TWI648748B - Conductive paste, conductive coating film, electrical circuit, conductive laminate, and touch panel - Google Patents

Conductive paste, conductive coating film, electrical circuit, conductive laminate, and touch panel Download PDF

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Publication number
TWI648748B
TWI648748B TW103133576A TW103133576A TWI648748B TW I648748 B TWI648748 B TW I648748B TW 103133576 A TW103133576 A TW 103133576A TW 103133576 A TW103133576 A TW 103133576A TW I648748 B TWI648748 B TW I648748B
Authority
TW
Taiwan
Prior art keywords
conductive
conductive paste
thermoplastic resin
printing
acid
Prior art date
Application number
TW103133576A
Other languages
English (en)
Chinese (zh)
Other versions
TW201517060A (zh
Inventor
Yasuhiro Sakamoto
坂本康博
Wataru KAWASHIMA
川島涉
Maki Kinami
木南萬紀
Original Assignee
Toyobo Co., Ltd.
日商東洋紡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co., Ltd., 日商東洋紡股份有限公司 filed Critical Toyobo Co., Ltd.
Publication of TW201517060A publication Critical patent/TW201517060A/zh
Application granted granted Critical
Publication of TWI648748B publication Critical patent/TWI648748B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW103133576A 2013-09-30 2014-09-26 Conductive paste, conductive coating film, electrical circuit, conductive laminate, and touch panel TWI648748B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-204073 2013-09-30
JP2013204073 2013-09-30

Publications (2)

Publication Number Publication Date
TW201517060A TW201517060A (zh) 2015-05-01
TWI648748B true TWI648748B (zh) 2019-01-21

Family

ID=52743233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103133576A TWI648748B (zh) 2013-09-30 2014-09-26 Conductive paste, conductive coating film, electrical circuit, conductive laminate, and touch panel

Country Status (4)

Country Link
JP (1) JP6767089B2 (fr)
CN (1) CN105612585B (fr)
TW (1) TWI648748B (fr)
WO (1) WO2015046096A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6372689B2 (ja) * 2014-07-28 2018-08-15 Dic株式会社 導電性ペースト及び導電性パターンの形成方法
WO2016170943A1 (fr) * 2015-04-21 2016-10-27 東レ株式会社 Élément de stratifié et panneau tactile
DE102015122034A1 (de) * 2015-12-16 2017-06-22 Ferro Gmbh Thermoplastische Siebdruckpaste
CN105702323B (zh) * 2016-03-15 2017-08-25 张家港瑞诺光电材料科技有限公司 一种柔性导电银浆及制备方法
KR102346389B1 (ko) * 2016-03-29 2022-01-04 도요보 가부시키가이샤 전연성 도전 페이스트 및 곡면 프린트 배선판의 제조 방법
WO2018029750A1 (fr) * 2016-08-08 2018-02-15 東レ株式会社 Élément stratifié et écran tactile
KR20180024827A (ko) * 2016-08-31 2018-03-08 주식회사 동진쎄미켐 전도성 조성물 및 이를 이용한 전도성 적층체
CN109716448B (zh) * 2016-09-16 2021-04-09 株式会社则武 树脂基板用银糊、包含树脂基板用银糊的电子元件及其制造方法
TWI779066B (zh) * 2017-07-19 2022-10-01 日商東洋紡股份有限公司 黏接劑組成物
WO2019039209A1 (fr) * 2017-08-24 2019-02-28 東洋紡株式会社 Pâte conductrice, circuit imprimé tridimensionnel, capteur tactile et procédés, respectivement pour produire ces produits
CN110097998B (zh) * 2018-01-31 2021-06-15 上海宝银电子材料有限公司 一种转印工艺触摸屏用导电银浆及其制备方法
CN108749244B (zh) * 2018-06-07 2020-07-14 浙江欣麟新材料技术有限公司 一种光学高柔性导电玻璃膜及其制备方法
CN109903885B (zh) * 2018-12-29 2020-10-02 无锡帝科电子材料股份有限公司 导电浆料及其应用、太阳能电池电极和太阳能电池
CN110993149A (zh) * 2019-12-26 2020-04-10 无锡晶睿光电新材料有限公司 一种金属网格电容式柔性触摸屏用银浆及其制备方法与应用
CN111370159A (zh) * 2020-03-11 2020-07-03 中国人民解放军国防科技大学 一种导电浆料及其制备方法和应用
CN114189983B (zh) * 2020-09-15 2024-03-26 北京梦之墨科技有限公司 一种柔性导电浆料及柔性电路板
CN113593776B (zh) * 2021-07-30 2023-03-10 长春捷翼汽车零部件有限公司 线束的生产方法及线束

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201025359A (en) * 2008-10-24 2010-07-01 Toyo Boseki Low-temperature curable conductive paste for plating and electric wiring using the same
WO2011046076A1 (fr) * 2009-10-15 2011-04-21 東洋紡績株式会社 Pâte électro-conductrice, film électro-conducteur, panneau tactile et procédé de fabrication du film électro-conducteur
TW201132720A (en) * 2010-01-08 2011-10-01 Toyo Boseki Electrically conductive paste and metal thin film
WO2013137110A1 (fr) * 2012-03-16 2013-09-19 日東電工株式会社 Composition adhésive et feuille adhésive

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4168631B2 (ja) * 2001-12-28 2008-10-22 東洋製罐株式会社 金属包装体用塗料及びその塗料を用いた金属包装体
JP5376808B2 (ja) * 2008-01-25 2013-12-25 Ｄｉｃ株式会社 透明導電性フィルムの製造方法、透明導電性フィルム及びタッチパネル
JP5699447B2 (ja) * 2009-10-09 2015-04-08 東洋インキＳｃホールディングス株式会社 導電性インキ
TWI570197B (zh) * 2011-03-31 2017-02-11 Taiyo Holdings Co Ltd Conductive paste
JP5767498B2 (ja) * 2011-03-31 2015-08-19 太陽ホールディングス株式会社 導電性ペースト
JP6001265B2 (ja) * 2011-12-21 2016-10-05 太陽ホールディングス株式会社 導電性ペースト
JP2014080555A (ja) * 2012-10-16 2014-05-08 Pelnox Ltd 熱硬化性組成物及び熱硬化性導電性ペースト
JP6301267B2 (ja) * 2012-12-27 2018-03-28 荒川化学工業株式会社 スクリーン印刷用導電性ペースト、並びに配線の製造方法及び電極の製造方法
US9464198B2 (en) * 2013-01-30 2016-10-11 Dic Corporation Conductive paste, method for forming conductive pattern, and object with printed conductive pattern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201025359A (en) * 2008-10-24 2010-07-01 Toyo Boseki Low-temperature curable conductive paste for plating and electric wiring using the same
WO2011046076A1 (fr) * 2009-10-15 2011-04-21 東洋紡績株式会社 Pâte électro-conductrice, film électro-conducteur, panneau tactile et procédé de fabrication du film électro-conducteur
TW201132720A (en) * 2010-01-08 2011-10-01 Toyo Boseki Electrically conductive paste and metal thin film
WO2013137110A1 (fr) * 2012-03-16 2013-09-19 日東電工株式会社 Composition adhésive et feuille adhésive

Also Published As

Publication number Publication date
CN105612585B (zh) 2018-03-16
JP6767089B2 (ja) 2020-10-14
JPWO2015046096A1 (ja) 2017-03-09
WO2015046096A1 (fr) 2015-04-02
CN105612585A (zh) 2016-05-25
TW201517060A (zh) 2015-05-01

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