TWI648932B - Laser processing system, laser radiation device of laser processing system - Google Patents

Abstract

A laser processing system, the laser processing system includes: laser irradiation a unit that irradiates a laser beam, and a chamber unit that accommodates the object to be processed, transmits the laser beam from the outside to the object to be processed, and a frequency conversion unit that is disposed to the chamber unit and the laser irradiation Between the units, it is rotatable and has a rotating plate formed with at least one slit.

Description

Laser irradiation system, laser processing system, laser irradiation device

The present invention relates to a laser irradiation system and a laser irradiation apparatus for a laser processing system.

The laser processing system irradiates a laser beam emitted from a laser light source to an object to be processed by an optical system, and performs marking, dicing, and scribing on the object to be processed by irradiating the laser beam. Processing operations such as scribing).

Such a laser processing system includes a laser irradiation unit for irradiating a laser beam to a workpiece, and the laser irradiation unit includes a laser light source and an optical system. The laser irradiation unit can be classified into a variable laser irradiation unit in which the frequency of the irradiated laser beam is changed, and a fixed laser irradiation unit in which the frequency of the irradiated laser beam is not changed.

The fixed laser irradiation unit cannot change the frequency of the laser beam. Therefore, when it is necessary to control the energy density applied to the object to be processed by the laser beam, the internal structure of the laser irradiation unit needs to be changed. Or replace laser exposure The problem with the unit itself.

Further, when the variable laser irradiation unit sets the frequency of the laser beam at a fixed frequency, the frequency setting of the laser beam needs to be changed again.

In an embodiment of the present invention, a laser processing system capable of easily controlling a frequency of a laser beam irradiated to an object to be processed and a laser irradiation unit of the laser processing system by using a simple mechanical configuration are provided .

A laser processing system according to an aspect of the present invention may include: a laser irradiation unit that irradiates a laser beam; and a chamber unit that accommodates an object to be processed inside, and transmits the laser beam from the outside to the object to be processed. And a frequency conversion unit disposed between the chamber unit and the laser irradiation unit, rotatable and having a rotating plate formed with at least one slit.

The frequency of the laser beam irradiated to the object to be processed by the rotating plate is changed by the change of the rotational speed of the rotating plate.

The above rotating plate may have a rotational speed of 50 rpm to 4000 rpm.

The cross-sectional shape of the above-mentioned rotating plate in the direction perpendicular to the rotation axis may be circular.

The above rotating plate may have a diameter of 500 mm or less.

In the above rotating plate, the reflectance of the surface opposed to the above-described laser irradiation unit may be 10% or less.

The laser beam irradiated from the above-described laser irradiation unit may have a first frequency, and the laser beam passing through the frequency conversion unit has a second frequency different from the first frequency.

The chamber unit may include: a base plate; a cover plate disposed to cover the substrate; a first window disposed to the cover plate to transmit the laser beam; and a second The window is provided to the cover plate so as to be spaced apart from the first window, and a measurement beam transmission for measuring the temperature of a specific region of the object to be processed is used.

The first window and the second window may be provided to the first wall surface and the second wall surface of the cover plate, and the second wall surface may be formed obliquely with respect to the first wall surface.

The laser processing system may further include a stage, the platform is disposed on the substrate, and the object to be processed is stacked, and the platform is disposed to be movable on the substrate.

The above platform can be disposed in such a manner that one end portion thereof moves up and down so as to be tiltable with respect to the above substrate.

The laser beam is obliquely incident on a surface of the object to be processed stacked on the stage, and a part of the laser beam reflected from the object to be processed may face the first window in an inner wall surface of the cover And the area of the second window travels.

The laser beam may be different from the wavelength of the measurement beam, and the first window and the second window may comprise different materials.

The laser processing system may further include a temperature measuring unit that emits a measurement beam for measuring a temperature of a specific region of the object to be processed.

The laser processing system described above may further include a vacuum unit that maintains the interior of the chamber unit as a vacuum.

The rotating plate may be disposed away from the laser irradiation unit and rotatably provided to the chamber unit.

A laser irradiation apparatus according to another aspect of the present invention may include: a laser irradiation unit that irradiates a laser beam to the object to be processed; and a frequency conversion unit that is disposed between the processing object and the laser irradiation unit, The rotating plate having the at least one slit is formed to rotate, and the frequency of the laser beam irradiated to the object to be processed by the rotating plate is changed by the rotation speed of the rotating plate.

The above rotating plate may have a rotational speed of 50 rpm to 4000 rpm.

