TWI628072B - Press machine, vacuum frame and press forming method - Google Patents

Press machine, vacuum frame and press forming method Download PDF

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Publication number
TWI628072B
TWI628072B TW102143417A TW102143417A TWI628072B TW I628072 B TWI628072 B TW I628072B TW 102143417 A TW102143417 A TW 102143417A TW 102143417 A TW102143417 A TW 102143417A TW I628072 B TWI628072 B TW I628072B
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Taiwan
Prior art keywords
diaphragm
hot plate
chamber
air pressure
workpiece
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TW102143417A
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Chinese (zh)
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TW201444673A (en
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岡崎靜明
則清功夫
弓戶良次
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北川精機股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B5/00Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B7/00Presses characterised by a particular arrangement of the pressing members
    • B30B7/02Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Press Drives And Press Lines (AREA)
  • Manufacturing & Machinery (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

本發明之實施態樣的沖壓裝置包含:上部隔膜,係在上下方向上劃分出上部空間與主腔室的彈性膜;下部隔膜,係與上部隔膜對向配置,並在上下方向上劃分出主腔室與下部空間的彈性膜;氣壓控制裝置,控制主腔室內與上部空間及下部空間的氣壓差;及加熱裝置,將配置於主腔室內的被加工物加熱。氣壓控制裝置,係以進行下述處理的方式所構成:沖壓處理,使主腔室內的氣壓低於上部空間及下部空間的氣壓,以對在上部隔膜與下部隔膜之間加熱的被加工物進行沖壓;及硬化處理,使主腔室內的氣壓高於下部空間的氣壓,以在非真空狀態下,對被加工物加熱。 The press apparatus according to an embodiment of the present invention includes: an upper diaphragm that divides an upper space and an elastic film of the main chamber in the up and down direction; and a lower diaphragm that is disposed opposite to the upper diaphragm and is divided in the up and down direction. An elastic film of the chamber and the lower space; a pneumatic control device that controls a difference in air pressure between the main chamber and the upper space and the lower space; and a heating device that heats the workpiece disposed in the main chamber. The air pressure control device is configured to perform a process of pressing the air pressure in the main chamber to be lower than the air pressure in the upper space and the lower space to perform a workpiece heated between the upper diaphragm and the lower diaphragm. Stamping; and hardening treatment, so that the air pressure in the main chamber is higher than the air pressure in the lower space to heat the workpiece in a non-vacuum state.

Description

沖壓裝置、真空框及沖壓成形方法 Stamping device, vacuum frame and stamping forming method

本發明係關於一種用於疊層品之疊層加工的沖壓裝置、真空框及沖壓成形方法。 The present invention relates to a press apparatus, a vacuum frame, and a press forming method for lamination processing of a laminate.

用於進行太陽能電池面板等的疊層品之疊層加工之使用隔膜(彈性膜)的熱沖壓裝置(以下稱為「疊層裝置」)已為人所知。專利文獻1中所揭示的習知隔膜式的疊層裝置中,於熱盤與隔膜之間形成真空腔室。藉由將真空腔室內抽真空,使配置於熱盤上的被加工物,於熱盤與隔膜之間被加壓,以進行疊層加工。 A hot stamping apparatus (hereinafter referred to as a "stacking apparatus") using a separator (elastic film) for laminating a laminate of a solar cell panel or the like is known. In the conventional diaphragm type laminating apparatus disclosed in Patent Document 1, a vacuum chamber is formed between the hot plate and the diaphragm. The object to be processed placed on the hot plate is pressurized between the hot plate and the diaphragm by vacuuming the inside of the vacuum chamber to perform lamination processing.

【先行技術文獻】 [First technical literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開2012-196835號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-196835

上述習知的疊層裝置,因為係在熱盤的平坦頂面與隔膜之間對被加工物進行沖壓,若非至少單面為平坦的被加工物,就無法以均勻的壓力進行沖壓,而無法進行適當的疊層加工。 In the above-mentioned conventional laminating apparatus, since the workpiece is pressed between the flat top surface of the hot plate and the diaphragm, if the workpiece is not at least one surface flat, the stamping cannot be performed under uniform pressure, and the workpiece cannot be pressed. Perform appropriate lamination processing.

本發明係鑒於上述情事所完成者,其目的係提供一種疊層裝置,可對兩面為非平坦面的被加工物進行疊層加工。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a laminating apparatus which can laminate a workpiece having a non-flat surface on both sides.

根據本發明之一實施態樣,提供一種沖壓裝置,其係具備:上部隔膜,係在上下方向上劃分出上部空間與主腔室的彈性膜;下部隔膜,係與該上部隔膜對向配置,且在上下方向上劃分出該主腔室與下部空間的彈性膜;氣壓控制裝置,控制該主腔室內部與該上部空間及該下部空間的氣壓差;及加熱裝置,將配置於該主腔室內的被加工物加熱,該氣壓控制裝置進行下述處理:沖壓處理,使該主腔室內的氣壓小於該上部空間及該下部空間的氣壓,以對於在該上部隔膜與該下部隔膜之間加熱的該被加工物進行沖壓;及硬化(cure)處理,使該主腔室內的氣壓大於該下部空間的氣壓,以在非真空下對該被加工物進行加熱。 According to an embodiment of the present invention, there is provided a press apparatus comprising: an upper diaphragm that defines an elastic film of an upper space and a main chamber in a vertical direction; and a lower diaphragm that is disposed opposite to the upper diaphragm, And separating an elastic film of the main chamber and the lower space in an up-and-down direction; a gas pressure control device controlling a difference in air pressure between the main chamber and the upper space and the lower space; and a heating device disposed in the main cavity The workpiece in the room is heated, and the air pressure control device performs a process of pressing the air pressure in the main chamber to be smaller than the air pressure in the upper space and the lower space to heat between the upper diaphragm and the lower diaphragm. The workpiece is stamped; and a cure process is performed such that the air pressure in the main chamber is greater than the air pressure in the lower space to heat the workpiece under non-vacuum.

根據本發明之一實施態樣,提供一真空框,其形成環狀,並以下述方式構成:其中形成氣密的主腔室,該主腔室係以下側被彈性膜即上部隔膜所封蓋的上部腔室,及上側被彈性膜即下部隔膜所封蓋的下部腔室所夾住,該主腔室的氣壓低於該上部腔室及該下部腔室的氣壓,藉此在該上部隔膜與該下部隔膜之間,對配置於該主腔室內的被加工物進行沖壓,該真空框具有對該主腔室進行供排氣體之通氣孔, 該通氣孔具有:環狀部,在該真空框的延長方向上延伸;第一部,從該環狀部延伸,並往該真空框的外周面開口;及第二部,從該環狀部延伸,並往該真空框的內周面開口。 According to an embodiment of the present invention, a vacuum frame is provided which is formed into a ring shape and is constructed in such a manner that an airtight main chamber is formed, the lower side of the main chamber being covered by an elastic film, that is, an upper diaphragm The upper chamber and the upper side are sandwiched by a lower chamber covered by an elastic membrane, that is, a lower diaphragm, the air pressure of the main chamber being lower than the air pressure of the upper chamber and the lower chamber, whereby the upper diaphragm is Between the lower diaphragm and the workpiece disposed in the main chamber, the vacuum frame has a vent hole for supplying and discharging the main chamber. The vent hole has an annular portion extending in a direction in which the vacuum frame extends; a first portion extending from the annular portion and opening to an outer circumferential surface of the vacuum frame; and a second portion from the annular portion Extending and opening to the inner peripheral surface of the vacuum frame.

根據本發明之一實施態樣,提供一種沖壓成形方法,其係:將被加工物配置於主腔室內,該主腔室係藉由上下對向配置的一對彈性膜、即上部隔膜與下部隔膜,而分別與上部空間及下部空間氣密地被劃分出來,進行沖壓處理,其中一方面將該被加工物加熱,一方面使該主腔室內的氣壓低於該上部空間及該下部空間的氣壓,以在該上部隔膜與該下部隔膜之間對被加熱的該被加工物進行沖壓,進行硬化處理,使該主腔室內的氣壓高於該下部空間的氣壓,以在非真空下對該被加工物進行加熱。 According to an embodiment of the present invention, a press forming method is provided in which a workpiece is disposed in a main chamber which is a pair of elastic membranes disposed between the upper and lower sides, that is, an upper diaphragm and a lower portion. The diaphragm is separately and airtightly partitioned from the upper space and the lower space, and is subjected to a stamping process, wherein the workpiece is heated on the one hand, and the air pressure in the main chamber is lower than the upper space and the lower space on the other hand. Pressurizing the workpiece to be heated between the upper diaphragm and the lower diaphragm, and performing a hardening treatment so that the air pressure in the main chamber is higher than the air pressure in the lower space to The workpiece is heated.

根據本發明之一實施態樣的構成,可對兩面非平坦面的被加工物進行疊層加工。 According to the configuration of an embodiment of the present invention, it is possible to laminate a workpiece having a non-flat surface on both sides.

