WO2014188619A1 - Press apparatus, vacuum frame, and press-forming method - Google Patents

Press apparatus, vacuum frame, and press-forming method Download PDF

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Publication number
WO2014188619A1
WO2014188619A1 PCT/JP2013/081609 JP2013081609W WO2014188619A1 WO 2014188619 A1 WO2014188619 A1 WO 2014188619A1 JP 2013081609 W JP2013081609 W JP 2013081609W WO 2014188619 A1 WO2014188619 A1 WO 2014188619A1
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Prior art keywords
diaphragm
chamber
workpiece
space
heating
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PCT/JP2013/081609
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French (fr)
Japanese (ja)
Inventor
岡崎 静明
功夫 則清
良次 弓戸
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北川精機株式会社
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Application filed by 北川精機株式会社 filed Critical 北川精機株式会社
Priority to JP2015518039A priority Critical patent/JP6211074B2/en
Priority to KR1020157035031A priority patent/KR101737604B1/en
Publication of WO2014188619A1 publication Critical patent/WO2014188619A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B5/00Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B7/00Presses characterised by a particular arrangement of the pressing members
    • B30B7/02Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Definitions

  • the present invention relates to a press apparatus, a vacuum frame, and a press molding method used for laminating laminated products.
  • a hot press apparatus (hereinafter referred to as “laminate apparatus”) using a diaphragm (elastic film) for laminating laminated products such as solar cell panels is known.
  • laminate apparatus using a diaphragm (elastic film) for laminating laminated products such as solar cell panels is known.
  • a vacuum chamber is formed between a hot platen and a diaphragm. By evacuating the inside of the vacuum chamber, the work piece placed on the hot platen is pressurized between the hot platen and the diaphragm, and laminating is performed.
  • the above conventional laminating apparatus presses a work piece between a flat upper surface of a hot platen and a diaphragm, and therefore cannot be pressed with a uniform pressure unless the work piece is flat on at least one side. Proper lamination could not be performed.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laminating apparatus capable of laminating a workpiece whose both surfaces are non-flat surfaces.
  • An upper diaphragm which is an elastic membrane that partitions the upper space and the main chamber vertically;
  • a lower diaphragm which is an elastic film that is disposed opposite to the upper diaphragm and divides the main chamber and the lower space vertically.
  • a pressure control device for controlling a pressure difference between the main chamber and the upper space and the lower space;
  • a heating device for heating a workpiece disposed in the main chamber;
  • the atmospheric pressure control device is A press process for pressing the workpiece heated between the upper diaphragm and the lower diaphragm by lowering the pressure in the main chamber below the pressure in the upper space and the lower space;
  • a curing process in which the pressure in the main chamber is made larger than the pressure in the lower space, and the workpiece is heated in a non-vacuum;
  • a press apparatus configured to perform the above is provided.
  • An upper chamber whose upper surface is closed by an upper diaphragm, which is an elastic membrane, and a lower chamber, whose upper surface is closed by a lower diaphragm, which is an elastic membrane, is sandwiched vertically to form an airtight main chamber, and the main chamber
  • the workpiece placed in the main chamber is pressed between the upper diaphragm and the lower diaphragm by lowering the pressure of the upper chamber and the lower chamber.
  • the main chamber has a vent for supplying and discharging air, and the vent is An annular portion extending in the extending direction of the vacuum frame; A first portion extending from the annular portion and opening in the outer peripheral surface of the vacuum frame; A second portion extending from the annular portion and opening in the inner peripheral surface of the vacuum frame; A vacuum frame is provided.
  • a workpiece is disposed in a main chamber that is airtightly partitioned from an upper space and a lower space by an upper diaphragm and a lower diaphragm, which are a pair of elastic films disposed vertically opposite to each other, While heating the workpiece, the pressure in the main chamber is made lower than the pressure in the upper space and the lower space, and the workpiece heated between the upper diaphragm and the lower diaphragm is heated. Press processing to press, There is provided a press molding method for performing a curing process in which the pressure in the main chamber is made larger than the pressure in the lower space and the workpiece is heated in a non-vacuum state.
  • FIG. 1 is a front perspective view of a laminating apparatus according to the first embodiment of the present invention.
  • FIG. 2 is an AA arrow view of FIG.
  • FIG. 3 is a diagram illustrating the configuration of the vacuum frame.
  • FIG. 4 is a view for explaining the procedure of laminating according to the first embodiment of the present invention.
  • FIG. 5 is a front perspective view of a laminating apparatus according to the second embodiment of the present invention.
  • FIG. 1 is a front perspective view of a laminating apparatus 1 according to the first embodiment of the present invention
  • FIG. 2 is a view taken in the direction of arrows AA in FIG.
  • the laminating apparatus 1 includes a main body 1a, a control unit 2, an atmospheric pressure control device 3, and a hydraulic pressure control device 4.
  • the main body 1 a, the atmospheric pressure control device 3, and the hydraulic pressure control device 4 are each connected to the control unit 2 and operate under the control of the control unit 2.
  • the main body 1 a includes an outer chamber 10, an upper heating plate 20, a lower heating plate 40, and a hydraulic cylinder 50 arranged in the outer chamber 10.
  • the external chamber 10 is connected to the atmospheric pressure control device 3 via the external chamber supply / exhaust pipe line 3a, and the internal pressure of the external chamber 10 is changed from a vacuum (for example, about 0.1 kPa) to an atmospheric pressure or more (for example, several) by the atmospheric pressure control device 3. (Atmospheric pressure).
  • the hydraulic cylinder 50 (drive device) is connected to the hydraulic control device 4 and operates according to the supply and discharge of hydraulic oil by the hydraulic control device 4.
  • the cylinder tube 51 of the hydraulic cylinder 50 is fixed to the frame of the external chamber 10.
  • the upper heating plate 20 is fixed to the frame of the external chamber 10 with the lower surface horizontal. Further, the lower heating plate 40 is arranged so that the upper surface thereof faces the lower surface of the upper heating plate 20.
  • the lower heating plate 40 is fixed to the ram 52 of the hydraulic cylinder 50 on the lower surface, and moves up and down together with the ram 52 in accordance with the supply and discharge of hydraulic oil to and from the hydraulic cylinder 50.
  • the upper heating plate 20 and the lower heating plate 40 are provided with an electric heater (not shown) and a temperature sensor (not shown), respectively, and the temperature of the upper heating plate 20 and the lower heating plate 40 is controlled by the control unit 2. Be controlled. Further, on the lower surface of the upper heating platen 20 and the upper surface of the lower heating platen 40, for example, far-infrared rays that generate high-efficiency far-infrared rays with strong absorption by the resin contained in the workpiece W using thermal energy. A layer (for example, a film or a plate) of the radiating material is provided so that the workpiece W can be efficiently heated. That is, the upper heating platen 20 and the lower heating platen 40 function as a heating device that heats the workpiece W.
  • the upper chamber unit 20U is attached to the lower surface of the upper heating platen 20.
  • the upper chamber unit 20U includes an upper diaphragm fixing frame 21U, an upper diaphragm 22U, and an upper diaphragm protection plate 23U.
  • the upper diaphragm fixing frame 21U is a substantially cylindrical member disposed with its central axis oriented in the vertical direction, and its upper end is joined in a state of being in airtight contact with the lower surface of the upper heating platen 20. For this joining, various methods such as welding, adhesion, and pressure welding via a sealing material can be used.
  • the upper diaphragm fixing frame 21U has a tapered surface with a frustoconical side surface so that its thickness increases as it approaches the upper heating platen 20.
  • the hollow portion of the upper diaphragm fixing frame 21U is airtightly closed at the lower end by the upper diaphragm 22U.
  • an upper chamber 24U that is airtightly surrounded by the upper heating platen 20, the upper diaphragm fixing frame 21U, and the upper diaphragm 22U is formed. Further, since the upper heating plate 20 of the present embodiment is provided with a vent hole 20a that communicates the lower surface and the side surface thereof (that is, communicates the upper chamber 24U and the external chamber 10), The internal pressure of the external chamber 10 is approximately the same.
  • the hollow portion (upper chamber 24U) of the upper diaphragm fixing frame 21U is partitioned by an upper diaphragm protection plate 23U, which is a flat plate arranged in parallel with the lower surface of the upper diaphragm fixing frame 21U (that is, with the upper diaphragm 22U).
  • an upper diaphragm protection plate 23U a plate material having air permeability, such as a punching plate or a porous plate, is used in order to prevent a pressure difference between the spaces on both sides thereof.
  • the lower chamber unit 40L configured in the same manner as the upper chamber unit 20U is attached upside down with respect to the upper chamber unit 20U. That is, the lower chamber unit 40L includes a lower diaphragm fixing frame 41L joined in a state where the lower end is in airtight contact with the upper surface of the lower heating plate 40, and a lower diaphragm fixing so as to airtightly close a hollow portion of the lower diaphragm fixing frame 41L.
  • a lower diaphragm 42L attached to the upper end of the frame 41L, and a lower diaphragm molding plate 43L attached to the inner peripheral surface of the lower diaphragm fixing frame 41L so as to partition the hollow portion vertically.
  • the lower heating plate 40 is provided with a vent hole 40a that communicates the upper surface and the side surface thereof.
  • One port of a three-port solenoid valve 47 is connected to one end of the vent hole 40a.
  • Another port of the three-port solenoid valve 47 is connected to the atmospheric pressure control device 3 via the lower chamber supply / exhaust pipe 3c, and the remaining one port is opened in the external chamber 10.
  • the 3-port solenoid valve 47 is controlled by the control unit 2 and is in a state in which the lower chamber 44L and the external chamber 10 are connected (open state) and in a state in which the lower chamber 44L and the atmospheric pressure control device 3 are connected (pressure control state). And switch.
  • annular vacuum frame 60 having substantially the same outer diameter as the lower diaphragm fixing frame 41L is airtightly attached to the upper surface of the lower chamber unit 40L.
  • FIG. 3A is an enlarged plan view of a part of the vacuum frame 60
  • FIG. 3B is a view taken along the line BB in FIG. 3A.
  • a tapered surface (or curved surface) 60a is formed so that it is not bent or deteriorated with a small radius of curvature.
  • the vacuum frame 60 includes an annular upper member 62, a lower member 64, and an O-ring 66, respectively.
  • the upper member 62 and the lower member 64 are stacked one above the other, and the joint is hermetically sealed by an O-ring 66.
  • an annular hollow portion 60b annular portion extending in the extending direction over the entire circumference is formed.
  • the upper member 62 and the lower member 64 are closely opposed to each other, and a ventilation slit 60c that connects the hollow portion 60b and the main chamber 26 is formed therebetween.
  • the ventilation slit 60 c is a slit-shaped ventilation path that extends over the entire circumference of the vacuum frame 60 and opens on the inner peripheral surface of the vacuum frame 60.
  • a vent hole 60d that connects the hollow portion 60b and the external chamber 10 is formed.
  • the vent hole 60d is enlarged in diameter on one end side (the outer peripheral surface side of the vacuum frame 60) to form a taper screw 60e.
  • a main chamber supply / exhaust line 3b (FIG. 1) from the atmospheric pressure control device 3 is connected to the taper screw 60e, and air (air or dry nitrogen or the like) enters the main chamber 26 through the vacuum frame 60 by the atmospheric pressure control device 3. Inert gas) can be supplied and discharged.
  • the ventilation slit 60c has a constant cross-sectional dimension over the entire circumference so that the pressure loss when supplying and discharging air to the main chamber 26 through the ventilation slit 60c is substantially uniform over the entire circumference.
  • the supply and discharge of air into the main chamber 26 is performed through a hollow portion 60b having a large cross-sectional area and a small pressure loss, and a ventilation slit 60c having a small cross-sectional area and a large pressure loss. Therefore, the supply and discharge of air to and from the main chamber 26 is performed substantially uniformly and gently from the entire circumference of the ventilation slit 60c.
  • the hydraulic cylinder 50 (FIG. 1) is driven to raise the lower heating platen 40 so that the upper chamber unit 20U and the vacuum frame 60 are brought into close contact with each other. Form.
  • the outer chamber 10 (FIG. 1), the upper chamber 24U, the main chamber 26, and the lower chamber 44L are all in a vacuum.
  • the workpiece W is sandwiched between the upper diaphragm 22U and the lower diaphragm 42L, and pressed by the pressure difference between the upper chamber 24U, the lower chamber 44L, and the main chamber 26. Is done. Then, if this state is maintained for a predetermined time, the workpiece W is processed by the radiant heat from the upper heating plate 20 and the lower heating plate 40 (when the thermosetting resin is used, the curing temperature of the resin, the thermoplastic resin is used). If the resin is heated to a temperature equal to or higher than the glass transition point of the resin, the resin contained in the workpiece W (for example, a thermosetting resin such as an epoxy resin or an ethylene vinyl acetate copolymer resin (EVA)) is used. The thermoplastic resin) is softened (and further cured in the case of a thermosetting resin), and the members constituting the workpiece W are joined together.
