TWI639654B - Use of polysilsesquioxane encapsulating material composition for UV-LED and metal alkoxide used therefor - Google Patents
Use of polysilsesquioxane encapsulating material composition for UV-LED and metal alkoxide used therefor Download PDFInfo
- Publication number
- TWI639654B TWI639654B TW104102550A TW104102550A TWI639654B TW I639654 B TWI639654 B TW I639654B TW 104102550 A TW104102550 A TW 104102550A TW 104102550 A TW104102550 A TW 104102550A TW I639654 B TWI639654 B TW I639654B
- Authority
- TW
- Taiwan
- Prior art keywords
- encapsulating material
- group
- polysilsesquioxane
- resin
- metal alkoxide
- Prior art date
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- 239000000463 material Substances 0.000 title claims abstract description 40
- 229920000734 polysilsesquioxane polymer Polymers 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 239000000203 mixture Substances 0.000 title claims abstract description 18
- 150000004703 alkoxides Chemical class 0.000 title claims abstract description 17
- 238000002834 transmittance Methods 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 125000003545 alkoxy group Chemical group 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 229910021645 metal ion Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 125000000962 organic group Chemical group 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 13
- 239000002904 solvent Substances 0.000 description 12
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 11
- 238000005259 measurement Methods 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 239000007858 starting material Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 150000003304 ruthenium compounds Chemical class 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- -1 aluminium alkoxide Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- LNOLJFCCYQZFBQ-BUHFOSPRSA-N (ne)-n-[(4-nitrophenyl)-phenylmethylidene]hydroxylamine Chemical compound C=1C=C([N+]([O-])=O)C=CC=1C(=N/O)/C1=CC=CC=C1 LNOLJFCCYQZFBQ-BUHFOSPRSA-N 0.000 description 1
