TWI626320B - 鐵基軟磁非晶合金塊材與製備方法及其應用 - Google Patents

鐵基軟磁非晶合金塊材與製備方法及其應用 Download PDF

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TWI626320B
TWI626320B TW105135574A TW105135574A TWI626320B TW I626320 B TWI626320 B TW I626320B TW 105135574 A TW105135574 A TW 105135574A TW 105135574 A TW105135574 A TW 105135574A TW I626320 B TWI626320 B TW I626320B
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iron
soft magnetic
amorphous alloy
based soft
magnetic amorphous
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TW201817898A (zh
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周力行
侯彥羽
楊智超
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財團法人工業技術研究院
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Priority to TW105135574A priority Critical patent/TWI626320B/zh
Priority to CN201611014964.7A priority patent/CN108022710A/zh
Priority to US15/391,316 priority patent/US20180122541A1/en
Priority to JP2017204309A priority patent/JP6514752B2/ja
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Abstract

一種鐵基軟磁非晶合金塊材(Fe-based amorphous soft magnetic bulk alloy)具有一個立體結構，此立體結構包括鐵基軟磁非晶合金組成物，此鐵基軟磁非晶合金組成物之化學式係Fea Cob Pc Bd Sie，其中76a80原子百分比(at%)，1b4at%，9c11at%，3d5at%，以及5e