  • a thermosetting resin such as an epoxy resin or an ethylene vinyl acetate copolymer resin (EVA)
  • the main chamber 26 When gas is generated from the workpiece W during the pressing process, the main chamber 26 is pressed during the pressing process by the atmospheric pressure control device 3 via the main chamber supply / exhaust pipe line 3b connected to the vacuum frame 60. Can be evacuated. As a result, the gas generated from the workpiece W during the press process can be forcibly discharged from the main chamber 26, and the bonding failure of the workpiece W and the deterioration of the diaphragm due to the generation of the gas can be prevented. it can.
  • the curing process is a process of stabilizing the workpiece W by keeping the workpiece W after bonding at the curing temperature of the resin (in the case of a thermoplastic resin, a temperature equal to or higher than the glass transition point).
  • the curing step is performed under non-vacuum (that is, in air or inert gas).
  • non-vacuum that is, in air or inert gas
  • 0.1 atmosphere or more is referred to as non-vacuum.
  • compressed air having a pressure P1 higher than the atmospheric pressure is introduced into the main chamber 26 by the atmospheric pressure control device 3 (FIG. 1).
  • the three-port solenoid valve 47 is switched to a state (pressure control state) in which the lower chamber 44L and the atmospheric pressure control device 3 are connected, and the lower chamber 44L is brought into the lower pressure P1 by the atmospheric pressure control device 3. Air having a pressure P2 is introduced into the main chamber 26.
  • the upper diaphragm 22U expands greatly toward the upper chamber 24U, and comes into close contact with the upper diaphragm protection plate 23U and becomes flat.
  • the upper diaphragm protection plate 23U prevents the upper diaphragm 22U from coming into contact with the upper heating plate 20 heated to a high temperature and being deteriorated or thermally damaged.
  • the upper diaphragm protection plate 23U is disposed in parallel and close to the lower surface of the upper heating platen 20, when the upper diaphragm 22U is in close contact with the upper diaphragm protection plate 23U, it is uniform due to the radiant heat from the upper heating platen 20. And it is efficiently heated to an appropriate temperature.
  • the upper diaphragm protection plate 23U can be preheated by holding the upper diaphragm protection plate 23U in close contact with the upper diaphragm protection plate 23U before press molding.
  • the lower diaphragm molding plate 43L has the same function and effect as the above-described upper diaphragm protection plate 23U.
  • the lower diaphragm 42L does not contact the lower diaphragm molding plate 43L, and the lower diaphragm 42L side according to the internal pressure difference. Inflates.
  • an internal pressure difference that causes the lower diaphragm 42L to bend along the lower surface of the workpiece W in a state where the workpiece W is placed on the lower diaphragm 42L is obtained in advance by calculation or experimentally.
  • the atmospheric pressure control device 3 controls the internal pressure P2 of the lower chamber 44L so that the obtained internal pressure difference is applied to the lower diaphragm 42L.
  • the workpiece W is supported at a substantially uniform pressure by the lower diaphragm 42L expanded at the same curvature, so that the entire surface of the workpiece W can be cured with less distortion applied to the workpiece W. Done. As a result, a highly reliable product (workpiece W) with little residual stress is obtained.
  • the three-port solenoid valve 47 is switched so that the lower chamber 44L is opened to the external chamber 10 (open state).
  • the lower diaphragm 42L greatly expands toward the lower chamber 44L and comes into close contact with the lower diaphragm molding plate 43L and becomes flat.
  • the workpiece W is supported by the flat lower diaphragm 42L at a uniform pressure, so that the curing process is performed with little distortion, and as a result, there is little residual stress and a highly reliable product ( A workpiece W) is obtained.
  • FIG. 5 is a front perspective view of the laminating apparatus 100.
  • the same or similar reference numerals are used for the same or similar components as those in the first embodiment, and the description of overlapping items is omitted.
  • the first embodiment described above is an example in which the present invention is applied to a single-stage laminating apparatus, but the second embodiment is one or more intermediate hot plates 130 between the upper hot platen 120 and the lower hot platen 140.
  • This is an example in which the present invention is applied to a multi-stage laminating apparatus provided with.
  • the laminating apparatus 100 according to the present embodiment includes one intermediate heating platen 130, but has a configuration in which two or more intermediate heating plates 130 are arranged side by side between the upper heating platen 120 and the lower heating platen 140. You can also
  • a lower chamber unit 130L and an upper chamber unit 130U are respectively attached to the upper surface and the lower surface of the intermediate heating platen 130.
  • the upper chamber unit 130U is the same as the upper chamber unit 120U (corresponding to the upper chamber unit 20U in the first embodiment) attached to the lower surface of the upper heating platen 120, and the lower chamber unit 130L is disposed on the upper surface of the lower heating platen 140. This is the same as the attached lower chamber unit 140L (corresponding to the lower chamber unit 40L in the first embodiment).
  • each chamber unit (upper chamber units 120U, 130U, lower chamber units 130L, 140L) is directly connected to the atmospheric pressure control device 103, and the atmospheric pressure control device 103 is connected. Is used to individually control the internal pressure of each chamber unit.
  • the time required for evacuation is greatly reduced, and the entire process time can be shortened.
  • the vacuum frames 60A and 60B are attached to the upper chamber units 20U and 30U, the upper surfaces of the lower chamber units 130L and 140L on which the workpiece W is placed become completely flat, and the laminating apparatus 100 It is possible to easily carry in / out the workpiece W to / from.
  • a pair of receiving plates 120b and 130b protruding from the left and right side surfaces are attached to the upper heating plate 120 and the intermediate heating plate 130 of the laminating apparatus 100, respectively.
  • the frame 110 of the laminating apparatus 100 is attached with two pairs of hot platen support mechanisms 112 (only a pair on the front side is shown) arranged to face each other in the width direction (left-right direction in FIG. 5). ing.
  • the hot platen support mechanism 112 carries the unprocessed workpiece W into the laminating apparatus 100 or the unprocessed workpiece (product) W from the laminating apparatus 100 when the upper and lower chamber units are spaced apart. This is a mechanism for holding the hot platen immediately above the workpiece W to be conveyed at a predetermined height.
  • the hot platen support mechanism 112 includes a movable pin 112a that can reciprocate in the width direction.
  • the hot platen support mechanism 112 is connected to the control unit 102, and the drive of the movable pin 112 a is controlled by the control unit 102.
  • the movable pin 112a When the movable pin 112a is retracted (moved outward in the width direction of the main body 100a), the hot plate support mechanism 112 does not disturb the vertical movement of the upper heat plate 120 and the intermediate heat plate 130, and the movable pin 112a protrudes (the main body 100a In this state, the plate is disposed so as to contact the receiving plate 120b of the upper heating plate 120 or the receiving plate 130b of the intermediate heating plate 130.
  • each hot platen support mechanism 112 is retracted, the intermediate hot platen 130 is placed on the lower hot platen 140, and the upper hot platen 120 is placed on the intermediate hot platen 130. Will be placed.
  • the hydraulic cylinder 150 is driven to move the lower heating plate 140 up and down, the intermediate heating plate 130 and the upper heating plate 120 stacked on the lower heating plate 140 move up and down together with the lower heating plate 140.
  • the position of the receiving plate 120b of the upper heating platen 120 is slightly smaller than the movable pin 112a of each heating platen support mechanism 112.
  • the hydraulic cylinder 150 is driven to raise the lower heating platen 140 until it becomes higher.
  • the movable pin 112a of each hot platen support mechanism 112 is projected to the upper hot platen 120 side.
  • the upper heating platen 120 is placed on the intermediate heating platen 130, and the receiving plate 120b is connected to each of the receiving plate 120b.
  • the hydraulic cylinder 150 is driven to raise the lower heat platen 140 until it slightly floats from the movable pin 112a of the heat plate support mechanism 112.
  • the hydraulic cylinder 150 is moved until the position of the receiving plate 130b of the intermediate hot platen 130 is slightly higher than the movable pin 112a of each hot platen support mechanism 112. Driven to raise the lower heating platen 140.
  • each hot platen support mechanism 112 is protruded to the intermediate hot platen 130 side and the hydraulic cylinder 150 is driven to lower the lower hot platen 140
  • the receiving plate 130b of the intermediate hot platen 130 is moved.
  • the lower surface abuts on the movable pin 112a of each hot platen support mechanism 112, and the intermediate hot platen 130 is placed on the two pairs of movable pins 112a.
  • the intermediate heat platen 130 is supported by the two pairs of movable pins 112a and is not lowered any further, so that the lower heat platen 140 is separated from the intermediate heat platen 130.
  • the hydraulic cylinder 150 is stopped.
  • the intermediate heating platen 130 is placed on the lower heating platen 140, and the receiving plate 130b of the intermediate heating platen 130 is moved from the movable pin 112a of each heating plate support mechanism 112.
  • the hydraulic cylinder 150 is driven to raise the lower heat platen 140 until it slightly floats, and then the movable pin 112a of each heat plate support mechanism 112 is retracted.
  • an electric heater is used for heating the hot platen, but the heating plate may be heated using other heating means.
  • a configuration in which the heating plate is uniformly heated by flowing a heat medium such as silicone oil through a flow path provided in the heating plate can be employed. .
  • an upper (lower) diaphragm fixing frame and a vacuum frame formed in a cylindrical shape are used.
  • the present invention is not limited to this configuration, and other shapes (for example, It is also possible to use an upper (lower) diaphragm fixing frame or a vacuum frame of a polygonal tube shape.
  • a flat plate-shaped lower diaphragm molding plate is used, but a lower diaphragm molding plate having the same shape as the lower surface of the workpiece W can also be used.
  • the inner pressure of the main chamber is made sufficiently higher than the inner pressure of the lower chamber, and the lower diaphragm is brought into close contact with the lower diaphragm molding plate, so that the lower diaphragm has the same shape as the lower surface of the workpiece W. Can be molded.

Abstract

According to an embodiment of the present invention, a press apparatus is provided with: an upper diaphragm, i.e., an elastic film, which vertically partitions an upper space and a main chamber from each other; a lower diaphragm, i.e., an elastic film, which is disposed to face the upper diaphragm, and which vertically partitions the main chamber and a lower space from each other; an atmospheric pressure control apparatus, which controls atmospheric pressure differences between the main chamber inside and the upper space, and between the main chamber inside and the lower space; and a heating apparatus, which heats a subject to be processed, said subject being disposed in the main chamber. The atmospheric pressure control apparatus is configured to perform: pressing wherein the atmospheric pressure in the main chamber is reduced to be lower than the atmospheric pressure in the upper space and that in the lower space, and the subject to be processed is pressed, said subject having been heated between the upper diaphragm and the lower diaphragm; and curing wherein the atmospheric pressure in the main chamber is increased to be higher than the atmospheric pressure in the lower space, and the subject to be processed is heated in a non-vacuum state.

Description

プレス装置、真空枠及びプレス成形方法Press device, vacuum frame, and press molding method
 本発明は、積層品のラミネート加工に用いられるプレス装置、真空枠及びプレス成形方法に関する。 The present invention relates to a press apparatus, a vacuum frame, and a press molding method used for laminating laminated products.
 太陽電池パネル等の積層品のラミネート加工を行うための、ダイヤフラム(弾性膜)を使用したホットプレス装置(以下「ラミネート装置」という。)が知られている。特許文献1に開示されているような従来のダイヤフラム式のラミネート装置では、熱盤とダイヤフラムとの間に真空チャンバーが形成される。真空チャンバー内を真空引きすることにより、熱盤上に配置された被加工物が熱盤とダイヤフラムとの間で加圧され、ラミネート加工が行われる。 2. Description of the Related Art A hot press apparatus (hereinafter referred to as “laminate apparatus”) using a diaphragm (elastic film) for laminating laminated products such as solar cell panels is known. In a conventional diaphragm type laminating apparatus as disclosed in Patent Document 1, a vacuum chamber is formed between a hot platen and a diaphragm. By evacuating the inside of the vacuum chamber, the work piece placed on the hot platen is pressurized between the hot platen and the diaphragm, and laminating is performed.
特開2012-196835号公報JP 2012-196835 A
 上記の従来のラミネート装置は、熱盤の平らな上面とダイヤフラムとの間で被加工物をプレスするため、少なくとも片面が平らな被加工物でなければ均等な圧力でプレスすることができず、適切にラミネート加工を行うことができなかった。 The above conventional laminating apparatus presses a work piece between a flat upper surface of a hot platen and a diaphragm, and therefore cannot be pressed with a uniform pressure unless the work piece is flat on at least one side. Proper lamination could not be performed.
 本発明は上記の事情に鑑みてなされたものであり、その目的とするところは、両面が非平坦面である被加工物のラミネート加工が可能なラミネート装置を提供することである。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laminating apparatus capable of laminating a workpiece whose both surfaces are non-flat surfaces.
