TWI640072B - 具有單列直插式引線的成型電源模組 - Google Patents

具有單列直插式引線的成型電源模組 Download PDF

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Publication number
TWI640072B
TWI640072B TW106135344A TW106135344A TWI640072B TW I640072 B TWI640072 B TW I640072B TW 106135344 A TW106135344 A TW 106135344A TW 106135344 A TW106135344 A TW 106135344A TW I640072 B TWI640072 B TW I640072B
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Taiwan
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lead
power supply
voltage power
low
item
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TW106135344A
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TW201816963A (zh
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徐範錫
牛志強
趙原震
松 陳
俊明 步
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萬國半導體（澳門）股份有限公司
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Publication of TW201816963A publication Critical patent/TW201816963A/zh
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Abstract

一種電源模組具有一個引線框、一個第一電源晶片、一個第二電源晶片、多個單列直插式引線、一個柵極驅動和保護積體電路(IC)、多個接合引線以及一個成型封裝。第一和第二電源晶片貼在引線框的頂面上。多個單列直插式引線具有一個高壓電源引線、一個低壓電源引線以及多個訊號控制引線。低壓電源引線具有一個引線部分和一個外延部分。柵極驅動和保護IC貼在低壓電源引線的外延部分。成型封裝密封第一和第二電源晶片、低壓電源引線的外延部分、柵極驅動和保護IC、多個接合引線以及至少一大部分引線框。

