KR101970620B1 - Substrate procesing apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, wherein the substrate processing apparatus includes a stage on which a polishing process is performed on a substrate, a grip unit for gripping a substrate, a base frame disposed above the grip unit, and one end of the base frame. The fixed end is fixed and the other end is connected to the grip unit and is arranged to face the fixed stretchable stretchable stretchable part and the fixed stretchable part, one end is rotatably mounted to the base frame and the other end is connected to the grip unit, and the selectively stretchable rotating stretchable part By adjusting the stretching lengths of the fixed and rotating stretch parts differently so as to selectively tilt the grip unit, thereby positioning the substrate at the correct point and preventing damage to the substrate during loading and unloading of the substrate. The beneficial effect of preventing can be obtained.

Description

Substrate Processing Unit {SUBSTRATE PROCESING APPARATUS}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of positioning a large area substrate at an accurate position and preventing damage to the substrate during loading and unloading of the substrate.

Recently, with increasing interest in information display and increasing demand for using a portable information carrier, a lightweight flat panel display (FPD), which replaces a conventional display device, a cathode ray tube (CRT), is used. The research and commercialization of Korea is focused on.

In the field of flat panel display devices, the light and low power consumption of the liquid crystal display device (LCD) has been the most noticeable display device, but the liquid crystal display device is not a light emitting device but a light receiving device, and the brightness and contrast ratio (contrast) Due to disadvantages such as ratio, viewing angle, and the like, development of a new display device capable of overcoming these disadvantages is being actively developed. Among these, one of the next-generation displays that are in the spotlight recently is an organic light emitting display (OLED).

In general, in the display apparatus, as the fine patterns are integrated and formed on the substrate at a high density, corresponding precision polishing should be performed.

In particular, the substrate is gradually increasing in size, and the process of polishing unnecessary portions while uniformizing the pattern of the substrate is a very important process and requires stable polishing reliability as it determines the completeness of the product.

Conventionally known methods of polishing a pattern of a substrate include a method of mechanically polishing a substrate (pattern) and a method of dipping and polishing the entire substrate in a polishing solution. However, the method of polishing the substrate only mechanically or immersed in the polishing solution has a problem of low polishing accuracy and low production efficiency.

Recently, as part of a method for precisely polishing a pattern of a substrate, a technique of polishing a pattern of a substrate by a chemical mechanical polishing (CMP) method in which mechanical polishing and chemical polishing are performed in parallel is disclosed. Here, chemical mechanical polishing refers to a method in which a slurry for chemical polishing is supplied together with polishing of a substrate by rotating contact with a polishing pad.

On the other hand, the substrate is subjected to a polishing process in a state arranged on the surface plate provided in the polishing region, if the position of the substrate disposed on the surface plate is slightly shifted, there is a problem that the polishing accuracy and polishing uniformity of the substrate is lowered, Since damage to the substrate may occur due to interference with peripheral components during the transfer of the substrate, the substrate should be able to be placed exactly in the intended position.

By the way, since a large area glass substrate (for example, 6th generation substrate of 1500 mm * 1850 mm) has a very large size, when placing a large area glass substrate on a surface plate (when loading), a large area glass substrate and a surface plate There is a problem that a large area glass substrate is temporarily suspended on the upper surface of the surface plate due to air or liquid fluid (for example, a cleaning liquid) existing therebetween, and a phenomenon occurs in which the large area glass substrate is deviated from the correct position (loading position).

In addition, when the substrate is lifted (unloaded) from the surface plate after polishing of the substrate is completed, surface tension due to a liquid fluid (for example, a cleaning liquid) existing between the glass substrate and the surface plate, or the sliding of the glass substrate is prevented. It is not only very difficult to remove the substrate by the adhesion force between the pad (PAD) placed on the surface and the glass substrate in order to prevent and absorb shock, but also inevitably the substrate must be removed with very strong force. This may be damaged.

To this end, recently, a large area substrate (a substrate having a side length of 1 m or more) can be accurately positioned at an intended position, and various studies have been made to prevent damage and breakage of the substrate during the loading and unloading process of the substrate. However, it is still insufficient and development of this is required.

It is an object of the present invention to provide a substrate processing apparatus capable of accurately placing a large area substrate at an intended position.

In particular, an object of the present invention is to suppress the attitude and position of the substrate during the loading process of the substrate and to accurately position the substrate at the intended position.

In addition, an object of the present invention is to prevent the substrate from twisting during the unloading process of the substrate, and to easily enter the substrate.

In addition, an object of the present invention is to prevent damage and breakage of the substrate, and to increase the stability and reliability.

According to a first preferred embodiment of the present invention for achieving the above objects of the present invention, a substrate processing apparatus includes a stage on which a polishing process is performed on a substrate, a grip unit for gripping a substrate, and an upper portion of the grip unit. A base frame to be disposed, one end of which is fixed to the base frame and the other end of which is connected to the grip unit, which is arranged to face a fixed stretchable stretchable stretchable stretchable portion, and one end that is rotatably mounted to the base frame, and the other end of the grip A rotating stretchable stretchable portion connected to the unit and selectively stretchable, the grip unit is selectively tilted by adjusting different stretch lengths of the fixed stretchable portion and the stretchable stretchable stretched portion.

This is to increase the loading and unloading accuracy of a large area substrate and to prevent damage to the substrate during loading and unloading of the substrate.

Above all, the present invention is advantageous in that the grip unit (substrate) can be tilted selectively inclined with respect to the stage, thereby suppressing the position and position of the substrate during the loading process and accurately positioning the substrate at the intended position. The effect can be obtained.

That is, a large area glass substrate (e.g., a sixth generation substrate of 1500 mm * 1850 mm) has a very large size, so that when placing a large area glass substrate flat on a flat stage (e.g., a plate) During loading), the large area glass substrate is temporarily suspended on the top surface of the stage by air or liquid fluid (e.g., cleaning liquid) present between the large area glass substrate and the stage and is out of position (loading position) ( There is a problem that occurs).

However, in the present invention, by selectively tilting the substrate with respect to the stage, the loading process of the substrate can be performed while the substrate is tilted. In this way, the loading process of the substrate is performed in an inclined tilted state rather than in a flat state, so that air or liquid fluid existing between the substrate and the stage escapes between the substrate and the stage during the loading process of the substrate. Therefore, it is possible to minimize the floating phenomenon of the substrate by the air layer or the liquid layer during the loading process of the substrate, to suppress the misalignment and posture of the substrate, and to obtain the advantageous effect of accurately positioning the substrate at the intended position. have.

In particular, the present invention by adjusting the extension length of the fixed expansion and contraction portion fixed to the base frame so that the grip unit that grips the substrate is selectively tilted inclined with respect to the stage, the support frame by the operation of the fixed expansion and contraction portion An advantageous effect of suppressing unstable flow (flow shaking in the left and right directions) can be obtained.

That is, when the expansion and contraction portion mounted on both sides of the base frame is formed of a structure (rotational expansion and contraction structure on both one side and the other side of the base frame), for example, any one side of the elastic portion disposed on both sides of the base frame Increasing the length of the stretchable part arranged in the upper and lower sides and the height of the support frame is changed, and the left and right positions of the support frame are changed. Therefore, the control of the expansion and contraction portion (extension length control) according to the change in the length of the expansion and contraction portion must reflect both the height and angle and the left and right positions of the support frame, which makes the control of the expansion and contraction part difficult and difficult. However, in the present invention, the fixed elastic part is fixedly mounted to the base frame, and only linear movement in the vertical direction of the support frame connected to the fixed elastic part is allowed, and the left and right movement is constrained, thereby expanding and contracting the fixed elastic part and the rotating elastic part. Length control can be performed more easily.

Moreover, since the fixed elastic part can suppress the left and right movement of the support frame, that is, the support frame can be connected to the fixed elastic part fixedly mounted to the base frame and the left and right movement can be suppressed at the source. It is possible to minimize the shaking of the substrate due to the unstable flow of the support frame during the operation of the negative, it is possible to obtain a favorable effect of preventing the grip failure due to the shaking and increase the stability and reliability. Therefore, it is not necessary to separately mount a separate guide means for preventing unstable flow of the support frame, for example, a guide bushing for guiding movement along the up and down direction of the support frame, thereby simplifying the structure and improving design freedom. Advantageous effects can be obtained.