The cross-sectional shape of the above-mentioned rotating plate in the direction perpendicular to the rotation axis may be circular.

The above rotating plate may have a diameter of 500 mm or less.

In the above rotating plate, the reflectance of the surface opposed to the above-described laser irradiation unit may be 10% or less.

The laser beam irradiated from the above-described laser irradiation unit may have a first frequency, The laser beam passing through the frequency conversion unit has a second frequency different from the first frequency described above.

The laser processing system and the laser irradiation unit of the embodiment of the present invention can easily control the frequency of the laser beam irradiated to the object to be processed by using the rotatable frequency conversion unit.

1‧‧‧Laser processing system

100‧‧‧Cell unit

105‧‧‧Substrate

110‧‧‧ cover

110a‧‧‧First wall

110b‧‧‧second wall

121‧‧‧First window

122‧‧‧ second window

130‧‧‧ platform

135‧‧ sales

137‧‧‧Guide members

200‧‧‧Laser illumination unit

210‧‧‧Laser light source

220‧‧‧Optical system

300‧‧‧ Temperature measuring unit

400‧‧‧vacuum unit

500‧‧‧ Pressure display unit

1000‧‧‧frequency conversion unit

1100, 1100a, 1100b, 1100c‧‧‧ rotating plate

1110‧‧‧Through the area

1120‧‧‧Blocking area

1111, 1111A‧‧ slit

1200‧‧‧Rotation Support

1300‧‧‧Rotary Drive Department

A‧‧‧Rotary axis

D‧‧‧diameter

DL‧‧‧ measurement beam

L1, L2‧‧‧ laser beam

RL‧‧" laser beam

T0‧‧‧ unit time

W‧‧‧Processing objects

θ ₁ ‧‧‧first angle

θ ₂ ‧‧‧second angle

Fig. 1 is a view schematically showing a laser processing system of an embodiment.

Fig. 2 is a view showing a laser processing system of the embodiment.

Fig. 3 is an enlarged perspective view showing, in an enlarged manner, a frequency conversion unit of the laser processing system of the embodiment.

4 is a plan view showing a rotary plate of a frequency conversion unit.

5a to 5c are plan views showing a rotary plate of another embodiment.

6a, 6b, and 6c are diagrams for explaining a process of converting the frequency of the laser beam by the frequency conversion unit of the laser processing system of the embodiment.

7a, 7b, and 7c are diagrams for explaining a process of converting a frequency of a laser beam by a frequency conversion unit of a laser processing system according to another embodiment.

8a, 8b, and 8c are diagrams for explaining a process of converting a frequency of a laser beam by a frequency conversion unit of a laser processing system according to still another embodiment.

9a and 9b are a perspective view and a side view of the chamber unit of Fig. 1.

10a and 10b are views showing an internal cross section of a chamber unit.

Figure 11 is a cross-sectional view showing the interior of a chamber unit according to another embodiment of the present invention.

Fig. 12 is a perspective view schematically showing a laser processing system according to still another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are given to the same components, and the size or thickness of each component can be exaggerated for clarity of description.

Terms such as "first", "second", etc., including ordinal numbers, can be used to describe various constituent elements, but constituent elements should not be limited by the terms. The term is used only for the purpose of distinguishing one component from another component. For example, the first constituent element may be named as the second constituent element without departing from the scope of the invention, and similarly, the second constituent element may be named as the first constituent element. The term "and/or" includes a combination of a plurality of related items or any of a plurality of related items.

Fig. 1 is a view schematically showing a laser processing system 1 of an embodiment, and Fig. 2 is a view showing a laser processing system 1 of an embodiment.

1 and 2, the laser processing system 1 includes a laser irradiation unit 200, a frequency conversion unit 1000, and a chamber unit 100. The laser irradiation unit 200 and the frequency conversion unit 1000 may be collectively referred to as a laser irradiation device.

The laser irradiation unit 200 is a unit that irradiates the laser beam L1, including: The light source 210 emits a laser beam L1; and the optical system 220 irradiates the laser beam L1 generated by the laser light source 210 to the outside of the laser irradiation unit 200.

The frequency of the laser beam L1 irradiated from the laser irradiation unit 200 can be fixed. For example, the laser irradiation unit 200 may illuminate the laser beam L1 having the first frequency. However, the laser irradiation unit 200 is not limited to the fixed laser irradiation unit 200, and may be a variable laser irradiation unit 200 that can realize frequency conversion.

The chamber unit 100 can house the object W inside. The chamber unit 100 can illuminate the processing object W by transmitting the laser beam L2 passing through the frequency conversion unit 1000 through the chamber unit 100.

