KR20180109673A - Resinoid grinding wheel, method for manufacturing resinoid grinding wheel, and processing device - Google Patents

Abstract

Hydrophilic property of a resinoid grindstone is increased by incorporating a fibrous member derived from a biocomponent into a cured resin. The resinoid grindstones (1A, 1B) comprise: a resin portion (5), the cured resin modeled by curing a resin material; an abrasive grains (6) incorporated into the resin unit (5); and cellulose nanofiber (CNF) which is a fibrous member (7) derived from the biolcomponent mixed into the resin unit (5).

Description

Technical Field [0001] The present invention relates to a resinoid grinding wheel, a resinoid grinding wheel, a resinoid grinding wheel,

The present invention relates to a method for manufacturing a resinoid grindstone, a resinoid grindstone, and a machining apparatus.

As a conventional technique, for example, Patent Document 1 discloses a resin-bonded bicarbonate grind stone in which CBN particles or diamond particles are dispersed in a resin bond (the same meaning as a "resinoid grindstone" used in the present application) And a short fiber is provided in the vicinity of the outer surface of the particle. As the short fibers, for example, those having a fiber (fiber) structure such as glass fiber, carbon fiber and various kinds of whiskers have been disclosed (for the above, see column 2, left column, lines 7 to 16 of Patent Document 1).

Japanese Patent Application Laid-Open No. 4-87776

The resin-bonded-paper-based-lip grinding wheel disclosed in Patent Document 1 has the effect of suppressing the drop of the paper-based lips (see the upper left column in the third page of Patent Document 1, lines 5 to 8). Thus, the disclosed resin bonded lip grits have a long life. Resin Bond Grass Grindstone is required to have a longer life.

It is an object of the present invention to provide a method and apparatus for manufacturing a resinoid grindstone, a resinoid grindstone, and the like, which have been further improved in longevity.

In order to solve the above problems, a resinoid grindstone according to the present invention comprises a cured resin molded by curing a resin material, abrasive grains mixed in the cured resin, and a fibrous member derived from the organism mixed in the cured resin.

In order to solve the above problems, a method for producing a resinoid grindstone according to the present invention comprises the steps of: preparing a mixed material by mixing a fibrous member derived from abrasive grains and a biorhythm and a resin material; And a step of curing the resin material to mold the cured resin.

In order to solve the above problems, a method for producing a resinoid grindstone according to the present invention comprises the steps of: preparing a mixed material by mixing an abrasive grain and a fibrous member derived from a biomolecule and a solvent; A step of impregnating the resin material with the mixed material to produce an impregnation material; a step of filling the impregnation material into the mold to heat the impregnated material while pressurizing; and a step of molding the cured resin by curing the resin material.

In order to solve the above-described problems, a processing apparatus according to the present invention is a processing apparatus comprising a cured resin molded by curing a resin material, abrasive grains mixed in the cured resin, and a biocompatible fibrous member Polishing the workpiece using a grinding wheel.

According to the present invention, the life of the Resinoid grinding wheel is increased.

Fig. 1 (a) is a front view and a side view of a resinoid grindstone according to the present invention, and Figs. 2 (b) and 2 (c) are enlarged schematic views of part A shown in Fig.
2 is a schematic view showing a process for producing a resinoid grindstone according to the present invention in the order of steps.
Fig. 3 (a) is a schematic plan view showing a machining apparatus according to the present invention, and Figs. 3 (b) and 3 (c) are schematic plan views showing examples of function modules other than the polishing module.

(Example 1)

(Constitution of resinoid grindstone)

Referring to Fig. 1, the configuration of the resinoid grindstone according to the first embodiment of the present invention will be described. Resinoid grinding stone is a collective name of a grinding stone using resin (resin) as a binder (bond) which is one of the elements constituting a grinding stone. Resinoid grindstones are used for cutting, grinding and polishing according to their purpose. In the case of machining an object to be processed, a machining fluid such as machining water is usually supplied to a place to be machined.

In the present application document, the term "polishing" is used to mean "general term of grinding and polishing" (JIS Industrial Terms Encyclopedia, Fourth Edition, Japan Society for Standardization, November 20, 1995 533). The phrase " polishing a work piece " in the present application document is based on the phrase " polishing a part in the thickness direction of the object to be processed (cutting a part from the surface of the object to be processed) (Completely cutting the object to be processed) " in all directions in the thickness direction of the object.

1 (a) is a front view and a side view of a resinoid grindstone according to the present invention. The resinoid grindstone 1A is a resinoid grindstone according to Embodiment 1 of the present invention and the resinoid grindstone 1B is a resinoid grindstone according to another embodiment (to be described later) of the present invention.

All drawings in the present application document are drawn schematically, omitting appropriately or exaggeratingly, for the sake of easy understanding. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

As shown in Fig. 1 (a), the resinoid grindstone 1A has an outer shape of a disk-like (circular) shape and a circular hole 2 concentric with the circular shape. The rotary shaft (not shown) of the working device is inserted into the round hole 2. The resinoid grindstone 1A has side surfaces 3 on both sides and a peripheral surface portion 4. In the resinoid grind stone 1A, the outer side portion of the round hole 2 of the side surface portions 3 on both sides is sandwiched by two opposing jigs (not shown) ). By mutually screwing two opposing jigs, the resinoid grindstone 1A is fixed to the rotary shaft of the machining apparatus. In general, when the resinoid grindstone 1A is used for polishing, a resinoid grindstone having a large thickness t is used, and when the resinoid grindstone 1A is used for cutting, a small thickness t Is used.

The virtual center C of the resinoid grindstone 1A coincides with the center line of the rotation axis of the machining apparatus. The rotary shaft of the processing apparatus is connected to the rotary shaft of a motor (not shown) such as a servo motor. As the rotary shaft of the motor rotates, the rotary shaft of the working device rotates. As a result, the resinoid grindstone 1A fixed to the rotating shaft of the machining apparatus rotates at a constant number of revolutions (for example, 15,000 to 30,000 rpm). The peripheral surface portion 4 of the rotating resinoid grindstone 1A is brought into contact with the object to be processed, thereby grinding the object.

