TWI648932B - 雷射加工系統、雷射加工系統的雷射照射裝置 - Google Patents

雷射加工系統、雷射加工系統的雷射照射裝置 Download PDF

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Publication number
TWI648932B
TWI648932B TW105130301A TW105130301A TWI648932B TW I648932 B TWI648932 B TW I648932B TW 105130301 A TW105130301 A TW 105130301A TW 105130301 A TW105130301 A TW 105130301A TW I648932 B TWI648932 B TW I648932B
Authority
TW
Taiwan
Prior art keywords
laser beam
laser
unit
window
processing system
Prior art date
Application number
TW105130301A
Other languages
English (en)
Chinese (zh)
Other versions
TW201715807A (zh
Inventor
黃大淳
金煐中
Original Assignee
南韓商Ｅｏ科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商Ｅｏ科技股份有限公司 filed Critical 南韓商Ｅｏ科技股份有限公司
Publication of TW201715807A publication Critical patent/TW201715807A/zh
Application granted granted Critical
Publication of TWI648932B publication Critical patent/TWI648932B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW105130301A 2015-10-22 2016-09-20 雷射加工系統、雷射加工系統的雷射照射裝置 TWI648932B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??10-2015-0147549 2015-10-22
KR1020150147549A KR101769463B1 (ko) 2015-10-22 2015-10-22 레이저 가공 시스템 및 레이저 가공 시스템의 레이저 조사 장치

Publications (2)

Publication Number Publication Date
TW201715807A TW201715807A (zh) 2017-05-01
TWI648932B true TWI648932B (zh) 2019-01-21

Family

ID=58557892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105130301A TWI648932B (zh) 2015-10-22 2016-09-20 雷射加工系統、雷射加工系統的雷射照射裝置

Country Status (3)

Country Link
KR (1) KR101769463B1 (ko)
TW (1) TWI648932B (ko)
WO (1) WO2017069402A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102572465B1 (ko) * 2019-02-01 2023-08-29 삼성전자주식회사 웨이퍼 클리닝 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05320917A (ja) * 1992-05-15 1993-12-07 Sumitomo Electric Ind Ltd 薄膜形成装置
JP2003180848A (ja) * 2001-12-20 2003-07-02 Matsushita Electric Ind Co Ltd レーザ装置
JP2011121093A (ja) * 2009-12-10 2011-06-23 Mitsubishi Materials Corp レーザ加工装置およびこれを用いた工具のレーザ加工方法
JP5320917B2 (ja) 2008-09-09 2013-10-23 株式会社明電舎 発電機の振動抑制制御装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294717A (ja) * 2005-04-07 2006-10-26 Alfa Ec Co Ltd 基板加熱装置
JP2012110945A (ja) * 2010-11-26 2012-06-14 Toshiba Corp レーザ加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05320917A (ja) * 1992-05-15 1993-12-07 Sumitomo Electric Ind Ltd 薄膜形成装置
JP2003180848A (ja) * 2001-12-20 2003-07-02 Matsushita Electric Ind Co Ltd レーザ装置
JP5320917B2 (ja) 2008-09-09 2013-10-23 株式会社明電舎 発電機の振動抑制制御装置
JP2011121093A (ja) * 2009-12-10 2011-06-23 Mitsubishi Materials Corp レーザ加工装置およびこれを用いた工具のレーザ加工方法

Also Published As

Publication number Publication date
TW201715807A (zh) 2017-05-01
KR20170047104A (ko) 2017-05-04
WO2017069402A1 (ko) 2017-04-27
KR101769463B1 (ko) 2017-08-18

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