A frequency conversion unit 1000 formed with at least one slit 1111 may be disposed between the laser irradiation unit 200 and the chamber unit 100.

A part of the frequency conversion unit 1000 can be disposed to overlap the laser irradiation unit 200. For example, a portion of the frequency conversion unit 1000 may be configured to illuminate a region of the laser beam L1 by the laser irradiation unit 200.

The frequency conversion unit 1000 is rotatable and can control exposure exposure of the laser beam L1 irradiated by the laser irradiation unit 200.

Fig. 3 is an enlarged perspective view showing, in an enlarged manner, a frequency conversion unit 1000 of the laser processing system 1 of the embodiment. 4 is a plan view showing a rotating plate 1100 of the frequency conversion unit. 5a to 5c are plan views showing rotary plates 1100a, 1100b, and 1100c according to another embodiment.

Referring to FIG. 3 to FIG. 4, the frequency conversion unit 1000 includes: a rotating plate 1100; and a rotation supporting portion 1200 that can support the rotating plate 1100 to rotate it; The rotation driving unit 1300 rotates the rotating plate 1100.

At least one slit 1111 through which the laser beam L1 can pass can be formed on the rotating plate 1100. For example, two slits 1111 may be formed in the rotating plate 1100. The slits 1111 may have a rectangular shape and extend in a radial direction of the rotary plate 1100.

However, the number and shape of the slits 1111 can achieve various deformations. As an example, the number of slits 1111 may be single as shown in FIG. 5a or three or more different from the figure. As another example, the shape of the slit 1111A may be an elliptical shape as shown in Fig. 5b. Further, the width of the slit 1111A may be appropriately changed in the circumferential direction as needed.

Referring again to FIG. 3, the rotation driving portion 1300 can provide a rotational driving force to the rotating plate 1100. The rotation plate 1100 is rotated by the rotation driving portion 1300, and the rotation speed of the rotary plate 1100 can be 50 rpm to 4000 rpm. However, the rotational speed of the rotating plate 1100 is not necessarily limited to this, and may be changed according to the frequency to be set of the laser beam L2 that is irradiated onto the object W to be processed.

The cross-sectional shape of the rotating plate 1100 in the direction perpendicular to the rotation axis A may be circular. However, the cross-sectional shape of the rotating plate 1100 is not limited thereto, and various modifications can be achieved. For example, the cross-sectional shape of the rotating plate 1100c may be polygonal as shown in Fig. 5c.

Referring to Fig. 4, the diameter D of the rotary plate 1100 may be 500 mm or less. However, the diameter D of the rotating plate 1100 may be more than twice the diameter of the region where the laser beam L1 is irradiated to the rotating plate 1100.

Hereinafter, a process of switching the frequency of the laser beam L1 by the frequency conversion unit 1000 configured as described above will be described.

Referring to FIGS. 3 to 4, the laser beam L1 irradiated from the laser irradiation unit 200 can be selectively passed through the frequency conversion unit 1000 by the slit 1111 by the rotation of the rotary plate 1100 in which the slit 1111 is formed. For example, a part of the laser beam L1 passes through the rotating plate 1100 by the slit 1111, but the remaining laser beam L1 collides with a portion of the rotating plate 1100 where the slit 1111 is not formed, and cannot pass. Therefore, the frequency of the laser beam L2 irradiated to the object W by the frequency conversion unit 1000 can be changed differently from the frequency of the laser beam L1. For example, when the frequency of the laser beam L1 irradiated by the laser irradiation unit 200 is the first frequency, the frequency of the laser beam L2 passing through the frequency conversion unit 1000 may be a second frequency different from the first frequency. For example, the second frequency can be less than the first frequency.

6a, 6b, and 6c are diagrams for explaining a process of converting the frequency of the laser beam L1 by the frequency conversion unit 1000 of the laser processing system 1 of an embodiment, and Fig. 6a is a view showing the laser irradiation unit FIG. 6b is a view showing a period in which the slit 1111 passes through a region where the laser beam L1 is irradiated by the laser irradiation unit 200, and FIG. 6c is a view showing a state in which the laser beam L1 is emitted from the rotation of the rotating plate 1100. A diagram of the laser beam L2 passing through the frequency conversion unit 1000.

Referring to FIG. 6a, the laser beam L1 illuminated by the laser irradiation unit 200 may be a pulsed laser beam. For example, the laser beam L1 can have 6 pulses per unit time t0.

