TWI642970B - 光學裝置、加工裝置及物品製造方法 - Google Patents
光學裝置、加工裝置及物品製造方法 Download PDFInfo
- Publication number
- TWI642970B TWI642970B TW106127414A TW106127414A TWI642970B TW I642970 B TWI642970 B TW I642970B TW 106127414 A TW106127414 A TW 106127414A TW 106127414 A TW106127414 A TW 106127414A TW I642970 B TWI642970 B TW I642970B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- incident
- optical device
- optical
- reflected
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 233
- 238000012545 processing Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 238000013519 translation Methods 0.000 description 51
- 230000014616 translation Effects 0.000 description 51
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/198—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors with means for adjusting the mirror relative to its support
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/18—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical projection, e.g. combination of mirror and condenser and objective
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/30—Collimators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Lenses (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Mechanical Optical Scanning Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016168612A JP6851751B2 (ja) | 2016-08-30 | 2016-08-30 | 光学装置、加工装置、および物品製造方法 |
| JP2016-168612 | 2016-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201807454A TW201807454A (zh) | 2018-03-01 |
| TWI642970B true TWI642970B (zh) | 2018-12-01 |
Family
ID=59738183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106127414A TWI642970B (zh) | 2016-08-30 | 2017-08-14 | 光學裝置、加工裝置及物品製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10845589B2 (https=) |
| EP (1) | EP3290982B1 (https=) |
| JP (1) | JP6851751B2 (https=) |
| KR (1) | KR102165511B1 (https=) |
| CN (1) | CN107797270B (https=) |
| TW (1) | TWI642970B (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7274989B2 (ja) * | 2019-09-05 | 2023-05-17 | 株式会社ディスコ | 光軸調整ジグおよびレーザー加工装置の光軸確認方法 |
| JP7278178B2 (ja) * | 2019-09-05 | 2023-05-19 | 株式会社ディスコ | レーザー加工装置の光軸確認方法 |
| CN110824684B (zh) * | 2019-10-28 | 2020-10-30 | 华中科技大学 | 一种高速立体三维多模态成像系统和方法 |
| US11662562B2 (en) * | 2020-02-09 | 2023-05-30 | Kla Corporation | Broadband illumination tuning |
| EP4144473A4 (en) * | 2020-04-30 | 2024-04-24 | Nikon Corporation | Processing system |
| JP7501104B2 (ja) * | 2020-05-22 | 2024-06-18 | 富士フイルムビジネスイノベーション株式会社 | 読取装置、出力装置及び画像形成装置 |
| EP4550020A1 (en) * | 2023-11-03 | 2025-05-07 | Confocal.nl B.V. | Re-scan optical system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6067127A (en) * | 1997-07-08 | 2000-05-23 | Sony Corporation | Method and apparatus for reducing the rotation rate of mirrors in a high resolution digital projection display |
| TW200633807A (en) * | 2005-03-31 | 2006-10-01 | Hitachi Via Mechanics Ltd | Laser machining apparatus |
| TW200711773A (en) * | 2005-06-17 | 2007-04-01 | Olympus Corp | Laser beam machining method and apparatus |
| TW201206603A (en) * | 2010-07-20 | 2012-02-16 | Disco Corp | Optical device and laser beam machining apparatus having optical device |
| TWI420146B (zh) * | 2008-05-22 | 2013-12-21 | Canon Kk | 光束掃描裝置、雷射加工裝置、測試方法及雷射加工方法 |
| TW201617684A (zh) * | 2014-11-13 | 2016-05-16 | 佳能股份有限公司 | 光學裝置、處理裝置及物品製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010606B2 (ja) * | 1977-05-17 | 1985-03-19 | キヤノン株式会社 | 走査効率の高い走査光学系 |