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- XYKNTXVAUYWFFE-UHFFFAOYSA-N 1-(1-hexoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCCCOCC(C)OCC(C)O XYKNTXVAUYWFFE-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- BWPAALSUQKGDBR-UHFFFAOYSA-N 1-hexoxypropan-2-ol Chemical compound CCCCCCOCC(C)O BWPAALSUQKGDBR-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- HIHCHRKDSFIIPE-UHFFFAOYSA-N 1-octan-3-yloxypropan-2-ol Chemical compound CCCCCC(CC)OCC(C)O HIHCHRKDSFIIPE-UHFFFAOYSA-N 0.000 description 1
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 1
- KJBPYIUAQLPHJG-UHFFFAOYSA-N 1-phenylmethoxypropan-2-ol Chemical compound CC(O)COCC1=CC=CC=C1 KJBPYIUAQLPHJG-UHFFFAOYSA-N 0.000 description 1
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JARYONIMGOLFHM-UHFFFAOYSA-N 2-(2-octan-3-yloxyethoxy)ethanol Chemical compound CCCCCC(CC)OCCOCCO JARYONIMGOLFHM-UHFFFAOYSA-N 0.000 description 1
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 1
- LCVQGUBLIVKPAI-UHFFFAOYSA-N 2-(2-phenoxypropoxy)propan-1-ol Chemical compound OCC(C)OCC(C)OC1=CC=CC=C1 LCVQGUBLIVKPAI-UHFFFAOYSA-N 0.000 description 1
- LJVNVNLFZQFJHU-UHFFFAOYSA-N 2-(2-phenylmethoxyethoxy)ethanol Chemical compound OCCOCCOCC1=CC=CC=C1 LJVNVNLFZQFJHU-UHFFFAOYSA-N 0.000 description 1
- ODMJMGLKCFIXGS-UHFFFAOYSA-N 2-(2-phenylmethoxypropoxy)propan-1-ol Chemical compound OCC(C)OCC(C)OCC1=CC=CC=C1 ODMJMGLKCFIXGS-UHFFFAOYSA-N 0.000 description 1
- HUFRRBHGGJPNGG-UHFFFAOYSA-N 2-(2-propan-2-yloxypropoxy)propan-1-ol Chemical compound CC(C)OC(C)COC(C)CO HUFRRBHGGJPNGG-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- NYMYNNQZRSELLV-UHFFFAOYSA-N 2-octan-3-yloxyethanol Chemical compound CCCCCC(CC)OCCO NYMYNNQZRSELLV-UHFFFAOYSA-N 0.000 description 1
- ZQWAHYNAELDSMU-UHFFFAOYSA-N 2-octan-3-yloxyethyl acetate Chemical compound C(C)(=O)OCCOC(CCCCC)CC ZQWAHYNAELDSMU-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- WHFKYDMBUMLWDA-UHFFFAOYSA-N 2-phenoxyethyl acetate Chemical compound CC(=O)OCCOC1=CC=CC=C1 WHFKYDMBUMLWDA-UHFFFAOYSA-N 0.000 description 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 1