Description

具有單列直插式引線的成型電源模組
本發明主要涉及一種具有單列直插式引線的成型電源模組。更確切地說，本發明是關於具有單列直插式引線的成型半導體電源模組，單列直插式引線由含有引線部分和外延部分的低壓電源引線構成。
傳統的電源模組含有一個或多個半導體元件。傳統電源模組較快的切換會產生高寄生電感等問題。高寄生電感在快速切換時會產生電壓過沖。 有必要研發一種具有高電壓性能、電壓超載保護和過熱保護的電源模組。
本發明的優勢包含快速和軟斷開切換、高電壓和高電流性能、電壓超載和過熱保護、高效的系統設計、改良的可靠性和封裝尺寸的減小。
本發明提出了一種具有一個晶片焊盤、一個第一電源晶片、一個第二電源晶片、多個單列直插式引線、一個柵極驅動和保護積體電路(IC)、多個接合引線和一個成型封裝的電源模組。第一和第二電源晶片貼在晶片焊盤的頂面上。多個單列直插式引線具有一個高壓電源引線、一個低壓電源引線以 及多個訊號控制引線。低壓電源引線具有一個引線部分和一個外延部分。柵極驅動和保護IC貼在低壓電源引線的外延部分上。成型封裝密封第一和第二電源晶片、低壓電源引線的外延部分、柵極驅動和保護IC、多個接合引線以及至少一大部分晶片焊盤。
在本發明的實施例中，電源模組的本體與標準的TO247封裝尺寸相同。電源模組的晶片焊盤比標準TO247封裝的更大。具有單列直插式引線，可以為散熱片的安裝獲得更多空間。在高壓電源引線和低壓電源引線之間引入一個隔離豁口，因此增大了剩餘電流距離。
100‧‧‧電路圖
108‧‧‧絕緣柵雙極電晶體
109‧‧‧二極體
110、410‧‧‧柵極驅動和保護積體電路
200、300、400、500、600A、600B‧‧‧電源模組
202、302、402‧‧‧單列直插式引線
220、320、420‧‧‧晶片連接盤
232、234、332、334、336、338‧‧‧凹槽
240、440、540‧‧‧高壓電源引線
250、450、550‧‧‧低壓電源引線
260、460‧‧‧訊號控制引線
290、390‧‧‧成型封裝
298‧‧‧隔離豁口
326‧‧‧散熱片
392‧‧‧第一邊表面
394‧‧‧第二邊表面
416‧‧‧第一電源晶片
418‧‧‧第二電源晶片
452、552‧‧‧引線部分
454‧‧‧外延部分
480、484、486‧‧‧接合引線
482‧‧‧垂直距離
556‧‧‧空間
554A、554B‧‧‧子部分
662‧‧‧引線
C‧‧‧高壓電源引線
COM‧‧‧接地引線
Csc‧‧‧電容器引線
E‧‧‧低壓電源引線
Rov‧‧‧電阻器引線
VCC‧‧‧公共偏壓引線
VFO‧‧‧跳躍輸出引線
Vin‧‧‧輸入電壓引線
Vot‧‧‧電壓輸出引線
第1圖表示在本發明的實施例中，一種電源模組的電路圖。
第2A圖表示在本發明的實施例中，電源模組的透視圖，第2B圖表示另一個透視圖。
第3A圖表示在本發明的實施例中，電源模組的俯視圖，第3B圖表示仰視圖，第3C圖表示垂直於AA面的剖面圖。
第4A圖表示在本發明的實施例中，電源模組(所帶的成型封裝沒有表示出)的俯視圖，第4B圖表示側視圖。
第5圖表示在本發明的實施例中，另一種電源模組(所帶的成型封裝沒有表示出)的俯視圖。
第6A圖表示在本發明的實施例中，一種電源模組的俯視圖，第6B圖表示另一種電源模組的俯視圖。
第1圖表示在本發明的實施例中，一種電源模組的電路圖100。柵極驅動和保護積體電路(IC)110控制絕緣柵雙極電晶體(IGBT)108，二極體109連接在IGBT的發射極和集電極之間，作為飛輪二極體(FWD)。
第2A圖表示在本發明的實施例中，電源模組200的透視圖，第2B圖表示另一種透視圖。電源模組200具有多個單列直插式引線202、晶片焊盤220和成型封裝290。多個單列直插式引線202具有高壓電源引線240、低壓電源引線250以及多個訊號控制引線260。成型封裝290具有兩個半圓形凹槽232和234用於螺絲安裝。在本發明的實施例中，電源模組200為絕緣柵雙極電晶體(IGBT)。 在本發明的實施例中，電源模組200的本體與TO247封裝的尺寸相同。在本發明的實施例中，晶片焊盤220的底面從成型封裝290中裸露出來。
在本發明的實施例中，成型封裝290在高壓電源引線240和低壓電源引線250之間具有一個隔離豁口298。因此增大了剩餘電流距離。
第3A圖表示在本發明的實施例中，電源模組300的俯視圖，第3B圖表示仰視圖，第3C圖表示垂直於AA面的剖面圖。電源模組300具有多個單列直插式引線302、晶片焊盤320、可選的散熱片326(用虛線表示)和成型封裝390。可選的散熱片326之間附著在晶片焊盤320裸露的底面上。成型封裝390具有兩個半圓形凹槽332和334，用於螺絲安裝。半圓形凹槽336與半圓形凹槽332對準。半圓形凹槽338與半圓形凹槽334對準。
在本發明的實施例中，成型封裝390為直角棱鏡形。成型封裝390具有第一邊表面392和第二邊表面394，第二邊表面394與第一邊表面392相對。第一個半圓形凹槽332在成型封裝390的第一邊表面392附近。第二個半圓形凹槽334在成型封裝390的第二邊表面394附近。
第4A圖表示在本發明的實施例中，電源模組400(所帶的第3C圖中的成型封裝390沒有表示出)的俯視圖，第4B圖表示側視圖。電源模組400具 有晶片焊盤420、第一電源晶片416、第二電源晶片418、多個單列直插式引線402、柵極驅動和保護IC 410、多個接合引線480以及第3C圖所示的成型封裝390。
