002—Making metallic powder or suspensions thereof amorphous or microcrystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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Abstract
本發明係關於用於積層製程之粉末,其包含10μm或以上之d2值、200μm或以下之d90值及ELaw/d50之比率0.8kJ/(kg*μm),其中ELaw係崩塌能量且d50係平均粒徑。此外,本發明係關於使用本發明之粉末藉助積層製造生產組件之方法。
Description
積層製程將徹底改革現有生產製程。積層製程可用於直接製造具有複雜三維幾何結構之組件。積層製造係用於表示製程之術語,其中組件係基於數位3D構築數據藉助層層沈積材料而構建。
基於粉末床之製程係積層製程之一種形式。最初,在該基於粉末床之積層製程中將粉末之薄層施加至構築平臺。藉助以富含能量之輻射形式進行足夠高的供能,例如藉助雷射或電子輻射在藉由電腦生成之構築數據預定之位點將粉末至少部分地熔融或燒結。然後,使粉末層經選擇性輻照之位點冷卻並固化。隨後,降低構築平臺且接著再次施加粉末。亦將下一個粉末層至少部分地熔融或加熱高於燒結溫度,並在選擇性加熱之位點連接至其下方之層。對多個連續層重複該等步驟,直至獲得呈最終形狀之組件為止。
近年來尤其在可藉助積層製造處理之材料數目方面已達成重大進展。因此,現今不僅可印刷塑膠材料,而且可印刷高熔點材料(例如金屬或陶瓷)。
具體而言,積層製程之目的係生產具有複雜幾何結構之組件,其包含與可利用已知消去製程(例如CNC碾磨)獲得之組件相比相當或甚至更佳
之材料性質。因此,舉例而言,組件之抗拉強度與孔隙度直接相關。材料可印刷地愈緊密,則成品組件之抗拉強度愈高。成品組件之其他相關性質包括(例如)高邊緣清晰度及最低可能表面粗糙度。
為獲得以最高可能機械穩定性為特徵之組件,期望得到緻密的粉末床。為獲得此粉末床,粉末層之總體密度較佳為至少50%、尤其至少60%。另一方面,基於粉末床之製程有利地使粉末之動態性質(例如流動性)經適當調整,使得粉末可藉助刮刀施加。
在實踐應用中,很明顯同時最佳化用於粉末施加及用於實際製造步驟之粉末性質極為困難。通常,某性質(例如流動性)之改良係以不同性質(例如成品組件之密度)為代價獲得。然而,迄今尚不可使用一量測值來預測是否可將粉末處理成具有低孔隙度之緻密組件。相反,迄今需要用每種可能適宜之粉末實施大量印刷實驗,以在之後評價經印刷組件之材料性質。
本發明之一個目標係提供粉末,可藉由積層製造自該等粉末製造具有高的相對密度(例如低孔隙度)之複雜組件。視情況,可自粉末生產之組件亦應包含最高可能邊緣清晰度及/或最低可能表面粗糙度。
本發明之目標係藉助獨立技術方案1來實現。
圖1係以實例性方式顯示自粉末8及9製得之經印刷組件之光學顯微術影像。
令人驚訝地,很明顯若粉末包含以下特徵,則該等粉末特別適於藉助選擇性熔融及/或燒結連續粉末層進行積層製造:
10μm或以上之d2值、200μm或以下之d90值及0.8kJ/(kg*μm)或以下之比率Q,其中Q係崩塌能量ELaw除以平均粒徑d50之比率(Q=ELaw/d50)。
指定本發明粉末之參數容許在粉末用於積層製程中之適合性方面作出可靠陳述。可省略費力的印刷測試及隨後的機械測試,此係極大簡化。
本發明之粉末較佳選自可燒結及/或熔融之材料。在本發明之範圍內,可燒結及/或熔融之材料應理解為在積層製程中在該製程所用條件下不經歷熱分解之材料。根據本發明,粉末由個別顆粒組成。粉末包含粒度分佈。
