TWI648233B - Substrate breaking method and substrate breaking device - Google Patents

Substrate breaking method and substrate breaking device Download PDF

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Publication number
TWI648233B
TWI648233B TW104111828A TW104111828A TWI648233B TW I648233 B TWI648233 B TW I648233B TW 104111828 A TW104111828 A TW 104111828A TW 104111828 A TW104111828 A TW 104111828A TW I648233 B TWI648233 B TW I648233B
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TW
Taiwan
Prior art keywords
substrate
scribe line
scribing
cutting
forming member
Prior art date
Application number
TW104111828A
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English (en)
Chinese (zh)
Other versions
TW201600481A (zh
Inventor
市川克則
西尾仁孝
上野勉
Original Assignee
日商三星鑽石工業股份有限公司
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Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201600481A publication Critical patent/TW201600481A/zh
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Publication of TWI648233B publication Critical patent/TWI648233B/zh

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
TW104111828A 2014-05-30 2015-04-13 Substrate breaking method and substrate breaking device TWI648233B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014111857A JP6349970B2 (ja) 2014-05-30 2014-05-30 基板分断方法並びに基板分断装置
JP2014-111857 2014-05-30

Publications (2)

Publication Number Publication Date
TW201600481A TW201600481A (zh) 2016-01-01
TWI648233B true TWI648233B (zh) 2019-01-21

Family

ID=54840959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111828A TWI648233B (zh) 2014-05-30 2015-04-13 Substrate breaking method and substrate breaking device

Country Status (4)

Country Link
JP (1) JP6349970B2 (ja)
KR (1) KR20150137986A (ja)
CN (1) CN105314837B (ja)
TW (1) TWI648233B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3066488B1 (fr) * 2017-05-19 2022-03-04 Saint Gobain Procede de rompage d'une feuille de verre
JP2019025792A (ja) * 2017-07-31 2019-02-21 三星ダイヤモンド工業株式会社 ブレイク装置
TWI664134B (zh) * 2018-08-07 2019-07-01 住華科技股份有限公司 輸送設備及使用其之輸送方式
JP2020066539A (ja) * 2018-10-22 2020-04-30 坂東機工株式会社 ガラス板の折割機械
NL2022696B1 (en) * 2019-03-08 2020-09-17 Voortman Steel Machinery Holding B V A sheet processing machine and a method for processing sheet material
CN110154249B (zh) * 2019-06-19 2021-06-18 江苏泽海机械科技有限公司 一种脆性板材剪切机
TWI754486B (zh) * 2020-12-10 2022-02-01 昌陽科技有限公司 玻璃基板裂片裝置
JP2024004015A (ja) * 2022-06-28 2024-01-16 日東電工株式会社 シート材の分断方法及びシート材の分断装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10338534A (ja) * 1997-06-03 1998-12-22 Toshiba Corp スクライブ装置、ブレーク装置、ガラス切断装置およびスクライブ方法
JP2001347497A (ja) * 2000-06-06 2001-12-18 Hitachi Ltd 分離切断方法及び装置
WO2007142264A1 (ja) * 2006-06-08 2007-12-13 Toray Engineering Co., Ltd. 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100907462B1 (ko) * 2005-05-30 2009-07-13 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판 절단장치 및 절단방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10338534A (ja) * 1997-06-03 1998-12-22 Toshiba Corp スクライブ装置、ブレーク装置、ガラス切断装置およびスクライブ方法
JP2001347497A (ja) * 2000-06-06 2001-12-18 Hitachi Ltd 分離切断方法及び装置
WO2007142264A1 (ja) * 2006-06-08 2007-12-13 Toray Engineering Co., Ltd. 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板

Also Published As

Publication number Publication date
JP2015223818A (ja) 2015-12-14
CN105314837A (zh) 2016-02-10
TW201600481A (zh) 2016-01-01
JP6349970B2 (ja) 2018-07-04
KR20150137986A (ko) 2015-12-09
CN105314837B (zh) 2019-05-10

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