 本発明の一実施形態によれば、
 上部空間と主チャンバーとを上下に仕切る弾性膜である上部ダイヤフラムと、
 前記上部ダイヤフラムと対向して配置され、前記主チャンバーと下部空間とを上下に仕切る弾性膜である下部ダイヤフラムと、
 前記主チャンバー内と、前記上部空間及び前記下部空間との気圧差を制御する気圧制御装置と、
 前記主チャンバー内に配置される被加工物を加熱する加熱装置と、
を備え、
 前記気圧制御装置が、
  前記主チャンバー内の気圧を前記上部空間及び前記下部空間の気圧よりも低くして、前記上部ダイヤフラムと前記下部ダイヤフラムとの間で加熱された前記被加工物をプレスするプレス処理と、
  前記主チャンバー内の気圧を前記下部空間の気圧より大きくして、前記被加工物を非真空下で加熱するキュア処理と、
を行うように構成されたプレス装置が提供される。
According to one embodiment of the present invention,
An upper diaphragm, which is an elastic membrane that partitions the upper space and the main chamber vertically;
A lower diaphragm, which is an elastic film that is disposed opposite to the upper diaphragm and divides the main chamber and the lower space vertically.
A pressure control device for controlling a pressure difference between the main chamber and the upper space and the lower space;
A heating device for heating a workpiece disposed in the main chamber;
With
The atmospheric pressure control device is
A press process for pressing the workpiece heated between the upper diaphragm and the lower diaphragm by lowering the pressure in the main chamber below the pressure in the upper space and the lower space;
A curing process in which the pressure in the main chamber is made larger than the pressure in the lower space, and the workpiece is heated in a non-vacuum;
A press apparatus configured to perform the above is provided.
 本発明の一実施形態によれば、
 弾性膜である上部ダイヤフラムによって下面が塞がれた上部チャンバーと、弾性膜である下部ダイヤフラムによって上面が塞がれた下部チャンバーとで上下に挟み込まれて気密な主チャンバーを形成し、前記主チャンバーの気圧を前記上部チャンバー及び前記下部チャンバーの気圧よりも低くすることによって、前記主チャンバー内に配置された被加工物が前記上部ダイヤフラムと前記下部ダイヤフラムとの間でプレスされるように構成された環状の真空枠であって、
 前記主チャンバーにエアを給排する通気孔を有し、該通気孔が、
  前記真空枠の延長方向に延びる環状部と、
  前記環状部から延びて前記真空枠の外周面に開口する第1部と、
  前記環状部から延びて前記真空枠の内周面に開口する第2部と、
を有する真空枠が提供される。
According to one embodiment of the present invention,
An upper chamber whose upper surface is closed by an upper diaphragm, which is an elastic membrane, and a lower chamber, whose upper surface is closed by a lower diaphragm, which is an elastic membrane, is sandwiched vertically to form an airtight main chamber, and the main chamber The workpiece placed in the main chamber is pressed between the upper diaphragm and the lower diaphragm by lowering the pressure of the upper chamber and the lower chamber. An annular vacuum frame,
The main chamber has a vent for supplying and discharging air, and the vent is
An annular portion extending in the extending direction of the vacuum frame;
A first portion extending from the annular portion and opening in the outer peripheral surface of the vacuum frame;
A second portion extending from the annular portion and opening in the inner peripheral surface of the vacuum frame;
A vacuum frame is provided.
 本発明の一実施形態によれば、
 上下に対向して配置された一対の弾性膜である上部ダイヤフラム及び下部ダイヤフラムによって上部空間及び下部空間とそれぞれ気密に仕切られた主チャンバー内に被加工物を配置し、
 前記被加工物を加熱しながら、前記主チャンバー内の気圧を前記上部空間及び前記下部空間の気圧よりも低くして、前記上部ダイヤフラムと前記下部ダイヤフラムとの間で加熱された前記被加工物をプレスするプレス処理を行い、
 前記主チャンバー内の気圧を前記下部空間の気圧より大きくして、前記被加工物を非真空下で加熱するキュア処理を行うプレス成形方法が提供される。
According to one embodiment of the present invention,
A workpiece is disposed in a main chamber that is airtightly partitioned from an upper space and a lower space by an upper diaphragm and a lower diaphragm, which are a pair of elastic films disposed vertically opposite to each other,
While heating the workpiece, the pressure in the main chamber is made lower than the pressure in the upper space and the lower space, and the workpiece heated between the upper diaphragm and the lower diaphragm is heated. Press processing to press,
There is provided a press molding method for performing a curing process in which the pressure in the main chamber is made larger than the pressure in the lower space and the workpiece is heated in a non-vacuum state.
 本発明の一実施形態の構成によれば、両面が非平坦面である被加工物のラミネート加工が可能になる。 According to the configuration of the embodiment of the present invention, it is possible to laminate a workpiece whose both surfaces are non-flat surfaces.
図1は本発明の第1の実施形態に係るラミネート装置の正面透視図である。FIG. 1 is a front perspective view of a laminating apparatus according to the first embodiment of the present invention. 図2は図1のA-A矢視図である。FIG. 2 is an AA arrow view of FIG. 図3は真空枠の構成を説明する図である。FIG. 3 is a diagram illustrating the configuration of the vacuum frame. 図4は本発明の第1実施形態に係るラミネート加工の手順を説明する図である。FIG. 4 is a view for explaining the procedure of laminating according to the first embodiment of the present invention. 図5は本発明の第2実施形態に係るラミネート装置の正面透視図である。FIG. 5 is a front perspective view of a laminating apparatus according to the second embodiment of the present invention.
 以下、本発明の実施の形態について、図面を参照しながら説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(第1実施形態)
 図1は本発明の第1実施形態に係るラミネート装置1の正面透視図であり、図2は図1のA-A矢視図である。ラミネート装置1は、本体1a、制御部2、気圧制御装置3及び油圧制御装置4を備えている。本体1a、気圧制御装置3及び油圧制御装置4は、それぞれ制御部2に接続されており、制御部2の制御下で動作する。
(First embodiment)
FIG. 1 is a front perspective view of a laminating apparatus 1 according to the first embodiment of the present invention, and FIG. 2 is a view taken in the direction of arrows AA in FIG. The laminating apparatus 1 includes a main body 1a, a control unit 2, an atmospheric pressure control device 3, and a hydraulic pressure control device 4. The main body 1 a, the atmospheric pressure control device 3, and the hydraulic pressure control device 4 are each connected to the control unit 2 and operate under the control of the control unit 2.
 本体1aは、外部チャンバー10と、外部チャンバー10内に配置された上部熱盤20、下部熱盤40及び油圧シリンダ50を備えている。外部チャンバー10は外部チャンバー給排気管路3aを介して気圧制御装置3に接続されていて、外部チャンバー10の内圧は気圧制御装置3によって真空(例えば約0.1kPa)から大気圧以上(例えば数気圧)の範囲で制御される。 The main body 1 a includes an outer chamber 10, an upper heating plate 20, a lower heating plate 40, and a hydraulic cylinder 50 arranged in the outer chamber 10. The external chamber 10 is connected to the atmospheric pressure control device 3 via the external chamber supply / exhaust pipe line 3a, and the internal pressure of the external chamber 10 is changed from a vacuum (for example, about 0.1 kPa) to an atmospheric pressure or more (for example, several) by the atmospheric pressure control device 3. (Atmospheric pressure).
 油圧シリンダ50(駆動装置)は、油圧制御装置4に接続されていて、油圧制御装置4による作動油の給排に応じて作動する。また、油圧シリンダ50のシリンダチューブ51は外部チャンバー10のフレームに固定されている。 The hydraulic cylinder 50 (drive device) is connected to the hydraulic control device 4 and operates according to the supply and discharge of hydraulic oil by the hydraulic control device 4. The cylinder tube 51 of the hydraulic cylinder 50 is fixed to the frame of the external chamber 10.
 上部熱盤20は、下面を水平にして、外部チャンバー10のフレームに固定されている。また、下部熱盤40は、その上面が上部熱盤20の下面と対向するように配置されている。下部熱盤40は下面において油圧シリンダ50のラム52に固定されていて、油圧シリンダ50への作動油の給排に応じて、ラム52と共に上下動する。 The upper heating plate 20 is fixed to the frame of the external chamber 10 with the lower surface horizontal. Further, the lower heating plate 40 is arranged so that the upper surface thereof faces the lower surface of the upper heating plate 20. The lower heating plate 40 is fixed to the ram 52 of the hydraulic cylinder 50 on the lower surface, and moves up and down together with the ram 52 in accordance with the supply and discharge of hydraulic oil to and from the hydraulic cylinder 50.
 また、上部熱盤20と下部熱盤40には、それぞれ電熱ヒータ(不図示)と温度センサ(不図示)が設けられていて、上部熱盤20と下部熱盤40の温度は制御部2によって制御される。また、上部熱盤20の下面と下部熱盤40の上面には、例えば、熱エネルギーを使用して、被加工物Wに含まれる樹脂が強い吸収を有する遠赤外線を高効率で発生する遠赤外線放射材料の層(例えば膜や板)が設けられていて、被加工物Wを効率的に加熱できるようになっている。すなわち、上部熱盤20及び下部熱盤40は、被加工物Wを加熱する加熱装置として機能する。 The upper heating plate 20 and the lower heating plate 40 are provided with an electric heater (not shown) and a temperature sensor (not shown), respectively, and the temperature of the upper heating plate 20 and the lower heating plate 40 is controlled by the control unit 2. Be controlled. Further, on the lower surface of the upper heating platen 20 and the upper surface of the lower heating platen 40, for example, far-infrared rays that generate high-efficiency far-infrared rays with strong absorption by the resin contained in the workpiece W using thermal energy. A layer (for example, a film or a plate) of the radiating material is provided so that the workpiece W can be efficiently heated. That is, the upper heating platen 20 and the lower heating platen 40 function as a heating device that heats the workpiece W.
 上部熱盤20の下面には、上部チャンバーユニット20Uが取り付けられている。上部チャンバーユニット20Uは、上部ダイヤフラム固定枠21U、上部ダイヤフラム22U及び上部ダイヤフラム保護板23Uを備えている。 The upper chamber unit 20U is attached to the lower surface of the upper heating platen 20. The upper chamber unit 20U includes an upper diaphragm fixing frame 21U, an upper diaphragm 22U, and an upper diaphragm protection plate 23U.
 上部ダイヤフラム22Uは、例えばシリコーンゴム等のエントロピー弾性を有するエラストマーから形成された伸縮性の高いシート材(弾性膜)である。 The upper diaphragm 22U is a highly stretchable sheet material (elastic film) formed of an elastomer having entropy elasticity such as silicone rubber.
 上部ダイヤフラム固定枠21Uは、中心軸を鉛直方向に向けて配置された略円筒状の部材であり、その上端が上部熱盤20の下面に気密に密着した状態で接合されている。この接合には、溶接、接着、シール材を介した圧接などの様々な方法を使用することができる。なお、上部ダイヤフラム固定枠21Uは、上部熱盤20に近づくほど肉厚が厚くなるように、内周面が円錐台側面状のテーパ面となっている。上部ダイヤフラム固定枠21Uの中空部は、その下端において、上部ダイヤフラム22Uによって気密に塞がれている。これにより、上部熱盤20、上部ダイヤフラム固定枠21U及び上部ダイヤフラム22Uによって気密に囲まれた上部チャンバー24Uが形成されている。また、本実施形態の上部熱盤20には、その下面と側面とを連絡する(すなわち、上部チャンバー24Uと外部チャンバー10とを連絡する)通気孔20aが設けられているため、上部チャンバー24Uと外部チャンバー10の内圧は略同じ大きさとなる。 The upper diaphragm fixing frame 21U is a substantially cylindrical member disposed with its central axis oriented in the vertical direction, and its upper end is joined in a state of being in airtight contact with the lower surface of the upper heating platen 20. For this joining, various methods such as welding, adhesion, and pressure welding via a sealing material can be used. The upper diaphragm fixing frame 21U has a tapered surface with a frustoconical side surface so that its thickness increases as it approaches the upper heating platen 20. The hollow portion of the upper diaphragm fixing frame 21U is airtightly closed at the lower end by the upper diaphragm 22U. Thus, an upper chamber 24U that is airtightly surrounded by the upper heating platen 20, the upper diaphragm fixing frame 21U, and the upper diaphragm 22U is formed. Further, since the upper heating plate 20 of the present embodiment is provided with a vent hole 20a that communicates the lower surface and the side surface thereof (that is, communicates the upper chamber 24U and the external chamber 10), The internal pressure of the external chamber 10 is approximately the same.
 上部ダイヤフラム固定枠21Uの中空部(上部チャンバー24U)は、上部ダイヤフラム固定枠21Uの下面と(すなわち上部ダイヤフラム22Uと)平行に配置された平板である上部ダイヤフラム保護板23Uによって仕切られている。上部ダイヤフラム保護板23Uには、その両側の空間に気圧差が生じないようにするため、例えばパンチングプレートや多孔質板等の通気性を有する板材が使用される。 The hollow portion (upper chamber 24U) of the upper diaphragm fixing frame 21U is partitioned by an upper diaphragm protection plate 23U, which is a flat plate arranged in parallel with the lower surface of the upper diaphragm fixing frame 21U (that is, with the upper diaphragm 22U). For the upper diaphragm protection plate 23U, a plate material having air permeability, such as a punching plate or a porous plate, is used in order to prevent a pressure difference between the spaces on both sides thereof.
