TWI643828B - Scribing device - Google Patents

Abstract

A scoring device is provided. Even if the width of the material region of the end of the substrate is as small as the edge grip of the gripper, it does not interfere with the gripper, and can scribe a predetermined scribe line in the X direction.

A scoring device includes a gripping and transporting unit B that transports a substrate W to a downstream scoring unit C in a state where the substrate W is gripped by the clamping claws 11, and is moved along by a cutter wheel 23 of the scoring unit C The scribe line of the scribe line S1 in the X direction which is orthogonal to the substrate surface and the substrate conveying direction is processed. The scribe line S1 adjacent to the X direction of the clamping jaw 11 is processed by the cutter wheel 23. During processing, the gripping claw 11 is used to release the grip of the substrate W, and the gripping claw 11 is configured to retreat to a position that does not interfere with the cutter wheel 23.

Description

Scribing device

The invention relates to a scoring device for a substrate made of brittle material. The surface of a substrate made of a brittle material such as glass, silicon, ceramics, etc. is processed along a predetermined line for scoring (grooving) for breaking. In particular, the present invention relates to a scoring device for a brittle material substrate having a terminal material region formed on a peripheral portion of the four sides.

In general, when a unit substrate is cut from a brittle material substrate (hereinafter simply referred to as a "substrate"), as shown in FIG. 9, first, the scribes along the X direction orthogonal to the surface of the substrate W ' The predetermined line S1 and the scribe line S2 in the Y direction are processed by scribing. The next step is to cut the unit substrate to be a product by scribing along these scribing lines S1 and S2. In this case, in order to make the end face of the unit substrate to be cut to have high accuracy, a terminal material region T is formed on the four sides adjacent to the substrate W '. When the chip is broken, the terminal material region is cut off and destroyed.

As a method of forming the scribe lines S1 and S2 described above, one end of the substrate (for the upstream side in the conveying direction) is transported to the scribe unit by the gripper, and the scribe line is formed by the scribe unit. As a method, for example, Patent Document 1 and the like are known.

FIG. 10 (a) is a description of a general method for causing the substrate W ′ to be transported to the scribe unit by gripping the claws shown in FIG. 9, and forming a scribe line on the surface of the substrate by the cutter wheel of the scribe unit. Illustration.

The substrate W 'is held in a horizontal posture by the clamping claws 30, and is directed toward the pillar 32 of the scoring unit 31. It is conveyed, by pressing the cutter wheel 34 of the scoring head 33 mounted on the cylinder 32 against the surface of the substrate W ′ and rotating it in the X direction, the scribe line is processed along the scribe line S1 in the X direction . In addition, the processing line of the scribe line S2 in the Y direction is such that the holder (outside of the drawing) of the cutter wheel 34 is rotated, and the rotation direction of the cutter wheel 34 is changed to the Y direction, and the substrate W 'is borrowed. The claw 30 grasps and moves toward the cutter wheel 34.

Generally, when the substrate W 'is held by the clamping claws 30, as shown in Fig. 10 (b), the edge grip L1 must be 2.5 to 3 mm. In the past, the width L2 of the end material region T was approximately 10 mm, and even if the edge grip required 2.5 to 3 mm, 7 to 7.5 mm remained between the adjacent scribe line S1 in the X direction, so that it could not interfere with the gripper 30 And scribing. In addition, in the case where the scribe line S2 along the Y direction of the substrate conveying direction is scribed, the chuck jaw 30 is arranged to be held away from the scribe line S1 away from the scribe line S1, and can be engraved without being disturbed by the chuck 30. Draw. In addition, even if it is assumed that the clamping jaw 30 is loaded on the scribe line S2 in the Y direction that must be processed, the diameter of the cutter wheel 34 is as small as 1 to 3 mm in diameter. The position of the predetermined line S1 can be scribed by the scribe line S2 in the Y direction by stopping the substrate transportation before contacting the gripper 30.