Preferably, the fixed expansion and contraction portion is fixed to the base frame to be stretchable in the vertical direction.

In addition, when the expansion and contraction length of the fixed expansion and contraction portion changes, the rotating expansion and contraction portion is interlocked and configured to rotate relative to the base frame. In this manner, by rotating the rotating expansion and contraction portion relative to the base frame in response to the change in the stretching length of the fixed expansion and contraction portion (when tilting the grip unit), an advantageous effect of automatically compensating for the rotational displacement change of the variable unit can be obtained.

At this time, the fixed expansion and contraction portion, which is spaced apart along one side of the base frame, and includes a plurality of first movable cylinder selectively stretchable. In addition, the rotational expansion and contraction portion is spaced apart along the other side of the base frame, and includes a plurality of second flexible electric cylinder that is selectively stretchable.

The grip method of the grip unit can be variously changed according to the required conditions and design specifications. For example, the grip unit includes a support frame that is angle-adjustable by a fixed stretch part and a rotary stretch part, and a gripper mounted to the support frame and gripping the substrate.

In this case, the gripper may be configured to be vacuum adsorbed on the substrate. Preferably, the gripper is configured to grip the non-active area of the substrate. As described above, by allowing the gripper to grip the substrate in the non-active region of the substrate (grip the non-active region of the substrate), an advantageous effect of preventing damage to the substrate and lowering of the yield due to contact of the gripper can be obtained.

The base frame is mounted to a guide frame that moves along a guide rail disposed along a transfer path of the substrate, and as the guide frame moves along the guide rail, the base frame (grip unit) moves from the loading area to the stage, or You can move to the unloading area in.

Preferably, one side of the substrate is disposed adjacent to the stage (tilting relative to one side of the substrate) with respect to the other side of the substrate while the grip unit is tilted with respect to the stage. Here, the one side of the substrate is disposed adjacent to the stage is defined as a concept including both the one side of the substrate is disposed in contact with the stage, or the one side of the substrate is disposed so as to be spaced apart to approach the stage.

For reference, the substrate processing apparatus according to the present invention may be used to load a substrate onto a stage after receiving the substrate in the loading region, and the substrate is loaded while the substrate is tilted inclined with respect to the stage.

In this case, the loading process of the substrate disposed to be tilted with respect to the stage may be performed while the tilting angle of the support frame (grip unit) is kept constant or the tilting angle of the support frame (grip unit) may be gradually decreased. have.

Preferably, the tilting angle (tilting angle of the substrate) of the grip unit relative to the stage is formed between 0.1 ° and 3 °. In other words, as the tilting angle of the substrate increases (for example, when it exceeds 3 °), the separation height of the substrate increases, so that the substrate may be damaged or broken when the substrate falls due to the grip release by the gripper. Since the loading time of the substrate increases and the process efficiency decreases, the tilting angle (tilting angle of the substrate) of the grip unit with respect to the stage is preferably formed at 0.1 ° to 3 °.

In addition, the loading process of the tilted substrate may be performed by sequentially turning off the grip by a plurality of grippers. That is, the grip of the substrate by the plurality of grippers is sequentially turned off in a direction toward the other side of the substrate facing one side of the substrate, and as the grips by the plurality of grippers are sequentially released, the substrate is one side. Is progressively loaded onto the stage along the direction from one side to the other.

As described above, the grip by the plurality of grippers is sequentially turned off while the substrate is tilted so that the loading can be performed, whereby the loading position of the substrate can be more accurately matched.

That is, when the grips of all the grippers are simultaneously released (OFF) while the tilting angle of the substrate (support frame) is kept constant, air or liquid fluid existing between the substrate and the stage is moved outwardly between the substrate and the stage. Although exiting, the substrate may be pushed out at the intended loading position. Accordingly, the present invention allows the grip of the substrate by the plurality of grippers to be sequentially turned off along the direction toward the other side of the substrate facing one side of the substrate, thereby accurately positioning the substrate without pushing the substrate. An advantageous effect of loading on can be obtained. In particular, when the grip of a part of the plurality of grippers is released, the substrate is in initial contact with the stage because the remaining part of the substrate is held in the grip unit (fixed state) while the part of the substrate is in contact with the stage. In this case, an advantageous effect of suppressing the position of the substrate can be obtained.

Preferably, the plurality of grippers are provided to be elastically movable with respect to the support frame. In this way, by allowing the plurality of grippers to move elastically with respect to the support frame, the grip by some of the plurality of grippers is released, so that the deflection of the substrate (a state where only a part of the substrate is partially in contact with the stage) is achieved. Even if it occurs, it is possible to obtain an advantageous effect of keeping the grip state of the gripper holding the grip on the substrate at a portion adjacent to the deflection portion (broken portion) of the substrate more stably, and further reducing the bending of the substrate.

The polishing process of the substrate may be performed using various polishing members depending on the required conditions and design specifications. In one example, the polishing process for the substrate is performed by a polishing belt which circulates and rotates along a path defined by a roller. In another example, the polishing process for the substrate is performed by a polishing pad rotating in contact with the substrate.

In addition, the substrate processing apparatus according to the present invention can be used to unload the substrate in the stage of the substrate, the polishing process is completed. Preferably, the substrate is unloaded from the stage while the grip unit is gradually tilted with respect to the stage.

As described above, the present invention allows the grip unit (substrate) to be unloaded in an inclined tilted state with respect to the stage, whereby an advantageous effect of making the unloading process of the substrate easier and more stable can be obtained.

That is, since a large area glass substrate (for example, a 6th generation substrate of 1500 mm * 1850 mm) has a very large size, when lifting a large area glass substrate from a flat stage (for example, a surface plate) (unloading) It is difficult to remove the substrate due to the surface tension by the liquid fluid (for example, the cleaning liquid) existing between the substrate and the stage, or by the adhesive force acting between the pad (PAD) and the glass substrate disposed on the surface. In addition, it is inevitable to remove the substrate with very strong force, which may damage the substrate during this process.

However, in the present invention, by untilting the substrate relative to the stage, the unloading process of the substrate may be performed while the substrate is tilted. As such, the unloading process of the substrate may be performed in an inclined tilted state rather than in a flat state, thereby minimizing the influence of surface tension caused by the liquid fluid present between the substrate and the stage during the unloading process of the substrate. It is possible to remove the substrate from the stage with a relatively small force, and the advantageous effect of minimizing the damage of the substrate due to the force for removing the substrate can be obtained.

In addition, the substrate processing apparatus may include a floating portion for floating the substrate on the stage.

The floating portion makes the unloading process of the substrate easier by floating the substrate at the stage before unloading the substrate. In other words, by lifting the substrate before the unloading of the substrate so that the fluid layer is formed in advance between the stage and the substrate, it is possible to obtain an advantageous effect of more smoothly lifting the substrate from the stage. For example, the floating portion is configured to float the substrate by spraying a fluid on the bottom of the substrate.

In addition, the substrate processing apparatus may include a non-contact adsorption unit for adsorbing the substrate in a non-contact manner.

Thus, by including a non-contact adsorption portion for adsorbing the substrate in a non-contact manner, the grip state of the substrate is more stably maintained during the loading or unloading process of the substrate, and the advantageous effect of lifting the substrate more easily during unloading is achieved. You can get it.

In particular, the gripper adsorbs the substrate during the unloading process of the substrate, thereby allowing the substrate to be stably separated from the stage without bending or deformation of the substrate. That is, since the gripper grips only the edge portion (non-active region) of the substrate, when the substrate is unloaded with the gripper only, the force that separates the substrate from the stage is applied to the center portion of the substrate (active region). It is difficult to apply effectively. Therefore, according to the present invention, by adsorbing the center portion (active region) of the substrate using the non-contact adsorption portion, an advantageous effect of making the unloading step of the substrate more smoothly can be obtained.

Of course, it is also possible to configure the gripper to grip the active area of the substrate, but since the active area of the substrate is very sensitive to contact, the contact in the active area should be able to be rejected as much as possible. Accordingly, the present invention can obtain an advantageous effect of preventing damage such as scratches caused by contact in the region of the substrate by adsorbing the active region of the substrate using the non-contact adsorption portion.

More specifically, the non-contact adsorption unit is configured to non-contact adsorption of the substrate using the surface tension by the fluid.