1‧‧‧疊層裝置 1‧‧‧Multilayer

1a‧‧‧本體 1a‧‧‧ Ontology

2‧‧‧控制部 2‧‧‧Control Department

3‧‧‧氣壓控制裝置 3‧‧‧Pneumatic control device

3a‧‧‧排氣管路 3a‧‧‧Exhaust line

3b‧‧‧排氣管路 3b‧‧‧Exhaust line

3c‧‧‧排氣管路 3c‧‧‧ exhaust line

4‧‧‧油壓控制裝置 4‧‧‧Hydraulic control device

10‧‧‧外部腔室 10‧‧‧External chamber

20‧‧‧上部熱盤 20‧‧‧ upper hot plate

20a‧‧‧通氣孔 20a‧‧‧Ventinel

20U‧‧‧上部腔室單元 20U‧‧‧Upper chamber unit

21U‧‧‧上部隔膜固定框 21U‧‧‧ upper diaphragm fixing frame

22U‧‧‧上部隔膜 22U‧‧‧ upper diaphragm

23U‧‧‧上部隔膜保護板 23U‧‧‧ upper diaphragm protection board

24U‧‧‧上部腔室 24U‧‧‧ upper chamber

26‧‧‧主腔室 26‧‧‧Main chamber

30‧‧‧中間熱盤 30‧‧‧Intermediate hot plate

37‧‧‧電磁閥 37‧‧‧ solenoid valve

40‧‧‧下部熱盤 40‧‧‧Lower hot plate

40a‧‧‧通氣孔 40a‧‧‧Ventinel

40L‧‧‧下部腔室單元 40L‧‧‧lower chamber unit

41L‧‧‧下部隔膜固定框 41L‧‧‧Lower diaphragm fixing frame

42L‧‧‧下部隔膜 42L‧‧‧ lower diaphragm

43L‧‧‧下部隔膜成形板 43L‧‧‧lower diaphragm forming plate

44L‧‧‧下部腔室 44L‧‧‧lower chamber

47‧‧‧3接頭電磁閥 47‧‧‧3 joint solenoid valve

50‧‧‧油壓汽缸 50‧‧‧Hydraulic cylinder

51‧‧‧汽缸管 51‧‧‧Cylinder tube

52‧‧‧柱塞 52‧‧‧Plunger

60‧‧‧真空框 60‧‧‧vacuum frame

60A‧‧‧真空框 60A‧‧‧vacuum frame

60B‧‧‧真空框 60B‧‧‧vacuum frame

60a‧‧‧錐面(曲面) 60a‧‧‧Cone surface (surface)

60b‧‧‧中空部 60b‧‧‧ Hollow

60c‧‧‧通氣縫 60c‧‧‧ Ventilation seam

60d‧‧‧通氣孔 60d‧‧‧vents

60e‧‧‧錐型螺釘 60e‧‧‧Conical screw

62‧‧‧上構件 62‧‧‧Upper components

64‧‧‧下構件 64‧‧‧lower components

66‧‧‧O型環 66‧‧‧O-ring

100‧‧‧疊層裝置 100‧‧‧Multilayer

100a‧‧‧本體 100a‧‧‧ Ontology

102‧‧‧控制部 102‧‧‧Control Department

103‧‧‧氣壓控制裝置 103‧‧‧Pneumatic control device

104‧‧‧油壓控制裝置 104‧‧‧Hydraulic control device

110‧‧‧框架 110‧‧‧Frame

112‧‧‧熱盤支持機構 112‧‧‧ hot plate support organization

112a‧‧‧可動銷 112a‧‧‧able sales

120‧‧‧上部熱盤 120‧‧‧ upper hot plate

120b‧‧‧支撐板 120b‧‧‧support plate

120U‧‧‧上部腔室單元 120U‧‧‧Upper chamber unit

130‧‧‧中間熱盤 130‧‧‧Intermediate hot plate

130b‧‧‧支撐板 130b‧‧‧Support plate

130L‧‧‧下部腔室單元 130L‧‧‧lower chamber unit

130U‧‧‧上部腔室單元 130U‧‧‧Upper chamber unit

140‧‧‧下部熱盤 140‧‧‧Lower hot plate

140L‧‧‧下部腔室單元 140L‧‧‧lower chamber unit

P1‧‧‧壓力 P1‧‧‧ pressure

P2‧‧‧壓力 P2‧‧‧ pressure

W‧‧‧被加工物(積層體) W‧‧‧Processed matter (layered body)

第一圖係本發明之第一實施態樣的疊層裝置的正面透視圖。 The first figure is a front perspective view of a lamination device of a first embodiment of the present invention.

第二圖係第一圖的A-A箭視圖。 The second figure is the A-A arrow view of the first figure.

第三圖係說明真空框之構成的圖。 The third figure is a diagram illustrating the construction of a vacuum frame.

第四圖係說明本發明之第一實施態樣的疊層加工之順序的圖。 The fourth figure is a view for explaining the sequence of lamination processing of the first embodiment of the present invention.

第五圖係本發明之第二實施態樣的疊層裝置的正面透視圖。 Figure 5 is a front perspective view of a lamination device of a second embodiment of the present invention.

以下,就本發明的實施態樣,參照圖式進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(第一實施態樣) (first embodiment)

第一圖係本發明之第一實施態樣的疊層裝置1的正面透視圖,第二圖係第一圖之A-A箭視圖。疊層裝置1具備本體1a、控制部2、氣壓控制裝置3及油壓控制裝置4。本體1a、氣壓控制裝置3及油壓控制裝置4分別與控制部2連接,並在控制部2的控制之下運作。 The first drawing is a front perspective view of the laminating apparatus 1 of the first embodiment of the present invention, and the second drawing is an A-A arrow view of the first drawing. The laminating apparatus 1 includes a main body 1a, a control unit 2, a pneumatic control device 3, and a hydraulic control device 4. The main body 1a, the air pressure control device 3, and the hydraulic pressure control device 4 are connected to the control unit 2, respectively, and operate under the control of the control unit 2.

本體1a,具備外部腔室10、以及配置於外部腔室10內的上部熱盤20、下部熱盤40及油壓汽缸50。外部腔室10,透過外部腔室供排氣管路3a,與氣壓控制裝置3連接,外部腔室10的內壓,藉由氣壓控制裝置3被控制在從真空(例如約0.1kPa)至大氣壓以上(例如數個氣壓)的範圍內。 The main body 1a includes an outer chamber 10 and an upper hot plate 20, a lower hot plate 40, and a hydraulic cylinder 50 disposed in the outer chamber 10. The external chamber 10 is connected to the air pressure control device 3 through the external chamber supply and exhaust line 3a, and the internal pressure of the external chamber 10 is controlled by the air pressure control device 3 from a vacuum (for example, about 0.1 kPa) to an atmospheric pressure. Above the range (for example, several air pressures).

油壓汽缸50(驅動裝置),與油壓控制裝置4連接,其對應以油壓控制裝置4所進行之液壓油的供排來進行運作。另外,油壓汽缸50的汽缸管51,固定於外部腔室10的框架上。 The hydraulic cylinder 50 (drive device) is connected to the hydraulic control device 4, and operates in accordance with the supply and discharge of hydraulic oil by the hydraulic control device 4. Further, the cylinder tube 51 of the hydraulic cylinder 50 is fixed to the frame of the outer chamber 10.

上部熱盤20,係以底面為水平的態樣固定於外部腔室10的框架上。另外,下部熱盤40,係以其頂面與上部熱盤20之底面對向的方式配置。下部熱盤40,其底面固定有油壓汽缸50的衝柱(ram)52,與對於油壓汽缸50之液壓油的供排對應,而與衝柱52一起上下移動。 The upper hot plate 20 is fixed to the frame of the outer chamber 10 with the bottom surface horizontal. Further, the lower hot plate 40 is disposed such that its top surface faces the bottom surface of the upper hot plate 20. The lower hot plate 40 has a ram 52 to which the hydraulic cylinder 50 is fixed on the bottom surface, and corresponds to the supply and discharge of the hydraulic oil to the hydraulic cylinder 50, and moves up and down together with the punch 52.

另外,上部熱盤20與下部熱盤40中,分別設有電熱加熱器(圖中未顯示)與溫度感測器(圖中未顯示),上部熱盤20與下部熱盤40的溫度,係以控制部2所控制。另外,上部熱盤20之底面與下部熱盤40之頂面,設有 例如遠紅外線放射材料層(例如膜或板),其使用熱能,以高效率產生遠紅外線,其可由被加工物W所包含的樹脂強力吸收,而能夠有效率地將被加工物W加熱。亦即,上部熱盤20及下部熱盤40,具有作為將被加工物W加熱之加熱裝置的功能。 In addition, the upper hot plate 20 and the lower hot plate 40 are respectively provided with an electric heater (not shown) and a temperature sensor (not shown), and the temperatures of the upper hot plate 20 and the lower hot plate 40 are respectively Controlled by the control unit 2. In addition, a bottom surface of the upper hot plate 20 and a top surface of the lower hot plate 40 are provided For example, a far-infrared radiation material layer (for example, a film or a plate) which uses thermal energy to generate far-infrared rays with high efficiency, can be strongly absorbed by the resin contained in the workpiece W, and can efficiently heat the workpiece W. That is, the upper hot plate 20 and the lower hot plate 40 have a function as a heating device for heating the workpiece W.

上部熱盤20之底面,安裝有上部腔室單元20U。上部腔室單元20U,具備上部隔膜固定框21U、上部隔膜22U及上部隔膜保護板23U。 The bottom surface of the upper hot plate 20 is mounted with an upper chamber unit 20U. The upper chamber unit 20U includes an upper diaphragm fixing frame 21U, an upper diaphragm 22U, and an upper diaphragm protection plate 23U.

上部隔膜22U,係高伸縮性片材(彈性膜),其以例如矽膠等具有熵彈性(Entropy Elasticity)的合成橡膠所形成。 The upper diaphragm 22U is a highly stretchable sheet (elastic film) formed of a synthetic rubber having entropy Elasticity such as silicone.

上部隔膜固定框21U,係中心軸朝向鉛直方向配置的略圓筒狀構件,其上端以密合的狀態,氣密地與上部熱盤20的底面接合。該接合,可使用溶接、黏接、透過密封材料之壓接等的各種方法。又,上部隔膜固定框21U,其內周面以越靠近上部熱盤20其厚度越厚的方式,形成圓錐台側面狀的錐面。上部隔膜固定框21U之中空部,其下端被上部隔膜22U氣密地封蓋。藉此,以上部熱盤20、上部隔膜固定框21U及上部隔膜22U,形成被氣密圍住的上部腔室24U。另外,本實施態樣之上部熱盤20,因為設有使其底面與側面連通(亦即使上部腔室24U與外部腔室10連通)的通氣孔20a,故上部腔室24U與外部腔室10的內壓大致相同。 The upper diaphragm fixing frame 21U is a slightly cylindrical member in which the center axis is disposed in the vertical direction, and the upper end thereof is airtightly joined to the bottom surface of the upper hot plate 20 in an adhered state. For the joining, various methods such as welding, bonding, and pressure-bonding through a sealing material can be used. Further, the upper diaphragm fixing frame 21U has a tapered surface which is formed on the side surface of the truncated cone so that the inner peripheral surface thereof becomes thicker toward the upper hot plate 20. The hollow portion of the upper diaphragm fixing frame 21U has its lower end hermetically sealed by the upper diaphragm 22U. Thereby, the upper hot plate 20, the upper diaphragm fixing frame 21U, and the upper diaphragm 22U form an airtightly enclosed upper chamber 24U. In addition, in the upper portion of the hot plate 20 of the present embodiment, since the vent hole 20a is provided such that the bottom surface thereof communicates with the side surface (even if the upper chamber 24U communicates with the outer chamber 10), the upper chamber 24U and the outer chamber 10 are provided. The internal pressure is approximately the same.