Referring to FIG. 6b, since the rotating plate 1100 is rotated by the rotation driving portion 1300 The slit 1111 formed in the rotary plate 1100 can pass through the region irradiating the laser beam L1 three times per unit time t0.

With the combination of the laser irradiation unit 200 and the frequency conversion unit 1000, the second, fourth, and sixth pulses of the laser beam L1 pass through the rotating plate 1100, and conversely, the first, third, The fifth pulse cannot pass through the rotating plate 1100. Therefore, the laser beam L2 passing through the frequency conversion unit 1000 can have three pulses per unit time t0 as shown in Fig. 6c. That is, the laser beam can be changed from the laser beam L1 having six pulses per unit time t0 to the laser beam L2 having three pulses per unit time t0 by the frequency conversion unit 1000.

7a, 7b, and 7c are diagrams for explaining a process of converting the frequency of the laser beam by the frequency conversion unit 1000 of the laser processing system 1 of another embodiment, and are shown in Figs. 6a and 6b. A diagram of changing the rotational speed of the rotating plate 1100 is shown in Fig. 6c.

Referring to Fig. 7a, as in Fig. 6a, the laser beam L1 can have 6 pulses per unit time t0.

Referring to Fig. 7b, the rotational speed of the rotating plate 1100 can be changed. For example, the rotating plate 1100 can be rotated by the slit 1111 in a manner of irradiating the region of the laser beam L1 four times in a unit time t0.

Referring to Figures 7a through 7c, the third and sixth pulses of the laser beam L1 pass through the rotating plate 1100, and conversely, the first, second, fourth, and fifth pulses cannot pass through the rotating plate 1100. Therefore, the laser beam L2 passing through the frequency conversion unit 1000 can have two pulses per unit time t0 as shown in Fig. 7c.

When the unit time t0 is 1 second, the frequency of the laser beam L1 is 6 Hz, and when the period of the slit 1111 of the rotating plate 1100 is converted into a frequency, the frequency of the rotating plate 1100 is 4 Hz. In this case, the frequency of the laser beam L2 is the least common multiple of the frequency of the laser beam L1 and the frequency of the rotating plate 1100, that is, 2 Hz.

6a, 6b, 6c and 7a, 7b, and 7c, even if the frequency of the laser beam L1 is the same, the laser beam L2 of the rotating plate 1100 is rotated by the rotation speed of the rotating plate 1100. The frequency is also different.

On the other hand, in the above embodiment, the case where the laser beam L1 is a pulsed laser beam has been mainly described. However, the laser beam L1 is not limited to a pulsed laser beam, and may be a continuous laser beam.

8a, 8b, and 8c are diagrams for explaining a process of converting the frequency of the laser beam by the frequency conversion unit 1000 of the laser processing system 1 according to still another embodiment, and are shown in Figs. 6a and 6b. A diagram of changing the laser beam L1 to a continuous laser beam in Fig. 6c.

Referring to FIGS. 8a to 8c, the laser beam L1 passes through the rotating plate 1100 only when the slit 1111 of the rotating plate 1100 passes through the region irradiating the laser beam L1. Therefore, the laser beam L2 passing through the frequency conversion unit 1000 can have three pulses per unit time t0 as shown in Fig. 8c.

As shown in FIG. 6a, FIG. 6b, FIG. 6c to FIG. 8a, FIG. 8b, and FIG. 8c, in the laser irradiation apparatus of the embodiment and the laser processing system 1 including the same, the object to be processed W and the thunder are arranged. The frequency conversion unit 1000 between the irradiation units 200 changes the frequency of the laser beam. In other words, by forming the slit 1111 The rotating plate 1100 rotates the mechanical structure to easily change the frequency of the laser beam L2 applied to the object W.

By changing the frequency of the laser beam L2, the energy density applied to the object W by the laser beam L2 can be controlled. The energy density applied to the object W by the laser beam is determined by the product of the energy of the unit pulse of the laser beam and the frequency of the laser beam. Therefore, by controlling the frequency of the laser beam L2 by the frequency conversion unit 1000, the energy density applied to the object W by the laser beam L2 can be controlled.

Referring again to FIGS. 3 and 4, the rotating plate 1100 can be divided into a passing region 1110 through which the slit 1111 is formed to pass the laser beam L1, and a blocking region 1120 in which the laser beam L1 is blocked without forming the slit 1111.

While the rotating plate 1100 is rotating, the passing region 1110 of the rotating plate 1100 and the blocking region 1120 periodically pass through the lower portion of the laser irradiation unit 200. Thereby, when the passing region 1110 passes through the lower portion of the laser irradiation unit 200, the laser beam L1 passes through the rotating plate 1100, and when the blocking region 1120 passes through the lower portion of the laser irradiation unit 200, the laser beam L1 cannot pass through the rotating plate 1100. And was blocked.

