TWI621198B - 基體板 - Google Patents

基體板 Download PDF

Info

Publication number
TWI621198B
TWI621198B TW101141288A TW101141288A TWI621198B TW I621198 B TWI621198 B TW I621198B TW 101141288 A TW101141288 A TW 101141288A TW 101141288 A TW101141288 A TW 101141288A TW I621198 B TWI621198 B TW I621198B
Authority
TW
Taiwan
Prior art keywords
base plate
substrate
plate
suction
patent application
Prior art date
Application number
TW101141288A
Other languages
English (en)
Other versions
TW201336009A (zh
Inventor
普林敏 慕法勒
Original Assignee
太陽能半導體有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽能半導體有限公司 filed Critical 太陽能半導體有限公司
Publication of TW201336009A publication Critical patent/TW201336009A/zh
Application granted granted Critical
Publication of TWI621198B publication Critical patent/TWI621198B/zh

Links

Classifications

    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21F—PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
    • D21F1/00—Wet end of machines for making continuous webs of paper
    • D21F1/36—Guiding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21G—CALENDERS; ACCESSORIES FOR PAPER-MAKING MACHINES
    • D21G1/00—Calenders; Smoothing apparatus
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21G—CALENDERS; ACCESSORIES FOR PAPER-MAKING MACHINES
    • D21G1/00—Calenders; Smoothing apparatus
    • D21G1/0066—Calenders; Smoothing apparatus using a special calendering belt
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21G—CALENDERS; ACCESSORIES FOR PAPER-MAKING MACHINES
    • D21G1/00—Calenders; Smoothing apparatus
    • D21G1/02—Rolls; Their bearings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Packaging For Recording Disks (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