The microstructure of the resinoid grindstone 1A according to the first embodiment of the present invention will be described with reference to Fig. 1 (b). As shown in Fig. 1 (b), the resinoid grindstone 1A includes a resin part 5 made of a hardened resin, abrasive grains 6, and a fibrous member 7 derived from a biocide. In other words, the abrasive grains 6 and the fibrous members 7 derived from a biocide are dispersed (mixed) in the resin part 5 made of a cured resin to form the resinoid grindstone 1A. It is preferable that the resin part 5, the abrasive grains 6 and the fibrous member 7 derived from a biomaterial are evenly mixed. The pores 8 may be formed in the resin part 5 depending on the use of the resinoid grindstone 1A.

The resin part 5 is made of a thermosetting resin such as a phenol resin, an epoxy resin, a polyimide resin or the like.

The abrasive grains (6) are roughly classified into general abrasive grains and grass grains. As the general abrasive grains, for example, ceramics hard materials such as alumina-based and silicon carbide-based materials are used. As the grass grains, diamond, cBN (cubic boron nitride) or the like, which is a harder material than general grains, is used.

The fibrous member 7 derived from a living organism is, for example, a vegetable fibrous member having hydrophilic properties. The vegetable fibrous member 7 preferably comprises cellulose. It is more preferable that the fibrous member 7 is a cellulose nanofiber (CNF) having high hydrophilicity. Cellulose nanofiber means "nanofiber produced by mechanical fibrillation using cellulose contained in plant fiber as a raw material" ("Japan's first mass production and sale of biomass nanofibers!", "Online" Sekigayasu Sugino Machine, [Search September 16, 2016], Internet <URL: http://www.sugino.com/site/biomass-nanofiber/guidance.html>).

Cellulose nanofibers have the following characteristics (Table 3-2, March 17, 2016, "Issue No. 254-2 of the Month, Industry Research Division, Nippon Seisakusho Co., Ltd., Japan)" Table 2-3 Characteristics and Expectations of Cellulose Nanofibers Use).

(1) lightweight (one fifth of steel) and high strength (more than five times that of steel).

(2) Less heat distortion (about one-fiftieth of glass).

(3) The specific surface area is large (not less than 250 m 2 / g).

The cellulose nanofibers used in Example 1 have, for example, a value of the diameter and a length of the following diameter (diameter of the cross section perpendicular to the longitudinal direction). The diameter of the cellulose nanofiber is about 10 (several tens) to 200 nm in diameter, and the length is about 1 to 10 m or more. Therefore, the aspect ratio (length / diameter value) of the cellulose nanofibers to be used is several tens (several tens) to several hundred (several hundreds) or more.

1 (b) and 1 (c) show a state in which a part of the distal end of the fibrous member 7 in the resinoid grindstone 1A, 1B in a state where the dressing (blade raising) And shows a state protruding from the surface. In the interior of the resin part 5, portions extending from the respective fibrous members 7 protruding from the surface of the resin part 5 are entangled with each other. In the inside of the resin part 5, abrasive grains 6 are present between a plurality of fibrous members 7 entangled with each other. With this configuration, the mechanical strength of the Resinoid grindstone 1A, for example, the elastic modulus, the bending strength, the tensile strength, and the like, increases.

The abrasive grains 6 and the fibrous members 7 (for example, cellulose nanofibers) derived from the organism are dispersed in the resin part 5 made of the cured resin in the resinoid grindstone 1A according to the first embodiment Lt; / RTI &gt; Since the fibrous member 7 derived from the organism has hydrophilicity, moisture can be easily maintained near the surface of the peripheral surface portion 4 and the side surface portion 3 of the Resinoid grindstone 1A. Therefore, the friction between the peripheral surface portion 4 and the side surface portion 3 of the resinoid grindstone 1A and the object to be processed is reduced. As a result, frictional heat generated when the object to be processed is polished using the resinoid grindstone is reduced. Therefore, the polishing ability of the resinoid grindstone can be improved, and the service life of the resinoid grindstone can be prolonged.

In the resinoid grindstone 1A according to the first embodiment, the proportion (mixing ratio) of the fibrous member 7 is preferably 0.5 volume% or more. The effect of reducing the friction between the peripheral surface portion 4 and the side surface portion 3 of the resinoid grindstone 1A and the object to be processed starts to occur because the fibrous member 7 is included at a blending ratio of about 0.5 volume% Because. This effect is presumed to be caused by the fact that the fibrous member 7 having high hydrophilicity is included in the resinoid grindstone 1A. The presumed contents of the present application do not affect the interpretation of the scope of right.

In the resinoid grind stone 1A according to the first embodiment, it is further preferable that the compounding ratio of the fibrous member 7 is 3 vol% or more. This is because the effect of increasing the mechanical strength of the resinoid grindstone 1A starts to occur remarkably because the fibrous member 7 is included at a blending ratio of about 3 vol%. By making the composite material including the cellulose nanofiber, the mechanical strength of the Resinoid grindstone 1A is improved.

In the resinoid grind stone 1A according to the first embodiment, the compounding ratio of the fibrous member 7 is preferably 30% by volume or less. According to the manufacturing method of the resinoid grindstone 1A (Example 2 described later), when the blend ratio of the fibrous member 7 exceeds 30% by volume, the abrasive grains 6, the fibrous members 7 This is because it is difficult to stir and knead the resin material. The above-mentioned resin material is a raw material of the cured resin constituting the resin part 5. The resin material exhibits a powdery state, a granular state or a liquid state at room temperature. The phrase &quot; indicating liquid at room temperature &quot; means having fluidity at room temperature and does not depend on the viscosity of the liquid.

(Action effect)

According to the resinoid grindstone 1A of the first embodiment, the following effects can be obtained. First, a fibrous member 7 having hydrophilicity derived from a living organism dispersed (mixed) together with the abrasive grains 6 in the resin portion 5 is provided on the peripheral surface portion 4 of the resinoid grindstone 1A And moisture near the surface of the side surface portion 3 can be easily retained. The moisture retained in the vicinity of these surfaces reduces the friction between the surface of the peripheral surface portion 4 of the resinoid grindstone 1A and the surface of the side surface portion 3 and the object to be processed. As a result, the frictional heat generated when the object to be cut is polished using the resinoid grindstone is reduced. Therefore, the polishing ability of the resinoid grindstone 1A can be improved, and the service life of the resinoid grindstone can be prolonged. In addition, since the number of revolutions of the resinoid grindstone 1A can be increased, the efficiency of grinding an object to be processed is improved. In addition, when the object to be processed is polished using the resinoid grindstone 1A, the polishing quality can be kept good. These effects are further enhanced by using a vegetable fibrous member 7 (for example, a cellulose nanofiber) having high hydrophilicity.

Secondly, the resinoid grindstone 1A includes the fibrous member 7 derived from the biologic material, thereby increasing the mechanical strength, for example, the elastic modulus, the bending strength, the tensile strength, and the like of the Resinoid grindstone 1A. As a result, vibrations, meandering, deformation, and the like of the Resinoid grindstone 1A are reduced when the plate-like member is polished using the Resinoid grindstone 1A, so that the life of the Resinoid grindstone 1A can be extended have. This effect is particularly remarkable in the case of cutting a plate-shaped member using a thinly formed resinoid grindstone 1A. In addition, since vibration, meandering, deformation, and the like of the Resinoid grindstone 1A are suppressed, the polishing quality (cutting quality) can be well maintained.

Further, the thickness of the resinoid grindstone 1A can be further reduced due to the increase in the mechanical strength of the resinoid grindstone 1A. Thereby, the width of the cuff kerf, which is the cut-out portion of the object to be processed, can be reduced. Therefore, it is possible to increase the number of products (take-out number) produced from one object to be processed.

In addition, even when the thickness of the resinoid grindstone 1A is reduced, the following effects can be obtained by increasing the outer diameter of the resinoid grindstone 1A based on the increase in the mechanical strength of the resinoid grindstone 1A. First, the life of the Resinoid grindstone 1A can be prolonged. Next, since the peripheral speed of the resinoid grindstone 1A is increased, the efficiency with which the resinoid grindstone 1A polishes the object to be processed can be improved. Next, the object to be processed having a large thickness can be completely polished (cut) in the thickness direction. Examples of the object to be processed having a large thickness include an IC for controlling an internal combustion engine, an IC for controlling an electric motor, an IC for controlling a drive system, an IC for controlling a braking system, and the like for a power control semiconductor device (IC, Finished substrate.

Third, since the biologically-derived fibrous member 7 having high hydrophilicity is included in the resinoid grind stone 1A, moisture contained in the peripheral surface portion 4 and the side surface portion 3 of the resinoid grindstone 1A . Therefore, the effect of cooling the resinoid grindstone 1A and the object to be processed by the water is improved, so that accumulation of heat due to machining can be reduced. Due to these factors, when the object is polished using the resinoid grindstone 1A, the grindability of the resinoid grindstone 1A can be improved and the life of the resinoid grindstone can be prolonged. In addition, the polishing quality can be kept good.

Fourth, since the fibrous member 7 is included in the resinoid grind stone 1A, the surface of the circumferential surface portion 4 of the resinoid grindstone 1A and the surface of the resinoidal grindstone 1B, A plurality of fibrous members 7 (including a part of the fibrous members 7) are sequentially dropped off from the surface of the side surface portion 3. It is presumed that in the case of using the fibrous fibrous member 7 having high hydrophilicity, the massive portions including the plurality of fibrous members 7 and the resin portions 5 entangled with each other may fall off. As a result, a new abrasive grain 6 easily appears on the surface of the peripheral surface portion 4 and the surface of the side surface portion 3. Therefore, since the new abrasive grains 6 tend to contribute to the abrasion instead of the abraded abrasive grains 6, the efficiency of polishing the object to be processed is improved. In addition, when the object to be processed is polished using the resinoid grindstone 1A, the polishing quality can be kept good.

In addition, when the resinoid grindstone 1A is used for cutting, the pores 8 may be formed in the resin part 5. By forming the pores 8, the inside of the resinoid grindstone 1A can be made porous. By forming the pores 8, the following effects can be obtained. First, during cutting the object to be processed, the cutting chip becomes easy to enter the inside of the pores 8. This makes it difficult for chips to accumulate between the abrasive grains 6 on the surface of the resinoid grindstone 1A. Therefore, clogging of the grinding wheel by the chip is suppressed.

Secondly, processing water easily enters the pores 8. The processing water which has entered the inside of the pores 8 suppresses the surface temperature of the resinoid grindstone 1A from rising during polishing of the object to be processed. Therefore, frictional heat generated between the surface of the peripheral surface portion 4 of the resinoid grindstone 1A and the surface of the side surface portion 3 and the object to be processed can be further reduced. The pores 8 are particularly useful when roughing the object to be processed.

In addition, when the resinoid grindstone 1A is used for cutting, an aggregate may be added to the resin portion 5. When the thickness of the resinoid grindstone 1A is thin, the strength of the resinoid grindstone 1A is improved by adding aggregate. As the aggregate, materials such as tungsten carbide (WC), alumina (Al ₂ O ₃ ), and silicon carbide (SiC) are used. The resinoid grindstone 1A may contain other additives depending on the purpose. As other additives, materials such as carbon black and silane coupling materials are used.

(Example 2)

(Manufacturing method of resinoids grits)

1 (b) and Fig. 2, a method of manufacturing a resinoid grindstone for manufacturing the Resinoid grindstone 1A according to the first embodiment of the present invention will be described. Fig. The production conditions described in the present application are merely examples. The production conditions in the production method of the resinoid grits are not limited to the production conditions described in the present application documents.

First, an abrasive grain 6 shown in Fig. 1 (b), a fibrous member (for example, a cellulose nanofiber) 7, and a resin material are prepared. If necessary, other additives including aggregates and the like may be prepared. The resin material preferably exhibits a powdery state, a granular state, or a liquid state at room temperature. The resin material is a synthetic resin, for example, a thermosetting resin containing a phenol resin, an epoxy resin, a polyimide resin or the like as a main material.