- HHKRKUHUUKNPAJ-UHFFFAOYSA-N 2-phenylmethoxyethyl acetate Chemical compound CC(=O)OCCOCC1=CC=CC=C1 HHKRKUHUUKNPAJ-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- HCDJVEYJSSTYSW-UHFFFAOYSA-N 2-propan-2-yloxyethyl acetate Chemical compound CC(C)OCCOC(C)=O HCDJVEYJSSTYSW-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- GBSGXZBOFKJGMG-UHFFFAOYSA-N 3-propan-2-yloxypropan-1-ol Chemical compound CC(C)OCCCO GBSGXZBOFKJGMG-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- GEADFHLCHUFFBM-UHFFFAOYSA-N C(C)#N.C(C(=O)C)(=O)O Chemical compound C(C)#N.C(C(=O)C)(=O)O GEADFHLCHUFFBM-UHFFFAOYSA-N 0.000 description 1
- WIIQXBSSDLUJAE-UHFFFAOYSA-N C(CCCC)C(CC)OC(C)COC(C)CO Chemical compound C(CCCC)C(CC)OC(C)COC(C)CO WIIQXBSSDLUJAE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XARCVCJMNAHBNG-UHFFFAOYSA-N tributylalumane hydrate Chemical compound CCCC[Al](CCCC)CCCC.O XARCVCJMNAHBNG-UHFFFAOYSA-N 0.000 description 1
- UOJDYENJFODXBG-UHFFFAOYSA-N triethylalumane;hydrate Chemical compound O.CC[Al](CC)CC UOJDYENJFODXBG-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/057—Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本發明係一種金屬烷氧化物之使用,其係作為硬化物之260nm之光的透過率為65%以上之UV-LED用聚倍半矽氧烷系封裝材料的硬化促進劑;及一種UV-LED用聚倍半矽氧烷系封裝材料組成物,其係含有聚倍半矽氧烷系封裝材料與金屬烷氧化物。
Description
本發明係有關UV-LED用聚倍半矽氧烷系封裝材料組成物及其用之金屬烷氧化物之使用。
專利文獻1記載縮合系矽氧封裝材料之硬化促進劑使用乙醯丙酮酸鋁所得的封裝材料。
專利文獻1:日本特開2007-112975號公報
但是此封裝材料在UV區域具有吸收,因此,作為UV-LED用之封裝材料,不一定可滿足者。
本發明包含下述〔1〕及〔2〕的發明。
〔1〕一種金屬烷氧化物之使用,其係作為硬化物之260nm之光的透過率為65%以上之UV-LED用聚倍半矽氧烷系封裝材料的硬化促進劑。
〔2〕一種UV-LED用聚倍半矽氧烷系封裝材料組成物,其係含有聚倍半矽氧烷系封裝材料與金屬烷氧化物。
依據本發明時,可提供適合於放出紫外線區域(特別是UV-C區域)之光之元件封裝的聚倍半矽氧烷系封裝材料組成物及其用之金屬烷氧化物之使用。
圖1為實施例1所得之硬化物之紫外光/可見光透過率測量結果。
圖2為比較例1所得之硬化物之紫外光/可見光透過率測量結果。
以下詳細說明本發明。
本發明中,聚倍半矽氧烷系封裝材料,例如有Azumax股份公司首頁「聚倍半矽氧烷.T-樹脂」
<URL:http://www.azmax.co.jp/cnt_catalog_chemical/
pdf/attach_20110517_135825.pdf>等所記載的聚倍半矽氧烷。
聚倍半矽氧烷系封裝材料之例,例如有包含具有式(1)表示之有機聚矽氧烷結構之樹脂A的封裝材料。