Description

鐵基軟磁非晶合金塊材與製備方法及其應用
本說明書所揭露的是關於一種高磁通密度和高磁導率的金屬軟磁材料與製備方法及其應用，特別是一種非晶質鐵基軟磁塊材(Fe-based amorphous soft magnetic bulk alloy)與製備方法及其應用。
製備馬達磁性元件之鐵芯(iron-core)的理想材料必須具有高磁通密度和高磁導率。傳統上是採用矽鋼(silicon steel)來製作馬達磁性元件的鐵芯。然而，由於矽鋼的片電阻率較低，僅能於較低頻率之直流和交流電下運轉。當操作頻率增加，矽鋼片鐵芯的渦流損耗會急劇增加，造成能源轉換效率降低。為了防止渦流產生或者減少渦流造成的能量損失，目前已有技術採用沖壓成形的矽鋼片與絕緣薄片或細絲相互堆疊形成鐵心來製作馬達磁性元件。但此種作法製程相當繁複，十分耗費加工成本，且 尺寸不易微縮。
非晶質鐵基軟磁材料，具有高飽和磁通密度、高電阻率、低矯頑磁力等特點。目前已有技術將非晶質鐵基軟磁材料應用於馬達磁性元件的製備，可有效降低渦流損及磁滯損。然而，受限於非晶質鐵基軟磁材料堅硬、易碎、難以進行切削與整平的材料特性，加工不易，也難以配合較複雜的元件磁路設計。另外，由於傳統的非晶質鐵基軟磁材料一般係以薄帶鑄造(tap casting)為主，有尺寸厚度的限制。再加上，又有材料耗損率偏高，捲繞後佔積率偏低等缺點，使非晶質鐵基軟磁材料的應用範圍受到相當大的限制。
因此，有需要提供一種先進的鐵基軟磁非晶合金塊材及其製備方法，來解決習知技術所面臨的問題。
本說明書中的一實施例是在提供一種鐵基軟磁非晶合金塊材(Fe-based amorphous soft magnetic bulk alloy)。其中，鐵基軟磁非晶合金塊材具有一個立體結構，此立體結構包括鐵基軟磁非晶合金組成物，此鐵基軟磁非晶合金組成物之化學式係Fea Cob Pc Bd Sie，其中76a80原子百分比(at%)，1b4at%，9c11at%，3d5at%，以及5e7at%。
本說明書中的一實施例是在提供一種鐵基軟磁非晶合金塊材的製作方法，此一方法包括下述步驟：首先提供如前所 述之鐵基軟磁非晶合金組成物。之後，進行霧化製程(atomisation)，將鐵基軟磁非晶合金組成物碎化成複數個粉末顆粒。接著，將這些粉末顆粒燒結/熔融，以形成一個立體結構；再對此立體結構進行退火處理(annealing)。
根據上述，本說明書的實施例是揭露一種鐵基軟磁非晶合金塊材及其製備方法。係先以霧化方法製作矽化及真圓度高的鐵基軟磁非晶合金粉體。再將鐵基非晶合金粉體燒結/熔融製作成具有立體結構的磁性塊材，可提高鐵基非晶合金材料的厚度尺寸，增進其加工特性。並可配合更複雜的加工設計增加其應用範圍。應用於馬達磁性元件的鐵芯中，可能提高磁性鐵芯的磁通量(Φ=Bs)和電阻值，降低磁性鐵芯的矯頑磁力(coercivity，Hc)，減少馬達磁性元件的渦流損耗。
100‧‧‧鐵基軟磁非晶合金塊材
201‧‧‧融熔液體
202‧‧‧流體
203‧‧‧液滴
204‧‧‧粉末顆粒
205‧‧‧惰性氣流
301‧‧‧基材
301a‧‧‧基材的表面
302‧‧‧聚焦能量束
303‧‧‧凸塊
304‧‧‧網格結構
305‧‧‧掃描路徑
400‧‧‧馬達磁性元件
401‧‧‧鐵芯定子
402‧‧‧轉子
402a‧‧‧盤狀金屬被鐵
402b‧‧‧磁石
403‧‧‧轉軸
404‧‧‧底座
θ‧‧‧非平角
S1‧‧‧提供一種鐵基軟磁非晶合金組成物
S2‧‧‧將鐵基軟磁非晶合金組成物碎化成複數個粉末顆粒
S3‧‧‧將粉末顆粒燒結/熔融以形成一個立體結構
S4‧‧‧對此立體結構進行退火處理
為了對本說明書之上述實施例及其他目的、特徵和優點能更明顯易懂，特舉數個較佳實施例，並配合所附圖式，作詳細說明如下：第1圖係根據本說明書的一實施例所繪示的一種製作鐵基軟磁非晶合金塊材的方法流程圖；第2A圖係根據本說明書的一實施例所繪示的一種用來實施霧化製程的裝置結構示意圖第2B圖係繪示採用第1圖之步驟S2所製備而成的鐵基軟磁 非晶合金粉末顆粒電子顯微影像；第3圖係根據本說明書的一實施例繪示採用第1圖之步驟S3所製備而成的立體結構製程結構剖面示意圖；以及第4圖係根據本說明書的一實施例繪示採用鐵基軟磁非晶合金塊材所製備的馬達磁性元件結構剖面示意圖。
本說明書所揭露的實施例是有關於一種鐵基軟磁非晶合金塊材及其製備方法，可解決習知馬達磁性元件採用矽鋼鐵芯造成渦流損耗過大，以及採用鐵基軟磁非晶合金材料加工特性不佳的問題。為讓本說明書之上述目的、特徵和優點能更明顯易懂，特舉數個較佳實施例，並配合所附圖式詳細描述如下。
但必須注意的是，這些特定的實施案例與方法，並非用以限定本發明。本發明仍可採用其他特徵、元件、方法及參數來加以實施。較佳實施例的提出，僅係用以例示本發明的技術特徵，並非用以限定本發明的申請專利範圍。該技術領域中具有通常知識者，將可根據以下說明書的描述，在不脫離本發明的精神範圍內，作均等的修飾與變化。在不同實施例與圖式之中，相同的元件，將以相同的元件符號加以表示。
請參照第1圖，第1圖係根據本說明書的一實施例所繪示的一種製作鐵基軟磁非晶合金塊材100的方法流程圖。製作鐵基軟磁非晶合金塊材100的方法包括下述步驟：首先提供一 種鐵基軟磁非晶合金組成物(如步驟S1所述)。其中，此鐵基軟磁非晶合金組成物之化學式係Fea Cob Pc Bd Sie，其中76a80原子百分比(at%)，1b4at%，9c11at%，3d5at%，以及5e7at%。然而鐵基軟磁非晶合金組成物的鐵(Fe)、鈷(Co)、磷(P)、硼(B)和矽(Si)的原子百分比a、b、c、d和e並不以此為限。例如，在本說明書的一些實施例中，76a78at%，2b4at%，9c11at%，3d5at%，以及5e7at%。
