TWI656948B - Resin bond grinding wheel, manufacturing method and processing device of resin bond grinding wheel - Google Patents

Abstract

The invention provides a resin bond grinding wheel, a method for manufacturing the resin bond grinding wheel, and a processing device. By mixing bio-derived fibrous components in the hardened resin, the hydrophilicity of the resin-bonded grinding wheel is improved. The resin-bond grinding wheel (1A, 1B) includes a resin portion (5), which is a hardened resin formed by curing a resin material; abrasive particles (6) are mixed into the resin portion (5); And cellulose nanofiber (CNF), which is a bio-derived fibrous member (7) mixed into the resin portion (5).

Description

Resin bond grinding wheel, manufacturing method and processing device of resin bond grinding wheel

The invention relates to a resin-bond grinding wheel, a method for manufacturing the resin-bond grinding wheel, and a processing device.

As a conventional technique, for example, Patent Document 1 discloses the following: a resin-bonded superhard abrasive wheel (which has the same meaning as the “resin-bond grinding wheel” used in this application) is dispersed in the resin-bonded There are CBN grains (cubic boron nitride grains) or diamond grains, and the resin-bonded super-hard abrasive grinding wheel is formed by providing single fibers near the outer surface of the CBN grains or diamond grains. As the single fiber, for example, a single fiber having a fiber structure such as glass fiber, carbon fiber, and various whiskers is disclosed (for the above, refer to lines 7 to 16 in the upper left column of page 2 of Patent Document 1).

Patent Document 1: Japanese Patent Publication No. Hei 4-87776

The resin-bonded superabrasive abrasive wheel disclosed in Patent Document 1 has an effect of suppressing the shedding of superabrasive particles (refer to lines 5 to 8 in the upper left column on page 3 of Patent Document 1). Therefore, the disclosed resin-bonded superhard abrasive wheel has a long life. The resin-bonded super-hard abrasive grinding wheel is required to have a longer life.

The present invention has been made in order to solve the above-mentioned problems, and an object thereof is to provide a resin-bond grinding wheel, a method for manufacturing the resin-bond grinding wheel, and a processing device that have a longer life.

In order to solve the above problems, the resin-bond grinding wheel according to the present invention includes: a hardened resin, which is hardened and molded from a resin material; abrasive particles are mixed into the hardened resin; and fibrous components derived from a living body are mixed into hardening Resin.

In order to solve the above problems, the method for manufacturing a resin-bonded grinding wheel according to the present invention includes the following processes: preparing a mixed material by mixing abrasive particles, bio-derived fibrous parts, and a resin material; and loading the mixed material into a molding die Heating the mixed material under pressure; and molding a hardened resin by hardening the resin material.

In order to solve the above problems, the method for manufacturing a resin-bonded grinding wheel according to the present invention includes the following processes: preparing a mixed material by mixing abrasive particles, bio-derived fibrous components, and a solvent; after the mixed material is dried, borrowing An impregnated material is prepared by impregnating a fluid resin material into the mixed material; the impregnated material is charged into a molding die and heated while the impregnated material is pressurized; and the resin material is hardened to form and harden Resin.

In order to solve the above-mentioned problems, the processing device according to the present invention uses a resin-bond grinding wheel to grind the object to be processed. The resin-bond grinding wheel includes: a hardening resin, which is hardened and molded from a resin material; The resin; and the fibrous member derived from the living body are mixed into the hardened resin.

According to the present invention, it is possible to increase the life of a resin-bonded grinding wheel.

1A, 1B ‧ ‧ ‧ resin bond grinding wheel

2‧‧‧ round hole

3‧‧‧ side

4‧‧‧ week facial

5‧‧‧Resin Department (hardened resin)

6‧‧‧ abrasive grain

7‧‧‧ Fibrous parts

8‧‧‧ Stomata

9A, 9B ‧‧‧ Disc-shaped hybrid material

10‧‧‧Forming Mould

11‧‧‧ lower mold

12‧‧‧ Upper mold

13‧‧‧ recess

14‧‧‧ upward convex

15‧‧‧ downward convex

16‧‧‧Heating furnace

17‧‧‧ Peripheral

18‧‧‧ heating section

19‧‧‧ units

20‧‧‧ support

21‧‧‧ Lifting Department

22‧‧‧heater

23‧‧‧ opening

24‧‧‧ Upper Parts

25‧‧‧Processing equipment

26‧‧‧Receiving module

27, 41, 45‧‧‧‧ receiving module

28‧‧‧ Submit Module

29‧‧‧Processing object

30‧‧‧ Product Group

31‧‧‧tray

32‧‧‧ Camera

33‧‧‧ mandrel (rotating mechanism)

34‧‧‧rotation axis

35, 39‧‧‧Servo motor

36‧‧‧Workbench (fixed mechanism)

37‧‧‧Rotating part

38‧‧‧ Mobile agency

40‧‧‧ball screw

42‧‧‧Cleaning and drying mechanism

43‧‧‧Cleaning Department

44‧‧‧ Drying section

46‧‧‧Grinding mechanism

47‧‧‧ grinding wheel

48‧‧‧thickness measuring mechanism

49‧‧‧ displacement sensor

C‧‧‧ Center

CTL‧‧‧Control Department

P‧‧‧ Products

t‧‧‧thickness

Fig. 1a is a front view and a side view of the resin-bond grinding wheel according to the present invention, and Figs. 1b and 1c are enlarged schematic diagrams of part A shown in Fig. 1a, which are related to different embodiments, respectively.

Figures 2a to 2e are schematic diagrams showing the manufacturing method of the resin-bond grinding wheel according to the present invention in the order of manufacturing processes.

Fig. 3a is a schematic plan view showing a processing device according to the present invention, and Figs. 3b and 3c are schematic plan views showing examples of functional modules other than the polishing module, respectively.

(Example 1)

(Structure of Resin Bonding Wheel)

The structure of the resin-bond grinding wheel according to Embodiment 1 of the present invention will be described with reference to FIGS. 1a to 1c. The resin-bonded grinding wheel is a general term for a grinding wheel that uses a resin (resin) as a bonding material (bonding agent) that is one of the elements of the structure of the grinding wheel. Resin-bond grinding wheels are used in cutting, grinding, and polishing processes depending on their purpose. When processing a processing object, a processing fluid such as processing water is usually supplied to the processing site.

In this application, the expression "grinding" is used with the meaning of "general name of grinding and grinding" (JIS Industrial Terminology Dictionary 4th Edition, (Finance) Japan Standards Association, November 20, 1995, No. Page 533). In the present application, the expression "grinding a work object" means "grinding a part of the thickness direction of the work object (cutting off a part from the surface of the work object) Minus "and" polishing all parts in the thickness direction of the processing target (completely cutting the processing target) ".