| GB2316253B (en) * | 1979-10-09 | 1998-07-01 | Rank Organisation Ltd | Combined rangefinding,thermal imaging system |
| DE3530189A1 (de) * | 1985-08-23 | 1987-03-05 | Zeiss Carl Fa | Einrichtung zur lagekorrektur eines ueber eine gelenkoptik gefuehrten laserstrahls |
| US4840483A (en) * | 1987-12-18 | 1989-06-20 | Cincinnati Milacron Inc. | Alignment tool for laser beam delivery systems and method of alignment |
| JPH0518815A (ja) * | 1991-07-10 | 1993-01-26 | Nec Corp | レーザビーム位置補正装置 |
| US5923418A (en) * | 1995-02-21 | 1999-07-13 | Clark-Mxr, Inc. | Apparatus for controlling the position and direction of a laser beam |
| JP2779778B2 (ja) * | 1995-02-23 | 1998-07-23 | 株式会社篠崎製作所 | レーザ発振光オートアラインメント装置 |
| JPH10318718A (ja) * | 1997-05-14 | 1998-12-04 | Hitachi Ltd | 光学式高さ検出装置 |
| US20030197117A1 (en) * | 2002-04-22 | 2003-10-23 | Knirck Jeffrey G. | Method and apparatus for compensating a vector command to a galvanometer with light beam pointing error information |
| JP2005118815A (ja) * | 2003-10-16 | 2005-05-12 | Hitachi Via Mechanics Ltd | レーザ加工方法およびレーザ加工装置 |
| JP2007175744A (ja) * | 2005-12-28 | 2007-07-12 | Yamazaki Mazak Corp | レーザ加工機における光路軸の調整装置 |
| JP2008238184A (ja) * | 2007-03-26 | 2008-10-09 | Mitsubishi Electric Corp | レーザ加工装置 |
| JP5540664B2 (ja) * | 2009-11-20 | 2014-07-02 | 日本電気株式会社 | 光軸調整システム、光軸調整装置、光軸調整方法、及びプログラム |
| KR20120016456A (ko) * | 2010-08-16 | 2012-02-24 | 주식회사 이오테크닉스 | 레이저 가공장치 및 레이저 가공방법 |
| JP2015141372A (ja) * | 2014-01-30 | 2015-08-03 | 株式会社ミツトヨ | 照射装置、照射方法、測定装置、及び測定方法 |
| EP3021153B1 (en) * | 2014-11-13 | 2018-12-12 | Canon Kabushiki Kaisha | Optical apparatus, processing apparatus, and article manufacturing method |
| JP6198805B2 (ja) | 2015-02-16 | 2017-09-20 | キヤノン株式会社 | リソグラフィ装置、リソグラフィ方法、プログラム、リソグラフィシステムおよび物品製造方法 |
-
2016
- 2016-08-30 JP JP2016168612A patent/JP6851751B2/ja active Active
-
2017
- 2017-08-14 TW TW106127414A patent/TWI642970B/zh active
- 2017-08-24 EP EP17187820.0A patent/EP3290982B1/en active Active
- 2017-08-28 US US15/688,495 patent/US10845589B2/en active Active
- 2017-08-30 CN CN201710759642.3A patent/CN107797270B/zh active Active
- 2017-08-30 KR KR1020170109815A patent/KR102165511B1/ko active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6067127A (en) * | 1997-07-08 | 2000-05-23 | Sony Corporation | Method and apparatus for reducing the rotation rate of mirrors in a high resolution digital projection display |
| TW200633807A (en) * | 2005-03-31 | 2006-10-01 | Hitachi Via Mechanics Ltd | Laser machining apparatus |
| TW200711773A (en) * | 2005-06-17 | 2007-04-01 | Olympus Corp | Laser beam machining method and apparatus |
| TWI420146B (zh) * | 2008-05-22 | 2013-12-21 | Canon Kk | 光束掃描裝置、雷射加工裝置、測試方法及雷射加工方法 |
| TW201206603A (en) * | 2010-07-20 | 2012-02-16 | Disco Corp | Optical device and laser beam machining apparatus having optical device |
| TW201617684A (zh) * | 2014-11-13 | 2016-05-16 | 佳能股份有限公司 | 光學裝置、處理裝置及物品製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3290982A1 (en) | 2018-03-07 |
| US10845589B2 (en) | 2020-11-24 |
| JP6851751B2 (ja) | 2021-03-31 |
| CN107797270A (zh) | 2018-03-13 |
| US20180059407A1 (en) | 2018-03-01 |
| JP2018036440A (ja) | 2018-03-08 |
| EP3290982B1 (en) | 2025-04-16 |
| TW201807454A (zh) | 2018-03-01 |
| KR102165511B1 (ko) | 2020-10-14 |
| KR20180025262A (ko) | 2018-03-08 |
| CN107797270B (zh) | 2021-04-30 |
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