粉末之顆粒較佳由在室溫及大氣壓下為固體之材料組成。在較佳實施例中,材料包含低於分解溫度之熔融溫度。視情況,材料可包含玻璃轉換溫度。材料之熔融溫度及/或玻璃轉換溫度(若存在)較佳高於100℃,尤其高於300℃。玻璃轉換溫度可(例如)藉助動態-機械分析或藉由差示掃描量熱法(DSC)來測定。
本發明之粉末可包含多種材料。粉末可包含至少一種選自由以下組成之群之材料:金屬、陶瓷、玻璃及玻璃陶瓷。在較佳實施例中,粉末由上文所指定材料中之一者組成。在較佳實施例中,粉末亦可係不同材料之粉末之混合物。
目前,「金屬」應理解為意指純金屬以及金屬合金二者。
本發明之粉末可含有純金屬、多種類型之純金屬、一種類型之金屬合金、多種類型之金屬合金或其混合物作為金屬。
在本發明之範圍內,術語「金屬」係指以元素形式存在且與硼位於元素週期系之同一週期但在硼左側、與矽位於同一週期但在矽左側、與鍺
位於同一週期但在鍺左側且與銻位於同一週期但在銻左側之化學元素以及原子序數大於55之所有元素。
術語「純金屬」不排除金屬包含雜質。較佳地,雜質之總量相對於純金屬之總量不超過1重量%、更佳不超過0.1重量%且甚至更佳不超過0.01重量%。在尤佳實施例中,純金屬不含故意添加之元素。
在較佳實施例中,純金屬可係貴金屬。在尤佳實施例中,貴金屬係鉑金屬、金或銀。鉑金屬可選自由以下組成之群:鉑、銥、鈀、釕、銠及鋨。
在另一較佳實施例中,純金屬可係耐火金屬。耐火金屬可選自以下元素:4族(例如鈦、鋯及鉿)、5族(例如釩、鈮及鉭)及6族(例如鉻、鉬及鎢)。
在另一較佳實施例中,純金屬可係非鐵金屬或鐵。非鐵金屬可選自由以下組成之群:鎘、鈷、銅、鎳、鉛、錫及鋅。
根據實施例,金屬可係金屬合金。根據本發明,金屬合金應理解為至少兩種元素之金屬混合物,其中至少一種元素係金屬。在此情況下,「金屬」應理解為意指在參與元素之間存在金屬鍵。
在較佳實施例中,金屬合金可係貴金屬合金。在尤佳實施例中,貴金屬合金含有選自由鉑金屬、金及銀組成之群之元素。
貴金屬合金中之較佳鉑金屬可選自由以下組成之群:鉑、銥、鈀、釕、銠及鋨。在另一較佳實施例中,貴金屬合金可係該等鉑金屬中至少兩者之合金(例如鉑-銥或鉑-銠合金)。
較佳地,金屬合金可含有選自耐火金屬、非鐵金屬、鐵以及該等金屬中至少兩者之組合之元素。
尤佳金屬合金亦可選自鋁合金、基於鎳之合金、基於鈷之合金、鈦-
鋁合金、銅-錫合金、不銹鋼合金、工具鋼合金及用於高溫應用之超合金。
在尤佳實施例中,金屬合金可係非晶形金屬。非晶形金屬應理解為包含金屬鍵結特徵且同時為非晶形(即非結晶)相之合金。非晶形金屬因其通常極硬而可具有特殊性質,但亦可塑性變形(延展性)且具高度彈性。非晶形金屬可選自由以下組成之群:基於鈦、鋯、鐵、鎳、鈷、鈀、鉑、銅、金、鎂、鈣及鋁之合金。在此情況下,「基於」應理解為意指各別元素代表相對於合金重量之最大部分。形成非晶形金屬之合金之尤佳實例選自由以下組成之群:NiNbSn、CoFeTaB、CaMgAgCu、CoFeBSiNb、FeGa(Cr,Mo)(P,C,B)、TiNiCuSn、FeCoLnB、Co(Al,Ga)(P,B,Si)、FeBSiNb、Ni(Nb,Ta)ZrTi。特定而言,非晶形金屬可係ZrCuAlNb合金。較佳地,該ZrCuAlNb包含除鋯以外23.5-24.5重量%之銅、3.5-4.0重量%之鋁以及1.5-2.0重量%之鈮(以名稱AMZ4®自Heraeus Deutschland GmbH購得)。