一種用以容裝一基體的基體板具有一吸點在一表面上。

Description

基體板 發明領域
本發明係有關一種依據申請專利範圍第1項之前言部份的基體板，及一種依據申請專利範圍第9項的使用。
發明背景
具有一旋轉板及一基體板的裝置係被用於製程處理，尤其是基體的上漆及/或塗層。一驅動器係設在該旋轉板底下，其會經由一旋轉軸來旋轉該旋轉及該基體板。
例如，EP 1 743 220 B1專利揭露此一裝置。但是，其並未揭露該基體係如何被固持於該基體板上。
已知的固持方法之缺點係其會損壞一已被上漆及/或塗層的基體表面，此係為在兩面皆要被上漆或塗的基體之一特別不利處。此對一朝下的基體表面乃是一缺點，其係在一稍後的工作步驟中亦要被上漆及/或塗層者，却會在另一面的上漆及/或塗層期間可能已被噴塗。
發明概要
本發明的目的係要提供一種基體板，其會最小化上述的缺點或甚至消除它們，並使正被塗漆的基體底面能 被盡可能地保持原樣。
申請專利範圍第1項和第9項的特徵會導致該目的的解決。
在典型的實例中一基本板包含一吸點以將一基體容裝在其表面上。此所提供的優點是該基體會被經由該吸點吸住附接，並因此而能被可靠地固持於該基體板上。即使當旋轉時，該基體板的加速和剎止亦止會有該基體掉落的危險。由於該固持力係以一吸點來施加，故所得到的優點是被固持元件、抓持件、夾具或類似物損壞的風險至少會最小化。
在典型的實例中，該吸板離該基體板之一表面有一間隔。此所提供的優點是該基體板只會與該吸點接觸，因此只會產生甚少的接觸表面其可能導致損害被造成。
該吸點較好離該基體板之一表面有一由1mm至30mm的間隔，而特別較佳的是7mm。此所提供的優點係一充分的間隔會被達到，但一形成該吸點的管仍具有足夠的穩定性。
在典型的實例中該基體板包含多數個吸點。此所提供的優點係該基體板會被可靠地固持在一平面上且不會傾斜。另外的優點係在每一個別的吸點上只須要一有限的固持力，因為有多數個吸點。因此若只有一輕微的部份真空被施加於基體板或吸點即已足夠。
在典型的實例中該基體板包含三、四或五個吸點。此乃特別地有利，因為該基體板會被它們可靠地固持， 且不會造成長管線。
在典型的實例中該吸點係以一通道連接於一部份真空源。此所提供的優點係一部份真空能被施加於該等吸點，而造成固持力。
在典型的實例中該等通道係被設在該基體板中。該等通道較好係設在該基體板之一板中。此所提供的優點係沒有額外的線路或管必須被鋪。此乃特別有利，因該基體板是以高速旋轉。
在典型的實例中，該通道係被銑設於該基體板之一表面中，或該基體板之一板中。此所提供的優點係該等通道可被非常容易地製成。
在典型的實例中，一封閉件會被嵌入該凹槽中而來密封該通道。以此方式該通道會保持暢適。此係特別地有利，因為該通道的製造會因此而大為簡化，且不須要長孔的鑽設。
在典型的實例中，該吸點包含一可撓表面。此所提供的優點係該吸點在會與該基體接觸的位置沒有尖銳邊緣，其可能會對該基體造成損害。該吸點較好包含一橡膠唇其會形成該可撓表面。
針對一基體板在一用於基體之旋轉塗漆的裝置中之使用會被分開地請求保護。此所提供的優點係該基體能被可靠地固持在一用以旋轉上漆及/或塗層的裝置中。該基體亦會被以一能藉該等基體吸點之設計保護其背面的方式來固持。
在典型的實例中，該裝置之一內部區域係被密封隔離於該旋轉塗漆的環境。此所述提供的優點係有一一起旋轉的空氣柱會形成於該基體與該基體板之間，且該效果會加強。此會阻止漆料或塗層介質達到該基體的背面，其係僅在嗣後才要被上漆及/或塗層者。
1‧‧‧基體板
2‧‧‧基體
3‧‧‧板
4‧‧‧連接位置
5，6，7，8‧‧‧吸點
9‧‧‧表面
10，11，12，13‧‧‧通道
14‧‧‧橡膠唇
15‧‧‧管
16‧‧‧腳
17‧‧‧螺絲
18‧‧‧開孔
19，20，21，22‧‧‧封閉件
23‧‧‧背面
A‧‧‧間隔
本發明會被參照所附圖式簡要地描述於後，其中個別的圖式示出：圖1為一依據本發明的基體板及一基體之側視示意圖；圖2為一依據本發明的基體板之頂視示意圖。
較佳實施例之詳細說明
圖1示出一依據本發明的基體板1及一基體2。該基體板1包含一板3，一連接位置4及四個吸點5、6、7和8。
該基體2和板3在本實例中係被設計成圓形碟盤。
在另外的實例中(未示出)，具有矩形、方形或三角形形狀的板會被使用。理論上，可用於所有基體形狀之全部板的形狀皆是適宜的，只有該等吸點的排列很重要。
每一個該等吸點5、6、7和8皆離該板3的表面9有一間隔A。此所提供的優點係該基體2只會與該基體板1形成甚少支撐點。因為如此，故可能導致該表面或塗層損壞之接觸位置的數目減少。
每一個該等吸點5、6、7和8皆經由一通道10、11、12和13連接於一壓縮空氣源(未示出)。該壓縮空氣源較好係 連接於通道10、11、12、13及一連接位置4。
該等吸點5、6、7和8各具有一管15。該管15的長度會決定該等吸點5、6、7、8及該基體2離該板3之一表面9的間隔A。
管15包含一腳16。該管15係被以腳16固緊於該板3。如圖2中所示。該腳16較好係以螺絲17等螺鎖於板3上。
每一該等吸點5、6、7、8皆具有一可撓表面。在本實例中該可撓表面係由橡膠唇14形成。該橡膠唇14係伸展於該管15之一頂緣上，而使一開孔18保持暢通。
該板3之一表面9的通道10、11、12、13較好係被銑設於板3中。如圖2中所示，該等通道10、11、12、13係各被一封閉件19、20、21、22封閉。此所提供的優點係該等通道能被簡單地製成。
本發明的功能如下：該基體板1較好係使用於基體之旋轉噴漆的裝置。為此目的該基體板1係連接於一部份真空源。
該基體2嗣會被放在該等吸點5、6、7和8上。基體2會被所施加的部份真空可靠地固持，即使在旋轉時。因為該等吸點5、6、7、8之有限數目和小尺寸，故可防止任何已經塗層的背面23被損壞。此對一要在兩面皆被塗層的基體2係特別地有利。
21藉著使用依據本發明的基體板1在一相對於環境被密封的噴漆裝置中，所獲得的優點係有一一起旋轉的空氣柱會形成於該基體2與板3之間的區域中。此會阻止噴漆 或塗層材料透入該板3與基體2之間的區域中。因此，噴灑於該基體2的背面能被避免。
在該基體2之一表面被噴漆及/或塗層之後，該部份真空源會被關閉，因此基體2能被以一傳送單元由該基體板1移除。該基體2嗣會被翻轉而使用圖1中所示的背面23朝上，並置於在該等吸點5、6、7、8上。
該部份真空源現會再開啟，以使該基體2再度可靠地固持於該等吸點5、6、7、8上。
該基體板1會旋轉而來塗層及/或上漆現已在上面的該基體1之背面23。如前所述，此係非常方便妥當的，因已被塗層的頂部現已位在底部。一方面，只有甚少的接觸位置會存在，其可能損害該塗層。另一方面，該一起旋轉的空氣柱會在第二塗層及/或噴漆製程期間阻止噴灑物達到該基體現位於底部而朝向板3之已被塗層的一面。