上部隔膜固定框21U的中空部(上部腔室24U),被與上部隔膜固定框21U的底面(亦即上部隔膜22U)平行配置的平板、即上部隔膜保護板23U所分隔。上部隔膜保護板23U,為了避免其兩側空間產生氣壓差,而使用例如具有沖孔板及多孔質板等的通氣性板材。 The hollow portion (upper chamber 24U) of the upper diaphragm fixing frame 21U is partitioned by a flat plate disposed in parallel with the bottom surface of the upper diaphragm fixing frame 21U (that is, the upper diaphragm 22U), that is, the upper diaphragm protective plate 23U. The upper diaphragm protection plate 23U is made of, for example, a gas permeable plate having a punching plate or a porous plate in order to avoid a difference in air pressure between the two sides.

在下部熱盤40的頂面上,以與上部腔室單元20U上下顛倒的 方式,安裝有與上部腔室單元20U為相同構成的下部腔室單元40L。亦即,下部腔室單元40L具備:下部隔膜固定框41L,下端以密合的狀態,氣密地與下部熱盤40的頂面接合;下部隔膜42L,以氣密地封蓋下部隔膜固定框41L之中空部的方式,安裝於下部隔膜固定框41L上端;及下部隔膜成形板43L,以上下地劃分中空部方式,安裝於下部隔膜固定框41L之內周面。下部隔膜成形板43L,與上部隔膜保護板23U相同,係具有通氣性的板材。另外,下部腔室單元40L內,形成下部腔室44L,其被下部熱盤40、下部隔膜固定框41L及下部隔膜42L氣密地圍住。 On the top surface of the lower hot plate 40, upside down with the upper chamber unit 20U In the manner, the lower chamber unit 40L having the same configuration as the upper chamber unit 20U is attached. That is, the lower chamber unit 40L includes a lower diaphragm fixing frame 41L whose lower end is airtightly joined to the top surface of the lower hot plate 40 in a close contact state, and a lower diaphragm 42L that hermetically seals the lower diaphragm fixing frame The hollow portion of the 41L is attached to the upper end of the lower diaphragm fixing frame 41L, and the lower diaphragm forming plate 43L is attached to the inner peripheral surface of the lower diaphragm fixing frame 41L by dividing the hollow portion upward and downward. The lower diaphragm forming plate 43L is the same as the upper diaphragm protecting plate 23U, and is a permeable plate material. Further, in the lower chamber unit 40L, a lower chamber 44L is formed, which is hermetically surrounded by the lower hot plate 40, the lower diaphragm fixing frame 41L, and the lower diaphragm 42L.

另外,下部熱盤40中設有通氣孔40a,其連通其頂面與側面。 通氣孔40a之一端,與三通電磁閥47中的1個接頭連接。三通電磁閥47的另1接頭,透過下部腔室供排氣管路3c與氣壓控制裝置3連接,剩下的1接頭向外部腔室10內開放。三通電磁閥47,被控制部2所控制,切換「下部腔室44L與外部腔室10連接」的狀態(開放狀態),與「下部腔室44L與氣壓控制裝置3連接」的狀態(壓力控制狀態)。 Further, the lower hot plate 40 is provided with a vent hole 40a communicating with the top surface and the side surface thereof. One end of the vent hole 40a is connected to one of the three-way solenoid valves 47. The other joint of the three-way solenoid valve 47 is connected to the air pressure control device 3 through the lower chamber supply and exhaust line 3c, and the remaining one joint is opened to the outside chamber 10. The three-way electromagnetic valve 47 is controlled by the control unit 2, and switches between the state in which the "lower chamber 44L is connected to the external chamber 10" (open state) and the state in which the "lower chamber 44L is connected to the air pressure control device 3" (pressure). Control status).

另外,在下部腔室單元40L的頂面,安裝有圓環狀的真空框 60,其與下部隔膜固定框41L具有大致相同的外徑。若使下部熱盤40上升,而使上部腔室單元20U的底面與真空框60的頂面密合,則形成被上部隔膜22U、下部隔膜42L及真空框60氣密地圍住的主腔室26(第四圖(b))。若上部腔室24U及下部腔室44L的內壓與主腔室26的內壓之間產生氣壓差,則上部隔膜22U及下部隔膜42L,在互相面向的腔室中,朝向氣壓較低的腔室側膨脹。 In addition, an annular vacuum frame is mounted on the top surface of the lower chamber unit 40L. 60, which has substantially the same outer diameter as the lower diaphragm fixing frame 41L. When the lower hot plate 40 is raised and the bottom surface of the upper chamber unit 20U is brought into close contact with the top surface of the vacuum frame 60, the main chamber that is hermetically surrounded by the upper diaphragm 22U, the lower diaphragm 42L, and the vacuum frame 60 is formed. 26 (Fig. 4 (b)). If a difference in air pressure between the internal pressure of the upper chamber 24U and the lower chamber 44L and the internal pressure of the main chamber 26 occurs, the upper diaphragm 22U and the lower diaphragm 42L face the chamber having a lower air pressure in the chambers facing each other. The chamber side is inflated.

第三圖(a),係將真空框60之一部份放大的上視圖,第三圖 (b),係第三圖(a)的B一B箭視圖。如第三圖(b)所示,為了避免在下部隔膜42L及上部隔膜22U往主腔室26側膨脹時,其沿著真空框60的角而彎曲形成曲率半徑較小態樣,進而產生劣化及損傷,故在真空框60之上底面的內周側形成錐面(或是曲面)60a。 Figure 3 (a) is a top view of a portion of the vacuum frame 60, the third view (b) is a B-B arrow view of the third figure (a). As shown in the third diagram (b), in order to prevent the lower diaphragm 42L and the upper diaphragm 22U from expanding toward the main chamber 26 side, it is bent along the corner of the vacuum frame 60 to form a smaller radius of curvature, thereby causing deterioration. Since the damage is caused, a tapered surface (or a curved surface) 60a is formed on the inner peripheral side of the bottom surface of the vacuum frame 60.

真空框60中,分別具備圓環狀的上構件62、下構件64及O型 環66。上構件62與下構件64上下重合,其接合部藉由O型環66密封。真空框60內,形成環狀的中空部60b(環狀部),其在延長方向上繞著整個圓周延伸。 另外,在比中空部60b更為內側之處,上構件62與下構件64互相接近並且對向,兩者之間形成通氣縫60c,使中空部60b與主腔室26連通。通氣縫60c,在真空框60的整個圓周上展開,係朝向真空框60的內周面開口的狹縫狀的通氣路徑。 The vacuum frame 60 is provided with an annular upper member 62, a lower member 64, and an O-shape, respectively. Ring 66. The upper member 62 and the lower member 64 are vertically overlapped, and the joint portion thereof is sealed by the O-ring 66. Inside the vacuum frame 60, an annular hollow portion 60b (annular portion) is formed which extends around the entire circumference in the extension direction. Further, at a position further inside than the hollow portion 60b, the upper member 62 and the lower member 64 are close to each other and opposed to each other, and a vent slit 60c is formed therebetween to allow the hollow portion 60b to communicate with the main chamber 26. The vent slit 60c is spread over the entire circumference of the vacuum frame 60 and is a slit-shaped air permeable path that opens toward the inner peripheral surface of the vacuum frame 60.

另外,真空框60的外周側,形成通氣孔60d,使中空部60b 與外部腔室10連通。通氣孔60d於一端側(真空框60的外周面側)擴徑,形成錐型螺釘(taper screw)60e。錐型螺釘60e,與來自氣壓控制裝置3的主腔室供排氣管路3b(第一圖)連接,可藉由氣壓控制裝置3,透過真空框60對主腔室26內進行氣體(空氣或是乾燥氮氣等的惰性氣體)的供排。 Further, on the outer peripheral side of the vacuum frame 60, a vent hole 60d is formed to allow the hollow portion 60b It is in communication with the outer chamber 10. The vent hole 60d is expanded in diameter on one end side (the outer peripheral surface side of the vacuum frame 60) to form a taper screw 60e. The conical screw 60e is connected to the main chamber supply and exhaust line 3b (first diagram) from the air pressure control device 3, and the gas in the main chamber 26 can be carried through the vacuum frame 60 by the air pressure control device 3. Or the supply and exhaust of an inert gas such as dry nitrogen.

通氣縫60c,係以在透過通氣縫60c對主腔室26供排氣體時, 使壓力損失在整個圓周上大致平均的方式,使其剖面尺寸為定值地形成於整個圓周上。另外,對於主腔室26內的氣體供排,係透過剖面積大而壓力損失小的中空部60b,以及剖面積小而壓力損失大的通氣縫60c來進行。因此,對主腔室26的氣體供排,係從通氣縫60c,在整個圓周上大致均勻且緩慢地進行。 The venting slit 60c is for supplying the exhaust body to the main chamber 26 through the venting slit 60c. The pressure loss is substantially averaged over the entire circumference so that the cross-sectional dimension is formed to be constant over the entire circumference. In addition, the gas supply and discharge in the main chamber 26 is performed by transmitting the hollow portion 60b having a large sectional area and a small pressure loss, and the vent slit 60c having a small sectional area and a large pressure loss. Therefore, the gas supply and discharge to the main chamber 26 is performed substantially uniformly and slowly over the entire circumference from the vent slit 60c.