Fig. 1a is a front view and a side view of a resin-bond grinding wheel according to the present invention. The resin bond grinding wheel 1A is a resin bond grinding wheel according to Example 1 of the present invention, and the resin bond grinding wheel 1B is a resin bond grinding wheel according to another embodiment (described later) of the present invention.

All the drawings in this application are for ease of understanding, and are appropriately omitted or exaggerated for schematic drawing. The same symbols are used for the same structural elements, and descriptions thereof are appropriately omitted.

As shown in FIG. 1, the resin-bond grinding wheel 1A has a disc-shaped (circular) outer shape and a circular hole 2 that is concentric with the circle. A rotary shaft (not shown) of the processing device is fitted into the circular hole 2. The resin-bond grinding wheel 1A has a side surface portion 3 and a peripheral surface portion 4 on both sides. In a state where the rotation axis of the resin-bond grinding wheel 1A is embedded in the circular hole 2, the outer portions of the circular hole 2 in the side portions 3 on both sides are clamped by two opposing jigs (not shown). The two opposite jigs are fixed by screws, and the resin-bonded grinding wheel 1A is fixed on the rotation axis of the processing apparatus. Generally, a resin bond grinding wheel having a large thickness t is used when the resin bond grinding wheel 1A is used as a grinding wheel, and a resin bond grinding wheel 1A is used when the resin bond grinding wheel 1A is used as a cutting wheel. Resin bond grinding wheel with smaller thickness t.

The imaginary center C of the resin-bond grinding wheel 1A coincides with the center line of the rotation axis of the processing apparatus. The rotating shaft of the processing device is connected to a rotating shaft of a motor (not shown) such as a servo motor. The rotation axis of the motor rotates the rotation axis of the processing device. As a result, the resin-bond grinding wheel 1A fixed on the rotation axis of the processing device is rotated at a predetermined number of revolutions (for example, 15,000 to 30,000 rpm). The peripheral surface portion 4 of the rotating resin-bond grinding wheel 1A comes into contact with the object to be processed, thereby polishing the object to be processed.

The microstructure of the resin-bond grinding wheel 1A according to Example 1 of the present invention will be described with reference to FIG. 1b. As shown in Fig. 1b, the resin-bond grinding wheel 1A includes a resin portion 5 made of a hardened resin, abrasive grains 6, and a fibrous member 7 derived from a living body. In other words, with abrasive particles 6 and The bio-derived fibrous member 7 is dispersed (mixed into) a resin portion 5 formed of a hardened resin to construct a resin-bond grinding wheel 1A. It is preferable to uniformly mix the resin part 5, the abrasive grain 6, and the bio-derived fibrous member 7. Depending on the application of the resin-bond grinding wheel 1A, air holes 8 may be formed in the resin portion 5.

The resin portion 5 is a synthetic resin, and is configured of, for example, a thermosetting resin made of a phenol resin, an epoxy resin, or a polyimide resin.

The abrasive grains 6 are roughly classified into ordinary abrasive grains and super-hard abrasive grains. As the ordinary abrasive grain, for example, a ceramic-based hard substance such as alumina-based or silicon carbide-based can be used. As the superabrasive particles, for example, diamond, cBN (cubic boron nitride), and the like, which are harder than ordinary abrasive particles, can be used.

The bio-derived fibrous member 7 is, for example, a plant-based fibrous member having hydrophilic properties. The plant-based fibrous member 7 preferably contains cellulose. The fibrous member 7 is more preferably a cellulose nanofiber (CNF) having high hydrophilicity. Cellulose nanofiber refers to "nano fiber produced by mechanical defibration using cellulose contained in plant fibers as a raw material"("Japan's first mass production and sale of biomass nanofibers!", [Online ( online)], Sugino Machinery Co., Ltd. ), [Search on September 16, 2008], Internet <URL: http://www.sugino.com/site/biomass-nanofiber/guidance.html>).

Cellulose nanofibers have the following characteristics (Industrial Survey Department, Japan Policy Investment Bank Co., Ltd., "This month's topic No. 254-2"), March 17, 2016, Figures 2 to 3, characteristics of cellulose nanofiber And expected use): (1) light weight (1/5 of steel) and high strength (more than 5 times of steel); (2) less thermal deformation (about 1/50 of glass); (3) ) Has a large specific surface area (250 m ² / g or more).

The cellulose nanofiber used in Example 1 has, for example, the following diameter (diameter of a cross section perpendicular to the longitudinal direction) value and length value. The diameter value Φ of cellulose nanofibers is about several tens (tens) to 200 nm, and the length value is about 1 to 10 μm or more. Therefore, the used cellulose nano The aspect ratio (length value / diameter value) of the fiber is several tens (tens) to several hundreds (hundreds) or more than several tens to several hundreds.

Figures 1b and 1c show dressing before use. In the following resin binder grinding wheels 1A and 1B, a part of the tip of the fibrous member 7 protrudes from the surface of the resin portion 5. Inside the resin portion 5, portions extending from the respective fibrous members 7 protruding from the surface of the resin portion 5 are wound around each other. Inside the resin portion 5, there are abrasive grains 6 between a plurality of fibrous members 7 that are entangled with each other. With this structure, mechanical strength such as elastic modulus, flexural strength, tensile strength, and the like of the resin-bonded grinding wheel 1A are increased.

In the resin-bond grinding wheel 1A according to Example 1, the abrasive grains 6 and the bio-derived fibrous member 7 (for example, cellulose nanofibers) are dispersed (mixed) into the resin portion 5 made of hardened resin. . Since the bio-derived fibrous member 7 is hydrophilic, it is easy to retain moisture near the surfaces in the peripheral surface portion 4 and the side surface portion 3 of the resin-bond grinding wheel 1A. Therefore, it is possible to reduce the friction between the peripheral surface portion 4 and the side surface portion 3 of the resin-bond grinding wheel 1A and the processing target. This makes it possible to reduce frictional heat generated when a processing object is polished using a resin-bond grinding wheel. Therefore, the grinding ability of the resin-bonded grinding wheel can be improved, and the life of the resin-bonded grinding wheel can be extended.

In the resin-bond grinding wheel 1A according to Example 1, the ratio (blending ratio) of the fibrous member 7 is preferably 0.5% by volume or more. This is because, by including the fibrous member 7 at a compounding ratio of about 0.5% by volume, the effect of reducing the friction between the peripheral surface portion 4 and the side surface portion 3 of the resin-bond grindstone 1A and the object to be processed begins. This effect is presumed to be caused by the inclusion of the fibrous member 7 having high hydrophilicity in the resin-bond grinding wheel 1A. The content presumed in this application will not affect the interpretation of the scope of patent application.