原則上,生產金屬粉末之適宜製程為熟習此項技術者已知。較佳地,自金屬顆粒生產粉末藉助霧化製程、具體而言電漿霧化、離心霧化或無坩堝霧化進行。
在實施例中,本發明粉末之材料可係陶瓷材料。在本發明之情況下,陶瓷應理解為無金屬特徵之結晶無機材料。在較佳實施例中,陶瓷材料可包含天然礦物。陶瓷材料可選自由氧化物陶瓷、氮化物陶瓷及碳化物陶瓷以及該等陶瓷中至少兩者之混合形式組成之群。
氧化物陶瓷可較佳包含選自由以下組成之群之元素之氧化物:鎂、鈣、鋁、矽、鈦、鋯及鋅。氧化物陶瓷材料可包含純元素氧化物或混合氧化物。在較佳實施例中,元素氧化物選自由以下組成之群:氧化鎂、氧化
鈣、氧化鋁、氧化矽、氧化鈦、氧化鋯及氧化鋅。在另一較佳實施例中,混合氧化物含有選自由以下組成之群之元素中之至少兩者:鎂、鈣、鋁、矽、鈦、鋯及鋅。視情況,混合氧化物可含有選自由元素週期系之主族3至6之元素組成之群之額外元素。具有不同形狀及大小之陶瓷粉末可藉由熟習此項技術者已知之製程(例如藉由研磨)產生。
在實施例中,本發明粉末之材料可係玻璃。在本發明之範圍內,玻璃應理解為不包含金屬鍵結特徵之無機非晶形材料。玻璃可係氧化玻璃。氧化類別可選自由矽酸鹽玻璃、硼酸鹽玻璃及磷酸鹽玻璃組成之群。該等較佳氧化玻璃之名稱各自指示關於重量最常見之組分。舉例而言,矽酸鹽(SiO4 4-)係矽酸鹽類別中最常見之組分。指定類型之玻璃中之每一者皆可含有呈氧化物形式之額外元素,其中該等額外元素可選自(例如)鹼金屬、鹼土金屬、鋁、硼、鉛、鋅及鈦。
玻璃粉末可根據熟習此項技術者已知之製程產生,例如藉由研磨或化學合成(例如沈澱、溶膠-凝膠製程)。
在實施例中,粉末可含有玻璃陶瓷材料。玻璃陶瓷係不包含金屬特徵且包含非晶形相及結晶相二者之無機材料。
較佳地,至少80%之顆粒符合以下條件:0.8dmin/dmax 1.0;其中dmin係顆粒之最小直徑且dmax係顆粒之最大直徑。
若在本發明粉末之情況下提及參數d2、d50及d90,則彼等參數可如下測定。可根據ISO 13320:2009藉助雷射繞射粒度分析對呈乾分散體形式之相應粉末進行量測,且可自量測數據確定累積體積分佈曲線。根據ISO 9276-2:2014,d2、d50及d90之值可自體積分佈曲線計算。在此,舉例而
言,「d2」意指2體積%之顆粒具有小於此值之直徑。
本發明之粉末具有10μm或以上、尤其20μm或以上且尤佳30μm或以上之d2值。此外,本發明之粉末具有200μm或以下、較佳150μm或以下、尤其100μm或以下且尤佳65μm或以下之d90值。通常,粉末包含(例如)10-32μm、10-45μm、20-63μm、45-100μm、45-150μm範圍內之粒度分佈。在此,連字符之前之值各自係指d2值且連字符之後之值係指d90值。
此外,本發明之粉末包含0.8kJ/(kg*μm)或以下之比率Q,其中Q係崩塌能量ELaw與平均粒徑d50之比率(Q=ELaw/d50)。在較佳實施例中,比率Q具有0.65kJ*μm/kg或以下之值,具體而言0.5kJ*μm/kg或以下之值。在本發明之範圍內,崩塌能量ELaw可藉由旋轉粉末分析來測定。旋轉粉末分析之程序闡述於「量測方法」部分中。
本發明之粉末可利用特徵為以下步驟序列之製程發現:a.提供由可熔融及/或燒結之材料製得之粉末;b.將粉末大小分級,使得粒度分佈符合d2 10μm且d90 200μm之條件;c.藉助旋轉粉末分析測定流動性並根據ISO 13320:2009藉助雷射繞射分析測定d50值;d.計算比率ELaw/d50;e.選擇ELaw/d50比率不超過0.80kJ/(kg*μm)之粉末。
藉助使用上文所指定之製程,可鑑別出可用於積層製程中、具體而言用於基於粉末床之製程(例如選擇性雷射熔融)中之粉末。