(式中,R1各自獨立表示烷基,R2各自獨立表示烷氧基、或羥基,p1、q1、a1、及b1表示[p1+b1×q1]:[a1×q1]=1:0.25~9的正數。)
較佳為進一步含有具有式(2)表示之有機聚矽氧烷結構之寡聚物B,而樹脂A與寡聚物B之混合比率,更佳為樹脂A:寡聚物B=100:0.1~20(質量比)。藉由以樹脂A為主成分,可抑制因紫外光所造成的劣化,或具有提高耐熱性的效果。
(式中,R1及R2表示與前述式(1)相同意義,p2、q2、r2、a2、及b2表示[a2×q2]/[(p2+b2×q2)+a2×q2+(r2+q2)]=0~0.3之0以上的數。)
以R1表示之烷基,可為直鏈狀,也可為支鏈狀,也可具有環狀結構,但是較佳為直鏈狀或支鏈狀之烷基,更佳為直鏈狀之烷基。該烷基之碳數無特別限定,較佳為1~10、更佳為1~6、又更佳為1~3、特佳為1。
R2各自獨立表示烷氧基、或羥基。
R2為烷氧基時,該烷氧基可為直鏈狀,也可為支鏈狀,也可具有環狀結構,但是較佳為直鏈狀或支鏈狀之烷氧基,更佳為直鏈狀之烷氧基。該烷氧基之碳數無特別限定,較佳為1~3、更佳為1~2、特佳為1。
複數之R1及R2各自可為同種之基,也可互為不同之基。
樹脂A係R1為具有選自由甲基及乙基所成群之1種以上,且R2為具有選自由甲氧基、乙氧基、異丙氧基、
及羥基所成群之1種以上者較佳,R1為具有選自由甲基及乙基所成群之1種以上,且R2為具有選自由甲氧基、乙氧基、及異丙氧基所成群之1種以上與羥基者更佳。
樹脂A之重量平均分子量(Mw)通常為1500以上8000以下。樹脂A之重量平均分子量滿足此範圍時,可提高硬化時之成形性。樹脂A之重量平均分子量較佳為1500以上7000以下、更佳為2000以上5000以下。
樹脂A係例如與上述各重複單位對應,具有可產生矽氧烷鍵之官能基的有機矽化合物作為起始原料來合成。「可產生矽氧烷鍵之官能基」,例如有鹵素原子、羥基、烷氧基。有機矽化合物,例如可列舉有機三鹵矽烷、有機三烷氧基矽烷。樹脂A可藉由將此等之起始原料以對應於各重複單位之存在比之比,使以水解縮合法進行反應來合成。樹脂A也可使用工業上市售的矽氧樹脂、烷氧基寡聚物等。
寡聚物B係R1為具有選自由甲基及乙基所成群之1種以上,R2為具有選自由甲氧基、乙氧基、異丙氧基、及羥基所成群之1種以上者較佳,R1為具有甲基,R2為具有甲氧基或羥基者更佳。
寡聚物B之重量平均分子量通常為未達1500。寡聚物B之重量平均分子量滿足此範圍時,可提高硬化時之成形性。寡聚物B之重量平均分子量較佳為200以上、未達1500、更佳為250~1000。
寡聚物B係例如與構成寡聚物B之上述各重複單位
對應,具有可產生矽氧烷鍵之官能基的有機矽化合物作為起始原料來合成。「可產生矽氧烷鍵之官能基」係表示與上述者相同意義。有機矽化合物例如可列舉有機三鹵矽烷、有機三烷氧基矽烷。寡聚物B可藉由將此等之起始原料以對應於各重複單位之存在比之比,使以水解縮合法進行反應來合成。
與樹脂A之重量平均分子量之差異,也可藉由例如控制使起始原料產生水解縮合反應時之反應溫度、對反應系內之起始原料之追加速度等來控制。寡聚物B也可使用工業上市售之矽氧樹脂、烷氧基寡聚物等。
樹脂A與寡聚物B之重量平均分子量係使用市售之GPC裝置,使用標準聚苯乙烯可進行測量。
硬化前之聚倍半矽氧烷系封裝材料,為了容易封裝設置於基板上的元件,因此可溶解於溶劑來使用。此時,所得之溶液的黏度調整成為在25℃下,10mPa.s至10000mPa.s即可。
溶劑只要是可分別溶解使用之硬化前的封裝材料者即可,例如有丙酮、甲基乙基酮等之酮溶劑;甲醇、乙醇、異丙醇、正丙醇等之醇溶劑;己烷、環己烷、庚烷、苯等之烴溶劑;乙酸甲酯、乙酸乙酯等之乙酸酯溶劑;二乙基醚、四氫呋喃等之醚溶劑;乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單異丙基醚、乙二醇單丁基醚、乙二醇單己基醚、乙二醇單乙基己基醚、乙二醇單苯基醚、乙二醇單苄基醚、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二
醇單異丙基醚、二乙二醇單丁基醚、二乙二醇單己基醚、二乙二醇單乙基己基醚、二乙二醇單苯基醚、二乙二醇單苄基醚、丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單異丙基醚、丙二醇單丁基醚、丙二醇單己基醚、丙二醇單乙基己基醚、丙二醇單苯基醚、丙二醇單苄基醚、二丙二醇單甲基醚、二丙二醇單乙基醚、二丙二醇單異丙基醚、二丙二醇單丁基醚、二丙二醇單己基醚、二丙二醇單乙基己基醚、二丙二醇單苯基醚、二丙二醇單苄基醚等之乙二醇醚溶劑;乙二醇單乙基醚乙酸酯、乙二醇單異丙基醚乙酸酯、乙二醇單丁基醚乙酸酯、乙二醇單己基醚乙酸酯、乙二醇單乙基己基醚乙酸酯、乙二醇單苯基醚乙酸酯、乙二醇單苄基醚乙酸酯等將乙酸基加成於前述記載之乙二醇醚溶劑的乙二醇酯溶劑等。