In the resin-bond grinding wheel 1A according to Example 1, the blending ratio of the fibrous member 7 is more preferably 3% by volume or more. This is because by including the fibrous member 7 at a compounding ratio of about 3% by volume, The effect of significantly increasing the mechanical strength of the resin-bonded grinding wheel 1A began to occur. By forming a composite material containing cellulose nanofibers, the mechanical strength of the resin-bonded grinding wheel 1A is improved.

In the resin-bond grinding wheel 1A according to Example 1, the blending ratio of the fibrous member 7 is preferably 30% by volume or less. This is because, according to the method for manufacturing a resin-bonded grinding wheel 1A (Example 2 described later), when the blending ratio of the fibrous member 7 is greater than 30% by volume, it is difficult to stir and knead the abrasive grains 6 and the fibers derived from the organism Like member 7 and resin material. The resin material is a raw material of a hardened resin constituting the resin portion 5. The resin material is powdery, granular, or liquid at normal temperature. "Liquid at normal temperature" This description refers to fluidity at normal temperature, regardless of the level of viscosity.

(Effect)

According to the resin-bond grinding wheel 1A according to Example 1, the following effects can be obtained. First, the fibrous member 7 which is biologically derived and has hydrophilicity dispersed (mixed into) the resin portion 5 together with the abrasive grains 6 is near the surface of the peripheral surface portion 4 of the resin-bond grinding wheel 1A and the side surface portion 3 It is easy to retain moisture near the surface. The moisture retained near these surfaces reduces the friction between the surface of the peripheral surface portion 4 and the side surface portion 3 of the resin-bonded grinding wheel 1A and the processing object. Accordingly, it is possible to reduce the frictional heat generated when the object to be ground is polished using the resin-bond grinding wheel 1A. Therefore, the grinding ability of the resin-bonded grinding wheel 1A can be improved, and the life of the resin-bonded grinding wheel can be extended. In addition, since the number of revolutions of the resin-bond grinding wheel 1A can be increased, the polishing efficiency of the object to be processed can be improved. In addition, when the object to be processed is polished using the resin-bond grinding wheel 1A, good polishing quality can be maintained. By using a plant-like fibrous member 7 having high hydrophilicity (for example, cellulose nanofibers), these effects are more remarkable.

Second, by including the bio-derived fibrous member 7 in the resin-bond grinding wheel 1A, the mechanical strength such as elastic modulus, bending strength, and tensile strength of the resin-bond grinding wheel 1A is increased. Accordingly, when the plate-shaped member is polished using the resin-bond grinding wheel 1A, vibration, tortuousness, and distortion of the resin-bond grinding wheel 1A can be reduced, and thus the life of the resin-bond grinding wheel 1A can be extended. This effect is particularly noticeable when cutting a plate-shaped member using a thinly formed resin-bonded grinding wheel 1A. With. In addition, since the vibration, tortuosity, deformation, and the like of the resin-bond grinding wheel 1A can be suppressed, good polishing quality (cutting quality) can be maintained.

In addition, the increase in the mechanical strength of the resin-bond grinding wheel 1A can further reduce the thickness of the resin-bond grinding wheel 1A. This makes it possible to reduce the width of the kerf of the cut to be processed. Therefore, the number of products (acquisitions) produced from one processing object can be increased.

In addition, even when the thickness of the resin bond grinding wheel 1A is reduced, the outer diameter of the resin bond grinding wheel 1A can be increased by increasing the mechanical strength of the resin bond grinding wheel 1A, thereby obtaining the following effects. First, the life of the resin-bonded grinding wheel 1A can be extended. Next, as the peripheral speed of the resin-bonded grinding wheel 1A increases, the grinding efficiency of the resin-bonded grinding wheel 1A to the processing object can be improved. Then, a processing object having a large thickness can be completely ground (cut) in the thickness direction. Examples of processing objects with a large thickness include resin-encapsulated power control semiconductor elements (ICs, transistors, etc.), ICs for internal combustion engine control, ICs for motor control, ICs for drive system control, or brakes for conveying equipment. A post-package substrate such as a system control IC.

Third, the resin-bonded grinding wheel 1A includes a bio-derived fibrous member 7 having high hydrophilicity, thereby increasing the moisture contained in the peripheral surface portion 4 and the side surface portion 3 of the resin-bonded grinding wheel 1A. Therefore, since the cooling effect of the resin-bond grindstone 1A and the object to be processed is enhanced by this moisture, heat accumulation due to processing can be reduced. Because of these effects, when the object to be processed is ground using the resin binder grinding wheel 1A, the grinding ability of the resin binder grinding wheel 1A can be improved, and the life of the resin binder grinding wheel 1A can be extended. In addition, good polishing quality can be maintained.

Fourthly, by including the fibrous member 7 in the resin-bond grinding wheel 1A, the surface of the peripheral surface 4 and the surface of the side 3 of the resin-bond grinding wheel 1A are sequentially processed along with the grinding process of the resin-bond grinding wheel 1A. The plurality of fibrous members 7 (including a part of the fibrous members 7) are detached. When the plant-like fibrous member 7 having high hydrophilicity is used, it is estimated that the block-like portion including the plurality of fibrous members 7 and the resin portion 5 entangled with each other may fall off. Thus, on the periphery New abrasive grains 6 tend to appear on the surface of the portion 4 and the surface of the side portion 3. Therefore, since the new abrasive grains 6 easily replace the worn abrasive grains 6 and contribute to the polishing, the polishing efficiency of the processing target is improved. In addition, when the object to be processed is polished using the resin-bond grinding wheel 1A, good polishing quality can be maintained.

When the resin-bonded grinding wheel 1A is used as a cutting wheel, air holes 8 may be formed in the resin portion 5. By forming the pores 8, the inside of the resin-bond grinding wheel 1A can be made porous. By forming the air holes 8, the following effects can be obtained. First, the chips easily enter the inside of the air holes 8 during cutting of the processing object. This makes it difficult for the abrasive grains 6 on the surface of the resin-bond grinding wheel 1A to accumulate chips. Therefore, clogging of the mesh of the grinding wheel due to chips can be suppressed.

Second, the processing water easily enters the inside of the air hole 8. The processing water entering the air holes 8 suppresses the surface temperature of the resin-bond grinding wheel 1A from rising during the grinding process of the processing object. Therefore, it is possible to further reduce the frictional heat generated between the surface of the peripheral surface portion 4 and the side surface portion 3 of the resin-bond grinding wheel 1A and the processing object. The air hole 8 is particularly useful when rough cutting a processing object.