Next, the abrasive grains 6, the fibrous member 7, the aggregate, other additives, and the resin material are respectively weighed. The weighed abrasive grains (6), fibrous members (7), aggregates and other additives and resin materials are ground and ground using a grinder. Thereafter, a kneader is used to knead the abrasive grains 6, the fibrous member 7, the aggregate, other additives, and the resin material while applying a shearing force thereto. As a result, the abrasive grains 6, the fibrous member 7, the aggregate and other additives are incorporated into the resin material. It is preferable to mix the abrasive grains 6, the fibrous member 7, aggregate, other additives, and resin materials as evenly as possible to prepare a mixed material. The mixed material is dried. Thereafter, the mixed material is rolled to produce a plate-like mixed material. In order to perform appropriate rolling, the hardness of the kneaded product may be adjusted by appropriately adding a solvent such as alcohol to the kneaded material (kneaded product), re-kneading the kneaded product, and then appropriately drying the kneaded product.

Next, by punching the plate-like mixed material, a disk-shaped mixed material 9A having round holes 2 shown in Figs. 2A and 2B is produced. 2 (a) and 2 (b) show a plan view and a front view, respectively, of the mixed material 9A on the disk. The mixed material 9A on the disk has the round hole 2, the side surface portion 3 and the peripheral surface portion 4. The mixed material 9B on the disk is a raw material of the resinoid grindstone 1B according to another embodiment of the present invention (Embodiment 4 described later), and has a component different from that of the mixed material 9A.

Next, as shown in Fig. 2 (c), a set of molding dies 10 is prepared. The mold 10 has a lower mold 11 and a top mold 12. The material constituting the forming die 10 may be a metal-based material such as a tool steel or a ceramics-based material. The forming die 10 may be formed by coating a ceramic material based on yttrium oxide (Y ₂ O ₃ ) on a base material made of a metal-based material or a ceramics-based material.

The lower die 11 is provided with a recess 13 in which the mixed material 9A on the disk is accommodated. An upward convex portion 14 corresponding to the round hole 2 of the mixed material 9A is provided on the inner bottom surface of the lower die 11 constituting the bottom of the concave portion 13 of the lower die 11. Downward convex portions 15 corresponding to the planar shape of the mixed material 9A are provided on the bottom surface (lower surface) of the upper die 12.

Next, as shown in Fig. 2 (c), the mixed material 9A on the disk is accommodated in the mold 10. Fig. 2 (c) shows an example in which two disc-shaped mixed materials 9A are accommodated in the mold 10. A plurality of disk-shaped mixed materials 9A may be accommodated in the depth direction of the drawing (for example, three per one row along the depth direction of the drawing). In this case, 6 (= 2 x 3) resinoid grindstones 1A can be collectively manufactured by one molding step using one set of molds 10. It is possible to increase the number that can be produced collectively by one molding step.

Next, the lower die 11 and the upper die 12 are clamped from the state shown in Fig. 2 (c). The mixed material 9A on the disk is sandwiched by the inner bottom surface of the lower mold 11 in the concave portion 13 and the lower surface of the convex portion 15 in the upper mold 12.

Next, the heating furnace 16 shown in Fig. 2 (d) is prepared. The construction of the heating furnace 16 will be described below.

The heating furnace 16 has an outer frame portion 17 and a heating portion 18. The heating furnace 16 also has a die 19 on which the mold 10 is placed, a support 20 for supporting the die 19 and a lift 21 for lifting the support 20. The die 19 is preferably made of a material having a high thermal conductivity (for example, a metal-based material). The support portion 20 is preferably made of a material having a low thermal conductivity (for example, a cementitious material). The heating section 18 is provided with a plurality of heaters 22. In Fig. 2 (d), as one example, a plurality of tubular heaters 22 are shown. As the heater 22, a heater using electromagnetic induction heating may be used.

The heating section 18 has a shape in the form of a lid having an opening 23 downward. It is preferable that a shutter (not shown) for opening and closing the opening 23 is provided in the heating furnace 16. The die 19 supported by the support portion 20 moves forward and backward with respect to the space inside the heating portion 18 via the opening 23 of the heating portion 18 as the lifting portion 21 is lifted and lowered.

Next, in the heating furnace 16 shown in Fig. 2 (d), the die 19 and the supporting portion 20 are positioned below the opening 23 by lowering the elevating portion 21. Then, By supplying power to the plurality of heaters 22, the space inside the heating unit 18 is heated to a predetermined temperature (for example, 150 ° C to 160 ° C).

Next, as shown in Fig. 2 (d), the mold 10 housing the mixed material 9A on two discs is accommodated in the heating furnace 16. Concretely, first, a mold 10 containing two mixing materials 9A on a disk is placed on a die 19 supported by a support 20.

2 (d), the mold 10 is moved into the internal space of the heating section 18 by using the elevating section 21, and the mold 10 is heated by the heating section To the upper member (24) of the base (18). The mold member 10 is pressed against and brought into contact with the upper member 24 of the heating unit 18 at a constant pressure using the lifting unit 21 to maintain the state. The heat generated by the heating section 18 is transferred to the two disk-like mixed materials 9A via the mold 10. In this state, the two mixed materials 9A on the disk are heated by a constant temperature (for example, 155 DEG C) while being pressurized by a constant pressure (for example, 800 kgf / cm2). In a series of processes, the die 19 functions as a heat conduction member, and the support 20 functions as a heat insulating member.

Next, the state shown in Fig. 2 (d) is maintained for a predetermined time (for example, 3 to 5 minutes) at a constant temperature (for example, 155 占 폚). As a result, the resin material contained in the mixed material 9A on the two disc substrates is cured to form the resin portion 5 (see Fig. 1 (b)) made of the cured resin.

2 (d), the mold 10 is taken out from the internal space of the heating section 18 below the heating section 18 by using the elevating section 21. Then, as shown in Fig. The taken-out mold 10 is transferred to a treatment chamber (not shown). The treatment chamber may be provided inside the heating furnace 16 or may be provided outside the heating furnace 16.

Next, the mold 10 containing two mixed materials 9A on the disk surface is left for a certain period of time at a suitable processing temperature of 200 DEG C or lower and under a constant atmosphere. For example, the mold 10 is allowed to stand at a treatment temperature of 180 ° C for 2 hours, and then left at a treatment temperature of 200 ° C for 1 hour. By performing the heat treatment (post-curing) in this manner, the curing reaction in which the resin material contained in the mixed material 9A on the disk-shaped substrate 9 is cured is sufficiently advanced. The resin material contained in the mixed material 9A on the disk is cured and the cured resin is molded to produce the resinoid grindstone 1A (see FIG. 2 (e)).