For example, the non-contact adsorption unit includes an adsorption plate disposed on an upper surface of the substrate, and a nozzle formed on the adsorption plate and selectively spraying a fluid between the substrate and the adsorption plate.

Preferably, a plurality of nozzles are formed to be spaced apart along at least one of the length direction and the width direction of the suction plate. In this way, by attaching a plurality of nozzles on the bottom of the adsorption plate at even intervals, and by the fluid is uniformly injected from the bottom of the adsorption plate as a whole, the advantageous effect of uniformly forming the adsorption force between the adsorption plate and the substrate as a whole You can get it.

Preferably, the adsorption plate is formed of a PVC material, the adsorption plate is formed to have a thickness of 3 ~ 30mm. Further, by forming the reinforcing rib on the upper surface of the adsorption plate, even if the adsorption plate is formed in a thin thickness, it is possible to obtain an advantageous effect of allowing the adsorption plate to have sufficient rigidity. And the cylinder which moves a suction plate to an up-down direction is included.

In addition, the substrate processing apparatus includes an adjusting unit for adjusting the horizontality of the suction plate. Thus, by providing the adjusting portion and maintaining the horizontal state of the adsorption plate with respect to the substrate, it is possible to obtain an advantageous effect that the adsorption force of the substrate via the fluid is uniformly formed throughout the substrate. More specifically, the adjusting unit includes a leveler plate fixed to the cylinder and to which the suction plate is mounted, and an adjusting member for adjusting a gap between the leveler plate and the suction plate.

For reference, the substrate in the present invention is formed of a rectangular substrate having a length of at least one side larger than 1 m. For example, as a substrate to be subjected to a chemical mechanical polishing process, a sixth generation glass substrate having a size of 1500 mm * 1850 mm may be used.

As described above, according to the present invention, an advantageous effect of increasing the loading and unloading accuracy of the substrate and preventing damage to the substrate during loading and unloading of the substrate can be obtained.

In particular, according to the present invention, by allowing the grip unit (substrate) to be tilted selectively inclined with respect to the stage, it is possible to suppress the attitude and position of the substrate during the loading process and to accurately position the substrate at the intended position. Advantageous effects can be obtained.

That is, a large area glass substrate (e.g., a sixth generation substrate of 1500 mm * 1850 mm) has a very large size, so that when placing a large area glass substrate flat on a flat stage (e.g., a plate) During loading), the large area glass substrate is temporarily suspended on the top surface of the stage by air or liquid fluid (e.g., cleaning liquid) present between the large area glass substrate and the stage and is out of position (loading position) ( There is a problem that occurs).

However, in the present invention, by selectively tilting the substrate with respect to the stage, the loading process of the substrate can be performed while the substrate is tilted. In this way, the loading process of the substrate is performed in an inclined tilted state rather than in a flat state, so that air or liquid fluid existing between the substrate and the stage escapes between the substrate and the stage during the loading process of the substrate. Therefore, it is possible to minimize the floating phenomenon of the substrate by the air layer or the liquid layer during the loading process of the substrate, to suppress the misalignment and posture of the substrate, and to obtain the advantageous effect of accurately positioning the substrate at the intended position. have.

Further, according to the present invention, the grip of the substrate by the plurality of grippers is sequentially released in a direction toward the other side of the substrate facing one side of the substrate, thereby loading the substrate at the correct position without the substrate phenomena. It is possible to obtain an advantageous effect. In particular, when the grip of a part of the plurality of grippers is released, the substrate is in initial contact with the stage because the remaining part of the substrate is held in the grip unit (fixed state) while the part of the substrate is in contact with the stage. In this case, an advantageous effect of suppressing the position of the substrate can be obtained.

In addition, according to the present invention, by allowing the grip unit (substrate) to be unloaded in a tilted state with respect to the stage, an advantageous effect of making the unloading process of the substrate easier and more stable can be obtained. .

That is, since a large area glass substrate (for example, a 6th generation substrate of 1500 mm * 1850 mm) has a very large size, when lifting a large area glass substrate from a flat stage (for example, a surface plate) (unloading) It is difficult to remove the substrate due to the surface tension by the liquid fluid (for example, the cleaning liquid) existing between the substrate and the stage, or by the adhesive force acting between the pad (PAD) and the glass substrate disposed on the surface. In addition, it is inevitable to remove the substrate with very strong force, which may damage the substrate during this process.

However, in the present invention, by untilting the substrate relative to the stage, the unloading process of the substrate may be performed while the substrate is tilted. As such, the unloading process of the substrate may be performed in an inclined tilted state rather than in a flat state, thereby minimizing the influence of surface tension caused by the liquid fluid present between the substrate and the stage during the unloading process of the substrate. It is possible to remove the substrate from the stage with a relatively small force, and the advantageous effect of minimizing the damage of the substrate due to the force for removing the substrate can be obtained.

In addition, according to the present invention by adjusting the extension length of the fixed expansion and contraction fixed to the base frame so that the grip unit is selectively tilted inclined with respect to the stage, the unstable flow of the support frame by the operation of the fixed expansion and contraction and rotational expansion and contraction ( The advantageous effect of suppressing the flow (swing in the left and right directions) can be obtained.

That is, when the expansion and contraction portion mounted on both sides of the base frame is formed of a structure (rotational expansion and contraction structure on both one side and the other side of the base frame), for example, any one side of the elastic portion disposed on both sides of the base frame Increasing the length of the stretchable part arranged in the upper and lower sides and the height of the support frame is changed, and the left and right positions of the support frame are changed. Therefore, the control of the expansion and contraction portion (extension length control) according to the change in the length of the expansion and contraction portion must reflect both the height and angle and the left and right positions of the support frame, which makes the control of the expansion and contraction part difficult and difficult. However, in the present invention, the fixed elastic part is fixedly mounted to the base frame, and only linear movement in the vertical direction of the support frame connected to the fixed elastic part is allowed, and the left and right movement is constrained, thereby expanding and contracting the fixed elastic part and the rotating elastic part. Length control can be performed more easily.

Moreover, since the fixed elastic part can suppress the left and right movement of the support frame, that is, the support frame can be connected to the fixed elastic part fixedly mounted to the base frame and the left and right movement can be suppressed at the source. It is possible to minimize the shaking of the substrate due to the unstable flow of the support frame during the operation of the negative, it is possible to obtain a favorable effect of preventing the grip failure due to the shaking and increase the stability and reliability. Therefore, it is not necessary to separately mount a separate guide means for preventing unstable flow of the support frame, for example, a guide bushing for guiding movement along the up and down direction of the support frame, thereby simplifying the structure and improving design freedom. Advantageous effects can be obtained.

Further, according to the present invention, by including a non-contact adsorption unit for adsorbing the substrate in a non-contact manner, the grip state of the substrate is more stably maintained during the loading or unloading process of the substrate, and the substrate is more easily lifted during unloading. Advantageous effects can be obtained.

In addition, according to the present invention, by performing the polishing process in a state where the substrate is loaded at the correct position, it is possible to increase the surface uniformity of the substrate, it is possible to obtain an advantageous effect of improving the polishing quality.

1 is a perspective view showing a substrate processing apparatus according to the present invention;
2 is a plan view showing a substrate processing apparatus according to the present invention,
3 is a front view showing a substrate processing apparatus according to the present invention;
4 is a substrate processing apparatus according to the present invention, which illustrates an active region and a non-active region of a substrate;
5 to 10 is a substrate processing apparatus according to the present invention, a view for explaining a loading process of the substrate,
11 and 12 are substrate processing apparatuses according to the present invention, which illustrate a polishing process of a substrate;
13 to 16 is a substrate processing apparatus according to the present invention, a diagram for explaining the unloading process of the substrate,
17 and 18 are diagrams for explaining a non-contact adsorption unit as the substrate processing apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by referring to the contents described in the other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.

1 is a perspective view showing a substrate processing apparatus according to the present invention, Figure 2 is a plan view showing a substrate processing apparatus according to the present invention, Figure 3 is a front view showing a substrate processing apparatus according to the present invention. 4 is a diagram for explaining an active region and a non-active region of a substrate as a substrate processing apparatus according to the present invention. 5 is a diagram illustrating a process of receiving a substrate in a loading area as a substrate processing apparatus according to the present invention, and FIG. 6 is a diagram illustrating a process of transferring a substrate to a stage as the substrate processing apparatus according to the present invention. 7 to 10 are diagrams for explaining a process of loading a substrate on a stage as a substrate processing apparatus according to the present invention. 11 and 12 are substrate processing apparatuses according to the present invention, which illustrate a polishing process of a substrate, and FIGS. 13 to 16 are substrate processing apparatuses according to the present invention, illustrating an unloading process of a substrate. It is a figure for following.