When the laser beam L1 that has not passed through the rotating plate 1100 is continuously irradiated to a part of the blocking region 1120, the blocking region 1120 may also have a possibility of heating or breaking. However, in the laser irradiation apparatus of the embodiment and the laser processing system 1 including the same, the rotating plate 1100 has a rotating configuration, whereby the blocking area 1120 of the irradiation laser beam L1 is rotated. Therefore, the laser beam L1 can be uniformly irradiated to a plurality of positions in the blocking region 1120 in the circumferential direction. Therefore, in the laser processing system 1 of the embodiment, it is possible to prevent a problem that occurs when the blocking region 1120 is at rest, that is, a part of the blocking region 1120 is heated or damaged by the concentrated irradiation of the laser beam L1. For example, in the laser processing system 1 of the embodiment, when the energy density of the laser beam L1 is 16,000 W/cm ² or less, the rotating plate 1100 is not damaged.

On the other hand, the blocking region 1120 and the passing region 1110 are arranged in the rotational direction, so that even if a part of the blocking region 1120 is broken, the laser beam L1 does not affect the passing through the passing region 1110. However, unlike the embodiment, in the case where the configuration of the region 1110 and the blocking region 1120 is arranged in the irradiation direction of the laser beam L1, such a blocking region 1120 is generated when the blocking region 1120 is broken or heated. The laser beam L1 is prevented from passing through the passing area 1110. However, in the embodiment, the rotating plate 1100 rotates and the blocking region 1120 and the passing region 1110 are arranged in the rotational direction, so that even if a part of the blocking region 1120 is broken, a part of the broken blocking region 1120 does not hinder the laser. The bundle L1 passes through the passage area 1110.

The rotating plate 1100 can have a low reflectance to the laser beam L1. For example, in the rotating plate 1100, the reflectance of the surface opposed to the laser irradiation unit 200 may be 10% or less. As an example, the material of the rotating plate 1100 may be aluminum (Al) or stainless steel (SUS). Since the rotating plate 1100 has a low reflectance, it is possible to prevent or reduce the reflection of the laser beam L1 that has not passed through the slit 1111 toward the peripheral member (not shown) while the rotating plate 1100 is rotating. Therefore, it is possible to prevent the peripheral member from being damaged or heated.

9a and 9b are a perspective view and a side view of the chamber unit of Fig. 1. In Fig. 10a and Fig. 10b, the internal cross section of the chamber unit is shown.

Referring to FIGS. 9a to 10b, the chamber unit 100 includes a base plate 105, and a cover plate 110 provided to cover the substrate 105. Here, a first window (window) 121 and a second window 122 are provided on the cover plate 110. Further, a stage 130 on which the object W is stacked is provided on the substrate 105.

The first window 121 is a position through which the laser beam L2 passing through the frequency conversion unit 1000 is transmitted, and is provided to the first wall surface 110a of the cover plate 110 (the upper surface of the cover plate in Fig. 9a).

The first window 121 may include a material that can transmit the wavelength of the incident laser beam L2 well. For example, in the case where the laser beam L2 has a wavelength of, for example, an ultraviolet range of 248 nm, 266 nm, 355 nm, or the like, the first window 121 may include, for example, fused silica or the like. Further, in the case where the laser beam L2 has a wavelength in the visible light range, the first window 121 may include, for example, quartz (Quartz) or the like. In addition, in the case where the laser beam L2 has a wavelength in the infrared range, the first window 121 may include ZnSe or the like. However, the material of the first window 121 mentioned above is merely an example, and in addition, the first window 121 may include other various materials.

The second window 122 is a position at which the measurement beam DL for measuring the temperature is transmitted, and is provided to the second wall surface 110b of the cover plate 110 (one side of the cover plate 110 in Fig. 9a). The measurement beam DL emitted from the temperature measuring unit 300 disposed outside the chamber unit 100, for example, the upper portion of the chamber unit 100, may be transmitted through the second window 122 of the cover plate 110 to be irradiated to the processing stacked on the stage 130. A specific area of the object W. Thereby, the temperature measuring unit 300 can measure the object to be processed in real time. The temperature of a particular area of W.