As the atmosphere in the heat treatment, the following atmosphere is employed. When the processing temperature is included in the temperature range where the resin material constituting the resin portion (cured resin) 5 (see FIG. 1 (b)) is deteriorated, an atmosphere of an inert gas (for example, nitrogen gas) Inert atmosphere) is employed. In this case, a low-oxygen atmosphere (reduced-pressure atmosphere) may be employed. When the processing temperature is not included in the temperature range in which the resin material constituting the resin part 5 deteriorates, an atmospheric atmosphere is employed.

Next, the mold 10 accommodating the two resinoid grinders 1A is removed from the treatment chamber and left. Thereby, the mold 10 and the two resinoid grindstones 1A accommodated in the mold 10 are naturally cooled. A low temperature gas may be injected to the mold 10 outside the process chamber. Thereby, the mold 10 and the two resinoid grindstones 1A accommodated in the mold 10 can be forcedly cooled. Therefore, the time for manufacturing the resinoid grindstone 1A can be shortened.

Next, as shown in Fig. 2 (e), the lower die 11 and the upper die 12 are opened. The two resinoid grinders 1A are taken out from the two concave portions 13 formed in the lower mold 11. [ Finishing (machining such as grinding or grinding) may be performed on each Resinoid grindstone 1A as required. For example, the circumferential surface portion 4 and the inner circumferential portion (outer portion of the round hole 2) of the Resinoid grindstone 1A shown in Fig. 2 (e) are machined by a lathe, do. By the steps up to this point, two resinoid grindstones 1A are finally completed.

(Action effect)

According to the method for manufacturing a resinoid grindstone according to the second embodiment, the resinoid grindstone 1A according to the first embodiment can be manufactured. By having a plurality of molds 10 taken out, a plurality of resinoid grindstones 1A can be collectively manufactured by a single molding step.

The elevating portion 21 is provided in the heating furnace 16 so as to move forward and backward with respect to the space inside the heating portion 18 via the opening 23 of the heating portion 18. [ Thereby, it becomes possible to automate the step of heating while pressurizing in the case of manufacturing the Resinoid grindstone 1A. These effects are the same in other embodiments relating to the manufacturing method of the resinoid grindstone.

In the manufacturing method of the resinoidal grindstone according to the second embodiment, a disc-shaped mixed material 9A having round holes 2 was used. Instead, a disc-shaped mixed material having no round holes 2 may be used. In this case, the cured molded article is machined by heating while being pressurized to form round holes 2. This also applies to other embodiments.

(Example 3)

The overall structure of the resinoid grindstone 1B according to the third embodiment of the present invention is the same as the overall structure of the resinoid grindstone 1A according to the first embodiment. Therefore, the description of the overall structure of the resinoid grindstone 1B is omitted.

The microstructure of the resinoid grindstone 1B will be described with reference to Fig. 1 (c). As shown in Fig. 1 (c), the resinoid grindstone 1B includes a resin portion 5 made of a hardened resin, abrasive grains 6, fibrous members 7 (for example, Cellulosic nanofibers). The resinoid grindstone 1B is the same as the resinoid grindstone 1A in terms of the kind of material constituting the resinoid grindstone 1B.

In the resinoidal grindstone 1B, it is preferable that the proportion (blending ratio) of the fibrous member 7 is 30% by volume or more. When the compounding ratio of the fibrous member 7 is less than 30 volume%, the mixed material in which the abrasive grains 6 and the fibrous member 7 are mixed with the solvent is mossed in the manufacturing method of the resinoidal grindstone (Example 4 described later) It is difficult to manufacture the mixed material on the disk.

In the resinoid grinding wheel 1B, it is preferable that the compounding ratio of the fibrous member 7 is 80% by volume or less. In the case of using a mixed material in which the blend ratio of the fibrous member 7 is more than 80% by volume, the compounding ratio of the abrasive grains 6 contained in the resinoidal grindstone decreases. Therefore, the efficiency with which the resinoid grindstone 1B polishes the object to be processed is lowered, which is not preferable.

According to the resinoid grindstone 1B of the third embodiment, the same effect as that of the resinoid grindstone 1A can be obtained. Incidentally, the respective effects obtained by the resinoid grindstone 1B are larger than the respective effects obtained by the resinoid grindstone 1A from the following reasons. In the resinoidal grindstone 1B, the compounding ratio of the fibrous member 7 is 30 vol% or more and 80 vol% or less. In the resinoid grindstone 1A, the compounding ratio of the fibrous member 7 is 0.5 volume% or more and 30 volume% or less. The resinoid grindstone 1B has a large mixing ratio of the fibrous member 7 as compared with the resinoid grindstone 1A. Therefore, each effect obtained by the resinoid grindstone 1B is larger than each effect obtained by the Resinoid grindstone 1A.

(Example 4)

1 (c) and Fig. 2, a method of manufacturing a resinoid grindstone for manufacturing the resinoid grindstone 1B according to the third embodiment of the present invention will be described. The steps from the preparation of the abrasive grains 6 to the fibrous member (for example, the cellulose nanofibers) 7, the resin material, and the step of weighing the materials are the same as those of the second embodiment.

Next, the abrasive grains 6 and the fibrous member 7 are dissolved in a solvent to prepare a mixed material. In other words, a mixed material is produced by dissolving a material other than the resin material in a solvent. It is preferable to mix the abrasive grains 6 and the fibrous members 7 as evenly as possible to prepare a mixed material. As the solvent, a water-based solvent, an alcohol-based solvent, or the like is used. As a material to be dissolved in a solvent, a binder and a dispersant may be added, or a small amount of powdery resin material may be added. In the prepared mixed material, it is preferable that the proportion (blending ratio) of the fibrous member 7 is 30 vol% or more and 80 vol% or less. In the produced mixed material, the fibers of the fibrous member 7 are in a state entangled with a material such as the abrasive grains 6 and a binder.

Next, the produced mixed material is floated. In this process, a machine having the same function as the paper machine is used. Thereby, the mixed material is formed into a circular shape. The mixed material formed on the circular plate is dried to produce the mixed material on the disk.