When the resin-bonded grinding wheel 1A is used as a cutting wheel, aggregate may be added to the resin portion 5. When the thickness of the resin-bonded grinding wheel 1A is thin, the strength of the resin-bonded grinding wheel 1A is increased by adding aggregate. As the aggregate, materials such as tungsten carbide (WC), alumina (Al ₂ O ₃ ), or silicon carbide (SiC) can be used. Depending on the purpose, the resin bond grinding wheel 1A may contain other additives. As other additives, materials such as carbon black or a silane coupling agent can be used.

(Example 2)

(Manufacturing method of resin bond grinding wheel)

Referring to FIG. 1b and FIGS. 2a to 2e, a method of manufacturing the resin-bond grinding wheel 1A and the resin-bond grinding wheel according to the first embodiment of the present invention will be described. The manufacturing conditions described in this application are examples. The manufacturing conditions in the manufacturing method of a resin bond grinding wheel are not limited to the manufacturing conditions described in this application.

First, the abrasive grains 6 shown in FIG. 1b, a fibrous member (for example, cellulose nanofiber) 7 derived from a living body, and a resin material are prepared. If necessary, other additives including aggregates may be prepared. The resin material is preferably powdery, granular, or liquid at normal temperature. The resin material is a synthetic resin, for example, a thermosetting resin containing a phenol resin, an epoxy resin, or a polyimide resin as a main material.

Next, the abrasive particles 6, the fibrous member 7, the aggregate, other additives, and the resin material were measured. The grit 6, the fibrous member 7, the aggregate, other additives, and the resin material, which were measured separately, were pulverized with a mash crusher and mixed at the same time. After that, using a kneader, these materials are kneaded while applying a shearing force to the abrasive grains 6, the fibrous member 7, the aggregate, other additives, and the resin material. As a result, the abrasive particles 6, the fibrous member 7, the aggregate, and other additives are mixed into the resin material. It is preferable to prepare the mixed material by mixing the abrasive particles 6, the fibrous member 7, the aggregate, other additives, and the resin material as uniformly as possible. The mixed material is dried. After that, a plate-like mixed material is prepared by rolling the mixed material. In order to perform appropriate rolling, a solvent such as alcohol may be appropriately added to the kneaded material (kneaded product), and after further kneading, appropriate drying may be performed to adjust the hardness of the kneaded product.

Next, a plate-shaped mixed material 9A having a circular hole 2 as shown in Figs. 2a and 2b is prepared by punching the plate-shaped mixed material. Figures 2a and 2b show a plan view and a front view of the disc-shaped mixed material 9A, respectively. The disc-shaped mixed material 9A includes a circular hole 2, a side surface portion 3, and a peripheral surface portion 4. The disc-shaped mixed material 9B is a raw material of the resin-bond grinding wheel 1B according to another embodiment of the present invention (Example 4 described later), and has a component different from that of the mixed material 9A.

Next, as shown in Fig. 2c, a set of molding dies 10 is prepared. The molding die 10 includes a lower die 11 and an upper die 12. The material for forming the mold 10 may be a metal material made of tool steel or the like, or may be a ceramic material. The molding die 10 can be constructed by coating a base material composed of a metal-based material or a ceramic-based material with a ceramic-based material containing yttrium oxide (Y ₂ O ₃ ).

The lower mold 11 is provided with a recessed portion 13 for accommodating a disc-shaped mixed material 9A. On the inner bottom surface of the lower mold 11 constituting the bottom surface of the recessed portion 13 of the lower mold 11, a circular hole 2 corresponding to the mixed material 9A is provided. Of upward convex portion 14. A lower surface (lower surface) of the upper mold 12 is provided with a downward-facing convex portion 15 corresponding to the planar shape of the mixed material 9A.

Next, as shown in FIG. 2C, the disc-shaped mixed material 9A is housed in the molding die 10. FIG. 2C shows an example in which two disk-shaped mixed materials 9A are accommodated in the mold 10. A plurality of disc-shaped mixed materials 9A may be accommodated in the depth direction of the drawing (for example, three in each row in the depth direction of the drawing). In this case, six (= 2 × 3) resin-bond grinding wheels 1A can be manufactured together by using a set of molding dies 10 through a single molding process. It is also possible to set a larger number that can be manufactured together through a single molding process.

Next, in the state shown in Fig. 2c, the lower mold 11 and the upper mold 12 are clamped. The disc-shaped mixed material 9A is sandwiched by the inner bottom surface of the lower mold 11 in the recessed portion 13 and the lower surface of the downward convex portion 15 in the upper mold 12.

Next, the heating furnace 16 shown in FIG. 2d is prepared. Hereinafter, the structure of the heating furnace 16 is demonstrated.

The heating furnace 16 includes a peripheral portion 17 and a heating portion 18. In addition, the heating furnace 16 includes a table 19 for placing the molding die 10, a support section 20 for supporting the table 19, and a lifting section 21 for lifting and lowering the support section 20. The stage 19 is preferably constructed of a material having high thermal conductivity (for example, a metal-based material). The support portion 20 is preferably made of a material having low thermal conductivity (for example, a cement-based material). The heater 18 is provided with a plurality of heaters 22. In Fig. 2d, a plurality of tubular heaters 22 are shown as an example. As the heater 22, a heater heated by electromagnetic induction can be used.

The heating portion 18 has a lid-like shape having an opening 23 below. A baffle (not shown) for opening and closing the opening 23 is preferably provided in the heating furnace 16. As the elevating portion 21 rises and lowers, the stage 19 supported by the supporting portion 20 advances and retreats with respect to the internal space of the heating portion 18 through the opening 23 of the heating portion 18.

Next, in the heating furnace 16 shown in FIG. 2d, the table 19 and the support portion 20 are positioned below the opening 23 by the lowering of the lifting portion 21. By supplying power to the plurality of heaters 22, the internal space of the heating section 18 is heated to a predetermined temperature (for example, 150 ° C. to 160 ° C.).

Next, as shown in FIG. 2D, the molding die 10 containing the two disk-shaped mixed materials 9A is stored in the heating furnace 16. Specifically, first, a molding die 10 containing two disc-shaped mixed materials 9A is placed on a table 19 supported by a support portion 20.

Next, as shown in FIG. 2d, the forming mold 10 is caused to enter the internal space of the heating portion 18 using the lifting portion 21, and the molding mold 10 is further pressed against the upper member 24 of the heating portion 18. The lifting die 21 is used to press the molding die 10 against the upper member 24 of the heating section 18 at a constant pressure, and this state is maintained. The heat generated by the heating portion 18 is transmitted to the two disc-shaped mixed materials 9A through the molding die 10. In this state, while pressing the two disc-shaped mixed materials 9A with a predetermined pressure (for example, 800 kgf / cm ² ), the two disc-shaped materials are heated at a predetermined temperature (for example, 155 ° C.). Mixed material 9A. In a series of processes, the stage 19 functions as a heat conducting member, and the support portion 20 functions as a heat insulating member.