在步驟b)中,使粉末經受至少一個大小分級製程。篩選及篩分係較
佳大小分級製程。篩選可(例如)藉助翻轉篩、旋轉篩或振動篩進行。通常,使用由不銹鋼製得之常見篩網進行篩選。用於粉末之篩分製程通常為熟習此項技術者已知。篩分可藉由(例如)風力篩分進行。
亦可連續實施該等大小分級製程中之兩個或更多個,以獲得經儘可能準確調整之粒度分佈。舉例而言,可實施最初一或多個篩選製程及隨後一或多個篩分製程。在此情況下,粉末可在很大程度上清除所包含之粒徑小於10μm(即d2 10μm)及大於200μm(即d90 200μm)之顆粒。
篩分後,崩塌能量(ELaw)可藉由旋轉粉末分析測定且d50值可藉由雷射繞射分析測定。用於此目的之量測方法闡述於下文中。
使用如此測定之值可確定崩塌能量(ELaw)與平均粒徑d50之比率Q(Q=ELaw/d50)。
然後,在步驟e)中,可選擇包含不超過0.80kJ/(kg*μm)之比率Q之粉末。在較佳實施例中,Q係0.65kJ*μm/kg或以下、具體而言0.5kJ*μm/kg或以下。若粉末無法符合要求之值,則可將其進一步處理以符合ELaw/d50值或可棄掉及/或回收粉末。
比率Q係粉末流動性之量度。熟習此項技術者基本上知曉如何在生產製程後進一步影響粉末之流動性。可在粉末生產期間藉由後處理或藉助二者之組合影響粉末之流動性。球形顆粒在生產製程期間有利於較佳流動性。流動性可(例如)藉由調整粉末之含水量改變。在生產粉末後例如藉助溫度處理或研磨改變顆粒表面來調節流動性亦係可行的。在一個可能的實施例中,可使用上文指定之措施來改變不符合Q之條件之彼等粉末之流動性。
此外,本發明係關於藉助積層製造生產組件之製程,其包含以下步
驟:a)提供包含10μm或以上之d2值、200μm或以下之d90值及不超過0.80kJ/(kg*μm)之ELaw/d50比率之粉末,及b)使用來自步驟a)之粉末積層製造組件。
在步驟a)中提供之粉末用於在步驟b)中積層製造組件。在本發明之範圍內,積層製程應理解為其中至少一個粉末層係經選擇性加熱至燒結及/或熔融溫度之彼等。該等積層製程亦稱為基於粉末床之方法。加熱層可藉由(例如)冷卻轉化為固化層。在較佳實施例中,至少兩個固化層一個在另一個之上生成,各自來自粉末床(即粉末層)。該等積層製程原則上為熟習此項技術者已知。欲在此提及之彼等製程之實例包括選擇性雷射燒結(SLS)、選擇性雷射熔融(SLM)及選擇性電子束熔融(EBM)。在較佳實施例中,可將積層製程與機械加工製程組合。
本發明方法之步驟b)之積層製造之較佳程序可包含以下子步驟:b1)將本發明粉末之層施加至(例如)構建板;b2)藉助雷射或電子輻射將第一層粉末之至少一部分加熱至燒結及/或熔融溫度,並隨後冷卻經加熱之粉末。
視情況,該製程進一步包含以下步驟:b3)將本發明粉末之另一層施加至先前所生成之層上;b4)藉助雷射或電子輻射將另一層粉末之至少一部分加熱至燒結及/或熔融溫度,並隨後冷卻經加熱之粉末。
類似於步驟b3)及b4),可在b4)之後將任何數目之其他層施加至彼此上,直至獲得成品組件為止。
視情況,其他步驟可各自在步驟b1)-b4)之間進行,只要維持該步
驟序列即可。
在步驟b1)中,將本發明粉末之第一層施加至構建板上。較佳地,構建板係水平的且包含高的導熱率。較佳地,構建板係由金屬製得。粉末層較佳可利用刮刀施加。第一層之施加較佳在封閉組裝空間中進行。視情況,在步驟b1)之前將組裝空間抽真空或填充惰性氣體(例如氮或稀有氣體)。
