TWI639277B - 電性接點及電性連接裝置 - Google Patents

電性接點及電性連接裝置 Download PDF

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Publication number
TWI639277B
TWI639277B TW105127692A TW105127692A TWI639277B TW I639277 B TWI639277 B TW I639277B TW 105127692 A TW105127692 A TW 105127692A TW 105127692 A TW105127692 A TW 105127692A TW I639277 B TWI639277 B TW I639277B
Authority
TW
Taiwan
Prior art keywords
plunger
contact
electrical contact
electrical
electrode
Prior art date
Application number
TW105127692A
Other languages
English (en)
Chinese (zh)
Other versions
TW201724662A (zh
Inventor
Kenichi Shibutani
澁谷健一
Original Assignee
Kabushiki Kaisha Nihon Micronics
日商日本麥克隆尼股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Nihon Micronics, 日商日本麥克隆尼股份有限公司 filed Critical Kabushiki Kaisha Nihon Micronics
Publication of TW201724662A publication Critical patent/TW201724662A/zh
Application granted granted Critical
Publication of TWI639277B publication Critical patent/TWI639277B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/64—Means for preventing incorrect coupling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
TW105127692A 2015-11-25 2016-08-29 電性接點及電性連接裝置 TWI639277B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-229513 2015-11-25
JP2015229513A JP6637742B2 (ja) 2015-11-25 2015-11-25 電気的接触子及び電気的接続装置

Publications (2)

Publication Number Publication Date
TW201724662A TW201724662A (zh) 2017-07-01
TWI639277B true TWI639277B (zh) 2018-10-21

Family

ID=58719483

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105127692A TWI639277B (zh) 2015-11-25 2016-08-29 電性接點及電性連接裝置

Country Status (4)

Country Link
US (1) US10018669B2 (enExample)
JP (1) JP6637742B2 (enExample)
KR (1) KR101833970B1 (enExample)
TW (1) TWI639277B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY177005A (en) * 2016-11-30 2020-09-01 Nidec Read Corp Contact terminal, inspection jig, and inspection device
KR102356584B1 (ko) 2017-05-17 2022-01-28 주식회사 만도 전자식 브레이크 시스템
KR102121754B1 (ko) * 2018-12-19 2020-06-11 주식회사 오킨스전자 상하 2개의 영역으로 구분되는 단일 코일 스프링을 포함하는 테스트 소켓
KR102126752B1 (ko) * 2018-12-19 2020-06-25 주식회사 오킨스전자 이중 코일 스프링에 의하여 3개의 플런저가 독립적으로 슬라이드 동작하는 테스트 소켓에 있어서, 레일을 통하여 콘택 특성이 개선되는 데스트 핀
KR102126753B1 (ko) * 2018-12-19 2020-06-25 주식회사 오킨스전자 단일 코일 스프링에 의하여 3개의 플런저가 독립적으로 슬라이드 동작하는 테스트 소켓에 있어서, 레일을 통하여 상기 슬라이드 동작이 제어되는 데스트 핀
KR102078549B1 (ko) * 2018-12-19 2020-02-19 주식회사 오킨스전자 동축에서 직렬로 탑재되는 듀얼 코일 스프링을 포함하는 테스트 소켓용 테스트 핀
JP7780969B2 (ja) * 2022-02-10 2025-12-05 日本発條株式会社 コンタクトプローブおよびプローブホルダ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM260995U (en) 2004-03-31 2005-04-01 Chupond Prec Co Ltd Central processor socket

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942972U (ja) * 1982-09-14 1984-03-21 日本電気株式会社 スル−ホ−ル導通抵抗測定端子
JP4695337B2 (ja) 2004-02-04 2011-06-08 日本発條株式会社 導電性接触子および導電性接触子ユニット
KR100584225B1 (ko) 2004-10-06 2006-05-29 황동원 전자장치용 콘택트
US7862391B2 (en) * 2007-09-18 2011-01-04 Delaware Capital Formation, Inc. Spring contact assembly
JP5361518B2 (ja) * 2009-04-27 2013-12-04 株式会社ヨコオ コンタクトプローブ及びソケット
JP5750535B2 (ja) * 2009-09-28 2015-07-22 株式会社日本マイクロニクス 接触子及び電気的接続装置
JPWO2011096067A1 (ja) * 2010-02-05 2013-06-10 株式会社日本マイクロニクス 接触子及び電気的接続装置
JP5629611B2 (ja) * 2011-03-01 2014-11-26 株式会社日本マイクロニクス 接触子及び電気的接続装置
US8373430B1 (en) * 2012-05-06 2013-02-12 Jerzy Roman Sochor Low inductance contact probe with conductively coupled plungers
KR101328581B1 (ko) * 2012-06-13 2013-11-13 리노공업주식회사 검사용 프로브 및 그 제조방법
JP6041565B2 (ja) * 2012-07-26 2016-12-07 株式会社ヨコオ 検査治具
JP6168911B2 (ja) 2013-08-20 2017-07-26 日立造船株式会社 カーボンナノチューブの製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM260995U (en) 2004-03-31 2005-04-01 Chupond Prec Co Ltd Central processor socket

Also Published As

Publication number Publication date
KR20170061058A (ko) 2017-06-02
US20170146593A1 (en) 2017-05-25
KR101833970B1 (ko) 2018-03-02
US10018669B2 (en) 2018-07-10
JP2017096787A (ja) 2017-06-01
TW201724662A (zh) 2017-07-01
JP6637742B2 (ja) 2020-01-29

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