接著,就使用本發明的第一實施態樣的疊層裝置1,對被加 工物W進行疊層加工的順序,參照第四圖進行說明。 Next, using the lamination device 1 of the first embodiment of the present invention, the pair is added The order in which the workpiece W is subjected to lamination processing will be described with reference to the fourth drawing.

首先,如第四圖(a)所示,驅動油壓汽缸50(第一圖),使下部 熱盤40下降,以使上部腔室單元20U與真空框60呈分開的狀態。此時,設於氣壓控制裝置3、與真空框60的通氣孔60d(第三圖)連接的主腔室供排氣管路3b的電磁閥37(第一圖)為關閉的態樣,而停止對於真空框60的氣體供排。另外,三通電磁閥47,使下部腔室44L與外部腔室10(第一圖)連接(開放狀態)。 接著,在下部隔膜42L之上載置被加工物W之後,以氣壓控制裝置3對外部腔室10進行真空抽氣。此時,分別與外部腔室10連通的上部腔室24U及下部腔室44L,亦藉由通氣孔20a及40a來進行抽真空。 First, as shown in the fourth figure (a), the hydraulic cylinder 50 (first figure) is driven to make the lower part The hot plate 40 is lowered to separate the upper chamber unit 20U from the vacuum frame 60. At this time, the electromagnetic valve 37 (first diagram) provided in the air pressure control device 3 and the main chamber supply and exhaust line 3b connected to the vent hole 60d (third diagram) of the vacuum frame 60 is closed, and The gas supply and discharge to the vacuum frame 60 is stopped. Further, the three-way solenoid valve 47 connects the lower chamber 44L to the external chamber 10 (first diagram) (open state). Next, after the workpiece W is placed on the lower diaphragm 42L, the external chamber 10 is evacuated by the air pressure control device 3. At this time, the upper chamber 24U and the lower chamber 44L which are respectively communicated with the external chamber 10 are also evacuated by the vent holes 20a and 40a.

接著,如第四圖(b)所示,驅動油壓汽缸50(第一圖)使下部熱 盤40上升,以使上部腔室單元20U與真空框60密合,形成主腔室26。此時,外部腔室10(第一圖)、上部腔室24U、主腔室26及下部腔室44L皆成為真空。 Next, as shown in the fourth figure (b), the hydraulic cylinder 50 (first figure) is driven to make the lower part heat The disk 40 is raised to bring the upper chamber unit 20U into close contact with the vacuum frame 60 to form the main chamber 26. At this time, the external chamber 10 (first diagram), the upper chamber 24U, the main chamber 26, and the lower chamber 44L are all vacuumed.

接著,藉由氣壓控制裝置3,將氣體導入外部腔室10內,使 外部腔室10內的氣壓緩緩升至大氣壓(約100kPa)。此時,與外部腔室10連通的上部腔室24U及下部腔室44L的氣壓,雖也上升至大氣壓,但密閉的主腔室26內仍維持在真空狀態。因此,藉由上部腔室24U及下部腔室44L與主腔室26的氣壓差,使上部隔膜22U及下部隔膜42L往主腔室26側膨脹。結果,如第四圖(c)所示,被加工物W,被上部隔膜22U與下部隔膜42L夾住,並且藉由上部腔室24U及下部腔室44L與主腔室26的氣壓差而被沖壓。接著,若將該狀態維持既定時間,則藉由來自上部熱盤20及下部熱盤40的輻射熱,將被加工物W加熱至加工溫度(使用熱硬化性樹脂的情況為樹脂的硬化溫 度、使用熱塑性樹脂的情況為樹脂的玻璃轉換點以上的溫度),使被加工物W所包含的樹脂(例如,環氧樹脂等的熱硬化性樹脂,或乙烯乙酸乙烯酯共聚合樹脂(EVA)等的熱塑性樹脂)軟化(熱硬化性樹脂的情況中則更進一步硬化),使構成被加工物W的各構件接合成一體。 Next, the gas is introduced into the external chamber 10 by the air pressure control device 3, so that The air pressure in the outer chamber 10 is slowly raised to atmospheric pressure (about 100 kPa). At this time, the air pressures of the upper chamber 24U and the lower chamber 44L that communicate with the external chamber 10 rise to the atmospheric pressure, but the inside of the sealed main chamber 26 is maintained in a vacuum state. Therefore, the upper diaphragm 22U and the lower diaphragm 42L are inflated toward the main chamber 26 side by the difference in air pressure between the upper chamber 24U and the lower chamber 44L and the main chamber 26. As a result, as shown in the fourth diagram (c), the workpiece W is sandwiched by the upper diaphragm 22U and the lower diaphragm 42L, and is separated by the air pressure difference between the upper chamber 24U and the lower chamber 44L and the main chamber 26. stamping. Then, when the state is maintained for a predetermined period of time, the workpiece W is heated to the processing temperature by the radiant heat from the upper hot plate 20 and the lower hot plate 40 (the hardening temperature of the resin is used when the thermosetting resin is used) The degree of use of the thermoplastic resin is a temperature equal to or higher than the glass transition point of the resin, and the resin contained in the workpiece W (for example, a thermosetting resin such as an epoxy resin or an ethylene vinyl acetate copolymer resin (EVA) The thermoplastic resin (such as a thermoplastic resin) is softened (in the case of a thermosetting resin, it is further cured), and the members constituting the workpiece W are joined together.

另外,在沖壓處理中從被加工物W產生氣體的情況,可在沖 壓處理中,藉由氣壓控制裝置3,透過與真空框60連接的主腔室供排氣管路3b,對主腔室26抽真空。藉此,在沖壓處理中,可將從被加工物W產生的氣體從主腔室26強制排出,而防止因為氣體的產生所造成的被加工物W的接合不良及隔膜的劣化等。 In addition, in the case of generating a gas from the workpiece W in the press processing, it is possible to In the pressure processing, the main chamber 26 is evacuated by the air pressure control device 3 through the main chamber supply and exhaust line 3b connected to the vacuum frame 60. By this, in the press processing, the gas generated from the workpiece W can be forcibly discharged from the main chamber 26, and the joint failure of the workpiece W and the deterioration of the separator due to the generation of gas can be prevented.

被加工物W的接合(沖壓步驟)結束後,接著進行硬化步驟。 硬化步驟,係藉由將接合後的被加工物W保持在樹脂的硬化溫度(熱塑性樹脂的情況為玻璃轉換點以上的溫度),使被加工物W穩定化的處理。本實施態樣中,硬化步驟係在非真空下(亦即,空氣中或是惰性氣體中)進行。又,此處,0.1氣壓以上稱為非真空。如第四圖(d)所示,本實施態樣的硬化步驟中,藉由氣壓控制裝置3(第一圖),將壓力P1(高於大氣壓)的壓縮空氣導入主腔室26內。另外,此時,三通電磁閥47,將狀態切換成下部腔室44L與氣壓控制裝置3連接的狀態(壓力控制狀態),並在下部腔室44L中,藉由氣壓控制裝置3,將壓力P2(低於壓力P1)的氣體導入主腔室26內。 After the joining of the workpiece W (stamping step) is completed, the hardening step is followed. The hardening step is a process of stabilizing the workpiece W by holding the workpiece W after bonding at a curing temperature of the resin (a temperature equal to or higher than a glass transition point in the case of a thermoplastic resin). In this embodiment, the hardening step is carried out under non-vacuum (i.e., in air or in an inert gas). Here, the pressure of 0.1 atm or more is referred to as non-vacuum. As shown in the fourth diagram (d), in the hardening step of the present embodiment, the compressed air of the pressure P1 (above atmospheric pressure) is introduced into the main chamber 26 by the air pressure control device 3 (first map). Further, at this time, the three-way solenoid valve 47 switches the state to a state in which the lower chamber 44L is connected to the air pressure control device 3 (pressure control state), and in the lower chamber 44L, the pressure is controlled by the air pressure control device 3. A gas of P2 (below pressure P1) is introduced into the main chamber 26.

此時,因為上部腔室24U的內壓與主腔室26的內壓差較大, 故上部隔膜22U大幅地往上部腔室24U側膨脹,而與上部隔膜保護板23U密合並形成平坦的態樣。上部隔膜保護板23U,防止上部隔膜22U因為與被加熱至高溫的上部熱盤20接觸而產生劣化或是熱損傷的情況。另外,上部隔 膜保護板23U,因為係以與上部熱盤20的底面接近並且平行的方式配置,在上部隔膜22U與上部隔膜保護板23U密合時,藉由來自上部熱盤20的輻射熱,均勻且有效率的加熱至適當溫度。在沖壓成形前,使上部隔膜22U保持在與上部隔膜保護板23U密合的狀態,可預熱上部隔膜22U。另外,下部隔膜成形板43L,亦與上述上部隔膜保護板23U有相同的作用效果。 At this time, since the internal pressure of the upper chamber 24U is larger than the internal pressure of the main chamber 26, Therefore, the upper diaphragm 22U is largely expanded toward the upper chamber 24U side, and is densely combined with the upper diaphragm protection plate 23U to form a flat surface. The upper diaphragm protection plate 23U prevents deterioration or thermal damage of the upper diaphragm 22U due to contact with the upper hot plate 20 heated to a high temperature. In addition, the upper partition The membrane protective plate 23U is disposed in such a manner as to be close to and parallel to the bottom surface of the upper hot plate 20, and is uniform and efficient by the radiant heat from the upper hot plate 20 when the upper diaphragm 22U is in close contact with the upper diaphragm protective plate 23U. Heat to the proper temperature. Before the press forming, the upper diaphragm 22U is held in close contact with the upper diaphragm protection plate 23U, and the upper diaphragm 22U can be preheated. Further, the lower diaphragm forming plate 43L also has the same operational effects as the upper diaphragm protecting plate 23U.