在步驟b2)中,藉由雷射或電子輻射將第一層粉末之至少一部分加熱至燒結及/或熔融溫度。適當進行加熱,使得超過粉末顆粒之燒結溫度及/或熔融溫度。燒結溫度應理解為意指例如藉助沿顆粒表面進行表面擴散使顆粒之原子擴散至接觸相鄰顆粒之位點可行之溫度。
對其中富含能量之輻射作用於粉末層並對其加熱之區域之控制較佳係由電腦控制來承擔。分解為多個虛擬切面之欲製造組件之3D模型可用於此目的。3D模型之該等虛擬切面中之每一者則可用作欲加熱之所施加粉末層區域之模板。
加熱後,將經加熱之區域冷卻至熔融及/或燒結溫度以下。在製程中,先前經加熱之粉末層變硬及/或固化。
在步驟b3)中,將本發明粉末之另一層施加至先前生成之層上。
在步驟b4)中,依舊將另一層粉末之至少一部分加熱至粉末顆粒之燒結或熔融溫度。由於顆粒被加熱超過燒結或熔融溫度,故顆粒材料可連接至同一層之相鄰顆粒之材料及先前所生成層之相鄰顆粒之材料二者。
一旦完成組件之製造,即可去除未燒結及/或未熔融之鬆散粉末。去除可(例如)藉由噴砂或抽吸進行。
視情況,組件可在積層製程後經受後處理,其中後處理可選自由以
下組成之群:燒蝕處理(例如研磨、拋光、碾磨、鑽孔、蝕刻、雷射或電漿燒蝕)、增層處理(例如塗佈、印刷、濺鍍、熔接、焊接)、熱處理(加熱及冷卻)、電處理(電銲、電鍍、侵蝕)、壓力改變(壓力增加、壓力減小)、機械變形(壓製、輥壓、拉伸、成型)及其至少兩者之任何組合。
由於在積層製程中使用本發明之粉末,故可製造具有高相對密度(即極低孔隙度)之組件。特定而言,高相對密度對於獲得機械穩定之組件甚為重要,此乃因孔或空隙可為破裂之潛在位點。此外,絕熱氣體內含物亦可減小導熱率。具體而言,若要求組件具有高導熱率,則材料中之該等絕熱區域可為不利的。
此外,本發明方法容許獲得相對密度大於90%、較佳大於95%之組件。
所製造之組件可為(例如)冷卻元件、拓撲最佳化之輕質組件、醫療裝置或個人化植入物。
使用本發明之粉末容許製造具有複雜或精巧結構之組件。具體而言,本發明方法適於製造因組件之複雜幾何結構所致無法藉助習用消去製程(例如碾磨)製造之組件。
就在複本中指定標準而言,該等參考文獻始終係指在申請日期有效之版本。
粒度分佈可根據ISO 13320:2009使用「Helos BR/R3」裝置(Sympatec GmbH,Germany)藉由雷射繞射來測定。端視粉末中所存在之粒度,在此量測範圍係0.9-875μm。
可使用具有振動式進料單元VIBRI(具有文丘裡噴嘴(Venturi nozzle))之乾法分散系統RODODS/M(Sympatec GmbH,Germany)來分散粉末顆粒。在此情況下試樣量為5g。製程中所用雷射輻射之波長為632.8nm。分析可基於米氏理論(Mie theory)進行。在本發明之範圍內,粒度係以體積分佈形式獲得,即粒度分佈係以體積分佈累計曲線形式測定。
d2、d50及d90值可自藉由雷射繞射量測之粒度分佈(體積分佈)計算,如ISO 9276-2:2014中所述。
為測定本發明粉末之崩塌能量(ELaw),粉末可藉助本文所述之旋轉粉末分析來表徵。舉例而言,可使用運行Revolution 6.06版軟體之旋轉粉末分析儀型號Rev2015(來自Mercury Scientific Inc.,Newton USA)來測定崩塌能量。在本發明之範圍內,使用以下程序來量測崩塌能量:使用總體重量及總體體積來確定粉末之總體密度。用100ml粉末填充圓柱形量測滾筒。量測滾筒具有100mm之直徑及35mm之深度。量測滾筒以0.3轉/分鐘之恆定速度圍繞水平定向之圓柱軸轉動。一起圍住填充至圓柱形量測滾筒中之粉末之圓柱兩個正面中之一個係透明的。在量測開始之前,使量測滾筒轉動60秒。對於實際量測,在旋轉期間使用照相機以10張影像/秒之成像速率沿量測滾筒之轉動軸對粉末進行拍照。在此情況下,適當選擇照相機參數,使得在粉末-空氣界面獲得最高可能對比度。在量測滾筒轉動期間,在粉末倒流至滾筒之較下部分中之前,將粉末逆著重力拖曳至一定高度。倒流通常以急動模式(間斷的)發生且亦稱為崩塌。在已記錄150次崩塌之滑動時完成量測。