The second wall surface 110b on which the second window 122 is disposed may be formed obliquely with respect to the first wall surface 110a on which the first window 121 is disposed. As described above, the reason why the second wall surface 110b of the second window 122 that is positioned to transmit the measurement beam DL is obliquely formed with respect to the first wall surface 110a on which the first window 121 that transmits the laser beam L2 is positioned is that by adjusting The measurement beam DL emitted from the temperature measuring unit 300 is incident on the angle of the second window 122, and the measurement beam DL is accurately reached at a desired position on the object W in the chamber unit 100. On the other hand, the present embodiment is not necessarily limited thereto, and the second wall surface 110b on which the second window 122 is provided may not be formed obliquely with respect to the first wall surface 110a on which the first window 121 is provided.

The measurement beam DL transmitted through the second window 122 may have a different wavelength than the laser beam L2 transmitting the first window 121, but is not necessarily limited thereto. The second window 122 may include a material that can transmit the wavelength of the incident measurement beam DL well. For example, in the case where the measurement beam DL has a wavelength of an infrared range, the second window 122 may include ZnSe or the like. However, the above is only an example. The measurement beam DL used in the present embodiment may have various wavelength ranges, and accordingly, the second window 122 may include a material that can transmit light of the wavelength of the measurement beam DL well.

A stage 130 on which the object W to be processed is placed on the upper surface of the substrate 105. In addition, as described below, the stage 130 may be disposed obliquely with respect to the substrate 105, and the above-described inclination angle may be adjusted to various angles. To this end, one end portion of the stage 130 can be moved up and down with respect to the substrate 105 by the guiding member 137, and the other end portion of the platform 130 is fixed with a pin 135 that prevents vertical movement. As mentioned above, phase The reason why the stage 130 is disposed obliquely with respect to the substrate 105 is that the laser beam L2 that transmits the first window 121 or the measurement beam DL that transmits the second window 122 can be accurately incident on a desired region of the object W. On the other hand, the stage 130 disposed on the substrate 105 can be disposed in such a manner as to be movable on the substrate 105 to a desired position.

The chamber unit 100 of the present embodiment preferably maintains its interior as a vacuum. This is because the object to be processed W is not hindered by other gases or impurities during the reaction by irradiating the laser beam L2, and the specific reaction with the object W is performed in a vacuum state. The gas is injected into the interior of the chamber unit 100, and a highly reliable processing process can be performed.

Referring to Fig. 10a, at the upper portion of the chamber unit 100, a laser irradiation unit 200 that emits a laser beam L1 and a frequency conversion unit 1000 that converts the laser beam L1 into a laser beam L2 having a different frequency are provided. A temperature measuring unit 300 that emits a measurement beam DL for measuring temperature is provided on one upper portion of the chamber unit 100. Further, inside the chamber unit 100, the stage 130 is inclined by a first angle θ ₁ with respect to the substrate 105, and the upper surface of the stage 130 inclined in this manner is stacked with the object W.

In the configuration as described above, the laser beam L2 emitted from the laser irradiation unit 200 is transmitted to the object W by being transmitted through the first window 121 provided to the first wall surface 110a (for example, the upper surface) of the cap plate 110. Here, the laser beam L2 is incident obliquely with respect to the surface of the object W. As described above, the laser beam L2 is irradiated to a specific region of the object W, whereby the processing operation can be performed.

In such a laser processing process, a part of the laser beam L2 incident on the object W is reflected, and the laser beam RL reflected in this manner is preferably not formed in the inner wall surface of the cover 110. One window 121 and a portion of the second window 122 travel on one side. This is because the first window 121 or the second window 122 is caused by the reflected laser beam RL when the laser beam RL reflected by the processing object W travels toward the first window 121 or the second window 122 side. Damaged.

The measurement beam DL emitted from the temperature measuring unit 300 can be transmitted to a specific region of the processing object W by transmitting the second window 122 provided to the inclined second wall surface 110b (for example, the side surface) of the cap plate 110. Thereby, the temperature measuring unit 300 can measure the temperature of the specific region of the processing target W in real time while the laser processing operation is being performed. Here, the specific region of the object W to be measured for temperature may be a laser irradiation region. However, the present invention is not limited thereto, and may be a peripheral region of the laser irradiation region or another region.

Referring to Figure 10b, the platform 130 is linearly moved in one direction on the substrate 105 as compared to Figure 10a, and the platform 130 is tilted at a second angle θ _{2 that} is greater than the first angle θ ₁ shown in Figure 10a. The laser beam L2 emitted from the laser irradiation unit 200 and transmitted through the first window 121 can be irradiated to other areas of the object W to perform a laser processing operation. Then, the measurement beam DL emitted from the temperature measuring unit 300 and transmitted through the second window 122 can be irradiated to a specific region of the object W to measure the monitoring temperature in real time. On the other hand, the inclination angles θ ₁ and θ ₂ of the stage 130 shown in Figs. 10a and 10b can be appropriately adjusted so that the angle at which the laser beam L2 and/or the measurement beam DL are incident on the object W can be optimal. Chemical.