Next, using a resin impregnator, the mixed material on the disk is impregnated with a fluid resin (a resin material having fluidity). In this step, it is preferable to reduce the space containing the mixed material on the disk. Thereby, the mixed material on the disk is impregnated with the fluid resin to prepare the mixed material on the disk.

Next, as shown in Fig. 2 (c), the mixed material 9B on the disk is accommodated in the mold 10. The following steps are the same as the steps described in the second embodiment, and therefore, the description of those steps is omitted.

According to the method for producing a resinoid grindstone according to the fourth embodiment, the resinoid grindstone 1B according to the third embodiment can be manufactured. In addition, the same effect as the effect of the method for producing a resinoid grindstone according to the second embodiment can be obtained.

(Example 5)

(Construction of Processing Apparatus)

Referring to Fig. 3, the machining apparatus according to the fifth embodiment of the present invention will be described. The machining apparatus shown in Fig. 3 is a machining apparatus that polishes all portions in the thickness direction of the object to be processed (completely cuts the object) using the peripheral surface portions of the Resinoid grindstones 1A and 1B. Therefore, as the resinoid grindstone, a resinoid grindstone having a small thickness is used.

The processing device 25 has at least a receiving module 26, a function module 27 having a polishing function, and a dispensing module 28. [ The receiving module 26, the function module 27 and the dispensing module 28 are arranged along the X direction shown in FIG. 3 (a) and fixed to each other.

The receiving module 26 and the functional module 27 can be detached. The function module 27 and the dispensing module 28 can be detached. With respect to the function module 27, other function modules can be detached. Thus, first, other functional modules may be removed between the receiving module 26 and the functional module 27. Secondly, another function module can be detached between the function module 27 and the dispensing module 28. [

The receiving module 26 receives the object to be processed 29 from the outside of the processing device 25. The function module 27 polishes the object 29 received from the receiving module 26. [ The function module 27 can perform both of partially polishing the object 29 in the thickness direction and completely polishing the object 29 in the thickness direction. In this case, the object to be processed 29 is completely polished (cut) in the thickness direction, and the object 29 is disassembled.

The dispensing module 28 receives from the function module 27 a product group 30 that is an aggregate of the products P produced by disengaging the object 29. [ The product group 30 is accommodated in the tray 31. Fig. The tray 31 in which the product group 30 is housed is discharged to the outside of the processing device 25. The dispenser module 28 may be provided with a camera 32 for optically inspecting each product P. [

The function module 27 has a spindle (rotation mechanism) 33. The spindle 33 has a servomotor 35 having a rotation shaft 34. The rotary shaft 34 is provided with either a resinoid grindstone 1A or a resinoid grindstone 1B. The resinoid grindstones 1A and 1B rotate in the plane including the Y direction and the Z direction in the drawing.

The function module 27 has a stage (fixing mechanism) 36, which is a die to which the object 29 is fixed. As an example of means for temporarily fixing the object 29, an adhesive sheet attached to the upper surface of the stage 36 is employed.

The function module 27 has a rotation part 37 for rotating the stage 36. [ The stage 36 is provided in the rotation part 37. [ A motor (not shown) made of, for example, a direct drive motor (DD motor) is provided below the rotation part 37. [ And the rotating portion 37 is fixed to the rotating shaft of the motor. By the rotation of the DD motor, the stage 36 provided on the rotary part 37 rotates in the? Direction.

The function module 27 has a moving mechanism 38 for moving the stage 36 and the spindle 33 relatively. The function module 27 has a servo motor 39, a ball screw 40 connected to the rotary shaft of the servo motor, and a ball nut (not shown) fitted in the ball screw 40. A moving mechanism (38) is provided on the ball nut. By driving the servo motor, the stage 36 moves along the Y direction. The object to be processed 29 is polished by moving the stage 36 and the spindle 33 relative to each other.

The processing device 25 has a control unit CTL. The control unit CTL is installed in the receiving module 26. [ The control unit CTL may be installed in another module. The control section CTL controls at least the rotational direction and the rotational speed of the resinoid grindstone 1A or the resinoid grindstone 1B and the relative movement direction and the moving speed of the stage 36 and the spindle 33 Hereinafter the same).

The function module having the specific function can be detached between the receiving module 26 and the function module 27 or between the function module 27 and the dispensing module 28. [ Specific functions include, for example, cleaning, drying, measurement and inspection of the product (P) in the product group 30 in addition to the above-described polishing. The specific function may be cutting or cutting (hereinafter referred to as &quot; cutting or the like &quot; as appropriate) targeted to the object 29 before polishing or the product group 30 that is a polished object to be processed . The function module can execute at least one of the plurality of functions. The receiving module 26, the functional module 27 and the dispensing module 28 are also included in the functional module.

A specific function may be a polishing function using other than the resinoid grindstone 1A or 1B. By using the polishing apparatus having these polishing functions, for example, it becomes possible to perform polishing by water jet, polishing by blasting using abrasive grains, and the like.

When the specific function is cutting or the like, it is possible to perform cutting with a rotary grindstone, cutting using a wire rod, cutting with laser light, and the like. By combining these cutting tool mechanisms and the resinoid grindstones 1A, 1B, the object 29 can be cut along a line combining a line segment and a curve. Such cutting and the like are useful when manufacturing a product having a shape in which a line segment and a curve are combined, such as an SD memory card.

Fig. 3 (b) shows a functional module 41 having a cleaning function and a drying function. It is preferable that the function module 41 is inserted between the function module 27 and the dispensing module 28 and is mounted.

The functional module 41 has a cleaning and drying mechanism 42. The cleaning and drying mechanism 42 has a cleaning section 43 and a drying section 44. The cleaning portion 43 is provided with a cleaning liquid injection mechanism for spraying the cleaning liquid. The cleaning section 43 may be provided with a scrub mechanism for rubbing the upper surface of the product group using a sponge containing a cleaning liquid. The cleaning mechanism 43 may be provided with a jetting mechanism and a scrub mechanism. The drying section 44 is provided with a gas injection mechanism for injecting a clean gas. The function module 41 shown in FIG. 3 (b) has a function of inspecting by the camera 32 in addition to the cleaning function by the cleaning section 43 and the drying function by the drying section 44.