 下部熱盤40の上面には、上部チャンバーユニット20Uと同様に構成された下部チャンバーユニット40Lが、上部チャンバーユニット20Uとは上下逆向きに取り付けられている。すなわち、下部チャンバーユニット40Lは、下端が下部熱盤40の上面に気密に密着した状態で接合された下部ダイヤフラム固定枠41Lと、下部ダイヤフラム固定枠41Lの中空部を気密に塞ぐように下部ダイヤフラム固定枠41Lの上端に取り付けられた下部ダイヤフラム42Lと、下部ダイヤフラム固定枠41Lの内周面に中空部を上下に仕切るように取り付けられた下部ダイヤフラム成形板43Lとを備えている。下部ダイヤフラム成形板43Lは、上部ダイヤフラム保護板23Uと同様の通気性を有する板材である。また、下部チャンバーユニット40L内には、下部熱盤40、下部ダイヤフラム固定枠41L及び下部ダイヤフラム42Lにより気密に囲まれた下部チャンバー44Lが形成されている。 On the upper surface of the lower heating platen 40, a lower chamber unit 40L configured in the same manner as the upper chamber unit 20U is attached upside down with respect to the upper chamber unit 20U. That is, the lower chamber unit 40L includes a lower diaphragm fixing frame 41L joined in a state where the lower end is in airtight contact with the upper surface of the lower heating plate 40, and a lower diaphragm fixing so as to airtightly close a hollow portion of the lower diaphragm fixing frame 41L. A lower diaphragm 42L attached to the upper end of the frame 41L, and a lower diaphragm molding plate 43L attached to the inner peripheral surface of the lower diaphragm fixing frame 41L so as to partition the hollow portion vertically. The lower diaphragm molding plate 43L is a plate material having air permeability similar to that of the upper diaphragm protection plate 23U. In the lower chamber unit 40L, a lower chamber 44L is formed that is airtightly surrounded by the lower heating plate 40, the lower diaphragm fixing frame 41L, and the lower diaphragm 42L.
 また、下部熱盤40には、その上面と側面とを連絡する通気孔40aが設けられている。通気孔40aの一端には3ポート電磁弁47の1ポートが接続されている。3ポート電磁弁47の別の1ポートは下部チャンバー給排気管路3cを介して気圧制御装置3に接続され、残りの1ポートは外部チャンバー10内に開放されている。3ポート電磁弁47は、制御部2によって制御され、下部チャンバー44Lと外部チャンバー10とを接続する状態(開放状態)と、下部チャンバー44Lと気圧制御装置3とを接続する状態(圧力制御状態)とを切り替える。 Further, the lower heating plate 40 is provided with a vent hole 40a that communicates the upper surface and the side surface thereof. One port of a three-port solenoid valve 47 is connected to one end of the vent hole 40a. Another port of the three-port solenoid valve 47 is connected to the atmospheric pressure control device 3 via the lower chamber supply / exhaust pipe 3c, and the remaining one port is opened in the external chamber 10. The 3-port solenoid valve 47 is controlled by the control unit 2 and is in a state in which the lower chamber 44L and the external chamber 10 are connected (open state) and in a state in which the lower chamber 44L and the atmospheric pressure control device 3 are connected (pressure control state). And switch.
 また、下部チャンバーユニット40Lの上面には、下部ダイヤフラム固定枠41Lと略同じ外径を有する円環状の真空枠60が気密に取り付けられている。下部熱盤40を上昇させて、上部チャンバーユニット20Uの下面に真空枠60の上面を密着させると、上部ダイヤフラム22U、下部ダイヤフラム42L及び真空枠60によって気密に囲まれた主チャンバー26(図4(b))が形成される。上部チャンバー24U及び下部チャンバー44Lの内圧と主チャンバー26の内圧との間に気圧差が生じると、上部ダイヤフラム22U及び下部ダイヤフラム42Lは、それぞれが面するチャンバーのうち、気圧が低いチャンバー側に膨張する。 Further, an annular vacuum frame 60 having substantially the same outer diameter as the lower diaphragm fixing frame 41L is airtightly attached to the upper surface of the lower chamber unit 40L. When the lower heating platen 40 is raised and the upper surface of the vacuum frame 60 is brought into close contact with the lower surface of the upper chamber unit 20U, the main chamber 26 (FIG. 4 (FIG. 4 (FIG. 4 (A))) is surrounded by the upper diaphragm 22U, the lower diaphragm 42L, b)) is formed. When an atmospheric pressure difference is generated between the internal pressure of the upper chamber 24U and the lower chamber 44L and the internal pressure of the main chamber 26, the upper diaphragm 22U and the lower diaphragm 42L expand to the lower pressure side of the chambers facing each other. .
 図3(a)は、真空枠60の一部を拡大した平面図であり、図3(b)は、図3(a)のB-B矢視図である。図3(b)に示されるように、真空枠60の上下面の内周側には、下部ダイヤフラム42L及び上部ダイヤフラム22Uが主チャンバー26側に膨張した際に、真空枠60の角に沿って小さな曲率半径で折り曲げられて劣化や損傷が生じないように、テーパ面(又は曲面)60aが形成されている。 3A is an enlarged plan view of a part of the vacuum frame 60, and FIG. 3B is a view taken along the line BB in FIG. 3A. As shown in FIG. 3B, on the inner peripheral side of the upper and lower surfaces of the vacuum frame 60, when the lower diaphragm 42L and the upper diaphragm 22U are expanded to the main chamber 26 side, along the corners of the vacuum frame 60. A tapered surface (or curved surface) 60a is formed so that it is not bent or deteriorated with a small radius of curvature.
 真空枠60は、それぞれ円環状の上部材62、下部材64及びOリング66を備えている。上部材62と下部材64は上下に重ね合わされ、その接合部がOリング66によって気密に封止されている。真空枠60内には、延長方向に全周に亘って延びる環状の中空部60b(環状部)が形成されている。また、中空部60bよりも内周側において、上部材62と下部材64とは近接して対向し、両者の間に、中空部60bと主チャンバー26とを連絡する通気スリット60cが形成されている。通気スリット60cは、真空枠60の全周に亘って広がり、真空枠60の内周面に開口するスリット状の通気路である。 The vacuum frame 60 includes an annular upper member 62, a lower member 64, and an O-ring 66, respectively. The upper member 62 and the lower member 64 are stacked one above the other, and the joint is hermetically sealed by an O-ring 66. In the vacuum frame 60, an annular hollow portion 60b (annular portion) extending in the extending direction over the entire circumference is formed. Further, on the inner peripheral side of the hollow portion 60b, the upper member 62 and the lower member 64 are closely opposed to each other, and a ventilation slit 60c that connects the hollow portion 60b and the main chamber 26 is formed therebetween. Yes. The ventilation slit 60 c is a slit-shaped ventilation path that extends over the entire circumference of the vacuum frame 60 and opens on the inner peripheral surface of the vacuum frame 60.
 また、真空枠60の外周側には、中空部60bと外部チャンバー10とを連絡する通気孔60dが形成されている。通気孔60dは、一端側(真空枠60の外周面側)において拡径されてテーパねじ60eが形成されている。テーパねじ60eには気圧制御装置3からの主チャンバー給排気管路3b(図1)が接続され、気圧制御装置3によって真空枠60を介して主チャンバー26内にエア(空気又は乾燥窒素等の不活性ガス)を給排可能になっている。 Further, on the outer peripheral side of the vacuum frame 60, a vent hole 60d that connects the hollow portion 60b and the external chamber 10 is formed. The vent hole 60d is enlarged in diameter on one end side (the outer peripheral surface side of the vacuum frame 60) to form a taper screw 60e. A main chamber supply / exhaust line 3b (FIG. 1) from the atmospheric pressure control device 3 is connected to the taper screw 60e, and air (air or dry nitrogen or the like) enters the main chamber 26 through the vacuum frame 60 by the atmospheric pressure control device 3. Inert gas) can be supplied and discharged.
 通気スリット60cは、通気スリット60cを介して主チャンバー26にエアを給排する際の圧力損失が全周で略均一になるように、断面寸法が全周に亘って一定に形成されている。また、主チャンバー26内へのエアの給排は、断面積が大きく圧力損失が小さい中空部60bと、断面積が小さく圧力損失が大きい通気スリット60cとを介して行われる。そのため、主チャンバー26へのエアの給排は、通気スリット60cの全周から略均一且つ緩やかに行われる。 The ventilation slit 60c has a constant cross-sectional dimension over the entire circumference so that the pressure loss when supplying and discharging air to the main chamber 26 through the ventilation slit 60c is substantially uniform over the entire circumference. The supply and discharge of air into the main chamber 26 is performed through a hollow portion 60b having a large cross-sectional area and a small pressure loss, and a ventilation slit 60c having a small cross-sectional area and a large pressure loss. Therefore, the supply and discharge of air to and from the main chamber 26 is performed substantially uniformly and gently from the entire circumference of the ventilation slit 60c.
 次に、本発明の第1実施形態に係るラミネート装置1による被加工物Wのラミネート加工の手順について、図4を参照しながら説明する。 Next, a procedure for laminating the workpiece W by the laminating apparatus 1 according to the first embodiment of the present invention will be described with reference to FIG.
 まず、図4(a)に示されるように、油圧シリンダ50(図1)を駆動して下部熱盤40を降下させ、上部チャンバーユニット20Uと真空枠60とが離れた状態にする。このとき、気圧制御装置3に設けられた、真空枠60の通気孔60d(図3)に接続される主チャンバー給排気管路3bの電磁弁37(図1)は閉じられていて、真空枠60に対する給排気は停止されている。また、3ポート電磁弁47は、下部チャンバー44Lを外部チャンバー10(図1)に接続する(開放状態)。そして、下部ダイヤフラム42Lの上に被加工物Wを載せた後、気圧制御装置3により外部チャンバー10を真空引きする。このとき、通気孔20a及び40aによりそれぞれ外部チャンバー10と連通した上部チャンバー24U及び下部チャンバー44Lも真空引きされる。 First, as shown in FIG. 4 (a), the hydraulic cylinder 50 (FIG. 1) is driven to lower the lower heating plate 40 so that the upper chamber unit 20U and the vacuum frame 60 are separated. At this time, the solenoid valve 37 (FIG. 1) of the main chamber supply / exhaust pipe line 3b connected to the vent hole 60d (FIG. 3) of the vacuum frame 60 provided in the atmospheric pressure control device 3 is closed. Supply / exhaust to 60 is stopped. The 3-port solenoid valve 47 connects the lower chamber 44L to the external chamber 10 (FIG. 1) (open state). Then, after placing the workpiece W on the lower diaphragm 42L, the external chamber 10 is evacuated by the atmospheric pressure control device 3. At this time, the upper chamber 24U and the lower chamber 44L communicating with the external chamber 10 through the vent holes 20a and 40a are also evacuated.
 次に、図4(b)に示されるように、油圧シリンダ50(図1)を駆動して下部熱盤40を上昇させて、上部チャンバーユニット20Uと真空枠60とを密着させ、主チャンバー26を形成する。このとき、外部チャンバー10(図1)、上部チャンバー24U、主チャンバー26及び下部チャンバー44Lは、いずれも真空となっている。 Next, as shown in FIG. 4B, the hydraulic cylinder 50 (FIG. 1) is driven to raise the lower heating platen 40 so that the upper chamber unit 20U and the vacuum frame 60 are brought into close contact with each other. Form. At this time, the outer chamber 10 (FIG. 1), the upper chamber 24U, the main chamber 26, and the lower chamber 44L are all in a vacuum.
 次に、気圧制御装置3により、外部チャンバー10内にエアを導入して、外部チャンバー10内の気圧を大気圧(約100kPa)にまで徐々に昇圧させる。このとき、外部チャンバー10と連通した上部チャンバー24U及び下部チャンバー44Lの気圧も大気圧まで上昇するが、密閉された主チャンバー26内は真空状態に維持される。そのため、上部チャンバー24U及び下部チャンバー44Lと主チャンバー26との気圧差により、上部ダイヤフラム22U及び下部ダイヤフラム42Lが主チャンバー26側へ膨張する。その結果、図4(c)に示されるように、被加工物Wが、上部ダイヤフラム22Uと下部ダイヤフラム42Lとで挟まれて、上部チャンバー24U及び下部チャンバー44Lと主チャンバー26との気圧差によりプレスされる。そして、この状態を所定時間維持すると、上部熱盤20及び下部熱盤40からの輻射熱により被加工物Wが加工温度(熱硬化性樹脂を使用する場合は樹脂の硬化温度、熱可塑性樹脂を使用する場合には樹脂のガラス転移点以上の温度)に加熱され、被加工物Wに含まれる樹脂(例えば、エポキシ樹脂等の熱硬化性樹脂や、エチレン酢酸ビニル共重合体樹脂(EVA)等の熱可塑性樹脂)が軟化して(熱硬化性樹脂の場合には、更に硬化して)、被加工物Wを構成する各部材が一体に接合される。 Next, air is introduced into the external chamber 10 by the atmospheric pressure control device 3, and the atmospheric pressure in the external chamber 10 is gradually increased to atmospheric pressure (about 100 kPa). At this time, the pressure in the upper chamber 24U and the lower chamber 44L communicating with the external chamber 10 also rises to atmospheric pressure, but the sealed main chamber 26 is maintained in a vacuum state. Therefore, the upper diaphragm 22U and the lower diaphragm 42L expand to the main chamber 26 side due to the pressure difference between the upper chamber 24U and the lower chamber 44L and the main chamber 26. As a result, as shown in FIG. 4C, the workpiece W is sandwiched between the upper diaphragm 22U and the lower diaphragm 42L, and pressed by the pressure difference between the upper chamber 24U, the lower chamber 44L, and the main chamber 26. Is done. Then, if this state is maintained for a predetermined time, the workpiece W is processed by the radiant heat from the upper heating plate 20 and the lower heating plate 40 (when the thermosetting resin is used, the curing temperature of the resin, the thermoplastic resin is used). If the resin is heated to a temperature equal to or higher than the glass transition point of the resin, the resin contained in the workpiece W (for example, a thermosetting resin such as an epoxy resin or an ethylene vinyl acetate copolymer resin (EVA)) is used. The thermoplastic resin) is softened (and further cured in the case of a thermosetting resin), and the members constituting the workpiece W are joined together.