Next, the state shown in FIG. 2d is maintained at a predetermined temperature (for example, 155 ° C) for a predetermined time (for example, 3 to 5 minutes). Thereby, the resin material contained in the two disk-shaped mixed materials 9A is hardened, and the resin portion 5 made of hardened resin is molded (see FIG. 1b).

Next, in the state shown in FIG. 2d, the mold 10 is taken out from the internal space of the heating section 18 using the lifting section 21 and below the heating section 18. The removed molding die 10 is transferred to a processing chamber (not shown). The processing chamber may be provided inside the heating furnace 16 or may be provided outside the heating furnace 16.

Next, the molding die 10 containing the two disk-shaped mixed materials 9A is left at a suitable processing temperature of 200 ° C. or lower and a predetermined atmosphere for a predetermined time. For example, after the molding die 10 is left at the processing temperature of 180 ° C for two hours, it is left at the processing temperature of 200 ° C for one hour. By performing the heat treatment (post-hardening) in this manner, the resin contained in the disc-shaped mixed material 9A is sufficiently performed. A hardening reaction in which a material hardens. A resin binder grinding wheel 1A is prepared by hardening a resin material contained in the disc-shaped mixed material 9A to mold a hardened resin (see FIG. 2e).

As the atmosphere during the heat treatment, the following atmospheres can be used. In a case where the processing temperature is within a temperature range in which the resin material of the structural resin portion (hardened resin) 5 (see FIG. 1b) deteriorates, an inert gas (for example, nitrogen) atmosphere (inert atmosphere) may be used. In this case, a low-oxygen atmosphere (a reduced-pressure atmosphere) may be used. When the processing temperature is not included in the temperature range in which the resin material of the structural resin portion 5 is deteriorated, an atmospheric atmosphere may be used.

Next, the molding die 10 in which two resin-bond grinding wheels 1A are housed is taken out and placed from the processing chamber. Thereby, the molding die 10 and the two resin-bond grinding wheels 1A housed inside the molding die 10 are naturally cooled. The low-temperature gas for cooling may be blown to the molding die 10 outside the processing chamber. As a result, the mold 10 and the two resin-bond grinding wheels 1A housed inside the mold 10 can be forcedly cooled. Therefore, the manufacturing time of the resin-bond grinding wheel 1A can be shortened.

Next, as shown in FIG. 2e, the lower mold 11 and the upper mold 12 are opened. The two resin-bond grinding wheels 1A are taken out of the two recessed portions 13 provided in the lower mold 11. Finishing (mechanical processing such as grinding or grinding) may be performed on each resin-bond grinding wheel 1A as necessary. For example, the peripheral surface portion 4 and the inner peripheral portion (outer portion of the circular hole 2) of the resin bond grinding wheel 1A shown in FIG. With the processes so far, two resin-bonded grinding wheels 1A are finally completed.

(Effect)

According to the manufacturing method of the resin bond grinding wheel which concerns on Example 2, the resin bond grinding wheel 1A which concerns on Example 1 can be manufactured. By setting the mold 10 to a multi-cavity ) Structure, a plurality of resin-bond grinding wheels 1A can be manufactured together through a single molding process.

In addition, the heating furnace 16 is provided with a lifting portion 21 that advances and retreats with respect to the internal space of the heating portion 18 through the opening 23 of the heating portion 18. Thereby, it is possible to realize the production of the resin binder Automation of the simultaneous pressurization and heating process for the grinding wheel 1A. About these effects. The same applies to other embodiments related to the method for manufacturing a resin-bonded grinding wheel.

In the method for manufacturing a resin-bond grinding wheel according to Example 2, a disc-shaped hybrid material 9A having a circular hole 2 was used. Instead of this, a disc-shaped hybrid material having no circular hole 2 may be used. In this case, the circular hole 2 is formed by machining a disk-shaped molded article that is hardened by heating while pressing. This point is the same in other embodiments.

(Example 3)

The overall structure of the resin-bond grinding wheel 1B according to Example 3 of the present invention is the same as that of the resin-bond grinding wheel 1A according to Example 1. Therefore, descriptions regarding the overall structure of the resin-bonded grinding wheel 1B are omitted.

The microstructure of the resin-bond grinding wheel 1B will be described with reference to Fig. 1c. As shown in FIG. 1c, the resin-bond grinding wheel 1B includes a resin portion 5 made of a hardened resin, abrasive grains 6, and a fibrous member 7 (for example, cellulose nanofiber) derived from a living body. The resin binder grinding wheel 1B is the same as the resin binder grinding wheel 1A in terms of the material types of the resin binder grinding wheel 1B.

In the resin-bond grinding wheel 1B, the ratio (blending ratio) of the fibrous member 7 is preferably 30% by volume or more. This is because when the blending ratio of the fibrous member 7 is less than 30% by volume, it is difficult to mix the fibrous member 7 and the fibrous member 7 by copying out the abrasive grains 6 in the method for manufacturing a resin-bonded grinding wheel (Example 4 described later). A disk-shaped mixed material is prepared by mixing the materials into a solvent.

In the resin bond grinding wheel 1B, the blending ratio of the fibrous member 7 is preferably 80% by volume or less. When a mixed material having a blending ratio of the fibrous member 7 of more than 80% by volume is used, the blending ratio of the abrasive grains 6 included in the resin-bond grinding wheel is reduced. For this reason, the resin-bonded grinding wheel 1B is not effective because it is less efficient in polishing the object to be processed.

According to the resin-bond grinding wheel 1B according to Example 3, the same effects as those obtained by the resin-bond grinding wheel 1A can be obtained. In addition, for the following reasons, The various effects obtained by 1B are larger than those obtained by the resin-bond grinding wheel 1A. In the resin-bond grinding wheel 1B, the blending ratio of the fibrous member 7 is 30% by volume or more and 80% by volume or less. In the resin-bond grinding wheel 1A, the blending ratio of the fibrous member 7 is 0.5% by volume or more and 30% by volume or less. Compared with the resin-bonded grinding wheel 1A, the resin-bonded grinding wheel 1B has a larger blending ratio value of the fibrous member 7. Therefore, various effects obtained by the resin-bond grinding wheel 1B are larger than those obtained by the resin-bond grinding wheel 1A.