第一和第二電源晶片416和418附著在晶片焊盤420的頂面上。在本發明的實施例中，第一電源晶片416為一個垂直二極體，其陰極在第一電源晶片416的底面上。第一電源晶片416的陰極電連接到晶片焊盤420。第二電源晶片418為IGBT，其底部集電極電連接到晶片焊盤420。多個單列直插式引線402具有一個連接到晶片焊盤420上的高壓電源引線440、一個在高壓電源引線440附近的低壓電源引線450，以及遠離高壓電源引線440的多個訊號控制引線460。低壓電源引線450具有一個引線部分452和一個外延部分454。引線部分452和外延部分454離開晶片焊盤420。低壓電源引線450的引線部分452通常平行於高壓電源引線440。高壓電源引線440和外延部分454位於引線部分452的兩邊上。低壓電源引線450的外延部分454在晶片焊盤420和多個訊號控制引線460之間。低壓電源引線450的外延部分454通常垂直於低壓電源引線450的引線部分452。低壓電源引線450的外延部分與多個訊號控制引線460分開。外延部分454的一端連接到引線部分452。外延部分454的另一端在多個訊號控制引線460的一邊上方延伸。外延部分454起連接桿的作用。柵極驅動和保護IC 410連接到低壓電源引線450的外延部分454。
第3C圖所示的成型封裝390密封了第一和第二電源晶片416和418、低壓電源引線450的外延部分454、柵極驅動和保護IC 410、多個接合引線480以及至少一大部分晶片焊盤420。低壓電源引線450的外延部分454的一個端面暴露於成型封裝390(圖中沒有表示出)的一個端面，成型封裝390與高壓電源引線440相對。
低壓電源引線450的外延部分454在晶片焊盤420和多個訊號控制引線460之間。
多個接合引線480將第一和第二電源晶片416和418電連接到低壓電源引線450。在本發明的實施例中，接合引線480連接到低壓電源引線450的外延部分454靠近低壓電源引線450的引線部分452的一個區域。在本發明的實施例中，另外的多個接合引線486將柵極驅動和保護IC 410電連接到第二電源晶片418、低壓電源引線450和多個訊號控制引線460。另外的多個接合引線486嵌入在第3C圖所示的成型封裝390中。
在本發明的實施例中，晶片焊盤420的厚度大於多個單列直插式引線402中每個同軸引線的厚度。高壓電源引線440的寬度大於多個訊號控制引線460中每個訊號控制引線的寬度。低壓電源引線450的引線部分452的寬度大於多個訊號控制引線460中每個訊號控制引線的寬度。高壓和低壓電源引線440和450之間的距離大於多個訊號控制引線鄰近的訊號控制引線之間的距離。
在本發明的實施例中引線框包含晶片焊盤420和引線440、450和460，引線框為雙規銅引線框。多個接合引線480為鋁引線。低壓電源引線450為單件組裝。
多個接合引線480中所選的接合引線484和晶片焊盤420之間最大的垂直距離482的預定義下限，是第3C圖所示成型封裝390的絕緣性能的函數。 隨著第3C圖所示成型封裝390的絕緣性能的下降(第3C圖所示成型封裝390的導熱係數增大)，預定義下限增大。在本發明的實施例中，當第3C圖所示成型封裝390的導熱係數為0.7瓦特每米克爾文時，預定義下限為3mm。當第3C圖所示成型封裝390的導熱係數為0.8瓦特每米克爾文時，預定義下限為4mm。
第5圖表示在本發明的實施例中，電源模組500(所帶的成型封裝沒有表示出)的俯視圖。電源模組500具有低壓電源引線550。電源模組500與電源模組400相比，除了低壓電源引線550為兩件式組裝結構之外，其他都與電源模組400類似。低壓電源引線550具有一個引線部分552和一個外延部分。低壓電 源引線550的引線部分552通常平行於高壓電源引線540。低壓電源引線550的外延部分通常垂直於低壓電源引線550的引線部分552。低壓電源引線550的外延部分被空間556分成兩個獨立的子部分554A和554B。子部分554A連接到引線部分552。部分554B在多個訊號控制引線的一個邊緣上延伸，起連接桿的作用。柵極驅動和保護IC 410附著在外延部分554B上，外延部分554B與低壓電源引線550分開。在子部分554A處，多個接合引線480將第一和第二電源晶片416和418電連接到低壓電源引線550。
第6A圖表示在本發明的實施例中，電源模組600A的俯視圖，第6B圖表示另一種電源模組600B的俯視圖。電源模組600A比電源模組600B多一個引線662。電源模組600A具有高壓電源引線C、低壓電源引線E、輸入電壓引線Vin、跳躍輸出引線VFO、電壓輸出引線Vot、電阻器引線Rov、公共偏壓引線VCC和接地引線COM。電源模組600B具有高壓電源引線C、低壓電源引線E、跳躍輸出引線VFO、輸入電壓引線Vin、用於電流超載保護的電容器引線Csc、公共偏壓引線VCC和接地引線COM。
所屬技術領域中具有通常知識者應明確上述實施例可能存在修正。例如，電源晶片的數量可能不同。訊號控制引線的數量可能不同。所屬技術領域中具有通常知識者做出的所有修正，都應認為在本發明的範圍內，並且本發明由所附的申請專利範圍限定。