隨後,藉助數位影像分析來分析所量測粉末之影像。將影像細分為
具有相等大小之像素。像素面積及數目取決於所使用之照相機。將暗像素分配至粉末並將亮像素分配至粉末上方之空氣體積。對於分配至粉末之每一像素,使用相應體積(像素面積*滾筒深度)及粉末密度來計算像素之質量。
此外,測定每一影像中每一像素與基線之距離h。基線作為量測滾筒圓周下方之水平切線位於所量測粉末之外部。
可在等式Epot像素=m*g*h中使用此數據來計算每一像素之位能(m=質量[kg],g=重力[m*s-2],h=基線上方之高度[m])。使用每一影像之所有經計算Epot像素之和來計算記錄時全部粉末之位能(EpotPulv)。藉由用如此獲得之EpotPulv除以所添加粉末之質量來計算粉末之比位能EpotSPulv。記錄每次成像時粉末之比位能。當在滾筒之旋轉期間拖曳粉末時,位能增加至最大值,且然後在崩塌滑動後減小至最小值。由於崩塌之該週期性滑動,EpotSPulv在量測期間在某些限度內變化。
計算每一EpotSPulv峰值與隨後EpotSPulv谷值之間之差異,藉此確定每一個別崩塌之位能E Law_單個 。自所有個別測定之崩塌能量E Law_單個 值計算崩塌能量ELaw之平均值。
孔隙度係由以下等式闡述:孔隙度P(以%計)=(1-(ρgeo/ρth))×100%,其中ρgeo係組件之幾何密度且ρth係組件之理論密度。
幾何密度可根據阿基米德(Archimedes)原理(例如)使用靜壓量表來測定。組件之理論密度對應於構成組件之材料之理論密度。相對密度Drel
(以%計)遵循(ρgeo/ρth)×100%。
藉由篩選將自可熔融及/或燒結之各種材料製得之粉末大小分級(表1)。使用來自Retsch GmbH,Germany之AS 200單元來篩選。使用網格寬度為10μm、20μm、45μm、63μm及140μm之不銹鋼篩並以不同幅度將大約100g粉末篩濾2-5分鐘。
測定經大小分級粉末之d2及d90值。若篩選後值不符合條件,即d2值10μm且d90值200μm,則開始進行其他大小分級步驟直至粒度分佈在指定限度內為止。熟習此項技術者知曉如何適當選擇不同篩之網格寬度,以自粉末去除在界定範圍之外之顆粒。
若粉末符合指定條件,即d2值10μm且d90值200μm,則亦量測粉末之d50值及崩塌能量並計算比率(ELaw/d50)。
使所有粉末經受所用量測,以藉助「選擇性雷射熔融」(SLN)使用ConceptLaser GmbH,Germany,型號MLab之設備產生邊長為10mm之立方體。全程使用相同製程參數(雷射功率:95W,雷射速度:150mm/s,線距:0.09mm)。
如上文所述測定所獲得組件之幾何密度及相對密度。
粉末及由其製得之組件之結果匯總於表1中。
自表1中顯而易見,單獨平均粒徑d50並非適宜顆粒之適宜選擇準則。具體而言,很明顯,藉由比較表1中實驗3、8及13之粒度無法識別成品組件之品質之趨勢。
圖1以實例性方式顯示自粉末8及9製得之經印刷組件之光學顯微術影像。同樣很明顯,粉末9具有顯著低於粉末8之孔隙度。
Claims (14)
- 一種用於積層製程之粉末,其包含:a.10μm或以上之d2值;b.200μm或以下之d90值;及c.ELaw/d50之比率0.8kJ/(kg*μm),其中ELaw係崩塌能量且d50係平均粒徑。