另一方面,下部隔膜42L,因為下部腔室44L的內壓P2與主 腔室26的內壓P1的差值較小,故不與下部隔膜成形板43L接觸,而與內壓差對應,往下部腔室44L側膨脹。本實施態樣中,在被加工物W載置於下部隔膜42L之上的狀態下,預先計算使下部隔膜42L形成沿著被加工物W的底面彎曲之態樣時的內壓差,或是以實驗求得該值,而氣壓控制裝置3則以將求得的內壓差施加至下部隔膜42L的方式,控制下部腔室44L的內壓P2。藉此,被加工物W,其底面的大致整個面,被以相同曲率膨脹的下部隔膜42L,以大致均勻的壓力所支持,而能夠在施加於被加工物W之應變較少的狀態下進行硬化處理。結果,殘留應力變少,而可得到可靠度高的製品(被加工物W)。 On the other hand, the lower diaphragm 42L because of the internal pressure P2 of the lower chamber 44L and the main Since the difference of the internal pressure P1 of the chamber 26 is small, it does not come into contact with the lower diaphragm forming plate 43L, but expands toward the lower chamber 44L side corresponding to the internal pressure difference. In the present embodiment, in the state in which the workpiece W is placed on the lower diaphragm 42L, the internal pressure difference when the lower diaphragm 42L is bent along the bottom surface of the workpiece W is calculated in advance, or This value is obtained experimentally, and the air pressure control device 3 controls the internal pressure P2 of the lower chamber 44L so that the obtained internal pressure difference is applied to the lower diaphragm 42L. As a result, the workpiece W has substantially the entire surface of the bottom surface thereof supported by the lower diaphragm 42L having the same curvature, and is supported by the substantially uniform pressure, and can be performed in a state where the strain applied to the workpiece W is small. Hardening treatment. As a result, the residual stress is reduced, and a highly reliable product (work W) can be obtained.

另外,如第四圖(e)所示,在被加工物W具有平坦底面的情 況中,以使下部腔室44L往外部腔室10開放的方式,切換三通電磁閥47(開放狀態),以加大下部腔室44L與主腔室26的內壓差。結果,下部隔膜42L,大幅地往下部腔室44L側膨脹,而與下部隔膜成形板43L密合進而形成平坦的態樣。藉此,被加工物W,因為以均勻的壓力被平坦的下部隔膜42L所支持,故可在應變較少的狀態下進行硬化處理,結果,殘留應力變少,可得到可靠度高的製品(被加工物W)。 In addition, as shown in the fourth figure (e), the workpiece W has a flat bottom surface. In this case, the three-way solenoid valve 47 (open state) is switched in such a manner that the lower chamber 44L is opened to the outer chamber 10 to increase the internal pressure difference between the lower chamber 44L and the main chamber 26. As a result, the lower diaphragm 42L expands substantially toward the lower chamber 44L side, and is in close contact with the lower diaphragm forming plate 43L to form a flat surface. Thereby, since the workpiece W is supported by the flat lower diaphragm 42L with a uniform pressure, the workpiece W can be hardened in a state where the strain is small, and as a result, the residual stress is reduced, and a highly reliable product can be obtained ( Workpiece W).

(第二實施態樣) (Second embodiment)

接著,就本發明的第二實施態樣的疊層裝置100進行說明。第五圖係疊層裝置100的正面透視圖。又,以下的說明中,對於與上述第一實施態樣相同或是類似的構成要件,使用相同或是類似的符號,並對於重複的事項省略其說明。 Next, a lamination device 100 according to a second embodiment of the present invention will be described. The fifth figure is a front perspective view of the lamination device 100. In the following description, the same or similar components as those of the above-described first embodiment are used, and the same or similar reference numerals are used, and the description of the duplicated items is omitted.

上述第一實施態樣,係將本發明應用於單段疊層裝置的一例,而第二實施態樣,係將本發明應用於在上部熱盤120與下部熱盤140之間設置一個以上的中間熱盤130的多段疊層裝置的一例。本實施態樣的疊層裝置100,雖具備1個中間熱盤130,但亦可在上部熱盤120與下部熱盤140之間,以上下並排的方式配置2個以上的中間熱盤130。 In the first embodiment described above, the present invention is applied to an example of a single-stage lamination apparatus, and in the second embodiment, the present invention is applied to providing more than one between the upper hot plate 120 and the lower hot plate 140. An example of a multi-stage lamination device of the intermediate hot plate 130. In the laminating apparatus 100 of the present embodiment, the intermediate hot plate 130 is provided. However, two or more intermediate hot plates 130 may be disposed between the upper hot plate 120 and the lower hot plate 140 in parallel with each other.

在中間熱盤130的頂面及底面,分別安裝有下部腔室單元130L及上部腔室單元130U。上部腔室單元130U,係與安裝於上部熱盤120的底面的上部腔室單元120U(相當於第一實施態樣中的上部腔室單元20U)相同的裝置;下部腔室單元130L,係與安裝於下部熱盤140的頂面之下部腔室單元140L(相當於第一實施態樣中的下部腔室單元40L)相同的裝置。 A lower chamber unit 130L and an upper chamber unit 130U are attached to the top surface and the bottom surface of the intermediate hot plate 130, respectively. The upper chamber unit 130U is the same device as the upper chamber unit 120U (corresponding to the upper chamber unit 20U in the first embodiment) mounted on the bottom surface of the upper hot plate 120; the lower chamber unit 130L is The same device is mounted on the lower surface chamber unit 140L (corresponding to the lower chamber unit 40L in the first embodiment) of the lower surface of the lower heat tray 140.

上述第一實施態樣中,係採用「疊層裝置1的本體1a整體收納於外部腔室10內,並透過外部腔室10控制各腔室(上部腔室24U、下部腔室44L)的內壓」的構成;而第二實施態樣中,並未設置外部腔室10,而是採用「使各腔室單元(上部腔室單元120U、130U,下部腔室單元130L、140L)與氣壓控制裝置103直接連接,藉由氣壓控制裝置103個別控制各腔室單元的內壓」的構成。該構成中,不需要將容積大的外部腔室10整體抽真空,故可大幅度地縮減抽真空所需的時間,進而縮短整個製程的時間。 In the first embodiment described above, the main body 1a of the lamination device 1 is entirely housed in the external chamber 10, and the inside of each of the chambers (the upper chamber 24U and the lower chamber 44L) is controlled by the external chamber 10. In the second embodiment, the external chamber 10 is not provided, but "each chamber unit (upper chamber unit 120U, 130U, lower chamber unit 130L, 140L) and air pressure control are employed. The device 103 is directly connected to the air pressure control device 103 to individually control the internal pressure of each chamber unit. In this configuration, it is not necessary to evacuate the entire outer chamber 10 having a large volume, so that the time required for vacuuming can be greatly reduced, and the time for the entire process can be shortened.

另外,本實施態樣中,因為真空框60A、60B安裝於上部腔 室單元20U、30U,故載置被加工物W的下部腔室單元130L、140L的頂面形成完全平坦的態樣,而可輕易地將被加工物W搬入/搬出疊層裝置100。 In addition, in this embodiment, since the vacuum frames 60A, 60B are installed in the upper chamber Since the chamber units 20U and 30U form a completely flat top surface of the lower chamber units 130L and 140L on which the workpiece W is placed, the workpiece W can be easily carried in and out of the lamination apparatus 100.

在疊層裝置100的上部熱盤120及中間熱盤130上,安裝有分 別從左右側面突出的一對支撐板120b及130b。另外,在疊層裝置100的框架110上,安裝有與寬度方向(第五圖中的左右方向)對向配置的兩對熱盤支持機構112(圖中僅顯示前方的一對)。熱盤支持機構112,係為在將加工前的被加工物W搬入疊層裝置100,或是從疊層裝置100搬出加工後的被加工物(製品)W時,因為上下的腔室單元具有間隔,故可使所搬送之被加工物W正上方的熱盤保持在既定高度的機構。 Mounted on the upper hot plate 120 and the intermediate hot plate 130 of the lamination device 100 A pair of support plates 120b and 130b that do not protrude from the left and right sides. Further, on the frame 110 of the lamination device 100, two pairs of hot plate supporting mechanisms 112 (only a pair in front are shown) which are disposed opposite to the width direction (the horizontal direction in the fifth drawing) are attached. The hot plate supporting mechanism 112 is configured such that when the workpiece W before processing is carried into the laminating apparatus 100 or the processed workpiece (product) W is carried out from the laminating apparatus 100, the upper and lower chamber units have With the interval, the hot plate directly above the workpiece W to be conveyed can be held at a predetermined height.

熱盤支持機構112,具備可在寬度方向上來回移動的可動銷 112a。熱盤支持機構112與控制部102連接,並藉由控制部102控制可動銷112a的驅動。熱盤支持機構112,在可動銷112a為退避(往本體100a的寬度方向外側移動)的狀態下,不妨礙上部熱盤120及中間熱盤130的上下移動,若可動銷112a形成突出(往本體100a的寬度方向內側移動)的狀態,則以與上部熱盤120的支撐板120b或是中間熱盤130的支撐板130b抵接的方式配置。 The hot plate support mechanism 112 has a movable pin that can move back and forth in the width direction 112a. The hot plate supporting mechanism 112 is connected to the control unit 102, and the control unit 102 controls the driving of the movable pin 112a. In the state in which the movable pin 112a is retracted (moving outward in the width direction of the main body 100a), the hot plate supporting mechanism 112 does not hinder the vertical movement of the upper hot plate 120 and the intermediate hot plate 130, and the movable pin 112a protrudes (to the body). The state of the 100a inward in the width direction is disposed so as to be in contact with the support plate 120b of the upper hot plate 120 or the support plate 130b of the intermediate hot plate 130.

接著,說明將被加工物W搬出/搬入疊層裝置100時的疊層裝 置100的動作。疊層加工(沖壓加工)中,各熱盤支持機構112的可動銷112a退避,而形成在下部熱盤140之上載置有中間熱盤130,且在中間熱盤130之上載置有上部熱盤120的狀態。該狀態下,驅動油壓汽缸150,使下部熱盤140上下移動,則堆疊於下部熱盤140之上的中間熱盤130及上部熱盤120,隨著下部熱盤140一起上下移動。 Next, the stacking of the workpiece W when it is carried out/loaded into the laminating apparatus 100 will be described. Set the action of 100. In the lamination processing (pressing processing), the movable pin 112a of each hot plate supporting mechanism 112 is retracted, and the intermediate hot plate 130 is placed on the lower hot plate 140, and the upper hot plate is placed on the intermediate hot plate 130. The state of 120. In this state, when the hydraulic cylinder 150 is driven to move the lower hot plate 140 up and down, the intermediate hot plate 130 and the upper hot plate 120 stacked on the lower hot plate 140 move up and down along with the lower hot plate 140.