Claims (16)

  1. 一種電源模組，其包含：一個晶片焊盤；一個或複數個電源晶片，貼在該晶片焊盤的頂面上；複數個單列直插式引線，包含一高壓電源引線、一低壓電源引線和複數個訊號控制引線，該低壓電源引線具有一個平行於該高壓電源引線的一引線部分，以及一個垂直於該引線部分的一外延部分；一個柵極驅動和保護積體電路(IC)，貼在該低壓電源引線的該外延部分上；複數個接合引線；以及一個成型封裝，密封該一個或複數個電源晶片、該低壓電源引線的該外延部分、該柵極驅動和保護IC、該複數個接合引線以及至少一大部分該晶片焊盤；其中該低壓電源引線的該外延部分在該晶片焊盤和該複數個訊號控制引線之間。
  2. 如申請專利範圍第1項所述之電源模組，其中該一個或複數個電源晶片為絕緣柵雙極電晶體(IGBT)。
  3. 如申請專利範圍第1項所述之電源模組，其中該晶片焊盤的底面暴露於該成型封裝。
  4. 如申請專利範圍第3項所述之電源模組，其中一散熱片直接貼在該晶片焊盤的暴露底面上。
  5. 如申請專利範圍第4項所述之電源模組，其中該成型封裝具有一第一螺絲安裝豁口和一第二螺絲安裝豁口；其中該散熱片具有一第三螺絲安裝豁口和一第四螺絲安裝豁口；其中該第三螺絲安裝豁口與該第一螺絲安裝豁口對準；並且其中該第四螺絲安裝豁口與該第二螺絲安裝豁口對準。
  6. 如申請專利範圍第1項所述之電源模組，其中該電源模組的本體與TO247封裝的尺寸相同。
  7. 如申請專利範圍第1項所述之電源模組，其中該成型封裝為直角棱鏡形；其中該成型封裝具有一第一端表面和一第二端表面，該第二端表面與該第一端表面相對；其中一第一螺絲安裝豁口在該成型封裝的該第一端表面附近；並且其中一第二螺絲安裝豁口在該成型封裝的該第二端表面附近。
  8. 如申請專利範圍第1項所述之電源模組，其中在該複數個單列直插式引線的該高壓電源引線和該低壓電源引線之間，該成型封裝具有一個絕緣豁口。
  9. 如申請專利範圍第1項所述之電源模組，其中該晶片焊盤的厚度大於該複數個單列直插式引線中每個同軸引線的厚度。
  10. 如申請專利範圍第1項所述之電源模組，其中該高壓電源引線的寬度大於該複數個訊號控制引線中每個訊號控制引線的寬度。
  11. 如申請專利範圍第1項所述之電源模組，其中該低壓電源引線的該引線部分的寬度大於該複數個訊號控制引線中每個訊號控制引線的寬度。
  12. 如申請專利範圍第1項所述之電源模組，其中該高壓電源引線和該低壓電源引線之間的距離大於該複數個訊號控制引線中鄰近的訊號控制引線之間的距離。
  13. 如申請專利範圍第1項所述之電源模組，其中引線框為雙規銅引線框。
  14. 如申請專利範圍第1項所述之電源模組，其中該複數個接合引線為鋁引線。
  15. 如申請專利範圍第1項所述之電源模組，其中該低壓電源引線為單件組裝結構。
  16. 如申請專利範圍第1項所述之電源模組，其中該低壓電源引線為兩件組裝結構，其中該低壓電源引線的該外延部分具有連接到該低壓電源引線的該引線部分的一第一部分以及與該第一部分分開的一第二部分。
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