之後，進行霧化製程，將鐵基軟磁非晶合金組成物碎化成複數個粉末顆粒204(如步驟S2所述)。請參照第2A圖，第2A圖係根據本說明書的一實施例所繪示的一種用來實施霧化製程的裝置結構示意圖。其中，霧化製程包括下述步驟：先對鐵基軟磁非晶合金組成物進行熔煉(melting)製程，使鐵基軟磁非晶合金組成物形成融熔液體201。之後，藉由流體202，例如水流或氣流，將該融熔液體碎化成複數個液滴203，並藉由水流或氣流將這些液滴冷卻凝固形成複數個粉末顆粒204。
請參照第2B圖，第2B圖係繪示採用第1圖之步驟S2所製備而成的鐵基軟磁非晶合金粉末顆粒204電子顯微影像。其中，鐵基軟磁非晶合金粉末顆粒204的平均粒徑實質介於25微米(μm)至70微米之間。且鐵基軟磁非晶合金粉末顆粒204的真圓度相當高。在本實施例之中鐵基軟磁非晶合金粉末顆粒204的平均粒徑實質為35微米。
在本說明書的一些實施例中，霧化製程可以選自於 水霧化法、氣霧化法、離心霧化法以及超音速脈衝惰性氣體霧化法。在本實施例中，係採用高純氬氣氣流202來將鐵基軟磁非晶合金組成物的融熔液體201霧化成細小液滴203，並在重力作用下降落經過惰性氣流205，使其冷卻凝固形成複數個粉末顆粒204。
表一係例示採用前述方法所製作而成之鐵基軟磁非晶合金粉末顆粒204的多個實施例，並量測鐵基軟磁非晶合金粉末顆粒204的磁通量和矯頑磁力。
接著，將這些粉末顆粒燒結/熔融，以形成一個立體結構(如步驟S3所述)。請參照第3圖，第3圖係根據本說明書的一實施例繪示採用第1圖之步驟S3所製備的立體結構製程結構剖面示意圖。其中，立體結構的形成包括下述步驟：將粉末顆粒204覆蓋於一個基材301的表面301a上。再提供一個聚焦能量束302沿著預設的掃描路徑305對這些粉末顆粒204進行燒結/熔融，以形成複數個凸塊303與基材表面301a夾一個非平角θ，藉以在基材表面301a定義出一個網格結構304。
在本說明書的一些實施例中，基材301可以是一種 硬質或可撓性的金屬基板。聚焦能量束302可以是一種雷射光束。在本實施例中，是採用功率實質介於200瓦特(W)至340瓦特、掃描速度實質介於1500毫米/秒(mm/s)至4500毫米/秒的雷射光束，對這些粉末顆粒204進行燒結/熔融，而在金屬基板上形成網格結構304。其中，網格結構304可以是一種單層結構，或多層堆疊結構。且網格結構304的厚度實質大於2公分(cm)。
後續，再對此立體結構304進行退火處理(annealing)(如步驟S4所述)，完成鐵基軟磁非晶合金塊材100的製備。在本說明書的一些實施例中，退火處理係於空氣氣氛(air atmosphere)中進行，處理時間實質介於0.5小時至2小時之間，且退火溫度實值介於300℃至600℃。
採用前述方法所製作而成的鐵基軟磁非晶合金塊材100不僅具有立體結構，其飽和磁通量(Φ=Bs)、電阻和矯頑磁力也與相同材質的鐵基軟磁非晶合金粉末顆粒204不同。在本說明書的一些實施例中，鐵基軟磁非晶合金塊材100的飽和磁通量實質大於1.3特斯拉(Tesla)至1.7特斯拉；矯頑磁力實質介於8A/m至16A/m；電阻實質為200(μ Ω-cm)。
表二係例示採用前述方法所製作而成之鐵基軟磁非晶合金塊材100的多個實施例：
將具有立體結構的鐵基軟磁非晶合金塊材100(如表二所例示)與表一所對應例示的鐵基軟磁非晶合金粉末顆粒204進行比較，可以發現：雖然二者皆係採用相同的鐵基軟磁非晶合金材料所構成，但二者具有不同的飽和磁通量、不同的矯頑磁力和不同的電阻。其中，鐵基軟磁非晶合金塊材100具有較大的飽和磁通量和電阻以及較小的矯頑磁力。
其中，又以實施例4(包含Fe77Co3P10B4Si6的鐵基軟磁非晶合金塊材100)所具備的飽和磁通量、矯頑磁力以及電阻的參數條件，最適合應用於製備馬達磁性元件之鐵芯。請參照第4圖，第4圖係根據本說明書的一實施例繪示採用鐵基軟磁非晶合金塊材100所製備的馬達磁性元件400結構剖面示意圖。在本實施例中，馬達磁性元件400可以是一種軸向式馬達，其包括鐵芯定子401、轉子402和線圈403。其中，鐵芯定子401係由鐵基軟磁非晶合金塊材100所製成的一盤式結構，固設於底座404上。轉子402包括套設於鐵芯定子401外側的一盤狀金屬被鐵402a，以及設於盤狀金屬被鐵402a與鐵芯定子401之間的磁石402b。轉子402與一，轉軸403連結，且可轉動地同軸裝設於底座404和鐵芯定子401之中。藉由外部導線(未繪示)提供電力流入纏繞於鐵芯定子401上的線圈(未繪示)產生磁場，使鐵芯定子 401形成電磁鐵，藉由電磁鐵與轉子402之磁石402b間的磁力作功，帶動轉軸403同軸轉動。
再將採用前述實施例之鐵基軟磁非晶合金塊材100所做成的鐵芯定子401與習知採用冷軋矽鋼片和鐵基軟磁非晶合金鑄造薄帶之比較例1和比較例2(如表三所例示)所做成的鐵芯定子做比較，可以發現：採用鐵基軟磁非晶合金塊材100之鐵芯定子401具有比習知冷軋矽鋼片和鐵基軟磁非晶合金鑄造薄帶所做成之鐵芯定子更大的飽和磁通量和電阻以及較小的矯頑磁力，可以大於減少馬達磁性元件400的渦流損耗。
另外，由於鐵基軟磁非晶合金塊材100具有厚度實質大於2公分的立體網格結構304。因此，比傳統的鐵基軟磁非 晶合金鑄造薄帶具有更強的韌性抗，可以抵抗加工時的機械應力，能配合更複雜的結構設計進行加工，有助於拓展其他領域的應用。在本說明書的一些實施例中，鐵基軟磁非晶合金塊材100具有實質為950Hv的硬度以及實質為2800MPa的抗拉強度。
根據上述，本說明書的實施例是揭露一種鐵基軟磁非晶合金塊材及其製備方法。係先以霧化方法製作矽化及真圓度高的鐵基軟磁非晶合金粉體。再將鐵基非晶合金粉體燒結/熔融製作成具有立體結構的磁性塊材，可提高鐵基非晶合金材料的厚度尺寸，增進其加工特性。並可配合更複雜的加工設計增加其應用範圍。應用於馬達磁性元件的鐵芯中，可能提高磁性鐵芯的磁通量(Φ=Bs)和電阻值，降低磁性鐵芯的矯頑磁力(coercivity，Hc)，減少馬達磁性元件的渦流損耗。
綜上所述，雖然本說明書已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。