As described above, in the chamber unit 100 of the present embodiment, the first window 121 and the second window 122 are respectively disposed on different wall surfaces of the cover 110, that is, the first wall surface 110a and the second wall surface 110b, thereby performing laser The beam L2 is transmitted through the first window 121 and irradiated to a specific region of the object W to perform a laser processing operation, and the measurement beam DL is transmitted through the second window 122 to measure the temperature of a specific region of the object W. In this way, during the laser processing operation, the temperature of the specific area (for example, the laser irradiation area or its surrounding area) of the processing target W can be measured in real time, and the laser processing operation can be confirmed in real time. Qualified quality.

As a specific example, in the case of a specific object to be processed such as a film, the temperature or damage interval of the object W to be reacted by the irradiation of the laser beam can be measured in real time. Further, when the laser beam L2 is irradiated to the mask in a state where the etching gas is injected into the chamber unit 100, it is possible to measure only the temperature of the irradiation region of the laser beam L2 or the surrounding region thereof. The area performs an etching process. Further, while performing the wafer annealing process, the temperature of the specific irradiation region of the laser beam L2 or the surrounding region thereof is measured in real time, whereby the annealing process can be accurately performed.

In addition, the first window 121 and the second window 122 that respectively transmit the laser beam L2 and the measurement beam DL are disposed on the cover plate 110 of the chamber unit 100, whereby various lights having different wavelengths from the laser beam L2 can be used. Used as a measurement beam DL.

Figure 11 is a cross-sectional view showing the interior of a chamber unit in accordance with another exemplary embodiment of the present invention.

Referring to FIG. 11, unlike the above embodiment, the chamber of the present embodiment is single. In the element 100', the stage 130 is disposed in parallel with the substrate 105, and is not disposed obliquely with respect to the substrate 105. Here, the stage 130 is provided so as to be movable on the substrate 105 to a desired position, whereby the laser beam L2 and the measurement beam DL can be irradiated to the respective regions of the object W.

Further, the laser irradiation unit 200 can be disposed such that the laser beam L2 can be incident obliquely with respect to the surface of the object W placed on the stage 130. At this time, the frequency conversion unit 1000 may be disposed so as to be inclined at an acute angle with respect to the laser beam L1 as shown in FIG. 11, but the present invention is not limited thereto, and may be disposed vertically with respect to the laser beam L1.

As described above, the embodiment in which the stage 130 is provided in parallel with the substrate 105 can be applied, for example, to a case where the size of the laser beam L2 irradiated to the object W is large.

Fig. 12 is a perspective view schematically showing a laser processing system according to still another embodiment of the present invention. In Fig. 12, a laser processing system 1 including the above-described chamber unit 100 is shown.

Referring to FIG. 12, the laser processing system 1 of the present embodiment may include a laser irradiation unit 200, a temperature measuring unit 300, a chamber unit 100, and a frequency converting unit 1000. For example, the laser irradiation unit 200 and the frequency conversion unit 1000 may be disposed to an upper portion of the chamber unit 100, and the temperature measurement unit 300 may be disposed to an upper portion of one side of the chamber unit 100. However, the above is merely an example, and the positions of the laser irradiation unit 200, the frequency conversion unit 1000, and the temperature measuring unit 300 can be variously modified.

The laser irradiation unit 200 emits the laser beam L1, and can emit ultraviolet rays. Range of wavelengths of the laser beam L1. However, the above description is merely an example, and in addition to this, the laser irradiation unit 200 may emit the laser beam L1 of various wavelength ranges according to the type of processing work.

The frequency conversion unit 1000 converts the frequency of the laser beam L2 applied to the processing object W to be different from the frequency of the laser beam L1. The frequency conversion unit 1000 can be replaced with other frequency conversion units (not shown) as needed. For example, it is possible to replace the frequency conversion unit with a different number of slits.

The temperature measuring unit 300 irradiates the measurement beam DL for measuring the temperature, and measures the temperature of the region irradiated with the laser beam L2 in the object W or the surrounding region thereof or another region. For example, the temperature measuring unit 300 may irradiate the measurement beam DL having a wavelength in the visible light range or the ultraviolet range, but is not necessarily limited thereto. As such a temperature measuring unit 300, for example, a thermal imaging camera, a pyrometer, or the like can be used. However, it is not limited to this.