 また、プレス処理中に被加工物Wからガスが発生する場合には、気圧制御装置3により、真空枠60に接続された主チャンバー給排気管路3bを介して、プレス処理中に主チャンバー26を真空引きすることもできる。これにより、プレス処理中に被加工物Wから発生するガスを主チャンバー26から強制的に排出することができ、ガスの発生による被加工物Wの接合不良やダイヤフラムの劣化等を防止することができる。 When gas is generated from the workpiece W during the pressing process, the main chamber 26 is pressed during the pressing process by the atmospheric pressure control device 3 via the main chamber supply / exhaust pipe line 3b connected to the vacuum frame 60. Can be evacuated. As a result, the gas generated from the workpiece W during the press process can be forcibly discharged from the main chamber 26, and the bonding failure of the workpiece W and the deterioration of the diaphragm due to the generation of the gas can be prevented. it can.
 被加工物Wの接合(プレス工程)が完了すると、次に、キュア工程が行われる。キュア工程は、接合後の被加工物Wを樹脂の硬化温度(熱可塑性樹脂の場合にはガラス転移点以上の温度)に保温することで、被加工物Wを安定化させる処理である。本実施形態では、キュア工程は、非真空下(すなわち、空気中又は不活性ガス中)で行われる。なお、ここでは、0.1気圧以上を非真空という。図4(d)に示されるように、本実施形態のキュア工程では、気圧制御装置3(図1)によって、大気圧よりも高い圧力P1の圧縮エアが主チャンバー26内に導入される。また、このとき、3ポート電磁弁47が、下部チャンバー44Lと気圧制御装置3とを接続する状態(圧力制御状態)に切り替えられ、下部チャンバー44Lには、気圧制御装置3によって、圧力P1以下の圧力P2のエアが主チャンバー26内に導入される。 When the joining (pressing process) of the workpieces W is completed, a curing process is then performed. The curing process is a process of stabilizing the workpiece W by keeping the workpiece W after bonding at the curing temperature of the resin (in the case of a thermoplastic resin, a temperature equal to or higher than the glass transition point). In the present embodiment, the curing step is performed under non-vacuum (that is, in air or inert gas). Here, 0.1 atmosphere or more is referred to as non-vacuum. As shown in FIG. 4D, in the curing process of the present embodiment, compressed air having a pressure P1 higher than the atmospheric pressure is introduced into the main chamber 26 by the atmospheric pressure control device 3 (FIG. 1). At this time, the three-port solenoid valve 47 is switched to a state (pressure control state) in which the lower chamber 44L and the atmospheric pressure control device 3 are connected, and the lower chamber 44L is brought into the lower pressure P1 by the atmospheric pressure control device 3. Air having a pressure P2 is introduced into the main chamber 26.
 このとき、上部チャンバー24Uの内圧と主チャンバー26の内圧との差が大きいため、上部ダイヤフラム22Uは上部チャンバー24U側に大きく膨張して、上部ダイヤフラム保護板23Uに密着して平らになる。上部ダイヤフラム保護板23Uは、上部ダイヤフラム22Uが高温に加熱された上部熱盤20に接触して劣化又は熱損傷するのを防止する。また、上部ダイヤフラム保護板23Uは上部熱盤20の下面と平行に近接して配置されているため、上部ダイヤフラム22Uは上部ダイヤフラム保護板23Uに密着したときに、上部熱盤20からの輻射熱によって均一且つ効率的に適温に加熱される。プレス成形前に上部ダイヤフラム保護板23Uを上部ダイヤフラム保護板23Uに密着させた状態に保持して、上部ダイヤフラム保護板23Uを予熱することもできる。また、下部ダイヤフラム成形板43Lも、上述した上部ダイヤフラム保護板23Uと同じ作用効果を有する。 At this time, since the difference between the internal pressure of the upper chamber 24U and the internal pressure of the main chamber 26 is large, the upper diaphragm 22U expands greatly toward the upper chamber 24U, and comes into close contact with the upper diaphragm protection plate 23U and becomes flat. The upper diaphragm protection plate 23U prevents the upper diaphragm 22U from coming into contact with the upper heating plate 20 heated to a high temperature and being deteriorated or thermally damaged. Further, since the upper diaphragm protection plate 23U is disposed in parallel and close to the lower surface of the upper heating platen 20, when the upper diaphragm 22U is in close contact with the upper diaphragm protection plate 23U, it is uniform due to the radiant heat from the upper heating platen 20. And it is efficiently heated to an appropriate temperature. The upper diaphragm protection plate 23U can be preheated by holding the upper diaphragm protection plate 23U in close contact with the upper diaphragm protection plate 23U before press molding. Also, the lower diaphragm molding plate 43L has the same function and effect as the above-described upper diaphragm protection plate 23U.
 一方、下部ダイヤフラム42Lは、下部チャンバー44Lの内圧P2と主チャンバー26の内圧P1との差が比較的に小さいため、下部ダイヤフラム成形板43Lには接触せず、内圧差に応じて下部チャンバー44L側に膨張する。本実施形態では、下部ダイヤフラム42Lの上に被加工物Wを載せた状態で、下部ダイヤフラム42Lが被加工物Wの下面に沿って湾曲するような内圧差を予め計算により又は実験的に求めて、求められた内圧差が下部ダイヤフラム42Lに加わるよう、気圧制御装置3が下部チャンバー44Lの内圧P2を制御する。これにより、被加工物Wは、その下面の略全体が、同じ曲率に膨張した下部ダイヤフラム42Lによって、略均一な圧力で支持されるため、被加工物Wに加わる歪みの少ない状態でキュア処理が行われる。その結果、残留応力が少なく、信頼性の高い製品(被加工物W)が得られる。 On the other hand, since the difference between the internal pressure P2 of the lower chamber 44L and the internal pressure P1 of the main chamber 26 is relatively small, the lower diaphragm 42L does not contact the lower diaphragm molding plate 43L, and the lower diaphragm 42L side according to the internal pressure difference. Inflates. In the present embodiment, an internal pressure difference that causes the lower diaphragm 42L to bend along the lower surface of the workpiece W in a state where the workpiece W is placed on the lower diaphragm 42L is obtained in advance by calculation or experimentally. The atmospheric pressure control device 3 controls the internal pressure P2 of the lower chamber 44L so that the obtained internal pressure difference is applied to the lower diaphragm 42L. As a result, the workpiece W is supported at a substantially uniform pressure by the lower diaphragm 42L expanded at the same curvature, so that the entire surface of the workpiece W can be cured with less distortion applied to the workpiece W. Done. As a result, a highly reliable product (workpiece W) with little residual stress is obtained.
 また、図4(e)に示されるように、被加工物Wが平坦な底面を有する場合には、下部チャンバー44Lが外部チャンバー10に開放されるように3ポート電磁弁47を切り替え(開放状態)、下部チャンバー44Lと主チャンバー26との内圧差を大きくする。その結果、下部ダイヤフラム42Lは、下部チャンバー44L側に大きく膨張して、下部ダイヤフラム成形板43Lに密着して平らになる。これにより、被加工物Wは、平坦な下部ダイヤフラム42Lによって均一な圧力で支持されるため、歪みの少ない状態でキュア処理が行われて、その結果、残留応力が少なく、信頼性の高い製品(被加工物W)が得られる。 Further, as shown in FIG. 4E, when the workpiece W has a flat bottom surface, the three-port solenoid valve 47 is switched so that the lower chamber 44L is opened to the external chamber 10 (open state). ) Increase the internal pressure difference between the lower chamber 44L and the main chamber 26. As a result, the lower diaphragm 42L greatly expands toward the lower chamber 44L and comes into close contact with the lower diaphragm molding plate 43L and becomes flat. As a result, the workpiece W is supported by the flat lower diaphragm 42L at a uniform pressure, so that the curing process is performed with little distortion, and as a result, there is little residual stress and a highly reliable product ( A workpiece W) is obtained.
(第2実施形態)
 次に、本発明の第2実施形態に係るラミネート装置100について説明する。図5は、ラミネート装置100の正面透視図である。なお、以下の説明においては、上記の第1実施形態と同一又は類似の構成要素に対して同一又は類似の符号を用い、重複する事項について説明を省略する。
(Second Embodiment)
Next, the laminating apparatus 100 according to the second embodiment of the present invention will be described. FIG. 5 is a front perspective view of the laminating apparatus 100. In the following description, the same or similar reference numerals are used for the same or similar components as those in the first embodiment, and the description of overlapping items is omitted.
 上述した第1実施形態は単段のラミネート装置に本発明を適用した例であるが、第2実施形態は、上部熱盤120と下部熱盤140との間に一つ以上の中間熱盤130を設けた多段ラミネート装置への本発明を適用した例である。本実施形態のラミネート装置100は1つの中間熱盤130を備えているが、上部熱盤120と下部熱盤140との間に2つ以上の中間熱盤130が上下に並べて配置された構成とすることもできる。 The first embodiment described above is an example in which the present invention is applied to a single-stage laminating apparatus, but the second embodiment is one or more intermediate hot plates 130 between the upper hot platen 120 and the lower hot platen 140. This is an example in which the present invention is applied to a multi-stage laminating apparatus provided with. The laminating apparatus 100 according to the present embodiment includes one intermediate heating platen 130, but has a configuration in which two or more intermediate heating plates 130 are arranged side by side between the upper heating platen 120 and the lower heating platen 140. You can also
 中間熱盤130の上面及び下面には、下部チャンバーユニット130L及び上部チャンバーユニット130Uがそれぞれ取り付けられている。上部チャンバーユニット130Uは上部熱盤120の下面に取り付けられた上部チャンバーユニット120U(第1実施形態における上部チャンバーユニット20Uに相当)と同じものであり、下部チャンバーユニット130Lは下部熱盤140の上面に取り付けられた下部チャンバーユニット140L(第1実施形態における下部チャンバーユニット40Lに相当)と同じものである。 A lower chamber unit 130L and an upper chamber unit 130U are respectively attached to the upper surface and the lower surface of the intermediate heating platen 130. The upper chamber unit 130U is the same as the upper chamber unit 120U (corresponding to the upper chamber unit 20U in the first embodiment) attached to the lower surface of the upper heating platen 120, and the lower chamber unit 130L is disposed on the upper surface of the lower heating platen 140. This is the same as the attached lower chamber unit 140L (corresponding to the lower chamber unit 40L in the first embodiment).
 上述した第1実施形態では、ラミネート装置1の本体1a全体を外部チャンバー10内に収容し、外部チャンバー10を介して各チャンバー(上部チャンバー24U、下部チャンバー44L)の内圧を制御する構成が採用されているが、第2実施形態では、外部チャンバー10を設けず、各チャンバーユニット(上部チャンバーユニット120U、130U、下部チャンバーユニット130L、140L)を気圧制御装置103に直接接続して、気圧制御装置103によって各チャンバーユニットの内圧を個別に制御する構成が採用されている。この構成では、容積の大きな外部チャンバー10全体を真空引きする必要が無いため、真空引きの所要時間が大幅に削減され、全工程時間を短縮することができる。 In the first embodiment described above, a configuration in which the entire main body 1a of the laminating apparatus 1 is accommodated in the external chamber 10 and the internal pressure of each chamber (the upper chamber 24U and the lower chamber 44L) is controlled via the external chamber 10 is adopted. However, in the second embodiment, the external chamber 10 is not provided, and each chamber unit ( upper chamber units 120U, 130U, lower chamber units 130L, 140L) is directly connected to the atmospheric pressure control device 103, and the atmospheric pressure control device 103 is connected. Is used to individually control the internal pressure of each chamber unit. In this configuration, since it is not necessary to evacuate the entire external chamber 10 having a large volume, the time required for evacuation is greatly reduced, and the entire process time can be shortened.
 また、本実施形態では、真空枠60A、60Bが上部チャンバーユニット20U、30Uに取り付けられているため、被加工物Wを載せる下部チャンバーユニット130L、140Lの上面が完全に平坦になり、ラミネート装置100への被加工物Wの搬入/搬出を容易に行うことができる。 In the present embodiment, since the vacuum frames 60A and 60B are attached to the upper chamber units 20U and 30U, the upper surfaces of the lower chamber units 130L and 140L on which the workpiece W is placed become completely flat, and the laminating apparatus 100 It is possible to easily carry in / out the workpiece W to / from.