- 如請求項1之粉末,其中該粉末包含0.65kJ/(kg*μm)或以下、具體而言0.5kJ/(kg*μm)或以下之ELaw/d50值。
- 如請求項1或2之粉末,其中該粉末包含金屬。
- 如請求項3之粉末,其中該金屬選自由貴金屬及鹼金屬組成之群。
- 如請求項3之粉末,其中該金屬係合金。
- 如請求項5之粉末,其中該合金選自由以下組成之群:鈦-鋁合金、銅-錫合金、鋁合金、鋼合金及基於鎳之合金。
- 如請求項3之粉末,其中該金屬係非晶形金屬。
- 如請求項7之粉末,其中該非晶形金屬係選自基於鋯之非晶形金屬、基於銅之非晶形金屬及基於鐵之非晶形金屬。
- 如請求項1或2之粉末,其中至少80%之顆粒符合以下條件:0.8dmin/dmax 1.0;其中dmin係顆粒之最小直徑且dmax係顆粒之最大直徑。
- 一種如請求項1至9中任一項之粉末之用途,其用於基於粉末床之積層製造方法中。
- 如請求項10之用途,其中該積層製造方法選自選擇性雷射熔融、選擇性雷射燒結及電子束熔融。
- 一種藉助積層製造生產組件之方法,其包含以下步驟:a)提供粉末,其包含10μm或以上之d2值、200μm或以下之d90值及不超過0.80kJ/(kg*μm)之ELaw/d50比率,及b)自該粉末積層製造該組件。
- 如請求項12之方法,其中步驟a)包含以下子步驟:a1)提供粉末;a2)將該粉末大小分級,使得粒度分佈符合d2 10μm且d90 200μm之條件;a3)選擇ELaw/d50比率不超過0.80kJ/(kg*μm)之粉末。
- 如請求項12或13之方法,其中步驟b)包含以下子步驟:b1)施加該粉末之層;b2)藉助雷射或電子輻射將該粉末之至少一部分加熱至燒結及/或熔融溫度,並隨後冷卻該經加熱之粉末。
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- 2018-01-03 US US16/483,125 patent/US20200230695A1/en active Pending
- 2018-01-03 CN CN201880006291.1A patent/CN110167698B/zh active Active
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CN110167698B (zh) | 2022-05-24 |
EP3360627A1 (de) | 2018-08-15 |
JP2020505504A (ja) | 2020-02-20 |
JP7126504B2 (ja) | 2022-08-26 |
TW201831332A (zh) | 2018-09-01 |
US20200230695A1 (en) | 2020-07-23 |
KR20190109456A (ko) | 2019-09-25 |
WO2018145824A1 (de) | 2018-08-16 |
CN110167698A (zh) | 2019-08-23 |
KR102419052B1 (ko) | 2022-07-07 |
EP3360627B1 (de) | 2022-01-05 |
JP2021185266A (ja) | 2021-12-09 |
KR20210076201A (ko) | 2021-06-23 |
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