(Example 4)

A manufacturing method of the resin-bond grinding wheel for manufacturing the resin-bond grinding wheel 1B according to the third embodiment of the present invention will be described with reference to FIGS. The process from preparation of the abrasive grains 6, bio-derived fibrous components (for example, cellulose nanofibers) 7 and resin materials to the measurement of these materials is the same as in the case of Example 2.

Next, a mixed material is prepared by dissolving the abrasive grains 6 and the fibrous member 7 in a solvent. In other words, a mixed material is prepared by dissolving a material other than the resin material in a solvent. It is preferable to prepare the mixed material by mixing the abrasive grains 6 and the fibrous member 7 as uniformly as possible. As the solvent, an aqueous solvent, an alcohol solvent, or the like can be used. As a material dissolved in a solvent, a binder and a dispersant may be added, and a small amount of a powdery resin material may be added. In the prepared mixed material, the ratio (blending ratio) of the fibrous member 7 is preferably 30% by volume or more and 80% by volume or less. In the prepared mixed material, the fibers of the fibrous member 7 are in a state of being entangled with materials such as the abrasive grains 6 and the adhesive.

Next, the prepared mixed material was copied. In this process, a machine having the same function as a papermaking machine is used. Thereby, the mixed material is molded into a circle. A disk-shaped mixed material is prepared by drying the mixed material shaped into a circle.

Next, a resin impregnating machine was used to impregnate a fluid resin (resin material having fluidity) into the disc-shaped mixed material. In this process, it is preferable to adjust the space included in the disc-shaped mixed material. Reduce the pressure. Thereby, the fluid resin was immersed in the disc-shaped mixed material to prepare a disc-shaped mixed material.

Next, as shown in FIG. 2C, the disc-shaped mixed material 9B is accommodated in the molding die 10. Since the following processes are the same as those described in Example 2, descriptions related to these processes are omitted.

According to the manufacturing method of the resin bond grinding wheel which concerns on Example 4, the resin bond grinding wheel 1B which concerns on Example 3 can be manufactured. In addition, the same effects as those obtained by the method for manufacturing a resin-bond grinding wheel according to Example 2 can be obtained.

(Example 5)

(Structure of processing device)

A processing device according to a fifth embodiment of the present invention will be described with reference to FIGS. 3a to 3c. The processing apparatus shown in FIGS. 3a to 3c is a processing apparatus that grinds (completely cuts the processing target) all parts in the thickness direction of the processing target using the peripheral surfaces of the resin-bond grinding wheels 1A and 1B. Therefore, as the resin bond grinding wheel, a thin resin bond grinding wheel can be used.

The processing device 25 has at least a receiving module 26, a functional module 27 having a grinding function, and a sending module 28. The receiving module 26, the function module 27, and the sending module 28 are arranged along the X direction shown in FIG. 3a and are fixed to each other.

The receiving module 26 and the function module 27 can be attached and detached. The functional module 27 and the sending module 28 can be attached and detached. The other functional modules can be attached to and detached from the functional module 27. Therefore, first, other functional modules can be attached and detached between the receiving module 26 and the functional module 27. Second, other function modules can be attached and detached between the function module 27 and the sending module 28.

The receiving module 26 receives a processing object 29 from the outside of the processing device 25. The function module 27 polishes the processing object 29 received by the receiving module 26. The function module 27 can perform local grinding of the processing object 29 in the thickness direction and complete grinding (cutting) of the processing object 29 in the thickness direction. (Off) These two grinds. In this case, an example is shown in which the processing object 29 is completely ground (cut) in the thickness direction and the processing object 29 is singulated.

The sending module 28 receives a product group 30 from the function module 27, and the product group 30 is an assembly of the product P prepared by singulating the processing object 29. The product group 30 is stored in a tray 31. The tray 31 containing the product group 30 is sent out to the outside of the processing device 25. A camera 32 for optically inspecting each product P may be provided in the delivery module 28.

The function module 27 includes a spindle (rotation mechanism) 33. The mandrel 33 includes a servo motor 35 that holds a rotation shaft 34. Either a resin-bond grinding wheel 1A or a resin-bond grinding wheel 1B is mounted on the rotation shaft 34. The resin-bond grinding wheels 1A and 1B rotate in a plane including the Y direction and the Z direction in the figure.

The functional module 27 includes a table (fixing mechanism) 36 as a table on which the processing object 29 is fixed. As an example of a mechanism for temporarily fixing the processing object 29, an adhesive sheet adhered to the upper surface of the table 36 can be used.

The function module 27 includes a rotating portion 37 for rotating the table 36. The table 36 is attached to the rotating portion 37. A motor (not shown) including, for example, a direct drive motor (DD motor) is provided below the rotating portion 37. The rotating portion 37 is fixed to a rotating shaft of the motor. By the rotation of the DD motor, the table 36 mounted on the rotating portion 37 rotates in the θ direction.

The function module 27 includes a moving mechanism 38 for relatively moving the table 36 and the spindle 33. The function module 27 includes, for example, a servo motor 39, a ball screw 40 connected to a rotation shaft of the servo motor, and a ball nut (not shown) meshed with the ball screw 40. The moving mechanism 38 is mounted on a ball nut. By driving the servo motor, the table 36 moves in the Y direction. By moving the table 36 and the spindle 33 relatively, the processing object 29 is polished.

The processing device 25 includes a control unit CTL. The control unit CTL is provided in the receiving module 26. The control section CTL may be provided in another module. The control unit CTL controls at least the resin bond grinding wheel 1A Or the rotation direction and number of rotations of the resin-bonded grinding wheel 1B, and the relative movement direction and movement speed between the table 36 and the mandrel 33 (the movement includes rotation. The same applies hereinafter).

A functional module having a specific function can be attached and detached between the receiving module 26 and the functional module 27 or between the functional module 27 and the sending module 28. The specific functions are cleaning, drying, measurement or inspection of the product P for the product group 30 in addition to the above-mentioned grinding. The specific function may be grinding or cutting (hereinafter referred to as “cutting or the like” as appropriate) the processing object 29 before polishing or the processing object (product group 30 as an assembly of product P) after polishing. The function module may perform at least one of these multiple functions. The receiving module 26, the function module 27, and the sending module 28 may also be included in the function module.

The specific function may be a grinding function using a mechanism other than the resin-bond grinding wheels 1A and 1B. By using a polishing mechanism having these polishing functions, for example, polishing by a water jet, polishing by sandblasting using abrasive grains, and the like can be performed.

When the specific function is cutting or the like, cutting with a rotary grinding wheel, cutting with a wire saw, cutting with laser, or the like can be performed. By combining these cutting mechanisms and the resin-bond grinding wheels 1A and 1B, the machining object 29 can be cut along a line formed by combining line segments and curves. Such cutting and the like are useful when manufacturing a product having a shape composed of a line segment and a curve, such as an SD memory card.