 ラミネート装置100の上部熱盤120及び中間熱盤130には、左右側面からそれぞれ突出する一対の受け板120b及び130bが取り付けられている。また、ラミネート装置100のフレーム110には、幅方向(図5における左右方向)に対向して配置された二対の熱盤支持機構112(手前側の一対のみが図示されている)が取り付けられている。熱盤支持機構112は、ラミネート装置100に加工前の被加工物Wを搬入し、又は、ラミネート装置100から加工後の被加工物(製品)Wを搬出する際に、上下のチャンバーユニットの間隔をあけるために、搬送する被加工物Wの直上の熱盤を所定の高さに保持する機構である。 A pair of receiving plates 120b and 130b protruding from the left and right side surfaces are attached to the upper heating plate 120 and the intermediate heating plate 130 of the laminating apparatus 100, respectively. The frame 110 of the laminating apparatus 100 is attached with two pairs of hot platen support mechanisms 112 (only a pair on the front side is shown) arranged to face each other in the width direction (left-right direction in FIG. 5). ing. The hot platen support mechanism 112 carries the unprocessed workpiece W into the laminating apparatus 100 or the unprocessed workpiece (product) W from the laminating apparatus 100 when the upper and lower chamber units are spaced apart. This is a mechanism for holding the hot platen immediately above the workpiece W to be conveyed at a predetermined height.
 熱盤支持機構112は、幅方向に往復移動可能な可動ピン112aを備えている。熱盤支持機構112は制御部102に接続されていて、制御部102によって可動ピン112aの駆動が制御される。熱盤支持機構112は、可動ピン112aが退避(本体100aの幅方向外側に移動)した状態では、上部熱盤120及び中間熱盤130の上下動を妨げず、可動ピン112aが突出(本体100aの幅方向内側に移動)した状態にすると、上部熱盤120の受け板120b又は中間熱盤130の受け板130bと当接するように配置されている。 The hot platen support mechanism 112 includes a movable pin 112a that can reciprocate in the width direction. The hot platen support mechanism 112 is connected to the control unit 102, and the drive of the movable pin 112 a is controlled by the control unit 102. When the movable pin 112a is retracted (moved outward in the width direction of the main body 100a), the hot plate support mechanism 112 does not disturb the vertical movement of the upper heat plate 120 and the intermediate heat plate 130, and the movable pin 112a protrudes (the main body 100a In this state, the plate is disposed so as to contact the receiving plate 120b of the upper heating plate 120 or the receiving plate 130b of the intermediate heating plate 130.
 次に、ラミネート装置100に被加工物Wを搬出/搬入する際のラミネート装置100の動作を説明する。ラミネート加工(プレス加工)中は、各熱盤支持機構112の可動ピン112aは退避し、下部熱盤140の上に中間熱盤130が載置され、中間熱盤130の上に上部熱盤120が載置された状態となる。この状態で油圧シリンダ150を駆動して下部熱盤140を上下に移動させると、下部熱盤140の上に積み重ねられた中間熱盤130及び上部熱盤120が下部熱盤140と共に上下動する。 Next, the operation of the laminating apparatus 100 when the workpiece W is carried out / into the laminating apparatus 100 will be described. During laminating (pressing), the movable pin 112 a of each hot platen support mechanism 112 is retracted, the intermediate hot platen 130 is placed on the lower hot platen 140, and the upper hot platen 120 is placed on the intermediate hot platen 130. Will be placed. In this state, when the hydraulic cylinder 150 is driven to move the lower heating plate 140 up and down, the intermediate heating plate 130 and the upper heating plate 120 stacked on the lower heating plate 140 move up and down together with the lower heating plate 140.
 上部熱盤120と中間熱盤130との間に被加工物Wを搬出/搬入する際には、上部熱盤120の受け板120bの位置が各熱盤支持機構112の可動ピン112aよりも少し高くなるまで油圧シリンダ150を駆動して下部熱盤140を上昇させる。次に、各熱盤支持機構112の可動ピン112aを上部熱盤120側に突出させる。その状態で、油圧シリンダ150を駆動して下部熱盤140を降下させると、上部熱盤120の受け板120bの下面が各熱盤支持機構112の可動ピン112aと当接し、上部熱盤120は二対の可動ピン112aの上に載置される。更に下部熱盤140を降下させると、中間熱盤130は下部熱盤140と共に降下するが、上部熱盤120は二対の可動ピン112aによって支持されて、それ以上降下しないため、中間熱盤130が上部熱盤120から離れる。そして、上部熱盤120と中間熱盤130との間隔が被加工物Wの搬出/搬入に十分な大きさに達すると、油圧シリンダ150の駆動を停止する。 When the work W is carried out / in between the upper heating platen 120 and the intermediate heating platen 130, the position of the receiving plate 120b of the upper heating platen 120 is slightly smaller than the movable pin 112a of each heating platen support mechanism 112. The hydraulic cylinder 150 is driven to raise the lower heating platen 140 until it becomes higher. Next, the movable pin 112a of each hot platen support mechanism 112 is projected to the upper hot platen 120 side. In this state, when the hydraulic cylinder 150 is driven to lower the lower heating platen 140, the lower surface of the receiving plate 120b of the upper heating platen 120 comes into contact with the movable pin 112a of each heating platen support mechanism 112, and the upper heating platen 120 It is mounted on the two pairs of movable pins 112a. When the lower heat platen 140 is further lowered, the intermediate heat platen 130 is lowered together with the lower heat platen 140, but the upper heat platen 120 is supported by the two pairs of movable pins 112a and is not lowered any further. Leaves the upper heating platen 120. Then, when the distance between the upper heating platen 120 and the intermediate heating platen reaches a size sufficient to carry out / in the workpiece W, the hydraulic cylinder 150 is stopped.
 続いて、中間熱盤130と下部熱盤140との間に被加工物Wを搬出/搬入する場合には、上部熱盤120が中間熱盤130の上に載置され、受け板120bが各熱盤支持機構112の可動ピン112aから少し浮き上がるようになるまで、油圧シリンダ150を駆動して下部熱盤140を上昇させる。次に、各熱盤支持機構112の可動ピン112aを退避させてから、中間熱盤130の受け板130bの位置が各熱盤支持機構112の可動ピン112aよりも少し高くなるまで油圧シリンダ150を駆動して下部熱盤140を上昇させる。次に、各熱盤支持機構112の可動ピン112aを中間熱盤130側に突出させてから、油圧シリンダ150を駆動して下部熱盤140を降下させると、中間熱盤130の受け板130bの下面が各熱盤支持機構112の可動ピン112aと当接して、中間熱盤130は二対の可動ピン112aの上に載置される。更に下部熱盤140を降下させると、中間熱盤130は二対の可動ピン112aによって支持されて、それ以上降下しないため、下部熱盤140が中間熱盤130から離れる。そして、中間熱盤130と下部熱盤140との間隔が被加工物Wの搬出/搬入に十分な大きさに達すると、油圧シリンダ150の駆動を停止する。そして、被加工物Wの搬出/搬入が終わると、中間熱盤130が下部熱盤140の上に載置され、中間熱盤130の受け板130bが各熱盤支持機構112の可動ピン112aから少し浮き上がるようになるまで、油圧シリンダ150を駆動して下部熱盤140を上昇させてから、各熱盤支持機構112の可動ピン112aを退避させる。 Subsequently, when the workpiece W is carried out / in between the intermediate heating platen 130 and the lower heating platen 140, the upper heating platen 120 is placed on the intermediate heating platen 130, and the receiving plate 120b is connected to each of the receiving plate 120b. The hydraulic cylinder 150 is driven to raise the lower heat platen 140 until it slightly floats from the movable pin 112a of the heat plate support mechanism 112. Next, after retracting the movable pin 112a of each hot platen support mechanism 112, the hydraulic cylinder 150 is moved until the position of the receiving plate 130b of the intermediate hot platen 130 is slightly higher than the movable pin 112a of each hot platen support mechanism 112. Driven to raise the lower heating platen 140. Next, after the movable pin 112a of each hot platen support mechanism 112 is protruded to the intermediate hot platen 130 side and the hydraulic cylinder 150 is driven to lower the lower hot platen 140, the receiving plate 130b of the intermediate hot platen 130 is moved. The lower surface abuts on the movable pin 112a of each hot platen support mechanism 112, and the intermediate hot platen 130 is placed on the two pairs of movable pins 112a. When the lower heat platen 140 is further lowered, the intermediate heat platen 130 is supported by the two pairs of movable pins 112a and is not lowered any further, so that the lower heat platen 140 is separated from the intermediate heat platen 130. Then, when the distance between the intermediate heating platen 130 and the lower heating platen 140 reaches a size sufficient for carrying out / in the workpiece W, the hydraulic cylinder 150 is stopped. When the workpiece W is unloaded / loaded in, the intermediate heating platen 130 is placed on the lower heating platen 140, and the receiving plate 130b of the intermediate heating platen 130 is moved from the movable pin 112a of each heating plate support mechanism 112. The hydraulic cylinder 150 is driven to raise the lower heat platen 140 until it slightly floats, and then the movable pin 112a of each heat plate support mechanism 112 is retracted.
 以上が本発明の実施形態の説明であるが、本発明は、上記の実施形態の構成に限定されるものではなく、その技術的思想の範囲内で様々な変形が可能である。 The above is the description of the embodiment of the present invention. However, the present invention is not limited to the configuration of the above embodiment, and various modifications are possible within the scope of the technical idea.
 上記の各実施形態では、熱盤の加熱に電熱ヒータが使用されているが、他の加熱手段を使用して熱盤を加熱する構成としてもよい。例えば、国際公開第2006/103868号に開示されているような、熱盤に設けられた流路にシリコーンオイル等の熱媒を流すことにより熱盤を均一に加熱する構成を採用することもできる。 In each of the above embodiments, an electric heater is used for heating the hot platen, but the heating plate may be heated using other heating means. For example, as disclosed in International Publication No. 2006/103868, a configuration in which the heating plate is uniformly heated by flowing a heat medium such as silicone oil through a flow path provided in the heating plate can be employed. .
 また、上記の各実施形態では、円筒状に形成された上部(下部)ダイヤフラム固定枠及び真空枠が使われているが、本発明はこの構成に限定されるものではなく、他の形状(例えば多角筒状)の上部(下部)ダイヤフラム固定枠や真空枠を使用することもできる。 In each of the above embodiments, an upper (lower) diaphragm fixing frame and a vacuum frame formed in a cylindrical shape are used. However, the present invention is not limited to this configuration, and other shapes (for example, It is also possible to use an upper (lower) diaphragm fixing frame or a vacuum frame of a polygonal tube shape.
 また、上記の各実施形態では、平板状の下部ダイヤフラム成形板が使用されているが、被加工物Wの下面と同じ形状を有する下部ダイヤフラム成形板を用いることもできる。この場合、キュア処理時には、主チャンバーの内圧を下部チャンバーの内圧よりも十分に高くして、下部ダイヤフラムを下部ダイヤフラム成形板に密着させることで、下部ダイヤフラムを被加工物Wの下面と同じ形状に成形することができる。これにより、被加工物Wは下部ダイヤフラムによって均一な圧力で支持されるため、残留応力が少なく、信頼性の高い製品(被加工物W)を得ることができる。 Further, in each of the above embodiments, a flat plate-shaped lower diaphragm molding plate is used, but a lower diaphragm molding plate having the same shape as the lower surface of the workpiece W can also be used. In this case, during the curing process, the inner pressure of the main chamber is made sufficiently higher than the inner pressure of the lower chamber, and the lower diaphragm is brought into close contact with the lower diaphragm molding plate, so that the lower diaphragm has the same shape as the lower surface of the workpiece W. Can be molded. Thereby, since the workpiece W is supported by the lower diaphragm at a uniform pressure, a product (workpiece W) with less residual stress and high reliability can be obtained.
 1、100…ラミネート装置
 2、102…制御部
 3、103…気圧制御装置
 4、104…油圧制御装置
 20、120…上部熱盤
 30、130…中間熱盤
 40、140…下部熱盤
 50…油圧シリンダ
 W…被加工物(積層体)
DESCRIPTION OF SYMBOLS 1,100 ... Laminating apparatus 2,102 ... Control part 3,103 ... Atmospheric pressure control apparatus 4,104 ... Hydraulic control apparatus 20,120 ... Upper hot platen 30,130 ... Intermediate hot platen 40,140 ... Lower hot platen 50 ... Hydraulic pressure Cylinder W ... Workpiece (laminate)

Claims (34)

  1.  上部空間と主チャンバーとを上下に仕切る弾性膜である上部ダイヤフラムと、
     前記上部ダイヤフラムと対向して配置され、前記主チャンバーと下部空間とを上下に仕切る弾性膜である下部ダイヤフラムと、
     前記主チャンバー内と、前記上部空間及び前記下部空間との気圧差を制御する気圧制御装置と、
     前記主チャンバー内に配置される被加工物を加熱する加熱装置と、
    を備え、
     前記気圧制御装置が、
      前記主チャンバー内の気圧を前記上部空間及び前記下部空間の気圧よりも低くして、前記上部ダイヤフラムと前記下部ダイヤフラムとの間で加熱された前記被加工物をプレスするプレス処理と、
      前記主チャンバー内の気圧を前記下部空間の気圧より大きくして、前記被加工物を非真空下で加熱するキュア処理と、
    を行うように構成されたプレス装置。
    An upper diaphragm, which is an elastic membrane that partitions the upper space and the main chamber vertically;
    A lower diaphragm, which is an elastic film that is disposed opposite to the upper diaphragm and divides the main chamber and the lower space vertically.