在上部熱盤120與中間熱盤130之間,搬出/搬入被加工物W 時,驅動油壓汽缸150使下部熱盤140上升,直到上部熱盤120的支撐板120b的位置稍微高於各熱盤支持機構112的可動銷112a為止。接著,使各熱盤支持機構112的可動銷112a往上部熱盤120側突出。此狀態下,若驅動油壓汽缸150使下部熱盤140下降,則上部熱盤120的支撐板120b的底面與各熱盤支持機構112的可動銷112a抵接,上部熱盤120載置於二對的可動銷112a之上。若進一步使下部熱盤140下降,中間熱盤130雖與下部熱盤140一起下降,但上部熱盤120被二對可動銷112a所支持而不會再下降,而使得中間熱盤130從上部熱盤120離開。接著,若上部熱盤120與中間熱盤130的間隔,達到足以進行被加工物W之搬出/搬入的大小,則停止油壓汽缸150的驅動。 The workpiece W is carried out/loaded between the upper hot plate 120 and the intermediate hot plate 130. At this time, the hydraulic cylinder 150 is driven to raise the lower hot plate 140 until the position of the support plate 120b of the upper hot plate 120 is slightly higher than the movable pin 112a of each of the hot plate supporting mechanisms 112. Next, the movable pin 112a of each of the hot plate supporting mechanisms 112 is caused to protrude toward the upper hot plate 120 side. In this state, when the hydraulic cylinder 150 is driven to lower the lower hot plate 140, the bottom surface of the support plate 120b of the upper hot plate 120 abuts against the movable pin 112a of each hot plate supporting mechanism 112, and the upper hot plate 120 is placed on the second. Above the movable pin 112a. If the lower hot plate 140 is further lowered, the intermediate hot plate 130 is lowered together with the lower hot plate 140, but the upper hot plate 120 is supported by the two pairs of movable pins 112a without being lowered, so that the intermediate hot plate 130 is heated from the upper portion. Disk 120 leaves. Next, when the interval between the upper hot plate 120 and the intermediate hot plate 130 is sufficient to carry out the loading/unloading of the workpiece W, the driving of the hydraulic cylinder 150 is stopped.

接著,在中間熱盤130與下部熱盤140之間,將被加工物W搬 出/搬入的情況中,驅動油壓汽缸150使下部熱盤140上升,直到上部熱盤120載置於中間熱盤130上,支撐板120b稍微浮在各熱盤支持機構112的可動銷112a之上為止。接著,在使各熱盤支持機構112的可動銷112a退避之後,驅動油壓汽缸150使下部熱盤140上升,直到中間熱盤130的支撐板130b的位置稍微高於各熱盤支持機構112的可動銷112a為止。接著,在使各熱盤支持機構112的可動銷112a往中間熱盤130側突出之後,驅動油壓汽缸150使下部熱盤140下降,中間熱盤130的支撐板130b的底面抵接於各熱盤支持機構112的可動銷112a,而使得中間熱盤130載置於二對可動銷112a之上。更進一步,若使下部熱盤140下降,則中間熱盤130被二對可動銷112a所支持而不會再下降,使得下部熱盤140從中間熱盤130離開。接著,若中間熱盤130與下部熱盤140之間隔,達到足以進行被加工物W之搬出/搬入的大小,則停止油壓 汽缸150的驅動。接著,若被加工物W的搬出/搬入結束,則驅動油壓汽缸150使下部熱盤140上升,直到中間熱盤130載置於下部熱盤140之上,中間熱盤130的支撐板130b稍微浮在各熱盤支持機構112的可動銷112a之上為止,之後使各熱盤支持機構112的可動銷112a退避。 Next, between the intermediate hot plate 130 and the lower hot plate 140, the workpiece W is moved. In the case of the loading/unloading, the hydraulic cylinder 150 is driven to raise the lower hot plate 140 until the upper hot plate 120 is placed on the intermediate hot plate 130, and the support plate 120b is slightly floated on the movable pin 112a of each of the hot plate supporting mechanisms 112. Up until now. Next, after the movable pin 112a of each hot plate supporting mechanism 112 is retracted, the hydraulic cylinder 150 is driven to raise the lower hot plate 140 until the position of the support plate 130b of the intermediate hot plate 130 is slightly higher than that of each of the hot plate supporting mechanisms 112. The movable pin 112a is up. Next, after the movable pin 112a of each hot plate supporting mechanism 112 is protruded toward the intermediate hot plate 130 side, the hydraulic cylinder 150 is driven to lower the lower hot plate 140, and the bottom surface of the support plate 130b of the intermediate hot plate 130 abuts against each heat. The movable pin 112a of the disk support mechanism 112 is such that the intermediate hot plate 130 is placed above the two pairs of movable pins 112a. Further, if the lower hot plate 140 is lowered, the intermediate hot plate 130 is supported by the two pairs of movable pins 112a without falling, so that the lower hot plate 140 is separated from the intermediate hot plate 130. Then, if the intermediate hot plate 130 and the lower hot plate 140 are spaced apart to a size sufficient to carry out the loading/unloading of the workpiece W, the oil pressure is stopped. The drive of the cylinder 150. Then, when the loading/unloading of the workpiece W is completed, the hydraulic cylinder 150 is driven to raise the lower hot plate 140 until the intermediate hot plate 130 is placed on the lower hot plate 140, and the support plate 130b of the intermediate hot plate 130 is slightly The floating pin 112a of each of the hot plate supporting mechanisms 112 is floated on the movable pin 112a of each hot plate supporting mechanism 112, and then the movable pin 112a of each hot plate supporting mechanism 112 is retracted.

以上雖為本發明之實施態樣的說明,但本發明並非限定於上述實施態樣的構成,而可在此技術之思想範圍內作各種變形。 The above description of the embodiments of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention.

上述的各實施態樣中,雖使用電熱加熱器來進行熱盤的加熱,但亦可使用其他的加熱手段,來做為將熱盤加熱的構成。例如,亦可採用如國際公開第2006/103868號所揭示,在設於熱盤的流路中,通入矽油等的熱媒,藉此使熱盤均勻加熱的構成。 In each of the above embodiments, the heating of the hot plate is performed using an electrothermal heater, but other heating means may be used as the heating means for heating the hot plate. For example, as disclosed in International Publication No. 2006/103868, a heat medium such as eucalyptus oil may be introduced into a flow path provided in a hot plate to uniformly heat the hot plate.

另外,上述各實施態樣中,雖使用形成圓筒狀的上部(下部)隔膜固定框及真空框,但本發明並不限於該構成,亦可使用其他形狀(例如多角筒狀)的上部(下部)隔膜固定框及真空框。 Further, in each of the above embodiments, a cylindrical upper (lower) diaphragm fixing frame and a vacuum frame are used. However, the present invention is not limited to this configuration, and an upper portion of another shape (for example, a polygonal tube shape) may be used ( Lower part) diaphragm fixing frame and vacuum frame.

另外,上述的各實施態樣中,雖使用平板狀的下部隔膜成形板,但亦可使用與被加工物W的底面具有相同形狀的下部隔膜成形板。此情況中,在進行硬化處理時,使主腔室的內壓充分高於下部腔室的內壓,而使下部隔膜與下部隔膜成形板密合,藉此可使下部隔膜形成與被加工物W的底面相同的形狀。藉此,因為被加工物W被下部隔膜以均勻的壓力所支持,殘留應力較少,而可得到可靠度高的製品(被加工物W)。 Further, in each of the above-described embodiments, a flat-shaped lower diaphragm forming plate is used, but a lower diaphragm forming plate having the same shape as the bottom surface of the workpiece W may be used. In this case, when the hardening treatment is performed, the internal pressure of the main chamber is sufficiently higher than the internal pressure of the lower chamber, and the lower diaphragm is brought into close contact with the lower diaphragm forming plate, whereby the lower diaphragm can be formed and processed. The bottom surface of W has the same shape. Thereby, since the workpiece W is supported by the lower diaphragm with a uniform pressure, the residual stress is small, and a highly reliable product (the workpiece W) can be obtained.

Claims (35)