Fig. 3b shows a functional module 41 having a cleaning function and a drying function. The function module 41 is preferably inserted and installed between the function module 27 and the sending module 28.

The functional module 41 includes a washing and drying mechanism 42. The washing and drying mechanism 42 includes a washing section 43 and a drying section 44. The cleaning unit 43 is provided with a cleaning liquid spraying mechanism for spraying a cleaning liquid. The cleaning unit 43 may be provided with a scrubbing mechanism that wipes the upper surface of the product group using a sponge containing a cleaning solution. The cleaning unit 43 may be provided with a spraying mechanism and a scrubbing mechanism in parallel. In the dry section 44 A gas injection mechanism for injecting a cleaning gas is provided therein. The function module 41 shown in FIG. 3b has an inspection function of the camera 32 in addition to the cleaning function of the cleaning section 43 and the drying function of the drying section 44.

Fig. 3c shows a functional module 45 having a polishing function, which is different from the functional module 27 having a polishing function. The functional module 45 is inserted and installed between the receiving module 26 and the functional module 27 or between the functional module 27 and the sending module 28. In order to shorten the cutting time in the functional module 27, it is preferable to insert and install a functional module 45 between the receiving module 26 and the functional module 27. According to this configuration, the processing object 29 is thinned by grinding in the function module 45 and then singulated by cutting in the function module 27.

The function module 45 is provided with a polishing mechanism 46. The polishing mechanism 46 includes a rotatable grinding wheel 47. The grinding wheel 47 is the same wheel as the resin-bond grinding wheels 1A and 1B. The grinding wheel 47 may be a grinding wheel that grinds the object 29 using the side portion 3. By using the rotating grinding wheel 47 included in the polishing mechanism 46, the upper surface of the encapsulation resin included in the substrate after encapsulation, or the upper surface of a semiconductor wafer or the like can be polished. Thereby, the product P which consists of an electronic component etc. can be made thin. The function module 45 may be provided with a thickness measurement mechanism 48. During or after the grinding process, the displacement sensor 49 of the thickness measuring mechanism 48 can be used to measure the height direction (Z direction) of the upper surface of the packaging resin to be polished or the upper surface of the semiconductor wafer. position. The function module 45 has both the grinding function of the grinding wheel 47 and the thickness measurement function of the displacement sensor 49.

The function module 27 shown in FIG. 3c may have a polishing function. The functional module 45 is inserted and installed between the receiving module 26 and the functional module 27 or between the functional module 27 and the sending module 28. The grinding module installed in the receiving module 26 performs rough grinding, and the grinding module installed in the sending module 28 performs fine grinding. The resin-bond grinding wheels 1A and 1B used at this time may be grinding wheels that grind the processing object 29 using the side surface portion 3.

(Effect)

The processing device 25 according to the fifth embodiment uses any one of the resin-bond grinding wheel 1A or the resin-bond grinding wheel 1B to grind the processing object 29. Therefore, the same effects as those described in the first embodiment can be obtained.

In addition, according to the processing device 25 according to the fifth embodiment, the following effects can be obtained. First, after the processing device 25 is manufactured or after the processing device 25 is installed in a user's factory, a functional module having a polishing function can be added to the processing device 25 afterwards as needed. After the user starts using the processing device 25, a functional module having a polishing function may be added to the processing device 25 afterwards. Therefore, the ability to polish the processing object 29 in the processing device 25 can be increased afterwards.

Second, after the processing device 25 is manufactured or after the processing device 25 is installed in a user's factory, a functional module having functions other than polishing can be added to the processing device 25 afterwards as needed. After the user starts using the processing device 25, a functional module having functions other than polishing may be added to the processing device 25 afterwards. Therefore, functions other than polishing in the processing device 25 can be added to the processing device 25 afterwards.

In addition, the processing objects 29 described in the embodiments 1 to 5 described so far include a circuit board in which a plurality of grid-shaped regions each containing a circuit are formed. The circuit board may be a semiconductor wafer made of silicon, silicon carbide, or the like. These processing objects have a substantially circular planar shape.

The processing object 29 includes a semiconductor wafer in which a plurality of grid-shaped regions each containing a circuit are formed, and one side of the semiconductor wafer is encapsulated with a resin. Protruded electrodes, electrical wiring, and the like may be formed on one surface of the semiconductor wafer.

The processing object 29 includes a plate-shaped member in which a plurality of regions each having a function of a grid shape are formed. The plate-shaped member may be a plate-shaped member in which a microlens array is formed in each of a plurality of regions. The plate-shaped member may be a plate-shaped member in which a light guide plate is formed in each of a plurality of regions. In these cases, the respective regions have functions such as optical functions of condensing, diffusing, and guiding light.

The packaged substrate, which is an example of the processing object 29, includes: a circuit board; a plurality of wafer-shaped components mounted in a plurality of grid-shaped regions of the circuit board; and a packaging resin to cover the plurality of regions together. Formed into a plate shape. The circuit board includes a lead frame made of copper, an iron-based alloy, or the like, and a printed substrate (printed wiring board) using a glass epoxy laminate or a copper-clad polyimide film as a base material. The circuit board includes a ceramic substrate based on alumina, silicon carbide or sapphire, a metal-based substrate based on a metal such as copper or aluminum, a film-based substrate based on a polyimide film, and the like.

The overall shape of the packaged substrate as an example of the processing object 29 is typically a plate shape (flat plate shape) when an IC, a surface mount transistor, or a surface mount capacitor is manufactured. Not limited to this, the overall shape of the resin package may be a shape having a plurality of protrusions functioning as a convex lens when the optical semiconductor element is manufactured, or the like.

Wafer-like components include wafer-like, semiconductor integrated circuit (IC), optical semiconductor components, transistors, diodes, crystal oscillators, filters, capacitors, inductors, resistors, thermistors, and Electronic components such as sensors. The wafer-shaped component includes a mechanical component such as a micro electro mechanical system (MEMS: Micro Electro Mechanical Systems). One wafer-shaped component may be mounted in one area in the substrate, or a plurality of wafer-shaped components may be mounted. The plurality of wafer-shaped components mounted in one area may be the same type or different types. As the sealing resin, for example, a hardened resin hardened by a resin binder such as an epoxy resin or a silicone resin can be used.

In each embodiment, the table 36 is moved in the X, Y, and Z directions in the figure. Instead of this, the mandrel 33 on which the resin-bond grinding wheels 1A and 1B are mounted may be moved in the X direction, the Y direction, and the Z direction in the drawing. In addition, both the table 36 and the mandrel 33 can be moved in the X direction, the Y direction, and the Z direction in the figure. According to these forms, the table 36 and the mandrel 33 can be relatively moved in the X direction, the Y direction, and the Z direction.