3 (c) shows a functional module 45 having a polishing function different from that of the functional module 27 having a polishing function. The function module 45 is inserted between the receiving module 26 and the function module 27 or inserted between the function module 27 and the dispensing module 28. In order to shorten the cutting time in the function module 27, it is preferable that the function module 45 is inserted between the receiving module 26 and the function module 27 and mounted. According to this configuration, the object to be processed 29 is thinned by being polished in the functional module 45, and then cut into pieces in the functional module 27, thereby being separated.

The function module 45 is provided with a polishing mechanism 46. The polishing apparatus 46 has a polishing grindstone 47 that can be rotated. The abrasive grindstone 47 is the same grindstone as the resinoid grindstones 1A and 1B and may be used to abrade the object 29 with the side surface portion 3. [ The upper surface of the encapsulating resin of the encapsulated substrate and the upper surface of the semiconductor chip or the like can be polished by using the rotating abrasive wheel 47 of the polishing mechanism 46. [ As a result, the product P made of an electronic component or the like can be made thin. The thickness measuring mechanism 48 may be provided on the function module 45. [ The position in the height direction (Z direction) of the upper surface of the encapsulating resin to be polished and the upper surface of the semiconductor chip or the like can be measured during polishing or after polishing by the displacement sensor 49 of the thickness measuring mechanism 48 . The function module 45 has a grinding function by the grinding stone 47 and a function of measuring the thickness by the displacement sensor 49 as well.

The function module 27 shown in FIG. 3 (c) may have a polishing function. The function module 45 is inserted between the function module 27 and the function module 27 and inserted between the function module 27 and the function module 27. [ The abrasive module mounted on the receiving module 26 performs abrading, and the abrading module mounted on the dispensing module 28 performs the finish polishing. The resinoid grindstones 1A and 1B used in this case may be used to polish the object 29 by using the side surface portion 3.

(Action effect)

The machining apparatus 25 according to the fifth embodiment polishes the object 29 using either the resinoid grindstone 1A or the resinoid grindstone 1B. Therefore, the same effect as the effect described in the first embodiment can be obtained.

Further, according to the processing device 25 of the fifth embodiment, the following effects can be obtained. Firstly, after the machining device 25 is manufactured, or after it is installed in the user's factory, a function module having a grinding function can be posteriorly added to the machining device 25, if necessary. After the user has started using the machining device 25, the function module having the grinding function may be added to the machining device 25 at a later stage. Therefore, the ability to polish the object 29 in the machining apparatus 25 can be increased posteriorly.

Secondly, after the machining device 25 is manufactured, or after it is installed in the user's factory, a function module having functions other than polishing can be added to the machining device 25, as needed. After the user starts using the machining device 25, the function module having a function other than polishing may be added to the machining device 25 in the post-process. Therefore, functions other than the polishing in the machining apparatus 25 can be added to the machining apparatus 25 in the post-process.

The object to be processed 29 described in the first to fifth embodiments described above includes a circuit board on which a plurality of regions in a lattice-like pattern in which electronic circuits are formed are formed. The circuit board may be a semiconductor wafer made of silicon, silicon carbide or the like. These objects to be processed have a substantially circular planar shape.

The object to be processed 29 is a semiconductor wafer having a plurality of lattice-like regions in which electronic circuits are formed, and includes a semiconductor wafer in which one surface is resin-sealed. On one side, protruding electrodes, electric wiring, and the like may be formed.

The object to be processed 29 includes a plate-like member having a plurality of lattice-like regions each having a function. The plate-shaped member may be a plate-like member having a microlens array formed in each of a plurality of regions. The plate-shaped member may be a plate-shaped member having a light-guide plate formed on each of a plurality of regions. In these cases, the functions of each of the plurality of regions are optical functions such as light focusing, diffusion, and light guiding.

The sealed substrate, which is an example of the object to be processed 29, includes a circuit board, a plurality of chip-like parts mounted on a plurality of lattice-shaped areas of the circuit board, and a sealing resin . The circuit board includes a printed board (Printed Wiring Board) made of a lead frame, a glass epoxy laminate, a copper polyimide film or the like made of copper, an iron-based alloy, or the like. The circuit board includes a ceramics substrate made of alumina, silicon carbide, sapphire or the like, a metal base substrate made of a metal such as copper or aluminum, a film base substrate made of a polyimide film or the like, and the like.

The entire shape of the sealed substrate, which is an example of the object to be processed 29, is typically a plate (flat plate) in the case of manufacturing an IC, a surface mount transistor, a surface mount capacitor, and the like. The overall shape of the resin encapsulant may be a shape having a plurality of protrusions functioning as a convex lens or the like in the case of manufacturing an optical semiconductor element.

Chip components include electronic components such as semiconductor integrated circuits (ICs), optical semiconductor elements, transistors, diodes, crystal oscillators, filters, capacitors, inductors, resistors, thermistors and sensors on a chip. Chip parts include mechanical parts such as MEMS (Micro Electro Mechanical Systems). One chip component may be mounted on one region of the substrate, or a plurality of chip components may be mounted on one region of the substrate. A plurality of chip components mounted on one area may be the same type or different types. As the sealing resin, for example, a cured resin formed by curing a thermosetting resin such as an epoxy resin or a silicone resin is used.

In each embodiment, the stage 36 is moved along the X direction, Y direction and Z direction in the figure. Instead of this, the spindle 33 provided with the resinoid grindstone 1A, 1B may be moved along the X direction, the Y direction and the Z direction in the figure. Further, both the stage 36 and the spindle 33 may be moved along the X direction, the Y direction, and the Z direction in the figure. According to these aspects, the stage 36 and the spindle 33 may be moved relative to each other along the X direction, the Y direction, and the Z direction.

The stage 36 and the spindle 33 are relatively moved along the X direction, the Y direction and the Z direction depending on the material constituting the object 29 or depending on the combination of the materials constituting the object 29 It is also possible to change the speed.

As a method of temporarily fixing the object 29 to the stage 36, the object 29 may be adsorbed on the upper surface of the stage 36 without using an adhesive tape. In this case, a groove is formed in the upper portion of the stage 36 so as to accommodate the peripheral surface portion 4 of the resinoid grindstone 1A, 1B so as to overlap each boundary line as a cut portion in a plan view.