Referring to FIG. 10a, the chamber unit 100 includes a substrate 105, a cover plate 110 disposed to cover the substrate 105, and a first window 121 and a second window 122 disposed to the cover plate 110. Here, the first window 121 is a position at which the laser beam L2 is transmitted, and may be provided to the first wall surface 110a of the cap plate 110 (for example, the upper surface of the cap plate 110). The laser beam L2 emitted from the laser irradiation unit 200 provided at the upper portion of the chamber unit 100 can be transmitted through the first window 121 of the cover plate 110 to be irradiated to a specific region of the processing object W stacked on the stage 130. Such a first window 121 may include a material that can transmit the wavelength of the incident laser beam L2 well.

The second window 122 is a bit that is transmitted using the measurement beam DL to measure the temperature. The second wall surface 110b of the cover plate 110 (for example, a side surface of the cover plate 110) may be disposed. The measurement beam DL emitted from the temperature measuring unit 300 provided on the upper side of the chamber unit 100 can be transmitted through the second window 122 of the cover plate 110 to be irradiated to a specific region of the processing object W stacked on the stage 130. Thereby, the temperature measuring unit 300 can measure the temperature of a specific region of the object W in real time. The second wall surface 110b on which the second window 122 is disposed may be formed obliquely with respect to the first wall surface 110a on which the first window 121 is disposed. On the other hand, the measurement beam DL transmitted through the second window 122 may have a different wavelength from the laser beam L2 transmitting the first window 121, but is not necessarily limited thereto. The second window 122 may include a material that can transmit the wavelength of the incident measurement beam DL well.

A stage 130 on which the object W is placed is placed on the substrate 105, and the stage 130 is provided to be movable on the substrate 105. In addition, the platform 130 can be disposed in a manner inclined with respect to the substrate 105. On the other hand, the platform 130 may not be disposed in a manner inclined with respect to the substrate 105.

A vacuum unit 400 may be further disposed at a lower portion of the chamber unit 100. Such a vacuum unit 400 can function to be connected to the chamber unit 100 to maintain the interior of the chamber unit 100 as a vacuum. Further, a pressure display unit 500 that functions to display the internal pressure of the chamber unit 100 may be further provided on the upper portion of the vacuum unit 400.

As described above, the first window 121 and the second window 122 are provided in the cover 110 of the chamber unit 100, whereby the laser beam L2 is transmitted through the first window 121 to be irradiated to a specific region of the object W for laser processing. In the work, the measurement beam DL is transmitted through the second window 122 to measure the temperature of a specific region of the object W. Therefore, performing laser During the processing operation, the temperature of a specific region (for example, a laser irradiation region or a surrounding region thereof) for monitoring the object W can be measured in real time. Further, as the measurement beam DL, light having various wavelengths different from the laser beam L2 can be used.

The frequency conversion unit 1000 and the chamber unit 100 of the embodiment of the present invention described above can be utilized in various fields in which laser processing is utilized. As an example, the chamber unit 100 and the frequency conversion unit 1000 can be used in laser annealing, removal of a mask adhesive, etching using a laser, or the like. Moreover, it can also be effectively used for measuring a change in temperature characteristics, a phase transition, and the like due to an absorption rate of an object to be processed by a laser.

The embodiments of the present invention have been described above, but the above-described embodiments are merely examples, and those skilled in the art should understand that various modifications and equivalent embodiments can be implemented in accordance with the embodiments described above.

Claims (2)

A laser processing system comprising: a laser irradiation unit that illuminates a laser beam; and a chamber unit that can house an object to be processed, and transmits the laser beam from the outside to the object to be processed, The chamber unit includes: a substrate; a cover plate disposed to cover the substrate; a first window disposed to the cover plate to transmit the laser beam; and a second window to be coupled to the first window Provided to the cover plate in a spaced manner, using a measurement beam transmission for determining a temperature of a specific region of the object to be processed; a frequency conversion unit disposed between the chamber unit and the laser irradiation unit, Rotatable and having a rotating plate formed with at least one slit; and a platform provided to the substrate to stack the object to be processed, the platform being disposed in a manner movable on the substrate, wherein The platform is disposed in such a manner that one end thereof moves up and down so as to be tiltable with respect to the substrate. The laser processing system according to claim 1, wherein the laser beam is obliquely incident with respect to a surface of the object to be processed stacked on the platform, and the reflection from the object to be processed A portion of the laser beam travels toward an area of the inner wall surface of the cover that does not form the first window and the second window.