The speed of the relative movement of the table 36 and the mandrel 33 in the X direction, the Y direction, and the Z direction may also be changed according to the material of the structure processing object 29 or the combination of the materials of the structure processing object 29.

As a method of temporarily fixing the processing object 29 on the table 36, the processing object 29 can be adsorbed on the upper surface of the table 36 without using tape. In this case, a groove for accommodating the peripheral surface portion 4 of the resin-bond grinding wheels 1A, 1B is formed on the upper portion of the table 36 so as to overlap the respective boundary lines of the portion to be cut in a plan view.

In the embodiments described so far, the plant-derived fibrous member 7 containing cellulose was used as the bio-derived fibrous member 7 mixed into the resin portion 5 made of hardened resin. An animal-derived fibrous member 7 having hydrophilicity may be used instead of a plant-derived fibrous member as the biologically-derived fibrous member 7. In other words, in the resin-bonded grinding wheels 1A and 1B, the fibrous member may be a fibrous member derived from an animal.

As an example of the animal-derived fibrous member 7 mixed into the resin portion 5 made of a hardened resin, a material containing chitin or chitosan may be mentioned. Chitin or chitosan is a natural polysaccharide contained in many organisms, such as crab or shrimp crustaceans or squid organs (see the website of Sugiye Machinery Co., Ltd.). According to the manufacturing method explained so far, the resin-bond grinding wheel similar to the resin-bond grinding wheel 1A, 1B demonstrated in Example 1, 3 can be manufactured using the animal-derived fibrous member 7.

The invention is not limited to the embodiments described above. Within the scope not departing from the gist of the present invention, the present invention may be arbitrarily and appropriately combined to change or selectively adopt each constituent element as necessary. For example, a configuration in which two spindles (rotating mechanisms) 33 are combined with one table 36 in the functional module 27 of the processing device 25 may be adopted. It is also possible to construct a grinding mechanism by combining one mandrel (rotation mechanism) 33 with one table 36, and a plurality of sets (for example, two groups) of grinding mechanisms may be provided in one function module 27 of one processing device 25.

The shape of the resin-bond grinding wheel is not limited to a disc shape. After preparing a plurality of resin-bond grinding wheels having an elongated rectangular parallelepiped shape, a plurality of resin-bond grinding wheels may be mounted along the outer periphery of the disc-shaped rotating jig. The object to be processed is ground by rotating the rotary jig in a state where the object to be processed is in contact with the resin-bond grinding wheel. In a state where the resin-bond grinding wheel having a rectangular parallelepiped shape is in contact with the processing object, the resin-bonding grinding wheel and the processing object may be relatively moved by a manual operation by an operator.

The glass fiber in the single fiber described in Patent Document 1 has been pointed out that it may have an adverse effect on the human body (for example, refer to Japanese Patent Publication No. Hei 3-287381, page 2, upper left column, line 16 to upper right column, line 5 ). The resin-bond grinding wheel according to the present invention includes a bio-derived fibrous member instead of glass fiber. Therefore, it is presumed that the possibility that the present invention has an adverse effect on the human body is small.

Claims (15)

A resin-bond grinding wheel includes: a hardened resin formed by mixing abrasive grains, bio-derived fibrous components, and a solvent to prepare a mixed material; and drying the mixed material by making the material fluid The resin material is impregnated into the mixed material to prepare an impregnated material; and the impregnated material is charged into a molding die and heated while the impregnated material is pressurized; the abrasive grains are mixed into the hardened resin; and The fibrous member of the living body is mixed into the hardened resin. The resin-bond grinding wheel according to item 1 of the application, wherein an aggregate is further mixed in the mixed material, and the resin-bond grinding wheel further has the aggregate mixed into the hardened resin. The resin-bond grinding wheel according to item 1 of the patent application scope, wherein the ratio of the fibrous member contained in the resin-bond grinding wheel is 30% by volume or more and 80% by volume or less. The resin-bonded grinding wheel according to any one of claims 1 to 3, wherein the fibrous component is derived from plants. The resin-bonded grinding wheel according to item 4 of the patent application scope, wherein the fibrous member comprises cellulose. The resin-bonded grinding wheel according to any one of claims 1 to 3, wherein the fibrous member is derived from an animal. The resin-bonded grinding wheel according to item 6 of the patent application scope, wherein the fibrous member comprises chitin or chitosan. A method for manufacturing a resin-bonded grinding wheel includes the following processes: preparing a mixed material by mixing abrasive grains, bio-derived fibrous parts, and a solvent; and after drying the mixed material, making a resin material having fluidity The impregnated material is impregnated into the mixed material to prepare an impregnated material; the impregnated material is loaded into a molding die and the impregnated material is heated while being pressed; and a hardened resin is formed by hardening the resin material. The method for manufacturing a resin-bonded grinding wheel according to item 8 of the scope of patent application, wherein in the process of preparing the mixed material, the ratio of the fibrous member contained in the mixed material is set to 30% by volume or more and 80%. Volume% or less. The method for manufacturing a resin-bonded grinding wheel according to item 8 or item 9 of the scope of patent application, wherein the fibrous component is derived from plants. The method for manufacturing a resin-bonded grinding wheel as described in claim 8 or claim 9, wherein the fibrous member is derived from an animal. A processing device uses a resin-bond grinding wheel according to any one of claims 1 to 3 in the scope of patent application to grind an object to be processed. The processing device according to item 12 of the scope of patent application, comprising: a rotation shaft to which the resin-bond grinding wheel is fixed; a rotation mechanism for rotating the rotation shaft; a fixing mechanism for fixing the processing object to the fixing A mechanism; and a moving mechanism for relatively moving the rotating mechanism and the fixed mechanism. The processing device according to item 12 of the patent application scope, wherein the resin bond grinding wheel has a peripheral surface portion and a side portion, and the processing device performs relative processing on the processing object by relatively moving the processing object and the resin bonding wheel Any of the following processes: (1) grinding using the side surface; (2) grinding using the peripheral surface; (3) groove formation using the peripheral surface; and (4) cutting using the peripheral surface Off. The processing device according to item 12 of the scope of patent application includes: a functional module having at least the rotating shaft, the rotating mechanism, the fixed mechanism, and the moving mechanism, the functional module having a grinding function; and a control unit, at least Controls the operation of the functional module. The functional module can be attached to and detached from other functional modules with a specific function. The specific function includes at least one of cutting, cleaning, drying, measuring, inspecting, and grinding.