Claims (9)

  1. 一種在基體之噴漆裝置中用以容裝基體的基體板，其特徵係：該基體板具有三個吸點在一表面上，其中每一吸點離一板之一表面具有一間隔，其中每一吸點具有一管，及其中該等吸點及該基體離該板之該表面的間隔決定該管的長度，其中該管包括一腳，且該管係以該腳固緊於該板。
  2. 如申請專利範圍第1項之基體板，其特徵係：一起旋轉的一空氣柱形成於該基體板之該表面與所容裝的該基體之該間隔中。
  3. 如申請專利範圍第2項之基體板，其特徵係：該基體板包含四個吸點。
  4. 如申請專利範圍第1項之基體板，其特徵係：該等吸點係經由一通道連接於一真空源。
  5. 如申請專利範圍第4項之基體板，其特徵係：該通道係設在該基體板中。
  6. 如申請專利範圍第4項之基體板，其特徵係：該通道係被銑設於該基體板之表面中並被一封閉件封閉。
  7. 如申請專利範圍第1項之基體板，其特徵係：該吸點包含一可撓表面。
  8. 一種如申請專利範圍第1至7項中之任一項的基體板的使用，用在一基體之旋轉噴漆裝置中。
  9. 如申請專利範圍第8項之使用，其特徵係：該旋轉噴漆裝置之一內部區域係相對於環境被封閉。
TW101141288A 2012-01-03 2012-11-07 基體板 TWI621198B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??102012100030.1 2012-01-03
DE102012100030A DE102012100030A1 (de) 2012-01-03 2012-01-03 Substratteller

Publications (2)

Publication Number Publication Date
TW201336009A TW201336009A (zh) 2013-09-01
TWI621198B true TWI621198B (zh) 2018-04-11

Family

ID=47594427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101141288A TWI621198B (zh) 2012-01-03 2012-11-07 基體板

Country Status (8)

Country Link
US (1) US10130971B2 (zh)
EP (1) EP2613347B1 (zh)
KR (1) KR20130079991A (zh)
CN (1) CN103187344A (zh)
DE (2) DE202012013640U1 (zh)
RU (1) RU2624883C2 (zh)
SG (1) SG191493A1 (zh)
TW (1) TWI621198B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101575129B1 (ko) * 2014-01-13 2015-12-08 피에스케이 주식회사 기판 이송 장치 및 방법, 그리고 기판 처리 장치
DE102015104735A1 (de) 2015-03-27 2016-09-29 Obducat Ab Drehteller zur Aufnahme eines Substrats für eine Belackungsvorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4280689A (en) * 1980-06-27 1981-07-28 Nasa Head for high speed spinner having a vacuum chuck
US4357006A (en) * 1980-11-28 1982-11-02 International Business Machines Corporation Distortion free 3 point vacuum fixture
US6590633B1 (en) * 1997-03-25 2003-07-08 Nikon Corporation Stage apparatus and method for producing circuit device utilizing the same
US20090277379A1 (en) * 2006-09-29 2009-11-12 National University Corporation Tohoku University Film coating apparatus