Claims (11)

  1. 一種鐵基軟磁非晶合金塊材(Fe-based amorphous soft magnetic bulk alloy)，具有一立體結構，該立體結構包括一鐵基軟磁非晶合金組成物，該鐵基軟磁非晶合金組成物之化學式係Fea Cob Pc Bd Sie，其中76a80原子百分比(at%)，1b3at%，9c11at%，3d5at%，以及5e7at%。
  2. 如申請專利範圍第1項所述之鐵基軟磁非晶合金塊材，其中76a78at%，2b3at%。
  3. 如申請專利範圍第1項所述之鐵基軟磁非晶合金塊材，其中該立體結構係一網格(grid)結構。
  4. 如申請專利範圍第1項所述之鐵基軟磁非晶合金塊材，其中該立體結構具有實質大於2公分(cm)的一厚度。
  5. 如申請專利範圍第1項所述之鐵基軟磁非晶合金塊材，其中該立體結構具有實質介於1.62特斯拉(Tesla)至1.7特斯拉的一飽和磁通量(Φ=Bs)，實質介於2.2A/m至10.5A/m的一矯頑磁力(coercivity，Hc)以及實質介於170至200(μ Ω-cm)的一電阻。
  6. 一種鐵基軟磁非晶合金塊材的製作方法，包括：提供如申請專利範圍第1項所述之鐵基軟磁非晶合金組成物；進行一霧化製程(atomisation)，將該鐵基軟磁非晶合金組成物碎化成複數個粉末顆粒；燒結/熔融該些粉末顆粒，以形成一立體結構；以及對該立體結構進行一退火處理(annealing)。
  7. 如申請專利範圍第6項所述之鐵基軟磁非晶合金塊材的製作方法，其中該霧化製程包括：進行一熔煉(melting)製程，使該鐵基軟磁非晶合金組成物形成一融熔液體；藉由一流體將該融熔液體碎化成複數個液滴；以及冷卻凝固該些液滴，以形成該些粉末顆粒。
  8. 如申請專利範圍第6項所述之鐵基軟磁非晶合金塊材的製作方法，其中該立體結構的形成，包括：將該些粉末顆粒覆蓋於一基材表面上；以及提供一聚焦能量束沿著一預設掃描路徑對該些粉末顆粒進行燒結/熔融，以形成複數個凸塊與該基材表面夾一非平角，藉以定義出一網格結構。
  9. 如申請專利範圍第8項所述之鐵基軟磁非晶合金塊材的製作方法，其中該聚焦能量束包括一雷射光束，具有實質介於200瓦特(W)至340瓦特的一功率，以及實質介於1500毫米/秒(mm/s)至4500毫米/秒的一掃描速度。
  10. 如申請專利範圍第6項所述之鐵基軟磁非晶合金塊材的製作方法，其中該退火處理係於一空氣氣氛(air atmosphere)中進行，處理時間實質介於0.5小時至2小時之間，且包括實值介於300℃至600℃的一退火溫度。
  11. 一種電磁機電裝置，包括：一定子，包含如申請專利範圍第1項所述之鐵基軟磁非晶合金塊材所製程的一永久磁鐵；一轉子，可轉動地同軸裝設於該定子之中；以及一線圈，繞組於該轉子上。
TW105135574A 2016-11-02 2016-11-02 鐵基軟磁非晶合金塊材與製備方法及其應用 TWI626320B (zh)

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