TWI628696B - 製程窗優化器 - Google Patents

製程窗優化器

Info

Publication number
TWI628696B
TWI628696B TW104102587A TW104102587A TWI628696B TW I628696 B TWI628696 B TW I628696B TW 104102587 A TW104102587 A TW 104102587A TW 104102587 A TW104102587 A TW 104102587A TW I628696 B TWI628696 B TW I628696B
Authority
TW
Taiwan
Prior art keywords
optimizer
process window
window
process
Prior art date
Application number
TW104102587A
Other languages
English (en)
Other versions
TW201532124A (en
Inventor
史蒂芬 亨奇
維努 維倫奇
Original Assignee
荷蘭商Asml荷蘭公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201461939071P priority Critical
Priority to US61/939,071 priority
Priority to US201461943834P priority
Priority to US61/943,834 priority
Application filed by 荷蘭商Asml荷蘭公司 filed Critical 荷蘭商Asml荷蘭公司
Publication of TW201532124A publication Critical patent/TW201532124A/zh
Application granted granted Critical
Publication of TWI628696B publication Critical patent/TWI628696B/zh

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50Computer-aided design
    • G06F17/5009Computer-aided design using simulation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management and control, including software
    • G03F7/705Modelling and simulation from physical phenomena up to complete wafer process or whole workflow in wafer fabrication
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management and control, including software
    • G03F7/70525Controlling normal operating mode, e.g. matching different apparatus, remote control, prediction of failure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
TW104102587A 2014-02-12 2015-01-26 製程窗優化器 TWI628696B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US201461939071P true 2014-02-12 2014-02-12
US61/939,071 2014-02-12
US201461943834P true 2014-02-24 2014-02-24
US61/943,834 2014-02-24

Publications (2)

Publication Number Publication Date
TW201532124A TW201532124A (en) 2015-08-16
TWI628696B true TWI628696B (zh) 2018-07-01

Family

ID=52302232

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104102587A TWI628696B (zh) 2014-02-12 2015-01-26 製程窗優化器
TW107106250A TW201834016A (zh) 2014-02-12 2015-01-26 製程窗優化器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107106250A TW201834016A (zh) 2014-02-12 2015-01-26 製程窗優化器

Country Status (8)

Country Link
US (2) US9990451B2 (zh)
EP (1) EP3105636A1 (zh)
JP (2) JP6386569B2 (zh)
KR (2) KR101939288B1 (zh)
CN (2) CN109283800A (zh)
SG (1) SG11201606207WA (zh)
TW (2) TWI628696B (zh)
WO (1) WO2015120996A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5969848B2 (ja) * 2012-07-19 2016-08-17 キヤノン株式会社 露光装置、調整対象の調整量を求める方法、プログラム及びデバイスの製造方法
CN106463434A (zh) * 2014-06-10 2017-02-22 Asml荷兰有限公司 计算晶片检验
KR20160004773A (ko) * 2014-07-04 2016-01-13 삼성전자주식회사 반도체 소자의 제조 방법 및 장치
CN107077077B (zh) * 2014-09-22 2019-03-12 Asml荷兰有限公司 过程窗口识别符
NL2017739A (en) 2015-11-27 2017-06-07 Asml Netherlands Bv Metrology target, method and apparatus, computer program and lithographic system
WO2017194281A1 (en) * 2016-05-12 2017-11-16 Asml Netherlands B.V. Identification of hot spots or defects by machine learning
WO2019043780A1 (ja) * 2017-08-29 2019-03-07 ギガフォトン株式会社 データ解析装置、半導体製造システム、データ解析方法、及び半導体製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777901A (en) * 1995-09-29 1998-07-07 Advanced Micro Devices, Inc. Method and system for automated die yield prediction in semiconductor manufacturing

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4597509B2 (ja) * 1999-08-26 2010-12-15 株式会社ナノジオメトリ研究所 パターン検査装置およびパターン検査方法
JP4663214B2 (ja) * 2001-03-20 2011-04-06 シノプシイス インコーポレイテッド マスク欠陥のプリンタビリティ解析を提供するシステム及び方法
JP2004053683A (ja) * 2002-07-16 2004-02-19 Fujitsu Ltd パターン形成プロセスの管理方法及び管理装置
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
KR101056142B1 (ko) * 2004-01-29 2011-08-10 케이엘에이-텐코 코포레이션 레티클 설계 데이터의 결함을 검출하기 위한 컴퓨터로구현되는 방법
EP2016620A2 (en) * 2006-04-17 2009-01-21 Omnivision Cdm Optics, Inc. Arrayed imaging systems and associated methods
JP4851924B2 (ja) * 2006-12-08 2012-01-11 株式会社東芝 危険箇所集計方法、パターン修正方法およびプログラム
US7689948B1 (en) * 2007-02-24 2010-03-30 Cadence Design Systems, Inc. System and method for model-based scoring and yield prediction
JP4333770B2 (ja) * 2007-04-12 2009-09-16 ソニー株式会社 マスクパターン作成プログラム、半導体製造方法、マスクパターン作成方法および半導体設計プログラム
US7707526B2 (en) * 2007-05-25 2010-04-27 Synopsys, Inc. Predicting IC manufacturing yield based on hotspots
NL2003654A (en) * 2008-11-06 2010-05-10 Brion Tech Inc Methods and system for lithography calibration.
NL2003699A (en) 2008-12-18 2010-06-21 Brion Tech Inc Method and system for lithography process-window-maximixing optical proximity correction.
US8312406B2 (en) * 2009-06-22 2012-11-13 Cadence Design Systems, Inc. Method and system performing RC extraction
NL2005523A (en) * 2009-10-28 2011-05-02 Asml Netherlands Bv Selection of optimum patterns in a design layout based on diffraction signature analysis.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777901A (en) * 1995-09-29 1998-07-07 Advanced Micro Devices, Inc. Method and system for automated die yield prediction in semiconductor manufacturing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Duo Ding,Xiang Wu,Joydeep Ghosh and David Z. Pan," Machine Learning based Lithographic Hotspot Detection with Critical-Feature Extraction and Classification",IC DESIGN AND TECHNOLOGY,2009 ICICDT`09 IEEE INTERNATIONAL CONFERENCE .IEEE PISCATAWAY,NJ,USA,18 MAY 2009,pages 219-222 *

Also Published As

Publication number Publication date
SG11201606207WA (en) 2016-09-29
JP2018194847A (ja) 2018-12-06
JP6386569B2 (ja) 2018-09-05
WO2015120996A1 (en) 2015-08-20
US20180330030A1 (en) 2018-11-15
CN105980934B (zh) 2018-10-09
CN105980934A (zh) 2016-09-28
EP3105636A1 (en) 2016-12-21
KR101939288B1 (ko) 2019-01-16
US9990451B2 (en) 2018-06-05
JP2017505460A (ja) 2017-02-16
KR20160122217A (ko) 2016-10-21
TW201834016A (zh) 2018-09-16
CN109283800A (zh) 2019-01-29
KR20180136581A (ko) 2018-12-24
US20150227654A1 (en) 2015-08-13
TW201532124A (en) 2015-08-16

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