聚倍半矽氧烷系封裝材料可單獨使用一種或可併用2種以上。
本發明中之硬化促進劑為金屬烷氧化物。金屬烷氧化物係指下述式(3)表示之化合物。
M(OR)n (3)
(式中,M表示金屬離子。R表示有機基(烷基)。n表示金屬離子之價數。)
金屬烷氧化物中之金屬(M),可列舉鋁、鎵、鈦、鋯、鉿、鋅等。其中,放出紫外線區域(特別是UV-C區
域)之光,故較佳為鋁、鋯,更佳為鋁。烷氧基(OR),例如有甲氧基、乙氧基、丙氧基、異丙氧基、sec-丁氧基、tert-丁氧基等,較佳為異丙氧基。金屬烷氧化物較佳為烷氧化鋁(aluminium alkoxide)或烷氧化鋯。烷氧化鋁例如有三乙氧化鋁、三異丙氧化鋁、三sec-丁氧化鋁、三tert-丁氧化鋁等。異丙氧化鋯例如有四異丙氧化鋯、三sec-丁氧化鋯等。
硬化促進劑可溶解於有機溶劑等之溶劑來使用。此時使用之溶劑,只要是溶解有機金屬錯合物者即可,較佳為醇系、酯系、醚系。硬化促進劑之濃度,較佳為0.01%~10%。
硬化促進劑之使用量係相對於聚倍半矽氧烷系封裝材料,通常為10ppm~500ppm(重量百萬分率)、較佳為10ppm~200ppm之範圍、更佳為10ppm~100ppm。
硬化促進劑係將樹脂A及寡聚物B以另外的溶液來準備,使用前,將該等溶液混合為佳。
硬化促進劑可單獨使用一種或可併用2種以上。
本發明之使用,通常為將含有上述聚倍半矽氧烷系封裝材料與硬化促進劑之硬化前的封裝材料封裝於設置於基板的元件,接著使硬化來使用。亦即,本發明之使用之UV-LED用元件之封裝方法包含以下步驟:將元件設置於基板之第1步驟,將含有聚倍半矽氧烷系封裝材料與下述
溶劑a之聚倍半矽氧烷系封裝材料組成物,封裝於第1步驟中,設置於基板之元件的第2步驟及使在第2步驟被封裝的聚倍半矽氧烷系封裝材料硬化的第3步驟。
在基板上之元件設置可藉由常法進行。電極、配線等、半導體發光裝置,通常也可設置必要之其他的構成。
上述封裝步驟通常藉由專用的分配器(Dispenser)將硬化前之封裝材料供給基板上來進行。供給之硬化前之封裝材料的量係因基板、元件等之構造、面積、體積、其他電極、導線配線等之構造等而異,但是埋入此等之元件、導線配線,且覆蓋發光元件上的封裝材料之厚度,盡可能可形成薄的量為佳,更佳為形成2mm以下之厚度的量。特別是近年開發之發光輸出電流100mA以上之可見光用功率LED(power LED),產生波長350nm以下之紫外線發光之UV-LED等,該傾向顯著,因此,發光元件上之封裝材料之厚度形成薄者較佳。
硬化條件只要設定通常產生聚縮合反應之溫度與時間即可,具體而言,大氣壓下,空氣中,溫度較佳為100~200℃,更佳為120~200℃。時間較佳為1~5小時。又,為了有效促進封裝材料中之殘留溶劑之揮發或聚縮合反應等,可階段性提高硬化溫度使硬化。
硬化物之260nm之光的透過率為65%以上,較佳為67%以上,更佳為70~93%。
下述實施例所記載之紫外光/可見光透過率測量所用的裝置及測量條件如下述。
裝置名:島津製作所公司製UV-3600
附屬裝置(attachment):積分球ISR-3100
測量波長:220~800nm
背景測量:大氣
測量速度:中速
樹脂A為使用具有前述式(1)表示之有機聚矽氧烷結構的樹脂(A-1)(Mw=3500、前述式(1)中,R1=甲基、R2=甲氧基或羥基)。樹脂(A-1)之各重複單位之存在比率如表1所示。又,寡聚物B為使用具有前述式(2)表示之有機聚矽氧烷結構之寡聚物(B-1)(Mw=450、前述式(2)中,R1=甲基、R2=甲氧基)。寡聚物(B-1)之各重複單位之存在比率如表2所示。
在設置於水浴內的燒瓶內,添加前述樹脂(A-1)135g及異丙醇72.7g,加熱攪拌使內溫成為85℃為止,使前述樹脂(A-1)溶解。接著,添加前述寡聚物(B-1)15g,攪拌1小時以上,使前述寡聚物(B-1)溶解得到混合物。
所得之混合物中添加乙酸2-丁氧基乙酯47.2g後,使用蒸發器,在溫度為80℃、壓力為4kPaA之條件下,餾除異丙醇直到異丙醇濃度成為1質量%以下為止,得到前述樹脂(A-1)與前述寡聚物(B-1)之混合比為90:10(重量比)的聚倍半矽氧烷系封裝材料組成物(α1)。
相對於聚倍半矽氧烷系封裝材料組成物(α1),使三異丙氧化鋁相對於α1成為100ppm(質量基準)來添加三異丙氧化鋁0.1wt%之異丙醇溶液,經充分攪拌混合得到聚倍半矽氧烷系封裝材料組成物(α1-1)。然後,在鋁製杯內投入組成物(α1-1)約3.8g,在烤箱之中,以3.7℃/分鐘之速度,由室溫升溫至150℃,在150℃下放置5小時,得到組成物(α1-1)之硬化物。所得之硬化物之厚度為1.7mm。