一種沖壓裝置,其係具備:上部隔膜,係在上下方向上劃分出上部空間與主腔室的彈性膜;下部隔膜,係與該上部隔膜對向配置,且在上下方向上劃分出該主腔室與下部空間的彈性膜;氣壓控制裝置,控制該主腔室內與該上部空間及該下部空間的氣壓差;及加熱裝置,將配置於該主腔室內的被加工物加熱,該氣壓控制裝置進行下述處理:沖壓處理,使該主腔室內的氣壓低於該上部空間及該下部空間的氣壓,以對在該上部隔膜與該下部隔膜之間加熱的該被加工物進行沖壓;及硬化(Cure)處理,使該主腔室內的氣壓高於該下部空間的氣壓,以在非真空下將該被加工物加熱。 A press device comprising: an upper diaphragm defining an elastic film of an upper space and a main chamber in a vertical direction; and a lower diaphragm disposed opposite to the upper diaphragm and dividing the main cavity in an up-and-down direction An elastic film of the chamber and the lower space; a gas pressure control device that controls a difference in air pressure between the main chamber and the upper space and the lower space; and a heating device that heats the workpiece disposed in the main chamber, the air pressure control device Performing a treatment of pressing the air pressure in the main chamber to be lower than the air pressure in the upper space and the lower space to press the workpiece heated between the upper diaphragm and the lower diaphragm; and hardening The (Cure) treatment is such that the gas pressure in the main chamber is higher than the air pressure in the lower space to heat the workpiece under non-vacuum. 如申請專利範圍第1項之沖壓裝置,其中,該氣壓控制裝置,在該被加工物的底面為彎曲凸面的情況中,係以在該硬化處理中,使該下部隔膜沿著該被加工物的底面彎曲,而以大致均勻的壓力支持該被加工物的方式,控制該主腔室內與該下部空間的氣壓差。 The press device according to claim 1, wherein the air pressure control device is configured to cause the lower diaphragm to follow the workpiece in the hardening process in a case where the bottom surface of the workpiece is a curved convex surface The bottom surface is curved, and the workpiece is supported at a substantially uniform pressure to control the difference in air pressure between the main chamber and the lower space. 如申請專利範圍第1項之沖壓裝置,其中更包含:隔膜成形板,具有在該下部空間內與該下部隔膜對向的平坦頂面,該氣壓控制裝置,在該被加工物的底面為平坦面的情況中,係以於 該硬化處理中,使該下部隔膜與該隔膜成形板密合而形成平坦之態樣,而以大致均勻的壓力支持該被加工物的方式,控制該主腔室內與該下部空間的氣壓差。 The stamping apparatus of claim 1, further comprising: a diaphragm forming plate having a flat top surface opposed to the lower diaphragm in the lower space, the air pressure control device being flat on a bottom surface of the workpiece In the case of In the hardening treatment, the lower diaphragm is brought into close contact with the diaphragm forming plate to form a flat surface, and the workpiece is supported by a substantially uniform pressure, and the air pressure difference between the main chamber and the lower space is controlled. 如申請專利範圍第1至3項中任一項之沖壓裝置,其中更包含:上部腔室單元,於底面具有該上部隔膜,並氣密地圍住該上部空間;下部腔室單元,於頂面具有該下部隔膜,並氣密地圍住該下部空間;真空框,配置於該上部腔室單元與該下部腔室單元之間,並具有上下貫通的中空部;及驅動裝置,在上下地驅動該上部腔室單元及該下部腔室單元的至少一方,藉由該驅動裝置的驅動,以該上部腔室單元與該下部腔室單元夾住該真空框,藉此形成該主腔室。 The stamping apparatus according to any one of claims 1 to 3, further comprising: an upper chamber unit having the upper diaphragm on a bottom surface and hermetically enclosing the upper space; and a lower chamber unit at the top The lower diaphragm has a lower diaphragm and hermetically encloses the lower space; a vacuum frame is disposed between the upper chamber unit and the lower chamber unit, and has a hollow portion penetrating vertically; and a driving device At least one of the upper chamber unit and the lower chamber unit is driven, and the vacuum chamber is sandwiched between the upper chamber unit and the lower chamber unit by driving of the driving device, thereby forming the main chamber. 如申請專利範圍第4項之沖壓裝置,其中,該加熱裝置包含:上部熱盤,該上部腔室單元固定於其底面;上部熱盤加熱手段,加熱該上部熱盤;下部熱盤,該下部腔室單元固定於其頂面;及下部熱盤加熱手段,加熱該下部熱盤,該上部熱盤的底面及該下部熱盤的頂面,設有遠紅外線放射材料層。 The stamping device of claim 4, wherein the heating device comprises: an upper hot plate, the upper chamber unit is fixed to a bottom surface thereof; an upper hot plate heating means for heating the upper hot plate; a lower hot plate, the lower portion The chamber unit is fixed to the top surface thereof; and the lower hot plate heating means heats the lower hot plate, and the bottom surface of the upper hot plate and the top surface of the lower hot plate are provided with a far-infrared radiation material layer. 如申請專利範圍第5項之沖壓裝置,其中,該上部腔室單元及該下部腔室單元,分別包含隔膜固定框,其具有 上下貫通中空部,該隔膜固定框,各別的上下方向上的一端面,與該上部熱盤的底面或是該下部熱盤的頂面密合固定,而形成於上下方向上之另一端面的該中空部開口,被該上部隔膜或是該下部隔膜氣密地封蓋。 The stamping device of claim 5, wherein the upper chamber unit and the lower chamber unit respectively comprise a diaphragm fixing frame having Opening the hollow portion up and down, the diaphragm fixing frame, one end surface in each of the upper and lower directions is closely fixed to the bottom surface of the upper hot plate or the top surface of the lower hot plate, and is formed on the other end surface in the up and down direction The hollow opening is hermetically sealed by the upper diaphragm or the lower diaphragm. 如申請專利範圍第5項之沖壓裝置,其中,該上部熱盤中,形成第一通氣孔,其進行對該上部空間的氣體的供排;該下部熱盤中,形成第二通氣孔,其進行對該下部空間的氣體的供排。 The stamping apparatus of claim 5, wherein the upper hot plate forms a first vent hole for performing gas supply and discharge to the upper space; and the lower hot plate forms a second vent hole. The supply and discharge of gas to the lower space is performed. 如申請專利範圍第7項之沖壓裝置,其中,該第一通氣孔,使該上部熱盤的底面與側面連通;該第二通氣孔,使該下部熱盤的頂面與側面連通。 The stamping device of claim 7, wherein the first venting hole communicates a bottom surface of the upper hot plate with a side surface; and the second venting hole communicates a top surface of the lower hot plate with a side surface. 如申請專利範圍第7項之沖壓裝置,其中更包含:外部腔室,收納該上部熱盤、該上部腔室單元、該真空框、該下部腔室單元及該下部熱盤,並與該氣壓控制裝置連接,該第一通氣孔及該第二通氣孔朝向該外部腔室開放,並藉由控制該外部腔室的氣壓,來控制該上部空間及該下部空間的氣壓。 The stamping device of claim 7, further comprising: an outer chamber accommodating the upper hot plate, the upper chamber unit, the vacuum frame, the lower chamber unit and the lower hot plate, and the air pressure The control device is connected, the first vent hole and the second vent hole are open toward the external chamber, and the air pressure of the upper space and the lower space is controlled by controlling the air pressure of the external chamber. 如申請專利範圍第7項之沖壓裝置,其中更包含:外部腔室,收納該上部熱盤、該上部腔室單元、該真空框、該下部腔室單元及該下部熱盤,並與該氣壓控制裝置連接;及三通切換閥, 該三通切換閥的第一接頭與該第二通氣孔連接,該三通切換閥的第二接頭朝向該外部腔室開放,該三通切換閥的第三接頭與該氣壓控制裝置連接,在以使該第一接頭與該第二接頭連接的方式,切換該三通切換閥時,藉由控制該外部腔室的氣壓,來控制該下部空間的氣壓;在以使該第一接頭與該第三接頭連接的方式,切換該三通切換閥時,該下部空間的氣壓被該氣壓控制裝置直接控制。 The stamping device of claim 7, further comprising: an outer chamber accommodating the upper hot plate, the upper chamber unit, the vacuum frame, the lower chamber unit and the lower hot plate, and the air pressure Control device connection; and three-way switching valve, a first joint of the three-way switching valve is connected to the second venting hole, a second joint of the three-way switching valve is opened toward the outer chamber, and a third joint of the three-way switching valve is connected to the air pressure control device, Controlling the air pressure of the outer chamber by controlling the air pressure of the outer chamber when the first joint is connected to the second joint, so that the first joint and the first joint are When the third joint is connected, when the three-way switching valve is switched, the air pressure in the lower space is directly controlled by the air pressure control device. 如申請專利範圍第7項之沖壓裝置,其中,該第一通氣孔及該第二通氣孔的至少一方與該氣壓控制裝置連接。 The press apparatus of claim 7, wherein at least one of the first vent hole and the second vent hole is connected to the air pressure control device. 如申請專利範圍第5項之沖壓裝置,其中,該加熱裝置包含:一個以上的中間熱盤,在該上部腔室單元固定於其底面的同時,該下部腔室單元固定於其頂面,並配置於該上部熱盤與該下部熱盤之間;及一個以上的中間熱盤加熱手段,分別加熱該一個以上的中間熱盤,該中間熱盤的頂面及底面設有遠紅外線放射材料層。 The stamping device of claim 5, wherein the heating device comprises: one or more intermediate hot plates, wherein the lower chamber unit is fixed to the top surface thereof while the upper chamber unit is fixed to the bottom surface thereof, and Arranging between the upper hot plate and the lower hot plate; and one or more intermediate hot plate heating means respectively heating the one or more intermediate hot plates, wherein the top and bottom surfaces of the intermediate hot plate are provided with a far infrared radiation material layer . 如申請專利範圍第12項之沖壓裝置,其中,該中間熱盤中形成有:第三通氣孔,進行對該上部腔室的氣體的供排;及第四通氣孔,進行對該下部腔室的氣體的供排。 The stamping apparatus of claim 12, wherein the intermediate hot plate is formed with: a third vent hole for performing gas supply and discharge to the upper chamber; and a fourth vent hole for performing the lower chamber The supply of gas. 如申請專利範圍第13項之沖壓裝置,其中,該第三通氣孔使該中間熱盤的底面與側面連通; 該第四通氣孔使該中間熱盤的頂面與側面連通。 The stamping device of claim 13, wherein the third vent hole connects the bottom surface of the intermediate hot plate to the side surface; The fourth vent hole connects the top surface of the intermediate hot plate to the side surface. 如申請專利範圍第12項之沖壓裝置,其中更包含:隔膜保護板,配置於該上部隔膜與該上部熱盤或是該中間熱盤之間,以防止該上部隔膜與該上部熱盤或是該中間熱盤的接觸。 