1 to 16, the substrate processing apparatus 1 according to the present invention includes a stage 100 for performing a polishing process on the substrate 10, a grip unit 200 for gripping the substrate 10, and , A base frame 310 disposed on the grip unit 200, one end of which is fixed to the base frame 310, and the other end of which is connected to the grip unit 200, and optionally elastically fixed and stretchable 320. It is disposed to face the fixed elastic portion 320, one end is rotatably mounted to the base frame 310 and the other end is connected to the grip unit 200 and optionally includes a rotational elastic portion 330 is stretchable, fixed The grip unit is selectively tilted by adjusting the stretch length of the stretchable part 320 and the rotary stretchable part 330 differently.

The stage 100 is disposed in a polishing region (not shown) provided between the loading region 101 and the unloading region 102, and the stage 100 mechanically polishes the substrate 10 (to the substrate pattern). A process or chemical mechanical polishing (CMP) process is performed. For example, a chemical mechanical polishing process of the substrate 10 may be performed by supplying a slurry for chemical polishing while mechanically polishing the surface of the substrate 10 using a polishing member (eg, a polishing pad or a polishing belt). Is done.

For reference, in the present invention, the substrate 10 is formed of a rectangular substrate 10 in which a pattern is formed and a length of at least one side is larger than 1 m. For example, as the substrate 10 to be subjected to the chemical mechanical polishing process, a sixth generation glass substrate 10 having a size of 1500 mm * 1850 mm is used as the substrate 10. In some cases, it is also possible to use 7th and 8th generation glass substrates as the substrate to be processed.

The substrate 10 is supplied to the loading area 101 by a transfer robot (not shown). The substrate 10 of the loading region 101 is transferred to the stage 100, and a polishing process for the substrate 10 is performed on the stage 100. Thereafter, the substrate 10 is transferred from the stage 100 to the unloading region 102 and then the next process is performed.

The stage 100 may be formed in various structures in which the substrate 10 may be mounted, and the present invention is not limited or limited by the shape and structure of the stage 100. For example, the stage 100 may be formed in a quadrangular shape.

In addition, a rectangular retainer 100a protrudes from an upper surface of the stage 100 to prevent separation of the substrate 10 during the polishing process. Preferably, the protruding height of the retainer 100a is formed to be equal to the thickness of the substrate 10. In some cases, it is also possible to configure the bottom surface of the substrate to be adsorbed onto the top surface of the stage while the polishing process is performed on the stage.

The grip unit 200 is provided to grip the substrate 10. Here, the grip unit 200 to grip the substrate 10, it is understood that the grip unit 200 grips the substrate 10 in a transportable or movable state, the grip method of the grip unit 200 It is not intended to be exhaustive or to limit the invention. For example, the grip unit 200 may be configured to grip the substrate 10 by an attachment, adsorption, or pressure method.

More specifically, the grip unit 200 is mounted on the support frame 210 and the support frame 210 that are angle-adjustable by the fixed stretchable part 320 and the rotary stretchable part 330, and grip the substrate 10. It includes a gripper 220. As an example, the gripper 220 may be configured to be vacuum-adsorbed to the substrate 10.

The support frame 210 may be formed in various shapes according to required conditions and design specifications. For example, the support frame 210 may be formed to have an approximately "H" shape. In some cases, the support frame may be formed to have a square or other geometric shape, and the present invention is not limited or limited by the shape and structure of the support frame.

The gripper 220 is mounted to the support frame 210 to face the top surface of the substrate 10. In this case, the gripper 220 may be directly mounted to the support frame 210, or alternatively, the gripper 220 may be mounted to the support frame 210 through a separate extension member or a connection member fixed to the support frame 210. Do.

The gripper 220 is configured to grip the substrate 10 in a vacuum suction method. As an example, a plurality of grippers 220 may be provided to independently adsorb the substrate 10. Preferably, the gripper 220 is configured to grip the non-active area 12 of the substrate 10. In this manner, the gripper 220 causes the gripper 220 to grip the non-active region 12 of the substrate 10 (grip the non-active region 12 of the substrate 10) by the gripper 220. The advantageous effect of preventing damage to the substrate 10 and lowering of the yield due to the contact of can be obtained.

Here, the non-active region 12 of the substrate 10 is defined as a region in which a pattern is not formed in the region of the substrate 10 or a dead zone in which a process is unnecessary.

As an example, the non-active area 12 of the substrate 10 may be formed at an edge portion of the active area 11 to surround the active area 11 of the substrate 10. Here, the active region 11 of the substrate 10 is defined as a region in which pixel cells and the like are formed substantially among the regions of the substrate 10, and generally, an area inside the edge of the substrate 10 is an active region ( 11). For reference, referring to FIG. 4, the non-active region 12 (hatched region) in the substrate 10 may be formed along the edge of the substrate 10, and the active region 11 may be formed in the substrate 10. It can be formed inside the edge.

In addition, the gripper 220 may be formed to have a rectangular shape (thin and long shape) having a length longer than the width. In this way, by forming the gripper 220 in a rectangular shape, the gripper 220 effectively grips the substrate 10 on the non-active region 12 having a narrow width without invading the active region 11. Advantageous effects can be obtained.

The tilting part 300 including the base frame 310, the fixed stretchable part 320, and the rotary stretchable part 330 includes a grip unit 200 which grips the substrate 10 with respect to the stage 100. It is provided for selectively tilting inclinedly.

Here, the grip unit 200 is tilted with respect to the stage 100, the grip unit 200 is defined as being inclined at a predetermined angle with respect to the stage 100, the grip unit ( As the 200 is tilted, the substrate 10 gripped by the grip unit 200 may also be disposed to be inclined at a predetermined angle with respect to the stage 100.

For reference, the base frame 310 is mounted to the guide frame 110 moving along the guide rail 110a disposed along the transfer path of the substrate 10, and the guide frame 110 supports the guide rail 110a. As it moves along, the base frame 310 may move from the loading area 101 to the stage 100 or from the stage 100 to the unloading area 102.

Preferably, one side of the substrate 10 is disposed adjacent to the stage 100 compared to the other side of the substrate 10 while the grip unit 200 is tilted inclined with respect to the stage 100 (substrate 10). Tilting relative to one side of Here, one side of the substrate 10 is disposed adjacent to the stage 100, one side of the substrate 10 is disposed in contact with the stage 100, or one side of the substrate 10 to the stage 100 It is defined as a concept that includes everything that is spaced apart in close proximity.

As such, the present invention allows the grip unit 200 (substrate) to be tilted selectively inclined with respect to the stage 100, thereby suppressing the attitude and position of the substrate 10 from shifting during the loading process, An advantageous effect of precisely arranging (10) at the intended position can be obtained.

That is, a large area glass substrate (e.g., a sixth generation substrate of 1500 mm * 1850 mm) has a very large size, so that when placing a large area glass substrate flat on a flat stage (e.g., a plate) During loading), the large area glass substrate is temporarily suspended on the top surface of the stage by air or liquid fluid (e.g., cleaning liquid) present between the large area glass substrate and the stage and is out of position (loading position) ( There is a problem that occurs).

However, in the present invention, by selectively tilting the substrate 10 with respect to the stage 100, the loading process of the substrate 10 may be performed while the substrate 10 is tilted. As such, the loading process of the substrate 10 is performed in an inclined tilted state rather than in a flat state, so that air existing between the substrate 10 and the stage 100 during the loading process of the substrate 10 or Since the liquid fluid can escape to the outside between the substrate 10 and the stage 100, the floating phenomenon of the substrate 10 by the air layer or the liquid layer is minimized during the loading process of the substrate 10, and the substrate 10 The position and the position of the c) can be suppressed, and an advantageous effect of accurately positioning the substrate 10 at the intended position can be obtained.

The base frame 310 may be formed in various shapes according to required conditions and design specifications. For example, the base frame 310 may be formed to have a rectangular shape. In some cases, the base frame 310 may be formed to have a circular or other geometric shape, and the present invention is not limited or limited by the shape and structure of the base frame 310.