    A pressure control device for controlling a pressure difference between the main chamber and the upper space and the lower space;
    A heating device for heating a workpiece disposed in the main chamber;
    With
    The atmospheric pressure control device is
    A press process for pressing the workpiece heated between the upper diaphragm and the lower diaphragm by lowering the pressure in the main chamber below the pressure in the upper space and the lower space;
    A curing process in which the pressure in the main chamber is made larger than the pressure in the lower space, and the workpiece is heated in a non-vacuum;
    A press device configured to perform
  2.  前記気圧制御装置が、前記被加工物の下面が湾曲した凸面である場合に、前記キュア処理において、前記下部ダイヤフラムが前記被加工物の下面に沿って湾曲して前記被加工物を略均一な圧力で支持するように、前記主チャンバー内と前記下部空間との気圧差を制御するように構成された、
    ことを特徴とする請求項1に記載のプレス装置。
    When the atmospheric pressure control device is a convex surface where the lower surface of the workpiece is curved, in the curing process, the lower diaphragm is curved along the lower surface of the workpiece so that the workpiece is substantially uniform. Configured to control the pressure difference between the main chamber and the lower space so as to support with pressure,
    The press apparatus according to claim 1.
  3.  前記下部空間内に前記ダイヤフラムと対向する平坦な上面を有するダイヤフラム成形板を備え、
     前記気圧制御装置が、前記被加工物の下面が平坦面である場合に、前記キュア処理において、前記下部ダイヤフラムが前記ダイヤフラム成形板に密着して平坦に成形されて前記被加工物を略均一な圧力で支持するように、前記主チャンバー内と前記下部空間との気圧差を制御する、
    ことを特徴とする請求項1に記載のプレス装置。
    A diaphragm molding plate having a flat upper surface facing the diaphragm in the lower space;
    When the lower surface of the workpiece is a flat surface, the pressure control device is configured so that, in the curing process, the lower diaphragm is in close contact with the diaphragm forming plate and is formed flat to make the workpiece substantially uniform. Control the pressure difference between the main chamber and the lower space so as to support with pressure,
    The press apparatus according to claim 1.
  4.  前記上部ダイヤフラムを下面に備え、前記上部空間を気密に囲う上部チャンバーユニットと、
     前記下部ダイヤフラムを上面に備え、前記下部空間を気密に囲う下部チャンバーユニットと、
     前記上部チャンバーユニットと前記下部チャンバーユニットの間に配置され、上下に貫通する中空部を有する真空枠と、
     前記上部チャンバーユニット及び前記下部チャンバーユニットの少なくとも一方を上下に駆動する駆動装置と、
    を備え、
     前記駆動装置の駆動により前記上部チャンバーユニットと前記下部チャンバーユニットとで前記真空枠を挟み込むことによって前記主チャンバーが形成される、
    ことを特徴とする請求項1から請求項3のいずれか一項に記載のプレス装置。
    An upper chamber unit that includes the upper diaphragm on a lower surface and hermetically surrounds the upper space;
    A lower chamber unit that includes the lower diaphragm on an upper surface and hermetically surrounds the lower space;
    A vacuum frame disposed between the upper chamber unit and the lower chamber unit and having a hollow portion penetrating vertically;
    A driving device for driving up and down at least one of the upper chamber unit and the lower chamber unit;
    With
    The main chamber is formed by sandwiching the vacuum frame between the upper chamber unit and the lower chamber unit by driving the driving device.
    The press apparatus according to any one of claims 1 to 3, wherein:
  5.  前記加熱装置が、
      前記上部チャンバーユニットが下面に固定された上部熱盤と、
      前記上部熱盤を加熱する上部熱盤加熱手段と、
      前記下部チャンバーユニットが上面に固定された下部熱盤と、
      前記下部熱盤を加熱する下部熱盤加熱手段と、
    を備え、
     前記上部熱盤の下面及び前記下部熱盤の上面に遠赤外線放射材料の層が設けられている、
    ことを特徴とする請求項4に記載のプレス装置。
    The heating device is
    An upper heating plate in which the upper chamber unit is fixed to the lower surface;
    Upper heating platen heating means for heating the upper heating platen;
    A lower heating plate in which the lower chamber unit is fixed to the upper surface;
    A lower heating plate heating means for heating the lower heating plate;
    With
    A layer of far infrared radiation material is provided on the lower surface of the upper heat plate and the upper surface of the lower heat plate,
    The press apparatus according to claim 4.
  6.  前記上部チャンバーユニット及び前記下部チャンバーユニットが、それぞれ上下に貫通する中空部を有するダイヤフラム固定枠を備え、
     前記ダイヤフラム固定枠の各々は、上下方向における一端面が前記上部熱盤の下面又は前記下部熱盤の上面に密着固定され、上下方向における他端面に形成された前記中空部の開口が前記上部ダイヤフラム又は前記下部ダイヤフラムによって気密に塞がれている、
    ことを特徴とする請求項5に記載のプレス装置。
    The upper chamber unit and the lower chamber unit each include a diaphragm fixing frame having a hollow portion penetrating vertically.
    Each of the diaphragm fixing frames has one end surface in the up-down direction closely fixed to the lower surface of the upper heat plate or the upper surface of the lower heat plate, and the opening of the hollow portion formed in the other end surface in the up-down direction is the upper diaphragm Or is hermetically closed by the lower diaphragm,
    The press apparatus according to claim 5.
  7.  前記上部熱盤には、前記上部空間にエアを給排する第1通気孔が形成されていて、
     前記下部熱盤には、前記下部空間にエアを給排する第2通気孔が形成されている、
    ことを特徴とする請求項5又は請求項6に記載のプレス装置。
    The upper heat plate is formed with a first vent hole for supplying and discharging air to the upper space,
    The lower heat plate is formed with a second ventilation hole for supplying and discharging air to the lower space.
    The press apparatus according to claim 5 or 6, characterized by the above.
  8.  前記第1通気孔が前記上部熱盤の下面と側面とを連絡し、
     前記第2通気孔が前記下部熱盤の上面と側面とを連絡する、
    ことを特徴とする請求項7に記載のプレス装置。
    The first vent communicates a lower surface and a side surface of the upper heating plate;
    The second vent communicates an upper surface and a side surface of the lower heating plate;
    The press apparatus according to claim 7.
  9.  前記上部熱盤、前記上部チャンバーユニット、前記真空枠、前記下部チャンバーユニット及び前記下部熱盤を収容し、前記気圧制御装置に接続された外部チャンバーを備え、
     前記第1通気孔及び前記第2通気孔が前記外部チャンバーに開放されていて、
     前記外部チャンバーの気圧を制御することによって、前記上部空間及び前記下部空間の気圧が制御されるように構成されている、
    ことを特徴とする請求項7又は請求項8に記載のプレス装置。
    The upper heating platen, the upper chamber unit, the vacuum frame, the lower chamber unit and the lower heating plate are accommodated, and includes an external chamber connected to the atmospheric pressure control device,
    The first vent hole and the second vent hole are open to the external chamber;
    By controlling the pressure of the external chamber, the pressure of the upper space and the lower space is controlled.
    The press apparatus according to claim 7 or 8, wherein
  10.  前記上部熱盤、前記上部チャンバーユニット、前記真空枠、前記下部チャンバーユニット及び前記下部熱盤を収容し、前記気圧制御装置に接続された外部チャンバーと、
     3ポート切換弁と、を備え、
     前記3ポート切換弁の第1ポートが前記第2通気孔に接続されていて、
     前記3ポート切換弁の第2ポートが前記外部チャンバーに開放されていて、
     前記3ポート切換弁の第3ポートが前記気圧制御装置に接続されていて、
     前記第1ポートと前記第2ポートとが接続されるように前記3ポート切換弁が切り換えられたときに、前記外部チャンバーの気圧を制御することによって、前記下部空間の気圧が制御され、
     前記第1ポートと前記第3ポートとが接続されるように前記3ポート切換弁が切り換えられたときに、前記下部空間の気圧が前記気圧制御装置によって直接制御される、
    ことを特徴とする請求項7又は請求項8に記載のプレス装置。
    An outer chamber connected to the atmospheric pressure control apparatus, containing the upper heating plate, the upper chamber unit, the vacuum frame, the lower chamber unit and the lower heating plate;
    A three-port switching valve,
    A first port of the three-port switching valve is connected to the second vent hole;
    A second port of the three-port switching valve is opened to the external chamber;
    A third port of the three-port switching valve is connected to the atmospheric pressure control device;
    When the three-port switching valve is switched so that the first port and the second port are connected, the atmospheric pressure of the lower space is controlled by controlling the atmospheric pressure of the external chamber,
    When the three-port switching valve is switched so that the first port and the third port are connected, the atmospheric pressure in the lower space is directly controlled by the atmospheric pressure control device.
    The press apparatus according to claim 7 or 8, wherein
  11.  前記第1通気孔及び前記第2通気孔の少なくとも一方が前記気圧制御装置に接続されている、
    ことを特徴とする請求項7又は請求項8に記載のプレス装置。
    At least one of the first vent hole and the second vent hole is connected to the atmospheric pressure control device;
    The press apparatus according to claim 7 or 8, wherein
  12.  前記加熱装置が、
      前記上部チャンバーユニットが下面に固定されるとともに、前記下部チャンバーユニットが上面に固定され、前記上部熱盤と前記下部熱盤との間に配置された一つ以上の中間熱盤と、
     前記一つ以上の中間熱盤をそれぞれ加熱する一つ以上の中間熱盤加熱手段と、
    を備え、
     前記中間熱盤の上面及び下面に遠赤外線放射材料の層が設けられている、
    ことを特徴とする請求項5から請求項11のいずれか一項に記載のプレス装置。
    The heating device is
    The upper chamber unit is fixed to the lower surface, the lower chamber unit is fixed to the upper surface, and one or more intermediate heating plates disposed between the upper heating plate and the lower heating plate;
    One or more intermediate heating plate heating means for respectively heating the one or more intermediate heating plates;
    With
    A layer of far-infrared radiation material is provided on the upper and lower surfaces of the intermediate heating platen,
    The press apparatus according to any one of claims 5 to 11, wherein the press apparatus is characterized in that:
  13.  前記中間熱盤には、
      前記上部チャンバーにエアを給排する第1通気孔と、
      前記下部チャンバーにエアを給排する第2通気孔と、が形成されている、
    ことを特徴とする請求項12に記載のプレス装置。
    In the intermediate heating plate,
    A first vent for supplying and discharging air to the upper chamber;
    A second vent hole for supplying and discharging air to the lower chamber is formed,
    The press apparatus according to claim 12.
  14.  前記第1通気孔が前記中間熱盤の下面と側面とを連絡し、
     前記第2通気孔が前記中間熱盤の上面と側面とを連絡する、
    ことを特徴とする請求項13に記載のプレス装置。
    The first vent communicates a lower surface and a side surface of the intermediate heating plate;
    The second vent communicates the upper surface and the side surface of the intermediate heating plate;
    The press apparatus according to claim 13.
  15.  前記上部ダイヤフラムと前記上部熱盤又は前記中間熱盤との間に配置され、前記上部ダイヤフラムと前記上部熱盤又は前記中間熱盤との接触を防止するダイヤフラム保護板を備えた、
    ことを特徴とする請求項5から請求項14のいずれか一項に記載のプレス装置。
    A diaphragm protection plate disposed between the upper diaphragm and the upper heating plate or the intermediate heating plate, and preventing contact between the upper diaphragm and the upper heating plate or the intermediate heating plate;
    The press apparatus according to any one of claims 5 to 14, wherein
  16.  前記駆動装置が油圧シリンダであり、該油圧シリンダのラムに前記下部熱盤が固定されている、
    ことを特徴とする請求項5から請求項15のいずれか一項に記載のプレス装置。
    The driving device is a hydraulic cylinder, and the lower heating plate is fixed to a ram of the hydraulic cylinder;
    The press apparatus according to any one of claims 5 to 15, wherein
  17.  前記真空枠には、前記気圧制御装置に接続された、前記主チャンバーにエアを給排する第3通気孔が形成されている、
    ことを特徴とする請求項4から請求項16のいずれか一項に記載のプレス装置。
    The vacuum frame has a third vent hole connected to the atmospheric pressure control device for supplying and discharging air to the main chamber.