In the embodiment described so far, a plant-derived fibrous member 7 containing cellulose is used as the fibrous member 7 derived from the organism contained in the resin part 5 made of a cured resin. As the fibrous member 7 derived from a living organism, a fibrous member 7 having hydrophilicity derived from an animal can be used instead of the fibrous member 7 derived from a plant. In other words, in the resinoid grindstone 1A, 1B, the fibrous member may be derived from an animal.

As an example of the animal-derived fibrous member 7 mixed in the resin part 5 made of a hardened resin, there can be mentioned a material containing chitin or chitosan. Chitin, chitosan is a natural polysaccharide contained in many organisms such as crabs, shells of shrimps, organs of water squid, etc. (see the above-mentioned web page of Sugino Machine Co., Ltd.). Using the fibrous member 7 derived from an animal, the same resinoid grindstone as the resinoidal grindstones 1A and 1B described in Examples 1 and 3 can be produced by the manufacturing method described so far.

The present invention is not limited to the above-described embodiments. The present invention may be embodied in various forms as needed without departing from the spirit of the present invention. For example, a configuration may be adopted in which two spindles (rotation mechanisms) 33 are combined with respect to one stage 36 in the functional module 27 of the processing device 25. [ A single spindle (rotating mechanism) 33 is combined with one stage 36 to constitute a polishing mechanism so that a plurality of sets (for example, , Two sets) of polishing apparatuses may be provided.

The shape of the resinoid grindstone is not limited to the disc shape. A plurality of resinoid grindstones having a shape of a rectangular parallelepiped may be provided and a plurality of resinoid grindstones may be provided along the periphery of the rotary jig on the disk. The object is polished by rotating the rotary jig in a state in which the object to be processed and the resinoid grindstone are in contact with each other. The operator may manually move the resinoid grindstone and the object to be processed relatively in a state in which the resinoid grindstone having a rectangular parallelepiped shape and the object to be processed are in contact with each other.

It is pointed out that the glass fiber of the short fibers described in Patent Document 1 may adversely affect the human body (see, for example, Japanese Patent Application Laid-Open No. 3-287381, page 2, upper left column, line 16, 5). The resinoid grindstone according to the present invention includes a fibrous member derived from a biocide instead of glass fiber. Therefore, according to the present invention, it is presumed that the possibility of adversely affecting the human body is small.

1A, 1B: Resinoid stone
2: round hole
3:
4:
5: Resin part (hardened resin)
6: abrasive grain
7: fibrous member
8: Groundwork
9A, 9B: mixed material on disc
10: Molding type
11: Lower mold
12: HYPER
13:
14: Upward convex
15: downward convex portion
16: heating furnace
17:
18:
19: Die
20: Support
21:
22: heater
23: aperture
24:
25: Processing device
26: Receiving module
27, 41, 45: function module
28: dispensing module
29: object to be processed
30: Products
31: Tray
32: Camera
33: spindle (rotating mechanism)
34:
35, 39: Servo motor
36: stage (stationary mechanism)
37:
38:
40: Ball Screw
42: Cleaning and drying apparatus
43: Three governments
44:
46: Polishing tool
47: abrasive stone
48: Thickness measuring instrument
49: Displacement sensor
t: Thickness
C: Center
CTL:
P: Products

Claims (15)

A cured resin formed by curing the resin material,
An abrasive grain mixed into the hardening resin,
And a fibrous member derived from the organism mixed in the cured resin. The method according to claim 1,
Wherein the ratio of the fibrous member contained in the resinoid grindstone is not less than 0.5% by volume and not more than 30% by volume. The method according to claim 1,
Wherein the ratio of the fibrous member contained in the resinoid grindstone is 30 vol% or more and 80 vol% or less. 4. The method according to any one of claims 1 to 3,
The fibrous member is a plant-derived, resinoidal grits. 5. The method of claim 4,
Wherein the fibrous member comprises cellulose. 4. The method according to any one of claims 1 to 3,
Wherein the fibrous member is derived from an animal. The method according to claim 6,
Wherein the fibrous member comprises chitin or chitosan. A step of mixing a fibrous member derived from abrasive grains and a biomolecule with a resin material to produce a mixed material,
Filling the mixed material with a molding die to pressurize the mixed material,
And curing the resin material to mold the cured resin. 9. The method of claim 8,
Wherein the ratio of the fibrous member contained in the mixed material is 0.5 volume% or more and 30 volume% or less in the step of manufacturing the mixed material. A step of mixing a fibrous member derived from abrasive grains and a biomolecule with a solvent to produce a mixed material,
A step of drying the mixed material and then impregnating the mixed material with a resin material having fluidity to prepare an impregnated material;
Heating the impregnated material while pressurizing the impregnated material to fill the mold,
And forming the cured resin by curing the resin material. 11. The method of claim 10,
Wherein the ratio of the fibrous member contained in the mixed material is 30% by volume or more and 80% by volume or less in the step of producing the mixed material. A machining apparatus for polishing an object to be processed by using the resinoid grindstone according to any one of claims 1 to 3. 13. The method of claim 12,
A rotary shaft to which the resinoid grindstone is fixed,
A rotating mechanism for rotating the rotating shaft,
A fixing mechanism for fixing the object to be processed,
And a moving mechanism for relatively moving the rotating mechanism and the fixing mechanism. 13. The method of claim 12,
Wherein the resinoid grindstone has a peripheral surface portion and a side surface portion,
Wherein the machining apparatus performs one of the following operations with respect to the object by relatively moving the object to be processed and the resinoid grindstone.
(1) Polishing by the side portion.
(2) Polishing by the peripheral surface portion.
(3) Formation of a groove by the peripheral surface portion.
(4) Cutting by the peripheral surface portion. 14. The method of claim 13,
A function module having at least the rotating shaft, the rotating mechanism, the fixing mechanism, and the moving mechanism and having a polishing function;
And a control unit for controlling at least an operation of the functional module,
The function module may be detachable with respect to another function module having a specific function,
Wherein the specific function comprises at least one of cutting, cleaning, drying, measuring, inspection and polishing.

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