One end of the fixed elastic portion 320 is fixed to the base frame 310, the other end of the fixed elastic portion 320 is connected to the grip unit 200, the fixed elastic portion 320 can be stretched based on one end have. Preferably, the fixed elastic portion 320 is fixed to be disposed perpendicular to the base frame 310 may be stretched in the vertical direction. More specifically, the fixed elastic part 320 includes a plurality of first electric cylinders 321 that are spaced apart along one side of the base frame 310 and are selectively stretchable.

The rotating elastic part 330 is disposed to face the fixed elastic part 320, one end of the rotating elastic part 330 is rotatably mounted to the base frame 310, and the other end of the rotating elastic part 330 is gripped. Is connected to the unit 200. The fixed elastic part 320 may rotate about the one end with respect to the base frame 310 and may be stretched about one end. More specifically, the rotary stretching unit 330 is spaced apart along the other side of the base frame 310, and includes a plurality of second electric cylinder 331 that can be selectively stretched.

In addition, when the stretch length of the fixed stretchable portion 320 is changed, the rotary stretchable portion 330 is interlocked and configured to rotate relative to the base frame 310. In this way, the rotational expansion and contraction portion 330 rotates with respect to the base frame 310 in response to the change in the extension length of the fixed expansion and contraction portion 320 (when the tilting of the grip unit). An advantageous effect can be obtained automatically.

For reference, the rotary stretching unit 330 may be rotatably mounted to the base frame 310 via a conventional rotary shaft means such as a rotary pin, hinge, etc., by the rotating structure of the rotary stretching unit 330 This is not limited or limited.

Hereinafter, two first electric cylinders 321 are mounted on one side of the base frame 310, and two second electric cylinders 331 on the other side of the base frame 310 to face the first electric cylinder 321. ) Will be described with an example in which the first electric cylinder and the second electric cylinder are arranged in a rectangular arrangement. In some cases, the fixed stretchable part 320 and the rotary stretchable part 330 may be configured by only one electric cylinder, or may include three or more electric cylinders.

In this case, the plurality of first electric cylinders 321 are synchronized and operated (operated simultaneously with the same stretching distance), and the plurality of second electric cylinders 331 are synchronized and operated.

As the electric cylinder (first electric cylinder, second electric cylinder), a conventional electric cylinder which can be selectively adjusted in length can be used, and the present invention is not limited or limited by the type and characteristics of the electric cylinder. For example, the electric cylinder is connected to a motor providing a driving force, a ball screw rotated by the motor, a ball screw nut mounted on the ball screw and linearly moving along the ball screw as the ball screw rotates, and a ball screw nut. It can be configured to include a rod, it is possible to control the stretch length of the rod by controlling the rotational speed and the rotational direction of the ball screw. Preferably, the first electric cylinder 321 and the second electric cylinder 331 may use a servo motor to enable fine stretching length adjustment. In some cases, as the fixed elastic part 320 and the rotary elastic part 330, other means capable of selectively adjusting the length may be used instead of the electric cylinder. The type of the fixed elastic part 320 and the rotary elastic part 330 may be used. Various changes may be made depending on required conditions and design specifications.

As such, the grip unit 200 grips the substrate 10 by tilting the stretchable length of the fixed stretchable and stretched part 320 fixedly installed to the base frame 310 so as to be tilted selectively inclined with respect to the stage 100. As a result, an advantageous effect of suppressing unstable flow (flow shaking in the left and right directions) of the support frame 210 due to the operation of the fixed elastic part 320 and the rotary elastic part 330 can be obtained.

That is, when the expansion and contraction portion mounted on both sides of the base frame is formed of a structure (rotational expansion and contraction structure on both one side and the other side of the base frame), for example, any one side of the elastic portion disposed on both sides of the base frame Increasing the length of the stretchable part arranged in the upper and lower sides and the height of the support frame is changed, and the left and right positions of the support frame are changed. Therefore, the control of the expansion and contraction portion (extension length control) according to the change in the length of the expansion and contraction portion must reflect both the height and angle and the left and right positions of the support frame, which makes the control of the expansion and contraction part difficult and difficult. However, in the present invention, the fixed elastic part 320 is fixedly mounted to the base frame 310, and only linear movement in the vertical direction of the support frame 210 connected to the fixed elastic part 320 is allowed, and left and right movements are restricted. By doing so, it is possible to more easily perform the stretch length control of the fixed elastic portion 320 and the rotary elastic portion 330.

In addition, since the fixed elastic part 320 can suppress the left and right movement of the support frame 210, in other words, the support frame is connected to the fixed elastic part 320 fixedly mounted to the base frame 310 so that the left and right movement can be performed. Since it can be suppressed at the source, it is possible to minimize the shaking of the substrate 10 due to the unstable flow of the support frame 210 during the operation of the fixed elastic part 320 and the rotary elastic part 330, the grip failure by the shaking It is possible to obtain an advantageous effect of preventing the damage and increasing the stability and reliability. Therefore, it is not necessary to separately install a separate guide means for preventing unstable flow of the support frame 210, for example, a guide bushing for guiding movement along the up and down direction of the support frame, thereby simplifying the structure and designing freedom. It is possible to obtain an advantageous effect of improving the. In particular, since the large-area substrate 10 having a length of at least one side greater than 1 m can be largely shaken even by a small shake of the support frame 210, it is important to suppress the left and right shake of the support frame 210 as much as possible. Do.

The substrate processing apparatus 1 according to the present invention may be used to load the substrate 10 on the stage 100 or to unload the substrate 10 in the stage 100. Here, loading of the substrate 10 is defined as a process of lowering the substrate 10 to be polished on the stage 100, and unloading of the substrate 10 refers to a polished substrate 10. It is defined as a lifting process from the stage 100.

As an example, the substrate processing apparatus 1 is used to load the substrate 10 into the stage 100 after receiving the substrate 10 in the loading region 101. That is, the substrate 10 is transferred from the loading area 101 to the stage 100, and the substrate 10 is loaded on the stage 100 while tilting the grip unit 200 inclined with respect to the stage 100. .

Hereinafter, the loading process of the substrate 10 will be described in more detail.

Referring to FIG. 5, the substrate 10 is supplied to the loading region 101 by a transfer robot (not shown), and the substrate 10 is received by the grip unit 200 in the loading region 101.

In the loading area 101, the support frame 210 may horizontally descend as the lengths of the fixed stretchable part 320 and the rotary stretchable part 330 are simultaneously down, and the support frame 210 is more than a predetermined length. When the gripper 220 descends and contacts the substrate 10, the substrate 10 is adsorbed by the gripper 220 by the suction force of the gripper 220. Thereafter, when the lengths of the fixed stretchable portion 320 and the rotary stretchable portion 330 are simultaneously reduced (up), the support frame 210 is horizontally raised while the substrate 10 is absorbed by the gripper 220. do.

Referring to FIG. 6, as the guide frame 110 moves along the guide rail 110a toward the stage 100 in a state where the substrate 10 is attached to the grip unit 200, the substrate 10 is loaded. In the area 101 is transferred to the stage 100.

Referring to FIG. 7, the substrate 10 transferred to the upper portion of the stage 100 is loaded on the upper surface of the stage 100 in a tilted state with respect to the stage 100.

That is, when the length of only one of the fixed elastic part 320 and the rotary elastic part 330 increases, for example, when the length of the fixed elastic part 320 increases (down), the rotary elastic part 330 While rotating in the counterclockwise direction (the direction in which the rotating expansion and contraction portion is disposed adjacent to the fixed expansion and contraction portion), the support frame 210 may be tilted inclined with respect to the stage 100, and the substrate gripped on the grip unit 200. 10 is also tilted obliquely relative to the stage 100. As described above, the substrate 10 is loaded while the substrate 10 is tilted inclined with respect to the stage 100.

In this case, the loading process of the substrate 10 disposed to be tilted with respect to the stage 100 may be performed while the tilting angle of the support frame 210 (the grip unit 200) is kept constant, or the support frame 210 is maintained. Tilting angle of the grip unit 200 may be gradually decreased.

For example, when the grips of all the grippers 220 are released at the same time while the tilting angle of the substrate 10 (support frame) is kept constant, the substrate 10 is on the right side (see FIG. 7). It is gradually loaded into the stage 100 along the direction toward the left side (see FIG. 7).