The stamping device of claim 12, further comprising: a diaphragm protection plate disposed between the upper diaphragm and the upper hot plate or the intermediate hot plate to prevent the upper diaphragm and the upper hot plate from being The contact of the intermediate hot plate. 如申請專利範圍第5項之沖壓裝置,其中,該驅動裝置為油壓汽缸,該下部熱盤固定於該油壓汽缸的衝柱。 The stamping device of claim 5, wherein the driving device is a hydraulic cylinder, and the lower hot plate is fixed to a punching cylinder of the hydraulic cylinder. 如申請專利範圍第4項之沖壓裝置,其中,該真空框中,形成與該氣壓控制裝置連接的第五通氣孔,其對該主腔室進行氣體的供排。 The press apparatus of claim 4, wherein the vacuum frame forms a fifth vent hole connected to the air pressure control device, and the main chamber is supplied with gas. 如申請專利範圍第17項之沖壓裝置,其中,該第五通氣孔具備:環狀部,在該真空框的延長方向上延伸;第一部,從該環狀部延伸,並往該真空框的外周面開口;及第二部,從該環狀部延伸,並往該真空框的內周面開口。 The press device of claim 17, wherein the fifth vent hole has an annular portion extending in a direction in which the vacuum frame extends; and a first portion extending from the annular portion to the vacuum frame The outer peripheral surface opening; and the second portion extends from the annular portion and opens to the inner peripheral surface of the vacuum frame. 如申請專利範圍第18項之沖壓裝置,其中,該第二部,形成在該真空框的延長方向上展開的狹縫狀。 A press apparatus according to claim 18, wherein the second portion is formed in a slit shape which is developed in a direction in which the vacuum frame extends. 如申請專利範圍第18項之沖壓裝置,其中,係以氣體通過該第二部時的壓力損失,大於氣體通過該第一部時的壓力損失的方式構成。 A press apparatus according to claim 18, wherein the pressure loss when the gas passes through the second portion is larger than the pressure loss when the gas passes through the first portion. 如申請專利範圍第1項之沖壓裝置,其中,該氣壓控制裝置,在該沖壓處理中,使該主腔室內的氣壓為真空,並使該上部空間及該下部空間的氣壓為大氣壓。 A press apparatus according to claim 1, wherein the air pressure control device causes the air pressure in the main chamber to be a vacuum and the air pressure in the upper space and the lower space to be atmospheric pressure. 如申請專利範圍第15項之沖壓裝置,其中,該氣壓控制裝置,在該沖壓處理前或是該硬化處理中,以使該上部隔膜膨脹而與該隔膜保護板密合的方式,控制該上部空間與該主腔室內的氣壓差。 The press device of claim 15, wherein the air pressure control device controls the upper portion in a manner to expand the upper diaphragm and adhere to the diaphragm protection plate before or during the pressing treatment. The space is different from the air pressure in the main chamber. 如申請專利範圍第3項之沖壓裝置,其中,該隔膜成形板形成有通氣孔。 The press device of claim 3, wherein the diaphragm forming plate is formed with a vent hole. 如申請專利範圍第1項之沖壓裝置,其中,該被加工物為疊層體,且進行疊層加工,該疊層加工,係在加熱下對該被加工物進行沖壓,而使該被加工物的構成構件接合為一體。 The press apparatus of claim 1, wherein the workpiece is a laminate and is subjected to lamination processing, and the workpiece is pressed under heating to process the workpiece. The constituent members of the object are joined together. 如申請專利範圍第15項之沖壓裝置,其中,該隔膜保護板形成有通氣孔。 The press device of claim 15, wherein the diaphragm protection plate is formed with a vent hole. 一種真空框,形成環狀,其中藉由底面被彈性膜即上部隔膜所封蓋的上部腔室,與頂面被彈性膜即下部隔膜所封蓋的下部腔室上下夾住,而形成氣密的主腔室,藉由使該主腔室的氣壓低於該上部腔室及該下部腔室的氣壓,以在該上部隔膜與該下部隔膜之間,對配置於該主腔室內的被加工物進行沖壓,其中具有對該主腔室進行供排氣體之通氣孔,該通氣孔具備:環狀部,在該真空框的延長方向上延伸;第一部,從該環狀部延伸,並往該真空框的外周面開口;及第二部,從該環狀部延伸,並往該真空框的內周面開口。 A vacuum frame is formed in an annular shape, wherein an upper chamber covered by an elastic film, that is, an upper diaphragm, is sandwiched between a lower chamber covered by an elastic membrane, that is, a lower diaphragm, to form an airtight shape. The main chamber is processed between the upper diaphragm and the lower diaphragm by the air pressure of the main chamber being lower than the air pressure of the upper chamber and the lower chamber Stamping, wherein the main chamber is provided with a vent hole for the air supply and exhaust body, the vent hole having an annular portion extending in a direction in which the vacuum frame extends; and a first portion extending from the annular portion Opening to the outer peripheral surface of the vacuum frame; and the second portion extending from the annular portion and opening to the inner peripheral surface of the vacuum frame. 如申請專利範圍第26項之真空框,其中, 該第二部,形成為在該真空框的延長方向上展開的狹縫狀。 Such as the vacuum box of claim 26, wherein The second portion is formed in a slit shape that is developed in the extending direction of the vacuum frame. 如申請專利範圍第26或27項之真空框,其中,係以氣體通過該第二部所造成的壓力損失,大於氣體通過該第一部所造成的壓力損失的方式所構成。 A vacuum frame according to claim 26 or 27, wherein the pressure loss caused by the passage of the gas through the second portion is greater than the pressure loss caused by the gas passing through the first portion. 一種沖壓成形方法,其係將被加工物配置於主腔室內,該主腔室係藉由上下對向配置的一對彈性膜、即上部隔膜與下部隔膜,而分別與上部空間及下部空間氣密地被劃分出來;進行沖壓處理的步驟,一方面將該被加工物加熱,一方面使該主腔室內的氣壓低於該上部空間及該下部空間的氣壓,以對在該上部隔膜與該下部隔膜之間加熱的該被加工物進行沖壓;進行硬化處理的步驟,使該主腔室內的氣壓高於該下部空間的氣壓,以在非真空的狀態下,將該被加工物加熱。 A press forming method for arranging a workpiece in a main chamber, wherein the main chamber is separated from the upper space and the lower space by a pair of elastic films arranged in the upper and lower directions, that is, an upper diaphragm and a lower diaphragm. The dense ground is divided; the step of performing a stamping process, on the one hand, heating the workpiece, on the one hand, the air pressure in the main chamber is lower than the air pressure in the upper space and the lower space, and the upper diaphragm and the upper The workpiece heated between the lower diaphragms is pressed; and the hardening treatment is performed such that the air pressure in the main chamber is higher than the air pressure in the lower space to heat the workpiece in a non-vacuum state. 如申請專利範圍第29項之沖壓成形方法,其中,該硬化處理中,於該被加工物的底面為彎曲之凸面的情況下,係以使該下部隔膜沿著該被加工物的底面彎曲,而藉由大致均勻的壓力支持該被加工物的方式,控制該主腔室內與該下部空間的氣壓差。 The press forming method according to claim 29, wherein, in the hardening treatment, when the bottom surface of the workpiece is a curved convex surface, the lower diaphragm is bent along a bottom surface of the workpiece. The manner in which the workpiece is supported by a substantially uniform pressure controls the difference in air pressure between the main chamber and the lower space. 如申請專利範圍第30項之沖壓成形方法,其中,將具有平坦頂面的隔膜成形板,以與該下部隔膜對向的方式配置於該下部空間內;在該被加工物的底面為平坦面的情況下,於該硬化處理中,以使該下部隔膜與該隔膜成形板的頂面密合而形成平坦之態樣,進而以大致 均勻的壓力支持該被加工物的方式,控制該主腔室與該下部空間的氣壓差。 The press forming method according to claim 30, wherein the diaphragm forming plate having a flat top surface is disposed in the lower space so as to face the lower diaphragm; and the bottom surface of the workpiece is a flat surface In the case of the hardening treatment, the lower diaphragm is brought into close contact with the top surface of the diaphragm forming plate to form a flat surface, and further The manner in which the uniform pressure supports the workpiece controls the difference in air pressure between the main chamber and the lower space. 如申請專利範圍第29至31項中任一項之沖壓成形方法,其中,在該上部空間側,以與該上部隔膜對向的方式配置熱盤;在該上部隔膜與該熱盤之間,配置防止該上部隔膜與該熱盤接觸的隔膜保護板;該沖壓處理前或是該硬化處理中,以使該上部隔膜往該上部空間側膨脹,而使其與該隔膜保護板密合的方式,控制該主腔室與該上部空間的氣壓差。 The press forming method according to any one of claims 29 to 31, wherein a hot plate is disposed on the upper space side so as to face the upper diaphragm; between the upper diaphragm and the hot plate, Providing a diaphragm protection plate for preventing the upper diaphragm from contacting the hot plate; before the pressing treatment or during the hardening treatment, the upper diaphragm is expanded toward the upper space side to be in close contact with the diaphragm protection plate And controlling a difference in air pressure between the main chamber and the upper space. 如申請專利範圍第29至31項中任一項之沖壓成形方法,其中,該上部隔膜與該下部隔膜之間,配置真空框,其具有上下貫通的中空部;在將該被加工物載置於該下部隔膜上之後,使該上部隔膜與該下部隔膜的至少一方上下移動,並藉由以該上部隔膜與該下部隔膜氣密地夾住該真空框,來形成該主腔室。 The press forming method according to any one of claims 29 to 31, wherein a vacuum frame having a hollow portion penetrating vertically is disposed between the upper diaphragm and the lower diaphragm; and the workpiece is placed After the lower diaphragm is moved, at least one of the upper diaphragm and the lower diaphragm is moved up and down, and the vacuum chamber is hermetically sandwiched by the upper diaphragm and the lower diaphragm to form the main chamber. 如申請專利範圍第29至31項中任一項之沖壓成形方法,其中,該沖壓處理中,使該主腔室內的氣壓為真空,使該上部空間及該下部空間的氣壓為大氣壓。 The press forming method according to any one of claims 29 to 31, wherein in the press working, the air pressure in the main chamber is made vacuum, and the air pressure in the upper space and the lower space is atmospheric pressure. 如申請專利範圍第29至31項中任一項之沖壓成形方法,其中,該被加工物為疊層體,且進行疊層加工,該疊層加工係在加熱的情況下,對該被加工物進行沖壓,而使該被加工物的構成構件接合成一體。 The press forming method according to any one of claims 29 to 31, wherein the workpiece is a laminate and is subjected to lamination processing, and the lamination is processed while being heated. The object is pressed, and the constituent members of the workpiece are joined together.
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