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU892751A1 (ru) * 1980-04-14 1981-12-23 Предприятие П/Я А-7881 Подвеска дл гальванической обработки печатных плат
US4559718A (en) * 1983-08-02 1985-12-24 Oki Electric Industry Co., Ltd. Method and apparatus for drying semiconductor wafers
EP0456426B1 (en) * 1990-05-07 2004-09-15 Canon Kabushiki Kaisha Vacuum type wafer holder
US5230741A (en) * 1990-07-16 1993-07-27 Novellus Systems, Inc. Gas-based backside protection during substrate processing
US5249785A (en) * 1992-04-20 1993-10-05 Boeing Commercial Airplane Group Reconfigurable holding fixture
US6001418A (en) * 1997-12-16 1999-12-14 The University Of North Carolina At Chapel Hill Spin coating method and apparatus for liquid carbon dioxide systems
US6196532B1 (en) * 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members
JP4068783B2 (ja) * 2000-03-08 2008-03-26 東京エレクトロン株式会社 膜形成装置及び膜形成方法における膜の均一性を向上させる方法
US6612590B2 (en) * 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
DE102004019731A1 (de) * 2004-04-20 2005-11-10 Sse Sister Semiconductor Equipment Gmbh Vorrichtung zum Drehbelacken von Substraten
JP4172504B2 (ja) * 2006-06-22 2008-10-29 ソニー株式会社 画像処理装置、撮像装置、および方法
CN201628841U (zh) * 2010-03-23 2010-11-10 中国电子科技集团公司第二研究所 匀胶机电机旋转台
CN102259083B (zh) * 2011-01-19 2013-03-27 沈阳芯源微电子设备有限公司 半导体封装用厚胶膜旋涂方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4280689A (en) * 1980-06-27 1981-07-28 Nasa Head for high speed spinner having a vacuum chuck
US4357006A (en) * 1980-11-28 1982-11-02 International Business Machines Corporation Distortion free 3 point vacuum fixture
US6590633B1 (en) * 1997-03-25 2003-07-08 Nikon Corporation Stage apparatus and method for producing circuit device utilizing the same
US20090277379A1 (en) * 2006-09-29 2009-11-12 National University Corporation Tohoku University Film coating apparatus

Also Published As

Publication number Publication date
EP2613347B1 (de) 2023-06-21
SG191493A1 (en) 2013-07-31
KR20130079991A (ko) 2013-07-11
DE102012100030A1 (de) 2013-07-04
US20130189439A1 (en) 2013-07-25
CN103187344A (zh) 2013-07-03
EP2613347A1 (de) 2013-07-10
DE202012013640U1 (de) 2018-11-12
EP2613347C0 (de) 2023-06-21
RU2012155091A (ru) 2014-07-10
US10130971B2 (en) 2018-11-20
TW201336009A (zh) 2013-09-01
RU2624883C2 (ru) 2017-07-07

Similar Documents

Publication Publication Date Title
TWI530447B (zh) 板狀構件運送裝置
TWI455233B (zh) 非接觸式輸送裝置
TWI524012B (zh) Sucker
WO2021030268A3 (en) Microfluidic apparatus and methods of use thereof
TWI621198B (zh) 基體板
WO2007084952A3 (en) Systems and methods for drying a rotating substrate
NO20035498D0 (no) Farmas degree ytiske preparater eller adsorbater av amorft legemiddel
RU2014136559A (ru) Системы с использованием газообразной среды и способы для перемещения дискретных изделий
ATE431963T1 (de) Vorrichtung und verfahren zur oberflächenbehandlung von substraten
JP2013530783A5 (zh)
KR101971086B1 (ko) 기판의 기계가공 장치 및 이를 위한 방법
EP2626898A3 (en) Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
USD838609S1 (en) Apparatus for detecting particle on test film
SG11201808117RA (en) Substrate processing apparatus
ATE414186T1 (de) Vorrichtung zum beidseitigen beschichten von substraten mit einer hydrophoben schicht
WO2018126098A3 (en) Sample processing systems and methods
CN205570695U (zh) 一种四胶头高精度点胶装置
ATE447238T1 (de) Randrad-trockenverteiler
JP2015523179A5 (zh)
HK1247516A2 (zh) 一種裝飾蓋
CN211848113U (zh) 一种汽车饰件无水雾化蒸镀装置
US9637375B2 (en) MEMS device having a getter structure and method of forming the same
JP2009043997A (ja) 塗布方法
USD929534S1 (en) Liquid discharge nozzle for semiconductor substrate processing apparatus
ES1202286U (es) Zócalo para pared