As another example, as shown in FIG. 9, when the substrate 10 is tilted with respect to the stage 100, the right side (see FIG. 7) of the substrate 10 first contacts the stage 100. As the length of the 330 gradually increases (down), the tilting angle of the substrate 10 gradually decreases, and the substrate 10 moves along the direction from the right side (see FIG. 7) to the left side (see FIG. 7). It is gradually loaded into the stage 100.

At this time, the tilting angle (tilting angle of the substrate 10) of the grip unit with respect to the stage 100 is preferably formed in 0.1 ° ~ 3 °. That is, as the tilting angle of the substrate 10 increases (for example, when it exceeds 3 °), the arrangement height of the left side (see FIG. 7) of the substrate 10 increases, and thus the gripper 220 When the substrate 10 falls due to the release of the grip, the substrate 10 may be damaged or broken, and the loading time of the substrate 10 increases, resulting in a decrease in process efficiency. The tilting angle (tilting angle of the substrate 10) is preferably formed from 0.1 ° to 3 °.

In addition, referring to FIG. 8, the loading process of the tilted substrate 10 may be performed by sequentially releasing grips by the plurality of grippers 220. That is, the grip of the substrate 10 by the plurality of grippers 220 is the other side of the substrate 10 facing one side (for example, the right side of the substrate based on FIG. 7) of the substrate 10 (eg, For example, as shown in FIG. 7, the substrate 10 is sequentially turned off along the direction toward the left side of the substrate, and as the grips by the plurality of grippers 220 are sequentially released, the substrate 10 may change from one side to the other. It is gradually loaded into the stage 100 along the facing direction.

In this way, by loading the grip by the plurality of grippers 220 sequentially OFF in the state that the substrate 10 is tilted so that the loading is performed, it is possible to more accurately match the loading position of the substrate 10 It has a beneficial effect.

That is, when the grips by all the grippers 220 are simultaneously released (OFF) while the tilting angle of the substrate 10 (support frame) is kept constant, the gap between the substrate 10 and the stage 100 is present. Although air or liquid fluid may escape outwardly between the substrate 10 and the stage 100, a phenomenon may occur in which the substrate 10 is pushed out at the intended loading position. Accordingly, in the present invention, the grip of the substrate 10 by the plurality of grippers 220 is different from one side of the substrate 10 (for example, the right side of the substrate based on FIG. 7) to the other side of the substrate 10. For example, by releasing sequentially (OFF) along the direction toward the right side of the substrate on the basis of Figure 7, the advantageous effect of loading the substrate 10 in the correct position without the sliding phenomenon of the substrate 10 You can get it. In particular, as shown in FIG. 7, when the grip of a part of the plurality of grippers 220 (eg, the gripper grips the right side portion of the substrate based on FIG. 7) is released, a part of the substrate 10 (eg, For example, in the state in which the right side portion of the substrate is in contact with the stage 100 based on FIG. 7, the remaining portion of the substrate 10 (eg, the left side portion of the substrate in FIG. 7) is grip unit 200. Since it is held in the state (fixed state), the advantageous effect of restraining the position of the substrate 10 from shifting when the substrate 10 first contacts the stage 100 can be obtained.

Preferably, the plurality of grippers 220 are provided to be elastically movable with respect to the support frame 210. Here, the gripper 220 is elastically movable with respect to the support frame 210, the placement height of the gripper 220 with respect to the support frame 210 (between the support frame 210 and the gripper 220) Gap length) (see L in FIG. 8) may be elastically variable. For example, the gripper 220 is mounted to the support frame 210 so as to be linearly movable in the vertical direction, and the linear movement of the gripper 220 with respect to the support frame 210 is elastically performed by an elastic member such as a spring. Can be supported.

As described above, by allowing the plurality of grippers 220 to move elastically with respect to the support frame 210, the grip by some of the plurality of grippers 220 is released to sag the substrate 10 (substrate 10 Even if only a part of the C) portion is partially in contact with the stage 100, the grip on the substrate 10 is held ON at a portion adjacent to the deflection portion (bent portion) of the substrate 10. An advantageous effect of keeping the grip state of the gripper 220 stable can be obtained. For example, with reference to FIG. 8, the grips of the gripper 220 disposed first and the gripper 220 disposed second from the right side of the support frame 210 are released, so that the deflection may be caused at the right side portion of the substrate 10. Even if it occurs, since the length of the gripper 220 arranged in the third (the distance between the support frame and the gripper) can be elastically increased, the grip state by the gripper 220 arranged in the third is stably maintained, An advantageous effect of more easing the bending of the substrate 10 can be obtained.

In addition, referring to FIG. 10, after the substrate 10 is loaded onto the stage 100, the length of the fixed stretchable part 320 and the rotary stretchable part 330 is simultaneously reduced (up). It is raised to the top of the stage 100.

After loading of the substrate 10 on the stage 100 is completed, a polishing process for the substrate 10 is performed on the stage 100. In this case, the polishing process of the substrate 10 may be performed using various polishing members according to the required conditions and design specifications.

For example, referring to FIG. 11, the polishing process for the substrate 10 is performed by the polishing belt 130 which circulates and rotates along a path defined by the roller 132.

The polishing belt 130 moves along a path defined by the roller 132 and is provided to linearly polish (planarize) the surface of the substrate 10. For example, the polishing belt 130 may be provided to linearly polish (planarize) the surface of the substrate 10 while circulating in an infinite loop manner.

The polishing belt 130 may have a length corresponding to the width of the substrate 10 (the width along the axial direction of the polishing belt 130) in the axial direction (the rotation axis direction of the roller 132). In some cases, the axial length of the polishing belt may be larger or smaller than the width of the substrate.

The polishing belt 130 is formed of a material suitable for mechanical polishing of the substrate 10. For example, the abrasive belt 130 may be made of polyurethane, polyurea, polyester, polyether, epoxy, polyamide, polycarbonate, polyethylene, polypropylene, fluoropolymer, vinyl polymer, acrylic and methacrylic polymer, Silicon, latex, nitride rubber, isoprene rubber, butadiene rubber, and various copolymers of styrene, butadiene and acrylonitrile may be formed, and the material and properties of the polishing belt 130 may be adjusted to the required conditions and design specifications. It can be changed in various ways.

For reference, the polishing process of the substrate 10 may be performed by only one polishing belt 130, but it is also possible to polish the substrate 10 simultaneously or sequentially using the plurality of polishing belts 130. In some cases, the abrasive belt does not circulate, but is open-looped in the reel to reel odor method of the conventional cassette tape (wound in the first reel and then in the opposite direction to the second reel). It is also possible to configure to grind the substrate while moving along the trajectory of the shape.

In addition, the polishing process of the substrate 10 may be performed by the stage 100 being fixed in position and the polishing belt 130 moving horizontally with respect to the stage 100. In some cases, the position of the polishing belt is fixed, and the stage can be configured so that the polishing process of the substrate is performed by horizontally moving with respect to the polishing belt.

As another example, referring to FIG. 12, the polishing process for the substrate 10 is performed by the polishing pad 130 ′ rotating in contact with the substrate 10.

The polishing pad 130 ′ is mounted on the polishing pad 130 ′ carrier 132 ′, and is provided to linearly polish (planarize) the surface of the substrate 10 while rotating in contact with the surface of the substrate 10. .

The carrier 132 ′ of the polishing pad 130 ′ may be formed in various structures capable of rotating the polishing pad 130 ′, and the present invention is limited by the structure of the carrier 132 ′ of the polishing pad 130 ′. It is not limited or restricted. For example, the polishing pad 130 ′, the carrier 132 ′ may be configured as one body or may be configured by combining a plurality of bodies, and configured to rotate in connection with a drive shaft (not shown). In addition, the polishing pad 130 ′ and the carrier 132 ′ are provided with a pressurizing part (for example, pneumatic pressure for pressing the polishing pad 130 ′) to press the polishing pad 130 ′ onto the surface of the substrate 10. Pressing section) is provided.

The polishing pad 130 ′ is formed of a material suitable for mechanical polishing of the substrate 10. For example, the polishing pad 130 'may be made of polyurethane, polyurea, polyester, polyether, epoxy, polyamide, polycarbonate, polyethylene, polypropylene, fluoropolymer, vinyl polymer, acrylic and methacrylic polymer. , Silicone, latex, nitride rubber, isoprene rubber, butadiene rubber, and various copolymers of styrene, butadiene and acrylonitrile, and the material and properties of the polishing pad 130 ' It can be changed in various ways according to the specification.