    The press apparatus according to any one of claims 4 to 16, wherein the press apparatus is characterized in that
  18.  前記第3通気孔が、
      前記真空枠の延長方向に延びる環状部と、
      前記環状部から延びて前記真空枠の外周面に開口する第1部と、
      前記環状部から延びて前記真空枠の内周面に開口する第2部と、
    を有することを特徴とする請求項17に記載のプレス装置。
    The third vent hole is
    An annular portion extending in the extending direction of the vacuum frame;
    A first portion extending from the annular portion and opening in the outer peripheral surface of the vacuum frame;
    A second portion extending from the annular portion and opening in the inner peripheral surface of the vacuum frame;
    The press apparatus according to claim 17, comprising:
  19.  前記第2部が、前記真空枠の延長方向に広がるスリット状に形成されている、
    ことを特徴とする請求項18に記載のプレス装置。
    The second part is formed in a slit shape extending in the extending direction of the vacuum frame,
    The press device according to claim 18.
  20.  前記第1部を気体が通過する際の圧力損失よりも、前記第2部を気体が通過する際の圧力損失の方が大きくなるように構成されている、
    ことを特徴とする請求項18又は請求項19に記載のプレス装置。
    The pressure loss when the gas passes through the second part is larger than the pressure loss when the gas passes through the first part.
    The press apparatus according to claim 18 or 19, characterized by the above.
  21.  前記気圧制御装置が、前記プレス処理において、前記主チャンバー内の気圧を真空にし、前記上部空間及び前記下部空間の気圧を大気圧にする、
    ことを特徴とする請求項1から請求項20のいずれか一項に記載のプレス装置。
    In the press process, the atmospheric pressure control device makes the atmospheric pressure in the main chamber a vacuum, and makes the atmospheric pressure in the upper space and the lower space atmospheric pressure,
    The press apparatus according to any one of claims 1 to 20, wherein:
  22.  前記気圧制御装置が、前記プレス処理前又は前記キュア処理において、前記上部ダイヤフラムが膨張して前記ダイヤフラム保護板に密着するように、前記上部空間と前記主チャンバー内との気圧差を制御する、
    ことを特徴とする請求項1から請求項21のいずれか一項に記載のプレス装置。
    The atmospheric pressure control device controls the atmospheric pressure difference between the upper space and the main chamber so that the upper diaphragm expands and adheres to the diaphragm protection plate before the pressing process or in the curing process.
    The pressing apparatus according to any one of claims 1 to 21, wherein the pressing apparatus is characterized in that
  23.  前記ダイヤフラム成形板及び前記ダイヤフラム保護板の少なくとも一方には通気孔が形成されている、
    ことを特徴とする請求項3又は請求項5に記載のプレス装置。
    At least one of the diaphragm molding plate and the diaphragm protection plate has a vent hole.
    The press apparatus according to claim 3 or 5, characterized in that.
  24.  前記被加工物が積層体であり、前記被加工物を加熱下でプレスして前記被加工物の構成部材を一体に接合するラミネート加工を行うことが可能に構成された、
    ことを特徴とする請求項1から請求項23のいずれか一項に記載のプレス装置。
    The workpiece is a laminate, and is configured to be capable of performing a laminating process in which the workpiece is pressed under heating to integrally join the components of the workpiece.
    The press apparatus according to any one of claims 1 to 23, wherein:
  25.  弾性膜である上部ダイヤフラムによって下面が塞がれた上部チャンバーと、弾性膜である下部ダイヤフラムによって上面が塞がれた下部チャンバーとで上下に挟み込まれて気密な主チャンバーを形成し、前記主チャンバーの気圧を前記上部チャンバー及び前記下部チャンバーの気圧よりも低くすることによって、前記主チャンバー内に配置された被加工物が前記上部ダイヤフラムと前記下部ダイヤフラムとの間でプレスされるように構成された環状の真空枠であって、
     前記主チャンバーにエアを給排する通気孔を有し、該通気孔が、
      前記真空枠の延長方向に延びる環状部と、
      前記環状部から延びて前記真空枠の外周面に開口する第1部と、
      前記環状部から延びて前記真空枠の内周面に開口する第2部と、
    を有する真空枠。
    An upper chamber whose upper surface is closed by an upper diaphragm, which is an elastic membrane, and a lower chamber, whose upper surface is closed by a lower diaphragm, which is an elastic membrane, is sandwiched vertically to form an airtight main chamber, and the main chamber The workpiece placed in the main chamber is pressed between the upper diaphragm and the lower diaphragm by lowering the pressure of the upper chamber and the lower chamber. An annular vacuum frame,
    The main chamber has a vent for supplying and discharging air, and the vent is
    An annular portion extending in the extending direction of the vacuum frame;
    A first portion extending from the annular portion and opening in the outer peripheral surface of the vacuum frame;
    A second portion extending from the annular portion and opening in the inner peripheral surface of the vacuum frame;
    Having a vacuum frame.
  26.  前記第2部が、前記真空枠の延長方向に広がるスリット状に形成されている
    ことを特徴とする請求項25に記載の真空枠。 
    26. The vacuum frame according to claim 25, wherein the second part is formed in a slit shape extending in the extending direction of the vacuum frame.
  27.  前記第1部を気体が通過するための圧力損失よりも、前記第2部を気体が通過するための圧力損失の方が大きくなるように構成された、
    ことを特徴とする請求項25又は請求項26に記載の真空枠。
    The pressure loss for the gas to pass through the second part is configured to be larger than the pressure loss for the gas to pass through the first part.
    The vacuum frame according to claim 25 or claim 26.
  28.  上下に対向して配置された一対の弾性膜である上部ダイヤフラム及び下部ダイヤフラムによって上部空間及び下部空間とそれぞれ気密に仕切られた主チャンバー内に被加工物を配置し、
     前記被加工物を加熱しながら、前記主チャンバー内の気圧を前記上部空間及び前記下部空間の気圧よりも低くして、前記上部ダイヤフラムと前記下部ダイヤフラムとの間で加熱された前記被加工物をプレスするプレス処理を行い、
     前記主チャンバー内の気圧を前記下部空間の気圧より大きくして、前記被加工物を非真空下で加熱するキュア処理を行うプレス成形方法。
    A workpiece is disposed in a main chamber that is airtightly partitioned from an upper space and a lower space by an upper diaphragm and a lower diaphragm, which are a pair of elastic films disposed vertically opposite to each other,
    While heating the workpiece, the pressure in the main chamber is made lower than the pressure in the upper space and the lower space, and the workpiece heated between the upper diaphragm and the lower diaphragm is heated. Press processing to press,
    A press molding method for performing a curing process in which the pressure in the main chamber is made larger than the pressure in the lower space and the workpiece is heated in a non-vacuum state.
  29.  前記キュア処理において、前記被加工物の下面が湾曲した凸面である場合に、前記下部ダイヤフラムが前記被加工物の下面に沿って湾曲して前記被加工物を略均一な圧力で支持するように、前記主チャンバー内と前記下部空間との気圧差を制御する、
    ことを特徴とする請求項28に記載のプレス成形方法。
    In the curing process, when the lower surface of the workpiece is a curved convex surface, the lower diaphragm is curved along the lower surface of the workpiece to support the workpiece with a substantially uniform pressure. Controlling the pressure difference between the main chamber and the lower space;
    The press molding method according to claim 28.
  30.  平坦な上面を有するダイヤフラム成形板を、前記下部ダイヤフラムと対向して前記下部空間内に配置し、
     前記被加工物の下面が平坦面である場合に、前記キュア処理において、前記下部ダイヤフラムが前記ダイヤフラム成形板の上面と密着して平坦に成形されて前記被加工物を略均一な圧力で支持するように、前記主チャンバーと前記下部空間との気圧差を制御する、
    ことを特徴とする請求項29に記載のプレス成形方法。
    A diaphragm molding plate having a flat upper surface is disposed in the lower space so as to face the lower diaphragm,
    When the lower surface of the workpiece is a flat surface, in the curing process, the lower diaphragm is in close contact with the upper surface of the diaphragm forming plate and is formed flat to support the workpiece with a substantially uniform pressure. So as to control the pressure difference between the main chamber and the lower space,
    30. The press molding method according to claim 29.
  31.  前記上部ダイヤフラムと対向して前記上部空間側に熱盤を配置し、
     前記上部ダイヤフラムと前記熱盤との間に、前記上部ダイヤフラムと前記熱盤との接触を防止するダイヤフラム保護板を配置し、
     前記プレス処理前又は前記キュア処理において、前記上部ダイヤフラムが前記上部空間側に膨張して前記ダイヤフラム保護板と密着するよう、前記主チャンバーと前記上部空間との気圧差を制御する、
    ことを特徴とする請求項28から請求項30のいずれか一項に記載のプレス成形方法。
    A hot platen is arranged on the upper space side to face the upper diaphragm,
    Between the upper diaphragm and the hot platen, a diaphragm protection plate for preventing contact between the upper diaphragm and the hot platen is disposed,
    Before the pressing process or the curing process, the pressure difference between the main chamber and the upper space is controlled so that the upper diaphragm expands toward the upper space and comes into close contact with the diaphragm protection plate.
    The press molding method according to any one of claims 28 to 30, wherein:
  32.  前記上部ダイヤフラムと前記下部ダイヤフラムの間に、上下に貫通する中空部を有する真空枠を配置し、
     前記下部ダイヤフラム上に前記被加工物を載せてから、前記上部ダイヤフラムと前記下部ダイヤフラムの少なくとも一方を上下に移動させて、前記上部ダイヤフラムと前記下部ダイヤフラムとで前記真空枠を気密に挟み込むことによって前記主チャンバーを形成する、
    ことを特徴とする請求項28から請求項31のいずれか一項に記載のプレス成形方法。
    Between the upper diaphragm and the lower diaphragm, a vacuum frame having a hollow portion penetrating vertically is disposed,
    The workpiece is placed on the lower diaphragm, and then at least one of the upper diaphragm and the lower diaphragm is moved up and down to sandwich the vacuum frame between the upper diaphragm and the lower diaphragm in an airtight manner. Forming the main chamber,
    32. The press molding method according to any one of claims 28 to 31, wherein:
  33.  前記プレス処理において、前記主チャンバー内の気圧を真空にし、前記上部空間及び前記下部空間の気圧を大気圧にする、
    ことを特徴とする請求項28から請求項32のいずれか一項に記載のプレス成形方法。
    In the pressing process, the atmospheric pressure in the main chamber is evacuated, and the atmospheric pressure in the upper space and the lower space is atmospheric pressure.
    The press molding method according to any one of claims 28 to 32, wherein:
  34.  前記被加工物が積層体であり、前記被加工物を加熱下でプレスして前記被加工物の構成部材を一体に接合するラミネート加工を行う、
    ことを特徴とする請求項28から請求項33のいずれか一項に記載のプレス成形方法。
    The work piece is a laminate, and the work piece is pressed under heating to perform a laminating process for integrally bonding the constituent members of the work piece.
    The press molding method according to any one of claims 28 to 33.
PCT/JP2013/081609 2013-05-20 2013-11-25 Press apparatus, vacuum frame, and press-forming method WO2014188619A1 (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016134554A (en) * 2015-01-21 2016-07-25 株式会社豊田自動織機 Method and apparatus for manufacturing solar battery module
KR20170043728A (en) * 2015-10-13 2017-04-24 삼성디스플레이 주식회사 Laminating device and laminating method using the same
FR3083155A1 (en) * 2018-06-29 2020-01-03 Roset Sas PRESS FOR GLUING A COVER ON A FURNITURE STRUCTURE USING A DEPRESSION
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JP2020179629A (en) * 2019-04-26 2020-11-05 新光エンジニアリング株式会社 Workpiece mounting device and workpiece bonding system
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276542A (en) * 1987-05-08 1988-11-14 Nippon Sheet Glass Co Ltd Laminating and bonding apparatus
JP2001102614A (en) * 1999-09-28 2001-04-13 Mitsubishi Heavy Ind Ltd Method for manufacturing solar cell panel
JP2012030381A (en) * 2010-07-28 2012-02-16 Npc Inc Laminating device
JP2012080120A (en) * 2009-09-10 2012-04-19 Kitagawa Elaborate Mach Co Ltd Laminate press, carrier plate, laminate system and laminating method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012196835A (en) 2011-03-18 2012-10-18 Showa Shell Sekiyu Kk Laminator, and method for manufacturing solar cell module using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276542A (en) * 1987-05-08 1988-11-14 Nippon Sheet Glass Co Ltd Laminating and bonding apparatus
JP2001102614A (en) * 1999-09-28 2001-04-13 Mitsubishi Heavy Ind Ltd Method for manufacturing solar cell panel
JP2012080120A (en) * 2009-09-10 2012-04-19 Kitagawa Elaborate Mach Co Ltd Laminate press, carrier plate, laminate system and laminating method
JP2012030381A (en) * 2010-07-28 2012-02-16 Npc Inc Laminating device

Cited By (11)

* Cited by examiner, † Cited by third party
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JP2016134554A (en) * 2015-01-21 2016-07-25 株式会社豊田自動織機 Method and apparatus for manufacturing solar battery module
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US11745476B2 (en) 2018-06-28 2023-09-05 Essilor International Device and method for forming a functional film intended to be laminated on an optical article
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JP2020179629A (en) * 2019-04-26 2020-11-05 新光エンジニアリング株式会社 Workpiece mounting device and workpiece bonding system
JP7272640B2 (en) 2019-04-26 2023-05-12 新光エンジニアリング株式会社 Work mounting device and work bonding system
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