TWI621863B - 基板檢查裝置及基板檢查方法 - Google Patents

基板檢查裝置及基板檢查方法 Download PDF

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Publication number
TWI621863B
TWI621863B TW106105795A TW106105795A TWI621863B TW I621863 B TWI621863 B TW I621863B TW 106105795 A TW106105795 A TW 106105795A TW 106105795 A TW106105795 A TW 106105795A TW I621863 B TWI621863 B TW I621863B
Authority
TW
Taiwan
Prior art keywords
measurement
value
inspection
current
good
Prior art date
Application number
TW106105795A
Other languages
English (en)
Chinese (zh)
Other versions
TW201732309A (zh
Inventor
笹岑敬一郎
斎藤智一
土田憲吾
Original Assignee
山葉汎提克股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山葉汎提克股份有限公司 filed Critical 山葉汎提克股份有限公司
Publication of TW201732309A publication Critical patent/TW201732309A/zh
Application granted granted Critical
Publication of TWI621863B publication Critical patent/TWI621863B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/16—Measuring impedance of element or network through which a current is passing from another source, e.g. cable, power line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
    • G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
TW106105795A 2016-03-14 2017-02-21 基板檢查裝置及基板檢查方法 TWI621863B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP??2016-050233 2016-03-14
JP2016050233A JP6633949B2 (ja) 2016-03-14 2016-03-14 基板検査装置及び基板検査方法

Publications (2)

Publication Number Publication Date
TW201732309A TW201732309A (zh) 2017-09-16
TWI621863B true TWI621863B (zh) 2018-04-21

Family

ID=59871588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106105795A TWI621863B (zh) 2016-03-14 2017-02-21 基板檢查裝置及基板檢查方法

Country Status (4)

Country Link
JP (1) JP6633949B2 (ko)
KR (1) KR101961536B1 (ko)
CN (1) CN107192913B (ko)
TW (1) TWI621863B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6965110B2 (ja) * 2017-11-09 2021-11-10 日置電機株式会社 検査装置および検査方法
JP7517680B2 (ja) * 2020-04-15 2024-07-17 ヤマハファインテック株式会社 検査装置、及び検査方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1556926A (zh) * 2001-09-20 2004-12-22 Oht��ʽ���� 检查装置及检查方法
TWI266885B (en) * 2001-04-19 2006-11-21 Oht Inc Inspection apparatus and inspection method
JP2008151554A (ja) * 2006-12-15 2008-07-03 Hioki Ee Corp 測定装置
CN101799516A (zh) * 2010-02-24 2010-08-11 海洋王照明科技股份有限公司 一种电路板检测装置
US8497693B2 (en) * 2007-10-10 2013-07-30 Cascade Microtech, Inc. Method for testing a test substrate under defined thermal conditions and thermally conditionable prober

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4588945A (en) * 1983-06-13 1986-05-13 Hewlett-Packard Company High throughput circuit tester and test technique avoiding overdriving damage
JP3214415B2 (ja) * 1997-10-30 2001-10-02 日本電産リード株式会社 基板検査装置および基板検査方法
JP3619819B2 (ja) * 2002-09-06 2005-02-16 日本電産リード株式会社 基板検査装置及び基板検査方法
JP2013170917A (ja) * 2012-02-21 2013-09-02 Nidec-Read Corp 基板内蔵電子部品の端子判別方法及び端子判別装置
JP5953135B2 (ja) * 2012-06-14 2016-07-20 日置電機株式会社 抵抗測定装置および回路基板検査装置
JP6375661B2 (ja) * 2014-03-26 2018-08-22 日本電産リード株式会社 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI266885B (en) * 2001-04-19 2006-11-21 Oht Inc Inspection apparatus and inspection method
CN1556926A (zh) * 2001-09-20 2004-12-22 Oht��ʽ���� 检查装置及检查方法
JP2008151554A (ja) * 2006-12-15 2008-07-03 Hioki Ee Corp 測定装置
US8497693B2 (en) * 2007-10-10 2013-07-30 Cascade Microtech, Inc. Method for testing a test substrate under defined thermal conditions and thermally conditionable prober
CN101799516A (zh) * 2010-02-24 2010-08-11 海洋王照明科技股份有限公司 一种电路板检测装置

Also Published As

Publication number Publication date
CN107192913B (zh) 2019-11-12
CN107192913A (zh) 2017-09-22
JP2017166875A (ja) 2017-09-21
KR20170106917A (ko) 2017-09-22
KR101961536B1 (ko) 2019-03-22
TW201732309A (zh) 2017-09-16
JP6633949B2 (ja) 2020-01-22

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