Preferably, as the polishing pad 130 ', a circular polishing pad 130' having a size smaller than that of the substrate 10 is used. That is, it is also possible to polish the substrate using a polishing pad having a larger size than the substrate, but using a polishing pad having a larger size than the substrate requires very large rotating equipment and space to rotate the polishing pad. However, there is a problem that space efficiency and design freedom are lowered and stability is lowered. Substantially, since the substrate has at least one side length greater than 1 m, it is very difficult to rotate a polishing pad having a size larger than the substrate (for example, a polishing pad having a diameter larger than 1 m). have. In addition, when using a non-circular polishing pad (for example, a square polishing pad), the surface of the substrate polished by the rotating polishing pad cannot be polished to a uniform thickness as a whole. However, the present invention, by rotating the circular polishing pad 130 ′ having a smaller size than the substrate 10 to polish the surface of the substrate 10, the polishing pad without significantly reducing the space efficiency and design freedom It is possible to rotate the substrate 130 'to polish the substrate 10, and to obtain an advantageous effect of keeping the polishing amount by the polishing pad 130' uniformly as a whole.

In addition, the polishing path of the polishing pad 130 ′ may be variously changed according to required conditions and design specifications, and the present invention is not limited or limited by the polishing path of the polishing pad 130 ′. For example, the polishing pad 130 ′ may be configured to polish the surface of the substrate 10 while continuously moving along the inclined first diagonal path and the inclined second diagonal path in a direction opposite to the first diagonal path. have. In some cases, it is also possible to polish the substrate while the polishing pad moves along the polishing path of the circular trajectory.

13 to 16, the substrate 10 having been polished on the stage 100 is transferred from the stage 100 to the unloading region 102, and then the next process is performed.

Preferably, the substrate 10 is unloaded from the stage 100 in a state where the grip unit 200 is gradually tilted with respect to the stage 100.

As described above, the present invention allows the grip unit 200 (substrate) to be unloaded in a tilted state with respect to the stage 100, so that the unloading process of the substrate 10 is made easier and more stable. Advantageous effects can be obtained.

That is, since the large-area glass substrate 10 (for example, a sixth generation substrate of 1500 mm * 1850 mm) has a very large size, the large-area glass substrate 10 is flat on the stage 100 (for example, When lifting from the surface plate (unloading), the surface tension by the liquid fluid (for example, the cleaning liquid) existing between the substrate 10 and the stage 100, or the pad PAD and glass disposed on the surface plate. It is not only difficult to remove the substrate 10 by the adhesive force between the substrates, but also inevitably the substrate 10 must be removed with a very strong force, which may damage the substrate 10 during this process.

However, in the present invention, by untilting the substrate 10 with respect to the stage 100, the unloading process of the substrate 10 may be performed while the substrate 10 is tilted. As such, the liquid phase existing between the substrate 10 and the stage 100 during the unloading process of the substrate 10 is performed by causing the unloading process of the substrate 10 to be performed in an inclined tilted state rather than in a flat state. Since the influence of the surface tension due to the fluid can be minimized, it is possible to detach the substrate 10 from the stage 100 with a relatively small force, and damage of the substrate 10 due to the force to remove the substrate 10. An advantageous effect of minimizing can be obtained.

More specifically, referring to FIG. 13, when the length of only one of the fixed elastic part 320 and the rotary elastic part 330 is shortened, for example, when the length of the rotary elastic part 330 is shortened (up). In addition, while the rotating elastic part 330 rotates in the counterclockwise direction (the direction in which the rotating elastic part is disposed adjacent to the fixed elastic part), the support frame 210 may be tilted inclined with respect to the stage 100 and the grip The substrate 10 gripped in the unit 200 is also tilted inclined with respect to the stage 100.

As described above, the substrate 10 is unloaded from the stage 100 by reducing the length of the fixed stretchable and stretched portion 320 as shown in FIG. 15.

Thereafter, as shown in FIG. 16, the guide frame 110 moves along the guide rail 110a toward the unloading region 102 in a state where the substrate 10 is adsorbed to the grip unit 200. 10 is transferred from the stage 100 to the unloading area 102.

In addition, the substrate processing apparatus 1 may include a floating portion 150 for floating the substrate 10 on the stage 100.

The floating part 150 makes the unloading process of the substrate 10 easier by floating the substrate 10 on the stage 100 before unloading the substrate 10. That is, the substrate 10 is lifted from the stage 100 by floating the substrate 10 prior to unloading the substrate 10 so that a fluid layer is formed between the stage 100 and the substrate 10 in advance. An advantageous effect can be obtained to make the lifting process more smooth.

Floating portion 150 may be configured to float the substrate 10 on the stage 100 in various ways depending on the requirements and design specifications required. For example, referring to FIG. 14, the floating part 150 may be configured to float the substrate 10 by spraying gas (or other fluid) on the bottom surface of the substrate 10. In some cases, it is also possible for the floating portion to float the substrate on the stage by using the vibration energy of the ultrasonic waves.

17 and 18 are diagrams for explaining the non-contact adsorption unit as the substrate processing apparatus according to the present invention. In addition, the same or equivalent reference numerals are given to the same or equivalent components as those described above, and detailed description thereof will be omitted.

17 and 18, the substrate processing apparatus 1 according to the present invention may include a non-contact adsorption unit 250 for adsorbing the substrate 10 in a non-contact manner.

The non-contact adsorption unit 250 is provided to more stably maintain the grip state of the substrate 10 during the loading or unloading process of the substrate 10, and to lift the substrate 10 more easily during unloading.

In particular, the gripper 220 adsorbs the substrate 10 during the unloading process of the substrate 10, thereby allowing the substrate 10 to be stably separated from the stage 100 without bending or deforming the substrate 10. . That is, since the gripper 220 grips only the edge portion (non-active area) of the substrate 10, when the gripper 220 unloads the substrate 10 with the gripper 220 only, the substrate ( A force for separating the substrate 10 from the stage 100 is hardly applied to the center portion (active region) of 10). Accordingly, the present invention obtains an advantageous effect of making the unloading process of the substrate 10 smoother by adsorbing the center portion (active region) of the substrate 10 using the non-contact adsorption unit 250. Can be.

Of course, the gripper 220 may be configured to grip the active region 11 of the substrate 10, but since the active region 11 of the substrate 10 is very sensitive to contact, Contact should be as rejected as possible. Accordingly, the present invention advantageously prevents damage such as scratches caused by contact in the region of the substrate 10 by adsorbing the active region 11 of the substrate 10 using the non-contact adsorption portion 250. The effect can be obtained.

More specifically, the non-contact adsorption unit 250 is configured to non-contact adsorption of the substrate 10 by using the surface tension by the fluid.

For example, the non-contact adsorption unit 250 may include an adsorption plate 252 spaced apart from an upper surface of the substrate 10, and an adsorption plate 252 formed between the substrate 10 and the adsorption plate 252. And a nozzle 254 for selectively injecting fluid.

The shape and size of the adsorption plate 252 may be variously changed according to the required conditions and design specifications. For example, the suction plate 252 may be formed in a quadrangular shape corresponding to the active region 11 of the substrate 10. At this time, the suction plate 252 may be mounted on the grip unit 200. In some cases, it is also possible to mount the suction plate separately from the grip unit 200.

The nozzle 254 is formed to inject fluid to the bottom of the suction plate 252 (the space between the suction plate 252 and the stage 100). That is, when the adsorption plate 252 is disposed on the upper surface of the substrate 10 at predetermined intervals, the fluid is injected from the nozzle 254, and the fluid injected from the nozzle 254 is transferred to the adsorption plate 252 and the substrate. It is filled between 10.

Preferably, a plurality of nozzles 254 are formed to be spaced apart along at least one of the length direction and the width direction of the suction plate 252. As such, the plurality of nozzles 254 are mounted on the bottom of the adsorption plate 252 at uniform intervals, and the fluid is uniformly sprayed on the bottom of the adsorption plate 252, thereby adsorbing the adsorption plate 252. An advantageous effect of uniformly forming the adsorption force between the substrates 10 as a whole can be obtained.

Preferably, the adsorption plate 252 is formed of a PVC material. In some cases, the adsorption plate may be formed of a metal material (for example, SUS). However, when the adsorption plate is formed of a metal material, since the weight of the adsorption plate increases, which causes inconvenience in transportation and management, the adsorption plate 252 is made of PVC material to reduce the weight of the adsorption plate. It is preferably formed.

At this time, the adsorption plate 252 is formed to have a thickness of 3 to 30 mm under the condition of adsorbing the active region 11 of the 6th generation substrate 10 of 1500 mm * 1850 mm.

In addition, a reinforcing rib 252a may be formed on the upper surface of the suction plate 252. As an example, the reinforcing rib 252a may be formed to have a lattice structure. In some cases, the reinforcing rib may be formed in a square or circular shape, and the present invention is not limited or limited by the shape and structure of the reinforcing rib. Thus, by forming the reinforcing rib 252a on the upper surface of the suction plate 252, even if the suction plate 252 is formed to a thin thickness (3 ~ 30mm), the suction plate 252 has sufficient rigidity A beneficial effect can be obtained.

In addition, the suction plate 252 may include a cylinder for moving in the vertical direction. The cylinder slowly raises the adsorption plate 252 while the substrate 10 is adsorbed to the adsorption plate 252 so that the substrate 10 can be separated from the stage 100.

And the substrate processing apparatus 1 includes the adjusting part 256 which adjusts the horizontal degree of the adsorption plate 252.

The adjusting unit 256 is provided to adjust the horizontal degree of the adsorption plate 252 to maintain the horizontal state of the adsorption plate 252 with respect to the substrate 10. As such, by providing the adjusting unit 256 and maintaining the horizontal state of the adsorption plate 252 with respect to the substrate 10, the adsorption force of the substrate 10 via the fluid is increased throughout the substrate 10. It is possible to obtain an advantageous effect of forming uniformly in the.

The adjusting unit 256 may be formed in various structures capable of adjusting the horizontal degree of the suction plate 252. For example, the adjusting unit 256 is a leveler plate 256a fixed to the cylinder and mounted with the adsorption plate 252, and an adjusting member 256b for adjusting a gap between the leveler plate 256a and the adsorption plate 252. ).

The adjusting member 256b may adjust the gap between the leveler plate 256a and the suction plate 252 through the tightening or loosening operation in the same manner as a conventional adjusting bolt. Preferably, the leveler plate 256a is formed in a quadrangular shape, and four adjustment members 256b may be provided at each corner of the leveler plate 256a.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that it can be changed.

10: substrate 100: stage
101: loading area 102: unloading area
110: guide frame 110a: guide rail
150: floating part 200: grip unit
250: non-contact adsorption unit 252: adsorption plate
252a: reinforcement rib 254: nozzle
256: adjuster 256a: leveler plate
256b: adjusting member 210: support frame
220: gripper 230: guide portion
232: guide rod 234: guide bushing
310: base frame 320: fixed expansion and contraction
321: first electric cylinder 330: rotary expansion and contraction
331: second electric cylinder 130: polishing belt
130 ': polishing pad

Claims (38)

As a substrate processing apparatus,
A stage in which a polishing process for the substrate is performed;
A grip unit which grips the substrate;
A base frame disposed on the grip unit;
One end is fixed to the base frame and the other end is connected to the grip unit, and the fixed elastic portion that is limited to the expansion and contraction in the vertical direction and the rotation about the base frame is suppressed, and is arranged to face the fixed elastic portion and one end is the base A tilting part rotatably mounted to the frame and connected to the grip unit and connected to the grip unit and interlocked with the fixed length of the fixed part and being stretched while rotating relative to the base frame; Including,
And selectively tilting the grip unit by differently adjusting the stretching lengths of the fixed elastic part and the rotary elastic part.
The method of claim 1,
The fixed expansion and contraction unit, the substrate processing apparatus, characterized in that spaced apart along one side of the base frame, and comprises a plurality of selectively stretchable first electric cylinder.
The method of claim 2,
And the plurality of first electric cylinders are operated in synchronization.
The method of claim 1,
The rotational expansion and contraction unit, the substrate processing apparatus, characterized in that spaced apart along the other side of the base frame, and optionally includes a plurality of second electric cylinders that are stretchable.
The method of claim 4, wherein
And the plurality of second electric cylinders are operated in synchronization.
The method of claim 1,
The grip unit,
A support frame angle adjustable by the fixed elastic part and the rotary elastic part;
A gripper mounted to the support frame to grip the substrate;
Substrate processing apparatus comprising a.
The method of claim 6,
And the substrate is adsorbed by the gripper.
The method of claim 7, wherein
And a plurality of the grippers are provided to be able to independently adsorb the substrate.
The method of claim 8,
And the gripper grips a non-active area of the substrate.
The method of claim 9,
The substrate is transferred to the stage in the loading region,
And the tilting unit loads the substrate on the stage while tilting the grip unit with respect to the stage.
The method of claim 10,
And one side of the substrate is disposed adjacent to the stage relative to the other side of the substrate while the grip unit is tilted with respect to the stage.
The method of claim 11,
The grip of the substrate by the plurality of grippers is sequentially released along the direction from the one side of the substrate toward the other side of the substrate facing the one side,
And the substrate is gradually loaded onto the stage in a direction from the one side to the other side as the grips by the plurality of grippers are sequentially released.
The method of claim 12,
And the tilting portion gradually reduces the tilting angle of the grip unit with respect to the stage while the substrate is gradually loaded onto the stage.
The method of claim 12,
And the plurality of grippers are elastically movable with respect to the support frame.
The method of claim 1,
The substrate is transferred to the unloading area at the stage,
And the tilting unit unloads the substrate from the stage while gradually tilting the grip unit with respect to the stage.
The method of claim 15,
And a floating portion for floating the substrate in the stage.
The method of claim 16,
And the floating portion floats the substrate by injecting a fluid into a bottom surface of the substrate.
The method according to any one of claims 1 to 17,
A retainer protrudes from an upper surface of the stage,
And the substrate is disposed inside the retainer.
The method of claim 18,
And a protrusion height of the retainer is equal to a thickness of the substrate.
The method according to any one of claims 1 to 17,
And a tilting angle of the grip unit with respect to the stage is 0.1 ° to 3 °.
The method according to any one of claims 1 to 17,
The substrate is a substrate processing apparatus, characterized in that the rectangular substrate having a length of at least one side larger than 1m.
The method according to any one of claims 1 to 17,
And a chemical mechanical polishing (CMP) process for the substrate is performed at the stage.
The method according to any one of claims 1 to 17,
And a non-contact adsorption unit for non-contact adsorption of the substrate.
The method of claim 23,
The non-contact adsorption unit is a substrate processing apparatus, characterized in that the non-contact adsorption of the substrate using the surface tension by the fluid.
The method of claim 24,
The non-contact adsorption unit,
An adsorption plate disposed on an upper surface of the substrate;
A nozzle formed on the suction plate and selectively spraying a fluid between the substrate and the suction plate;
Substrate processing apparatus comprising a.
The method of claim 25,
And a plurality of nozzles are formed to be spaced apart along at least one of the length direction and the width direction of the suction plate.
The method of claim 26,
The adsorption plate is a substrate processing apparatus, characterized in that formed of PVC material.
The method of claim 27,
The suction plate is a substrate processing apparatus, characterized in that formed in a thickness of 3 ~ 30mm.
The method of claim 28,
And a reinforcing rib formed on an upper surface of the suction plate.
The method of claim 25,
And a cylinder for moving the suction plate in the vertical direction.
The method of claim 30,
Substrate processing apparatus comprising a control unit for adjusting the level of the adsorption plate.
The method of claim 31, wherein
The control unit,
A leveler plate fixed to the cylinder, to which the suction plate is mounted;
An adjusting member for adjusting a distance between the leveler plate and the suction plate;
Substrate processing apparatus comprising a.
The method of claim 23,
And the non-contact adsorption unit adsorbs an active area of the substrate.
The method according to any one of claims 1 to 17,
A guide rail on which the substrate is disposed along a transfer path;
A guide frame mounted with the base frame and moving along the guide rail;
Substrate processing apparatus comprising a.
The method according to any one of claims 1 to 17,
And the polishing step for the substrate is performed by a polishing belt rotating along a path defined by a roller.
The method according to any one of claims 1 to 17,
And the polishing step for the substrate is performed by a polishing pad rotating in contact with the substrate.
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