圖1表示硬化物之紫外光/可見光透過率測量結果。260nm之紫外光/可見光透過率為70%。
將甲基三甲氧基矽烷12.7g、二甲基二甲氧基矽烷11.2g、甲醇3.3g、水8.1g及5質量%乙醯丙酮鋁鹽(Acetylacetone aluminum)甲醇溶液4.8g於燒瓶內以瓶栓密封,使用攪拌器(Stirrer)攪拌,同時以50℃之溫水浴加熱8小時後,返回室溫,調製樹脂液。
將此樹脂液7.3g置入直徑5cm之鐵氟龍(註冊商標)盤(Schale)中,40℃下保持4小時,接著以3小時升溫至65℃,接著以1小時升溫至150℃,在150℃下保持3小時,得到硬化物。此時之硬化物的厚度為0.9mm。圖2表示硬化物之紫外光/可見光透過率測量結果。260nm之紫外光/可見光透過率為0%。
本發明可作為例如UV-LED用之封裝材料使用。
Claims (2)
- 一種UV-LED用聚倍半矽氧烷系封裝材料組成物,其係含有聚倍半矽氧烷系封裝材料與金屬烷氧化物,其特徵為:聚倍半矽氧烷系封裝材料係包含下述樹脂A的封裝材料,金屬烷氧化物係下述式(3)表示之化合物,金屬烷氧化物之含有量係相對於聚倍半矽氧烷系封裝材料之含有量,為10ppm~500ppm(重量百萬分率);<樹脂A>具有式(1)表示之有機聚矽氧烷結構之樹脂
- 一種金屬烷氧化物之使用,其係作為硬化物之260nm之光的透過率為65%以上之UV-LED用聚倍半矽氧烷系封裝材料的硬化促進劑,其特徵為:UV-LED用聚倍半矽氧烷系封裝材料係包含下述樹脂A的封裝材料,金屬烷氧化物係下述式(3)表示之化合物,金屬烷氧化物之使用量係相對於UV-LED用聚倍半矽氧烷系封裝材料之使用量,為10ppm~500ppm(重量百萬分率);<樹脂A>具有式(1)表示之有機聚矽氧烷結構之樹脂
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JP4791083B2 (ja) * | 2005-05-30 | 2011-10-12 | 信越化学工業株式会社 | 光関連デバイス封止用樹脂組成物およびその硬化物 |
US7928457B2 (en) * | 2005-09-22 | 2011-04-19 | Mitsubishi Chemical Corporation | Member for semiconductor light emitting device and method for manufacturing such member, and semiconductor light emitting device using such member |
EP2682446A3 (en) * | 2006-06-27 | 2014-03-26 | Mitsubishi Chemical Corporation | Illuminating device |
CN101506969B (zh) * | 2006-08-22 | 2011-08-31 | 三菱化学株式会社 | 半导体器件用部材、以及半导体器件用部材形成液和半导体器件用部材的制造方法、以及使用该方法制造的半导体器件用部材形成液、荧光体组合物、半导体发光器件、照明装置和图像显示装置 |
JP2009224754A (ja) * | 2007-08-22 | 2009-10-01 | Mitsubishi Chemicals Corp | 半導体発光装置、照明装置、及び画像表示装置 |
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TW200415186A (en) * | 2003-02-14 | 2004-08-16 | Chung Hwa Chemical Ind Works Ltd | Polysilsesquioxane-metal alkoxide hybrid film material, its preparation and use |
JP2006077234A (ja) * | 2004-08-10 | 2006-03-23 | Shin Etsu Chem Co Ltd | Led素子封止用樹脂組成物および該組成物を硬化してなる硬化物 |
WO2011125646A1 (ja) * | 2010-03-31 | 2011-10-13 | Jsr株式会社 | 硬化性樹脂組成物および発光装置 |
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JP6343947B2 (ja) | 2018-06-20 |
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