[Patent Document 1] Japanese Patent Laid-Open No. 2013-249206

However, in recent years, in order to make the unit substrate of the product compact or to effectively use the material, the width of the terminal material region T has been narrowed. Specifically, it is required to be reduced to about 3 mm. However, if the width of the terminal material region T is reduced to 3 mm, as shown in FIG. 6 (b), the jaw 11 interferes with the scribe line S1 adjacent to the X direction, and the scribe line cannot be scribed. Line S1.

Therefore, the object of the present invention is to provide a scoring device in view of the above problems, that is, The width of the material area at the end of the substrate is as small as about 3 mm from the edge grip of the clamping claw, and it is not disturbed by the clamping claw, and can be scribed along a predetermined line of the X direction.

To solve the above problems, the present invention adopts the following technical means. That is, the scoring device of the present invention is provided with a gripping and conveying unit that transfers an upstream end portion of a substrate to a scoring unit on a downstream side in a state of being gripped by a gripper, and a knife provided in the scoring unit. The wheel is used to process the scribe line extending on the surface of the substrate in a direction orthogonal to the substrate conveying direction, and is characterized in that when the scribe line adjacent to the gripper is processed by the cutter wheel, The gripper releases the grip of the substrate, and the gripper is configured to retract to a position that does not interfere with the cutter wheel.

According to the present invention, even if the end material area of the substrate to be processed is set to be approximately the same width as the edge grip of the gripper, when processing the scribe line adjacent to the X direction of the gripper, the gripper performs The grip of the substrate is released, and the gripper is retracted to a position where it does not interfere with the cutter wheel, so that the scoring can be performed smoothly.

In the above-mentioned invention, it is preferable that the scoring unit includes a pressing member configured to press the upper surface of the substrate and to hold the substrate between the platen on which the substrate is placed, and which is capable of lifting and lowering the substrate.

Thereby, during the scribe process of the X direction adjacent to the clamping claw, after the clamping claw releases the gripping of the substrate, the surface of the substrate can also be stably held by the pressing member.

A‧‧‧Loader

B‧‧‧Grasp and transfer unit

C‧‧‧Scribing unit

S1‧‧‧X direction scribe line

S2 ‧‧‧Y-line scribe line

T‧‧‧end material area

W‧‧‧ substrate

W1‧‧‧Unit substrate area

1‧‧‧ conveyor belt

3‧‧‧Adsorption plate

10‧‧‧platform

11‧‧‧Jaw

11a‧‧‧Upper claw

11b‧‧‧Lower claw

12‧‧‧ jaw member

20‧‧‧ cylinder

23‧‧‧knife wheel

26‧‧‧Pressing member

FIG. 1 is an overall perspective view showing an example of a scoring device of the present invention.

FIG. 2 is a side view of the scoring device shown in FIG. 1. FIG.

FIG. 3 is a partially enlarged cross-sectional view showing a state in which a substrate is gripped by a gripper on a platen.

FIG. 4 is an operation explanatory diagram of a gripper of a conveying unit.

Fig. 5 is a side view showing a portion of the scoring unit.

FIG. 6 is an explanatory view showing a state in which the substrate is transported to the scribe unit after the substrate is gripped by the gripper in a plan view.

FIG. 7 is an explanatory view showing a platen transfer process of a substrate by a loader.

FIG. 8 is an explanatory diagram showing another example of the interference avoidance operation by the gripper.

FIG. 9 is a plan view showing a conventional layout of a predetermined scribe line on a substrate.

FIG. 10 is an explanatory diagram showing an example of the substrate scribing method of FIG. 9 in a plan view.

Hereinafter, details of the scoring device of the present invention will be described with reference to FIGS. 1 to 8. As shown in FIG. 6 (a), the substrate W that is scribed in the present invention is divided into six scribe lines S1 in the X direction and scribe lines S2 in the Y direction. The unit substrate region W1 and the terminal material region T around the four sides. In this embodiment, the width of the terminal material region T is about 3 mm.

The scoring device of the present invention, as shown in FIGS. 1 and 2, is composed of a loader A, a gripping and conveying unit B, and a scoring unit C which are sequentially arranged from the upstream side of the substrate conveying direction.

