TWI625314B - 劃線工具、劃線工具之製造方法及劃線之形成方法 - Google Patents
劃線工具、劃線工具之製造方法及劃線之形成方法 Download PDFInfo
- Publication number
- TWI625314B TWI625314B TW103124446A TW103124446A TWI625314B TW I625314 B TWI625314 B TW I625314B TW 103124446 A TW103124446 A TW 103124446A TW 103124446 A TW103124446 A TW 103124446A TW I625314 B TWI625314 B TW I625314B
- Authority
- TW
- Taiwan
- Prior art keywords
- protrusion
- line
- forming
- diamond
- ridge line
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013222127A JP6287060B2 (ja) | 2013-10-25 | 2013-10-25 | スクライビング工具、スクライビング工具の製造方法、およびスクライブラインの形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201516013A TW201516013A (zh) | 2015-05-01 |
TWI625314B true TWI625314B (zh) | 2018-06-01 |
Family
ID=53047250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103124446A TWI625314B (zh) | 2013-10-25 | 2014-07-16 | 劃線工具、劃線工具之製造方法及劃線之形成方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6287060B2 (ja) |
KR (1) | KR20150048018A (ja) |
CN (1) | CN104556662B (ja) |
TW (1) | TWI625314B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6855780B2 (ja) * | 2016-01-22 | 2021-04-07 | Agc株式会社 | 曲面ガラス加工装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101549415A (zh) * | 2008-03-31 | 2009-10-07 | 住友电工硬质合金株式会社 | 带凹口的可转位刀片 |
CN102275229A (zh) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | 脆性材料基板的切割方法 |
TWI406821B (zh) * | 2004-07-16 | 2013-09-01 | Mitsuboshi Diamond Ind Co Ltd | Cutter wheel and its manufacturing method, manual scribing tool and scribing device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3851874B2 (ja) * | 2002-06-24 | 2006-11-29 | 忠 橋本 | 折り曲げ罫線入りプラスチックシート及びそのプラスチックシート用罫線刃 |
JP4365251B2 (ja) * | 2004-03-31 | 2009-11-18 | 旭ダイヤモンド工業株式会社 | ダイヤモンドスクライバー及びダイヤモンドスクライバーの製造方法 |
-
2013
- 2013-10-25 JP JP2013222127A patent/JP6287060B2/ja not_active Expired - Fee Related
-
2014
- 2014-07-14 KR KR1020140088302A patent/KR20150048018A/ko not_active Application Discontinuation
- 2014-07-16 TW TW103124446A patent/TWI625314B/zh not_active IP Right Cessation
- 2014-07-21 CN CN201410347670.0A patent/CN104556662B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI406821B (zh) * | 2004-07-16 | 2013-09-01 | Mitsuboshi Diamond Ind Co Ltd | Cutter wheel and its manufacturing method, manual scribing tool and scribing device |
CN101549415A (zh) * | 2008-03-31 | 2009-10-07 | 住友电工硬质合金株式会社 | 带凹口的可转位刀片 |
CN102275229A (zh) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | 脆性材料基板的切割方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104556662A (zh) | 2015-04-29 |
JP6287060B2 (ja) | 2018-03-07 |
KR20150048018A (ko) | 2015-05-06 |
CN104556662B (zh) | 2019-03-08 |
TW201516013A (zh) | 2015-05-01 |
JP2015083347A (ja) | 2015-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI625313B (zh) | Scribing method | |
TWI648231B (zh) | 脆性材料基板之分斷方法 | |
TWI722494B (zh) | 脆性基板之裂縫線之形成方法及脆性基板 | |
TWI660828B (zh) | 液晶顯示面板之製造方法 | |
JP5210355B2 (ja) | 脆性材料基板のスクライブ方法 | |
TWI663134B (zh) | 脆性基板之分斷方法 | |
TWI625314B (zh) | 劃線工具、劃線工具之製造方法及劃線之形成方法 | |
TWI609754B (zh) | 脆性基板之分斷方法 | |
CN106079116B (zh) | 脆性材料基板的断开方法 | |
TWI647080B (zh) | 脆性基板之分斷方法 | |
TWI619588B (zh) | 脆性材料基板之裂斷方法及裂斷裝置 | |
TWI474981B (zh) | 伴隨表面壓縮應力控制,切割一強化玻璃基板之方法 | |
TWI712478B (zh) | 脆性基板之分斷方法 | |
JP5416381B2 (ja) | 脆性材料基板の分断方法 | |
TWI656102B (zh) | 脆性基板之分斷方法 | |
TWI619589B (zh) | 脆性材料基板之裂斷方法及裂斷裝置 | |
JP2014097908A (ja) | 化学強化ガラス、及び化学強化ガラスの割断方法 | |
JP2017149079A (ja) | 脆性基板の分断方法 | |
TWI607845B (zh) | Breaking method of brittle substrate | |
TW201919798A (zh) | 鑽石刀刀鋒及基板分斷方法 | |
TW201341325A (zh) | 玻璃基材的切割方法及由該切割方法製得的玻璃基板 | |
JP2017065007A (ja) | 脆性基板の分断方法 | |
TW201741107A (zh) | 脆性基板之分斷方法 | |
JP2018001474A (ja) | 脆性基板の分断方法 | |
TW201622933A (zh) | 複合基板之刻劃方法及刻劃裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |