TWI621679B - 聚苯醚寡聚物及高頻銅箔基板 - Google Patents

聚苯醚寡聚物及高頻銅箔基板 Download PDF

Info

Publication number
TWI621679B
TWI621679B TW105142422A TW105142422A TWI621679B TW I621679 B TWI621679 B TW I621679B TW 105142422 A TW105142422 A TW 105142422A TW 105142422 A TW105142422 A TW 105142422A TW I621679 B TWI621679 B TW I621679B
Authority
TW
Taiwan
Prior art keywords
polyphenylene ether
group
ether oligomer
independently hydrogen
item
Prior art date
Application number
TW105142422A
Other languages
English (en)
Other versions
TW201723130A (zh
Inventor
郭政柏
陳泊如
Original Assignee
財團法人工業技術研究院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 財團法人工業技術研究院 filed Critical 財團法人工業技術研究院
Publication of TW201723130A publication Critical patent/TW201723130A/zh
Application granted granted Critical
Publication of TWI621679B publication Critical patent/TWI621679B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/257Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings
    • C07C43/285Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings having unsaturation outside the six-membered aromatic rings
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/257Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings
    • C07C43/295Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings containing hydroxy or O-metal groups
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • C07C69/54Acrylic acid esters; Methacrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D303/00Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02Compounds containing oxirane rings
    • C07D303/12Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F122/00Homopolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F122/10Esters
    • C08F122/1006Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4093Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group characterised by the process or apparatus used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/44Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols by oxidation of phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • C08G65/485Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00Systems containing at least three condensed rings
    • C07C2603/56Ring systems containing bridged rings
    • C07C2603/58Ring systems containing bridged rings containing three rings
    • C07C2603/60Ring systems containing bridged rings containing three rings containing at least one ring with less than six members
    • C07C2603/66Ring systems containing bridged rings containing three rings containing at least one ring with less than six members containing five-membered rings
    • C07C2603/68Dicyclopentadienes; Hydrogenated dicyclopentadienes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyethers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明實施例提供一種聚苯醚(polyphenylene ether)寡聚物及高頻銅箔基板。該聚苯醚寡聚物係具有如式(I)所示之結構:
其中,每一R1係獨立地為氫、C1-6的烷基或苯基;每一R2係獨立地為氫、C1-6的烷基或苯基;a:(a+b)係介於0.05:1至1:1之間;n:(a+b)係介於0.05:1至5:1之間;Q係,m係0至4之整數,Ra係C1-6的烷撐基,Rb係C1-6的烷撐基;每一X係獨立地為氫、丙烯醯基(acryloyl group)、丙烯基(allyl group)、乙烯基苯基(vinylbenzyl group)、環氧丙基(epoxypropyl group)、甲基丙烯醯基(methacryloyl group)、丙炔基(propargyl group)或丙 烯腈基(cyanol group);以及該聚苯醚寡聚物之數目平均分子量(Mn)係介於400至2000之間。

Description

聚苯醚寡聚物及高頻銅箔基板
本發明係有關於一種聚苯醚寡聚物及高頻銅箔基板。
現今通訊電子產業發展迅速,並朝向高速、高頻、高密度發展,因此具高耐熱性、低介電係數、高堅韌結構特性之高分子是下一世代電子構裝及高頻基板材料開發之主要方向。聚苯醚(polyphenylene ether)即為一種高性能材料。然而,聚苯醚的應用中,在加工製程方面,還需要開發具備良好溶解度的材料。因此,聚苯醚的設計開發是相當重要的研究。
本發明實施例提供一種聚苯醚(polyphenylene ether)寡聚物,聚苯醚寡聚物係具有如式(I)所示之結構:
其中,每一R1係獨立地為氫、C1-6的烷基或苯基;每一R2 係獨立地為氫、C1-6的烷基或苯基;a:(a+b)係介於0.05:1至1:1之間;n:(a+b)係介於0.05:1至5:1之間;Q係,m係0至4之整數,Ra係C1-6的烷撐基,Rb係C1-6的烷撐基;每一X係獨立地為氫、丙烯醯基(acryloyl group)、丙烯基(allyl group)、乙烯基苯基(vinylbenzyl group)、環氧丙基(epoxypropyl group)、甲基丙烯醯基(methacryloyl group)、丙炔基(propargyl group)或丙烯腈基(cyanol group);以及該聚苯醚寡聚物之數目平均分子量(Mn)係介於400至2000之間。
一種高頻銅箔基板,包含銅箔基板以及黏著層,黏著層位於銅箔基板之上,其中黏著層由一組成物製備而得,組成物包含上述的聚苯醚寡聚物。
為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂,下文特舉出較佳實施例,作詳細說明如下:
本發明提供一種聚苯醚(polyphenylene ether)寡聚物,具有良好的溶解度有利於加工,以聚苯醚寡聚物製得之製品可呈現良好的電性。
本發明提供一種聚苯醚(polyphenylene ether)寡聚物,具有如式(I)所示之結構:
其中,每一R1可以獨立地為氫、C1-6的烷基或苯基;每一R2可以獨立地為氫、C1-6的烷基或苯基;a:(a+b)約介於0.05:1至1:1之間;n:(a+b)約介於0.05:1至5:1之間。
Q可以是,m可以是0至4之整數,Ra可以是C1-6的烷撐基,Rb可以是C1-6的烷撐基;以及每一X可以獨立地為氫、丙烯醯基(acryloyl group)、丙烯基(allyl group)、乙烯基苯基(vinylbenzyl group)、環氧丙基(epoxypropyl group)、甲基丙烯醯基(methacryloyl group)、丙炔基(propargyl group)或丙烯腈基(cyanol group)。
在本發明一實施例中,聚苯醚寡聚物的數目平均分子量(Mn)約介於400至2000之間,例如約介於500至2000之間或約介於800至2000之間,也可以是介於1000至2000之間,或是介於900至1700之間。若聚苯醚寡聚物的數目平均分子量過低,則易造成熱穩定性不佳。若聚苯醚寡聚物的重量平均分 子量過高,則易造成加工性不佳。
值得說明的是,於本揭露中,介於某兩數值之間亦包含某兩數值,例如約介於500至2000之間亦包含500與2000。
在本發明一實施例中,Q可以是
在本發明一實施例中,每一X可以獨立地為氫、 ,其中R3可以獨立地為氫或C1-3烷基,p可以是1至4之整數,W可以是環氧基、羥基或乙烯基,R4可以是C1-12烷撐基,g係0或1之整數,s係0或1之整數,R5可以是獨立地為氫或C1-12烷基。
在本發明一實施例中,每一X可以獨立地為
在本發明一實施例中,聚苯醚寡聚物可具有如式(II)所示之結構:
其中a:(a+b)約介於0.05:1至1:1之間;n:(a+b)約介於0.05:1至5:1之間。
在本發明一實施例中,聚苯醚寡聚物可具有如式(III)所示之結構:
其中a:(a+b)約介於0.05:1至1:1之間;n:(a+b)約介於0.05:1至5:1之間。
在本發明一實施例中,聚苯醚寡聚物可具有如式(IV)所示之結構:
其中a:(a+b)約介於0.05:1至1:1之間;n:(a+b)約介於0.05:1至5:1之間。
在本發明一實施例中,聚苯醚寡聚物可具有如式(V)所示之結構:
其中a:(a+b)約介於0.05:1至1:1之間;n:(a+b)約介於0.05:1 至5:1之間。
在本發明一實施例中,係利用第一反應物(例如 )與第二反應物(例如 、或上述之組合)作為起始物合成雙酚單體,接著,將雙酚單體與第三反應物(例如 )進行聚合反應,以形成聚苯醚寡聚物。每一R1可以獨立地為氫、C1-6的烷基或苯基;每一R2可以獨立地為氫、C1-6的烷基或苯基;m可以是0至4之整數,Ra可以是C1-6的烷撐基,Rb可以是C1-6的烷撐基,X可以是氫、丙烯醯基(acryloyl group)、丙烯基(allyl group)、乙烯基苯基(vinylbenzyl group)、環氧丙基(epoxypropyl group)、甲基丙烯醯基(methacryloyl group)、丙炔基(propargyl group)或丙烯腈基(cyanol group)。
在本發明一實施例中,係利用第一反應物(例如 )與第二反應物(例如 、或上述之組合)作為起始物合成雙酚單體,接著,將雙酚單體與第三反應物(例如 )進行聚合反應後再與第四反應物(例如 )進行取代反應,以形成聚苯醚寡聚物。每一R1可以獨立地為氫、C1-6的烷基或苯基;每一R2可以獨立地為氫、C1-6的烷基或苯基;m可以是0至4之整數,Ra可以是C1-6的烷撐基,Rb可以是C1-6的烷撐基,X可以是氫、丙烯醯基(acryloyl group)、丙烯基(allyl group)、乙烯基苯基(vinylbenzyl group)、環氧丙基(epoxypropyl group)、甲基丙烯醯基(methacryloyl group)、丙炔基(propargyl group)或丙烯腈基(cyanol group),R4可以是C1-12烷撐基,g係0或1之整數,s係0或1之整數,R5可以是獨立地為氫或C1-12烷基。
在本發明一實施例中,第一反應物(例如 )與第二反應物(例如 、或上述之組合)的莫耳比約介於2:1至3:1之間。
在本發明一實施例中,第三反應物(例如 )對第二反應物(例如 、或上述之組合)的莫耳比約介於0.2:1至20:1之間。若上述莫耳比過低,則可能造成熱穩定性不佳。若上述莫耳比過高,則可能造成材料韌性不足。
在本發明一實施例中,聚苯醚寡聚物可應用於高頻銅箔基板的製作,例如高頻銅箔基板可包含銅箔基板以及黏著層,黏著層位於銅箔基板,其中黏著層由組成物製備而得,組成物包含上述的聚苯醚寡聚物。
以下藉由下列實施例來說明本發明所述之聚苯醚寡聚物的合成方式,用以進一步闡明本發明之技術特徵。
【實施例1】合成聚苯醚寡聚物1
取102.97克(0.84mol)2,6-二甲基苯酚(2,6-dimethylphenol,DMP)和2.36克(0.018mol)氯化鋁(aluminium chloride)加入至反應器中,在氮氣系統下加熱至120℃。接著,在120℃下,加入15.6克(0.12mol)雙環戊二烯(dicyclopentadiene),再持續攪拌反應。待反應結束後,加入5wt%氫氧化鈉(0.06mol)水溶液中和觸媒,並加入甲苯攪拌1小時後將反應液過濾除去鹽類與觸媒,所得之濾液利用水洗數次,取有機層並減壓蒸餾純化即可得40.61克的深棕色雙酚單體(DCPD-DIDMP),產率為90%。
混合16.22克(43.08mmol)DCPD-DIDMP、15.66克(128.36mmol)2,6-二甲基苯酚、1.33克(13.14mmol)N,N’-二甲基 丁胺(N,N’-dimethylbutylamine)、1.05克(8.14mmol)二正丁胺(di-n-butylamine)與208克甲醇形成單體混合溶液。
在氧氣系統下於反應器中混合0.253克(1.13mmol)溴化銅(CuBr2)、0.71克(7.02mmol)N,N’-二甲基丁胺(N,N’-dimethylbutylamine)、0.55克(4.26mmol)二正丁胺(di-n-butylamine)和235克甲苯,加熱至45℃。而後,在氧氣系統下將單體混和溶液加入至反應器中。
待反應結束後,將1.2克(3.16mmol)乙二胺四乙酸四鈉溶解於200克水中,加入反應器中,以終止反應。分離水層和有機層。將有機層溶液減壓濃縮,獲得28克之聚酚醚寡聚物1,上述反應可表示如下式:
DCPD-DIDMP的氫核磁共振(1H-NMR)光譜(400MHz,氘-二甲基亞碸(DMSO-d 6 ),化學位移2.54ppm)1H-NMR分析結果:δ7.93ppm(-OH),δ6.87-6.55ppm(Aromatic H of DMP),δ2.19-1.05ppm(Aliphatic H of DMP and DCPD)。在δ 7.93ppm訊號為DCPD-DIDMP之DMP苯環上羥基吸收位置。聚苯醚寡聚物1的氫核磁共振(1H-NMR)光譜(400MHz,溶劑為氘-丙酮(acetone-d 6 ),化學位移2.05ppm), 1H-NMR分析結果:δ7.20-7.15ppm(5H),δ7.09-6.99ppm(4H),δ6.86-6.81ppm(3H),δ6.53-6.50ppm(2H),δ6.34ppm(1H)。聚苯醚寡聚物1的FT-IR圖譜測得3600cm-1為聚苯醚寡聚物1末端之酚羥基吸收峰。
由膠透層析儀(Gel Permeation Chromatography,GPC)鑑定,聚苯醚寡聚物1之數目平均分子量(Mn)約為1044,而分子量分佈值(polydispersity,PDI)約為1.41,相關溶解度測試結果請參閱表2。
聚苯醚寡聚物1之溶解度測試方式:聚苯醚寡聚物與溶劑混合後溶液為澄清無沉澱物則為可溶,反之為不可溶,聚苯醚寡聚物與溶劑混合之重量比為1:1。本揭露所有聚苯醚寡聚物之溶解度測試皆同上述方式。
【實施例2】合成聚苯醚寡聚物2
取25克聚苯醚寡聚物1、1.17克(9.58mmol)4-二甲氨基吡啶(4-dimethylaminopyridine,DMAP)、16.65克(107mmol)甲基丙烯酸酐(methacrylic anhydride)和63.8克甲苯,加熱至80℃反應。待反應結束後,回至常溫加入甲苯63.8克,將此反應溶液沉澱於大量甲醇中,所得沉澱粗產物以抽氣過濾收集,再以300ml甲醇清洗攪拌30分鐘後再以抽氣過濾收集得到固體產物,然後在減壓下乾燥,以獲得17克之聚苯醚寡聚物2,上述反應可表示如下式:
聚苯醚寡聚物2的FT-IR圖譜中顯示在3600cm-1(聚苯醚寡聚物1末端之酚羥基吸收位置)吸收峰消失,然而在1734cm-1為聚苯醚寡聚物2末端之甲基丙烯醯基(methylacryloy group)吸收峰。聚苯醚寡聚物2的氫核磁共振(1H-NMR)光譜(400MHz,溶劑為氘-丙酮(acetone-d 6 ),化學位移2.05ppm),1H-NMR分析結果:δ7.09-6.99ppm(4),δ6.53-6.48ppm(3),δ6.33ppm(2),δ5.83ppm(1)。
由膠透層析儀(Gel Permeation Chromatography;GPC)鑑定,聚苯醚寡聚物2之數目平均分子量(Mn)約為1594,而分子量分佈值(PDI)約為1.29,相關溶解度測試結果請參閱表2。
【實施例3】合成聚苯醚寡聚物3
取2克(1.92mmol)聚苯醚寡聚物1至100ml的雙頸瓶中,加入20ml四氫呋喃(THF)作為溶劑,在氮氣系統下加熱至60℃。接著,加入8克濃度為25%的氫氧化鈉水溶液,緊接著緩慢加入20ml(27.5mmol)對氯甲基苯乙烯(4-chloromethylstyrene)。待反應結束後,回至常溫後加入甲苯與 去離子水進行萃取,所得有機層溶液迴旋濃縮後再溶解於甲苯並於甲醇中沉澱,以抽氣過濾收集固體產物,然後在減壓下乾燥,以獲得1.2克之聚苯醚寡聚物3;上述反應可表示如下式:
聚苯醚寡聚物3的氫核磁共振(1H-NMR)光譜(400MHz,溶劑為氘-氯仿(CDCl3),化學位移7.24ppm)1H-NMR分析結果:δ7.44-7.34ppm(4H),δ7.06-6.89ppm(6H),δ6.77-6.73ppm(2H),δ6.47-6.46ppm(2H),δ6.39ppm(2H),δ5.79-5.74ppm(1H),δ5.29-5.25ppm(1H),δ4.76ppm(2H),δ4.58ppm(1H)。聚苯醚寡聚物3的FT-IR圖譜中顯示3600cm-1(聚苯醚寡聚物1末端之酚羥基吸收位置)吸收峰消失,官能基已改變。
由膠透層析儀(Gel Permeation Chromatography;GPC)鑑定,聚苯醚寡聚物3之數目平均分子量約為1953,PDI值為1.33。
【實施例4】合成聚苯醚寡聚物4
聚苯醚寡聚物1(2g,1.92mmol)至100ml的雙頸瓶中,並加入環氧氯丙烷(11.7g,117mmol),在氮氣系統下加熱至100℃。接著,緩慢滴加入乙氧化鈉(0.36g,5.44mmol)溶解 於乙醇(1.6g)中而製得之溶液。待反應結束後,回至常溫後加入甲苯與去離子水進行萃取,所得有機層溶液迴旋濃縮後再溶解於甲苯並於甲醇中沉澱,以抽氣過濾收集固體產物,然後在減壓下乾燥,以獲得1.1g之聚苯醚寡聚物4;上述反應可表示如下式:
聚苯醚寡聚物4的氫核磁共振(1H-NMR)光譜(400MHz,溶劑為氘-丙酮(acetone-d 6 ),化學位移2.05ppm)。1H-NMR詳細分析結果如下:δ7.26-7.05ppm(6H),δ6.96-6.91ppm(2H),δ6.54-6.52ppm(2H),δ6.40ppm(2H),δ4.08-4.05ppm(2H),δ3.63-3.59ppm(1H),δ3.30ppm(2H)。聚苯醚寡聚物4的FT-IR圖譜中顯示3600cm-1(聚苯醚寡聚物1末端之酚羥基吸收位置)吸收峰消失,官能基已改變。
由膠透層析儀(Gel Permeation Chromatography;GPC)鑑定,聚苯醚寡聚物4之數目平均分子量約為1916,PDI值為1.38。
【實施例5】量測介電特性
將上述聚苯醚寡聚物2製備所得之黏著層與銅箔 進行高溫壓合硬化,形成銅箔基板材料後,以介電分析儀量測其相關電氣特性數據,請參閱表1。
由表1可知本發明實施例之聚苯醚寡聚物具有相當優異的介電常數(dielectric constant,Dk)與介電損耗(dissipation factor,Df)。
【比較例1】聚苯醚寡聚物A
混合16.22克(43.08mmol)DCPD-DIDMP、52.55克(430.8mmol)2,6-二甲基苯酚、3.19克(31.54mmol)N,N’-二甲基丁胺(N,N’-Dimethylbutylamine)、2.52克(19.54mmol)二正丁胺(di-n-butylamine)與208克甲醇形成單體混合溶液。
在氧氣系統下於反應器中混合0.61克(2.71mmol)溴化銅(CuBr2)、1.70克(16.85mmol)N,N’-二甲基丁胺(N,N’-dimethylbutylamine)、1.32克(10.22mmol)二正丁胺(di-n-butylamine)和235克甲苯,加熱至45℃。而後,在氧氣系統下將單體混和溶液加入至反應器中。
待反應結束後,將2.88克(7.58mmol)乙二胺四乙酸四鈉溶解於200克水中,加入反應器中,以終止反應。分離水層和有機層。將有機層溶液減壓濃縮,以獲得62g之聚苯醚寡聚物A;數目平均分子量約為2,009,PDI為1.54。相關溶解度測試結果請參閱表2。
由表2可知本發明實施例之聚苯醚寡聚物可溶於多種溶劑,有利於加工應用,尤其對丙酮具有良好的溶解度。
雖然本發明已以數個較佳實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作任意之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。

Claims (10)

  1. 一種聚苯醚(polyphenylene ether)寡聚物,係具有如式(I)所示之結構: 其中,每一R1係獨立地為氫、C1-6的烷基或苯基;每一R2係獨立地為氫、C1-6的烷基或苯基;a:(a+b)係介於0.05:1至1:1之間;n:(a+b)係介於0.05:1至5:1之間;Q係m係0至4之整數,Ra係C1-6的烷撐基,Rb係C1-6的烷撐基;每一X係獨立地為氫、丙烯醯基(acryloyl group)、丙烯基(allyl group)、乙烯基苯基(vinylbenzyl group)、環氧丙基(epoxypropyl group)、甲基丙烯醯基(methacryloyl group)、丙炔基(propargyl group)或丙烯腈基(cyanol group);以及該聚苯醚寡聚物之數目平均分子量(Mn)係介於400至2000之間。
  2. 如申請專利範圍第1項所述之聚苯醚寡聚物,其中Q係
  3. 如申請專利範圍第1項所述之聚苯醚寡聚物,其中每一X係獨立地為氫、 其中R3係獨立地為氫或C1-3烷基,p係1至4之整數,W係環氧基、羥基或乙烯基,R4係C1-12烷撐基,g係0或1之整數,s係0或1之整數,R5係獨立地為氫或C1-12烷基。
  4. 如申請專利範圍第1項所述之聚苯醚寡聚物,其中每一X係獨立地為
  5. 如申請專利範圍第1項所述之聚苯醚寡聚物,其中該聚苯醚寡聚物的數目平均分子量介於500至2000之間。
  6. 如申請專利範圍第1項所述之聚苯醚寡聚物,其係具有如式(II)所示之結構: 其中a:(a+b)係介於0.05:1至1:1之間;n:(a+b)係介於0.05:1至5:1之間。
  7. 如申請專利範圍第1項所述之聚苯醚寡聚物,其係具有 如式(III)所示之結構: 其中a:(a+b)係介於0.05:1至1:1之間;n:(a+b)係介於0.05:1至5:1之間。
  8. 如申請專利範圍第1項所述之聚苯醚寡聚物,其係具有如式(IV)所示之結構: 其中a:(a+b)係介於0.05:1至1:1之間;n:(a+b)係介於0.05:1至5:1之間。
  9. 如申請專利範圍第1項所述之聚苯醚寡聚物,其係具有如式(V)所示之結構: 其中a:(a+b)係介於0.05:1至1:1之間;n:(a+b)係介於0.05:1至5:1之間。
  10. 一種高頻銅箔基板,包含:一銅箔基板;以及一黏著層,黏著層位於銅箔基板,其中該黏著層由一組成物製備而得,該組成物包含如申請專利範圍第1項的聚苯醚寡聚物。
TW105142422A 2015-12-22 2016-12-21 聚苯醚寡聚物及高頻銅箔基板 TWI621679B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562270843P 2015-12-22 2015-12-22
US62/270,843 2015-12-22

Publications (2)

Publication Number Publication Date
TW201723130A TW201723130A (zh) 2017-07-01
TWI621679B true TWI621679B (zh) 2018-04-21

Family

ID=59065863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105142422A TWI621679B (zh) 2015-12-22 2016-12-21 聚苯醚寡聚物及高頻銅箔基板

Country Status (3)

Country Link
US (1) US10358585B2 (zh)
CN (1) CN107022075B (zh)
TW (1) TWI621679B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6967084B2 (ja) * 2017-11-30 2021-11-17 中国塗料株式会社 アクリルポリシロキサン樹脂系塗料組成物およびその用途
JP7102202B2 (ja) * 2018-04-19 2022-07-19 旭化成株式会社 ポリフェニレンエーテル及びその製造方法
TWI698460B (zh) * 2018-06-05 2020-07-11 台灣中油股份有限公司 含雙環戊二烯之官能化聚(2,6-二甲基苯醚)寡聚物、其製造方法及其用途
TWI752357B (zh) * 2019-02-20 2022-01-11 元鴻應用材料股份有限公司 一種樹脂、由其製成的銅箔基板以及印刷電路板
JP7308082B2 (ja) * 2019-06-13 2023-07-13 旭化成株式会社 ポリフェニレンエーテル含有樹脂組成物
JPWO2021241255A1 (zh) * 2020-05-28 2021-12-02
CN115745931B (zh) * 2021-09-03 2024-05-24 财团法人工业技术研究院 酸酐化合物、由其制得的聚酰亚胺与薄膜
TWI785916B (zh) * 2021-12-03 2022-12-01 財團法人工業技術研究院 樹脂化合物以及包含其之樹脂組合物
WO2024106209A1 (ja) * 2022-11-15 2024-05-23 日鉄ケミカル&マテリアル株式会社 多官能ビニル樹脂、その製造方法、多官能ビニル樹脂組成物及びその硬化物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW572882B (en) * 2001-10-17 2004-01-21 Mitsubishi Gas Chemical Co Bifunctional biphenyl and process for producing bifunctional phenylene ether oligomer compound using the same
US20080269427A1 (en) * 2002-01-28 2008-10-30 Kenji Ishii Polyphenylene ether oligomer compound, derivatives thereof and use thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2021100A1 (en) 1989-09-15 1991-03-16 William R. Haaf Polyphenylene ether compositions having improved flow
JP2002053646A (ja) 2000-08-09 2002-02-19 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ、及び、絶縁基板
TW591054B (en) 2001-06-28 2004-06-11 Mitsubishi Gas Chemical Co Bifunctional phenylene ether oligomer, derivatives and process for the production thereof
JP4009826B2 (ja) 2002-03-01 2007-11-21 三菱瓦斯化学株式会社 (メタ)アクリレート化合物およびその硬化物
JP4196159B2 (ja) 2002-07-25 2008-12-17 三菱瓦斯化学株式会社 多官能(メタ)アクリレート化合物およびその硬化物
CA2413636A1 (en) 2002-12-05 2004-06-05 Bayer Inc. Adhesive compositions
US7329708B2 (en) 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
US7541421B2 (en) 2005-12-08 2009-06-02 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) copolymer
US20080085989A1 (en) 2006-10-05 2008-04-10 Gary William Yeager Poly(arylene ether) copolymer
US7595367B2 (en) 2007-08-28 2009-09-29 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) preparation method
US8017697B2 (en) 2008-06-24 2011-09-13 Sabic Innovative Plastics Ip B.V. Poly(arylene ether)-polysiloxane composition and method
US7847032B2 (en) 2008-12-10 2010-12-07 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) composition and extruded articles derived therefrom
US20110152420A1 (en) 2009-12-22 2011-06-23 Mark Elkovitch Poly(arylene ether)/polyamide compositions, methods, and articles
US8669332B2 (en) 2011-06-27 2014-03-11 Sabic Innovative Plastics Ip B.V. Poly(arylene ether)-polysiloxane composition and method
US8598281B2 (en) 2011-09-01 2013-12-03 Sabic Innovative Plastics Ip B.V. Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW572882B (en) * 2001-10-17 2004-01-21 Mitsubishi Gas Chemical Co Bifunctional biphenyl and process for producing bifunctional phenylene ether oligomer compound using the same
US20080269427A1 (en) * 2002-01-28 2008-10-30 Kenji Ishii Polyphenylene ether oligomer compound, derivatives thereof and use thereof

Also Published As

Publication number Publication date
TW201723130A (zh) 2017-07-01
US20170174957A1 (en) 2017-06-22
CN107022075B (zh) 2019-06-28
US10358585B2 (en) 2019-07-23
CN107022075A (zh) 2017-08-08

Similar Documents

Publication Publication Date Title
TWI621679B (zh) 聚苯醚寡聚物及高頻銅箔基板
CN110268003B (zh) 固化性化合物
TWI510517B (zh) 聚酚醚寡聚物及包含其之產品
CN109970519B (zh) 含双环戊二烯之官能化聚(2,6-二甲基苯醚)寡聚物、其制造方法及其用途
CN109161014B (zh) 一种低分子量双端羟基聚苯醚树脂的制备方法
CN109867590B (zh) 以改进固化动力学制备稳定且可热聚合的乙烯基、氨基或低聚苯氧基苯并环丁烯单体的方法
JP5657871B2 (ja) 熱硬化性オリゴマーまたはポリマー、これを含む熱硬化性樹脂組成物およびこれを用いたプリント配線板
JP6293457B2 (ja) ポリイミドおよび耐熱性フィルム
Su et al. Preparation, characterization and curing properties of epoxy-terminated poly (alkyl-phenylene oxide) s
JP2019108524A (ja) 可逆架橋反応組成物
CN108456303B (zh) 含呋喃环结构生物基聚芳醚树脂及其制备方法
JP5039615B2 (ja) 新規な脂環式ビニルエーテル重合体
CN112313284A (zh) 固化性组合物
CN113603723B (zh) 磷系(2,6-二甲基苯醚)寡聚物及其制备方法与固化物
JP2021513586A (ja) フラン環構造含有バイオ系ポリアリーレンエーテル樹脂及びその製造方法
Lee et al. Synthesis, structures and thermal properties of new class epoxide-terminated telechelic poly (2, 6-dimethyl-1, 4-phenylene oxide) s
CN110804173A (zh) 聚苯醚中间体、聚苯醚衍生物及其制备方法和应用
JP4176074B2 (ja) ビスフェニル−2,3,5,6−テトラフルオロ−4−トリフルオロメチルフェニルホスフィンオキシド誘導体およびその製造方法
WO2021020521A1 (ja) ジベンゾホスホールオキシド誘導体およびその製造法
JP6462236B2 (ja) ポリイミドおよび耐熱性フィルム
US20110028584A1 (en) Curable cyclic phosphazene compound and method of preparing the same
TWI709585B (zh) 可自身固化的環氧樹脂組成物、其製備方法及其製備之環氧固化物
CN107849251B (zh) 硫化物类聚合物、包含该聚合物的薄膜以及该薄膜的制备方法
Hino et al. Unusual cationic copolymerization behavior of a six‐membered ring spiro‐orthocarbonate bearing adamantane backbones with a monofunctional epoxide
KR100469080B1 (ko) 1-(3',5'-비스(플루오로알킬)벤젠)피로멜리틱다이안하이드라이드 및 이의 제조방법