In the following description, the substrate transfer direction is referred to as the Y direction, and the direction orthogonal to the substrate transfer direction (Y direction) is referred to as the X direction. The upstream side in the substrate transfer direction is referred to as the upstream side only, and the downstream side in the substrate transfer direction is referred to as the downstream side only.

The loader includes a gripping and conveying unit B that sucks the conveying member 2 and selects the substrate W sent by the conveyer 1 and transfers it to the downstream side.

The suction conveying member 2 includes a suction plate 3 having a plurality of air suction holes underneath, and the suction plate 3 is held by the support member 5 so as to be able to move up and down by a lifting mechanism 4 such as a hydraulic cylinder. The support member 5 is formed so as to be able to reciprocate along the guide rail 7 of the pillar 6 extending in the Y direction.

The transfer unit B includes a plurality of scribe units C for transferring the substrate W to the downstream side while the upstream end portion of the substrate W placed on the table 10 is held by the clamping claws 11. In the example, five gripper members 12 are provided. The gripper member 12 is held by a common frame 13 extending in the X-square term, and the frame 13 is formed at both ends along the left and right guide rails 14 extending in the Y direction so as to be able to reciprocate.

The jaws 11 of each jaw member 12 are movably arranged along a groove 15 extending in the Y direction of the table 10. When the substrate W is held by the clamping claws 11, as shown in FIG. 3, the lower surface of the substrate is connected to the upper surface of the platen 10 so as to be able to be placed on the platen 10.

Moreover, as shown in detail in FIG. 4, the clamping jaw 11 is formed by an upper claw piece 11 a and a lower claw surface 11 b, and the upper claw piece 11 a uses a hinge 11 c as a fulcrum so that it can be clamped from the substrate of FIG. 4 (a). It is formed by turning the head position to the release position of FIG. 4 (b). At this release position, in the present embodiment, when the scribe line S1 in the X direction on the most upstream side is scribed by the cutter wheel 23 of the scribe unit C described later, the upper claw piece 11a must be incompatible with the knife. The manner in which the wheel 23 interferes with the avoidance posture and is wide open is formed. The chuck and release operation of the upper claw piece 11a is performed by the hydraulic cylinder 11d.

The scoring unit C is, as shown in detail in FIG. 5, provided with: a gate-shaped pillar 20 arranged across the table 10; and a gate extending in the X direction (front and rear directions in FIG. 5) provided on the pillar. A guide member 21; and a guide member 21 that can move in the X direction along a guide rail 21a provided on the guide member Installed scoring head 22. In the scoring head 22, a bracket 24 having a cutter wheel 23 at a lower end portion is provided by a lifting mechanism 25 such as a hydraulic cylinder to be lifted and lowered. The bracket 24 is mounted with respect to the scoring head 22 in a manner that the mounting angle can be changed, and thereby the direction of the blade end of the cutter wheel 23 can be changed in the X direction and the Y direction.

Further, the scoring unit C is provided with a pressing member 26 that is capable of lifting and lowering the substrate W placed on the table 10 and holding the substrate W between the table 10. The pressing member 26 is driven by a driving mechanism 27 such as a hydraulic cylinder.

Furthermore, in FIGS. 1 and 2, the drive mechanism for the purpose of reciprocating the suction conveying member 2 of the loader A along the guide rail 7 in the Y direction, and holding the guide rails 8 a and 20 of the conveying unit B, A driving mechanism for moving in the X direction, a driving mechanism for moving the frame 13 holding the transport unit B to and fro in the Y direction along the guide rail 14, and a scoring head 22 of the scoring unit C along the guide rail 21a. The driving mechanism for the purpose of reciprocating in the X direction is omitted to avoid complication of the drawings.

Next, the operation of the scoring device will be described.

As shown in Figs. 7 (a) to (d), the substrate W system carried by the conveyor belt 1 is selected by the suction plate 3 of the loader A, and moves to the downstream side along the guide rail 7 and spans the grip The frame 13 of the transfer unit B is sent onto the table 10.

As shown in FIG. 6, the substrate W transferred to the table 10 is gripped on the gripper 11 of the transfer unit B by the end material region T of the upstream end portion. In this case, the edge grip of the jaw 11 is 3 mm which is slightly the same as the width of the end material region T. In this state, the substrate W moves toward the scribe unit C on the downstream side. When the X-direction scribe line S1 on the most downstream side (leading end side) of the substrate W reaches directly below the cutter wheel 23 of the scribe unit C, the transport unit B is held. The substrate conveyance is stopped, the cutter wheel 23 is lowered, and the scribe is pushed in the X direction while pushing along the predetermined scribe line at this moment.

In this way, the scribe line S1 in the X direction is sequentially scribed from the downstream side. However, as shown in FIG. 6 (b), in the case of scoring the planned line S1 in the X direction upstream of the processing, since the edge grip of the jaw 11 and the width of the end material region T are slightly the same, the cutter wheel 23 and the jaw 11 Disturbance cannot be scored. Therefore, at this time, as shown in FIG. 4 (b), the upper claw piece 11 a of the clamping claw 11 holding the substrate W is rotated by the hydraulic cylinder 11 d to a releasing posture without interfering with the cutter wheel 23. Thereby, the X-direction scribe line S1 on the most upstream side can be smoothly scribed.

Also, in this embodiment, at the position after the gripping claw 11 releases the gripping of the substrate W, since the upper claw piece 11a of the gripping claw 11 is rotated to the retracted posture, the substrate releasing action and interference avoiding motion of the gripping claw 11 can be controlled by An action proceeds quickly.

Furthermore, when scoring the predetermined line S1 in the X direction upstream of the scribe, the pressing member 27 is lowered to a position connected to the surface of the substrate W, and the substrate W clamp which becomes unstable by the chuck of the clamp jaw 11 is released. It is better to hold between the platens 10.

After all the scribe lines S1 in the X direction are scribed, when the scribe line S2 in the Y direction is processed, the direction of the cutting edge of the cutter wheel 23 is changed to the Y direction, so that the substrate W is returned to the position shown in FIG. 6 (a) and borrowed. The substrate W is grasped by the gripper 11 and moved to the cutter wheel 23. At this time, as shown in FIG. 6 (a), if the clamping jaw 11 is held in advance at a position away from the scribe line S2 in the Y direction, the cutter wheel 23 can be scored without being disturbed by the clamping jaw 11. .

In the above-mentioned embodiment, during the processing of the scoring predetermined line S1 in the uppermost X direction, although the upper jaw piece 11a is opened at the upper position in the release position of the clamping jaw 11 to avoid interference with the cutter wheel 23, As shown in FIG. 8, the gripper 11 is moved away from the frame 23 to the upstream side to avoid it. Interference with the cutter wheel 23 is also preferable.

As mentioned above, although the representative embodiment of the present invention has been described, the present invention is not necessarily limited to the structure of the above embodiment to achieve its purpose, and can be appropriately modified and changed without departing from the scope of the patent application.

The invention can be applied to a scoring device for processing a scribe line on the surface of a substrate made of a brittle material such as glass.

Claims (3)

A scoring device includes: a gripping and transporting unit that transports an upstream end portion of a substrate to a scoring unit on a downstream side while being gripped by a gripper; and a cutter wheel provided on the scoring unit to the surface of the substrate The processing of the scribe line extending in a direction orthogonal to the substrate conveying direction is characterized in that when the scribe line adjacent to the gripper is processed by a cutter wheel, the gripper releases the substrate. The gripper is formed so as to retreat to a position that does not interfere with the cutter wheel; wherein the scoring unit is provided with a lifting mechanism capable of pressing the upper surface of the substrate and holding the substrate between the substrate and a platen on which the substrate is placed. Pressing member. For example, the scoring device of the first patent application range, wherein when the gripper releases the gripping of the substrate, the upper jaw piece of the gripper rotates in a posture to avoid interference with the cutter wheel in its released position. Way to form. For example, in the scoring device of the first patent application range, when the gripper releases the substrate, the gripper moves to the upstream side of the substrate carrying direction to avoid interference with the cutter wheel.