TWI619823B - 真空沈積系統及用以於其中沈積材料之方法 - Google Patents

真空沈積系統及用以於其中沈積材料之方法 Download PDF

Info

Publication number
TWI619823B
TWI619823B TW104140033A TW104140033A TWI619823B TW I619823 B TWI619823 B TW I619823B TW 104140033 A TW104140033 A TW 104140033A TW 104140033 A TW104140033 A TW 104140033A TW I619823 B TWI619823 B TW I619823B
Authority
TW
Taiwan
Prior art keywords
substrate
vacuum
deposition system
chamber
deposition
Prior art date
Application number
TW104140033A
Other languages
English (en)
Chinese (zh)
Other versions
TW201631185A (zh
Inventor
喬斯曼紐 地古坎柏
史丹分 班格特
奧利佛 黑蒙
戴德 海斯
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201631185A publication Critical patent/TW201631185A/zh
Application granted granted Critical
Publication of TWI619823B publication Critical patent/TWI619823B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW104140033A 2014-12-05 2015-12-01 真空沈積系統及用以於其中沈積材料之方法 TWI619823B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2014/076747 WO2016087005A1 (en) 2014-12-05 2014-12-05 Material deposition system and method for depositing material in a material deposition system
??PCT/EP2014/076747 2014-12-05

Publications (2)

Publication Number Publication Date
TW201631185A TW201631185A (zh) 2016-09-01
TWI619823B true TWI619823B (zh) 2018-04-01

Family

ID=52130229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104140033A TWI619823B (zh) 2014-12-05 2015-12-01 真空沈積系統及用以於其中沈積材料之方法

Country Status (5)

Country Link
JP (1) JP6550464B2 (enExample)
KR (1) KR101932943B1 (enExample)
CN (1) CN107002223B (enExample)
TW (1) TWI619823B (enExample)
WO (1) WO2016087005A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106637091B (zh) * 2017-02-24 2019-08-30 旭科新能源股份有限公司 用于薄膜太阳能电池制造的高温蒸发炉
CN109699190B (zh) * 2017-08-24 2023-04-28 应用材料公司 在真空处理系统中非接触地传输装置及方法
JP2021503546A (ja) * 2017-11-16 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 堆積源を冷却する方法、堆積源を冷却するためのチャンバ、及び、堆積システム
KR102495121B1 (ko) * 2018-03-28 2023-02-06 어플라이드 머티어리얼스, 인코포레이티드 기판을 프로세싱하는 진공 프로세싱 장치 및 방법
CN111663104A (zh) * 2020-06-24 2020-09-15 武汉华星光电半导体显示技术有限公司 蒸镀系统及蒸镀方法
US20230361077A1 (en) * 2020-11-23 2023-11-09 Lg Electronics Inc. Self-assembly device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070272156A1 (en) * 2006-05-23 2007-11-29 Semes Co., Ltd. Linear evaporator for manufacturing organic light emitting device using numerous crucibles
US20110052795A1 (en) * 2009-09-01 2011-03-03 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US20120064728A1 (en) * 2010-09-15 2012-03-15 Jeong-Ho Yi Substrate depositing system and depositing method using the same
JP5364200B2 (ja) * 2009-03-31 2013-12-11 エスエヌユー プレシジョン カンパニー リミテッド 薄膜蒸着装置と薄膜蒸着方法及び薄膜蒸着システム
US8734914B2 (en) * 2007-04-27 2014-05-27 Semiconductor Energy Laboratory Co., Ltd. Film formation method and method for manufacturing light-emitting device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
JP4013859B2 (ja) * 2003-07-17 2007-11-28 富士電機ホールディングス株式会社 有機薄膜の製造装置
JP4685404B2 (ja) * 2003-10-15 2011-05-18 三星モバイルディスプレイ株式會社 有機電界発光素子の垂直蒸着方法，その装置，及び有機電界発光素子の垂直蒸着装置に使用される蒸着源
KR100635496B1 (ko) * 2005-02-25 2006-10-17 삼성에스디아이 주식회사 격벽을 구비하는 측면 분사형 선형 증발원 및 그 증발원을구비하는 증착장치
US20080131587A1 (en) * 2006-11-30 2008-06-05 Boroson Michael L Depositing organic material onto an oled substrate
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
JP2014005478A (ja) * 2010-10-08 2014-01-16 Kaneka Corp 蒸着装置
JP5911958B2 (ja) * 2011-08-25 2016-04-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 長方形基板に層を堆積させるためのマスク構造体、装置および方法
JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法
EP3080327A1 (en) * 2013-12-10 2016-10-19 Applied Materials, Inc. Evaporation source for organic material, apparatus having an evaporation source for organic material, system having an evaporation deposition apparatus with an evaporation source for organic materials, and method for operating an evaporation source for organic material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070272156A1 (en) * 2006-05-23 2007-11-29 Semes Co., Ltd. Linear evaporator for manufacturing organic light emitting device using numerous crucibles
US8734914B2 (en) * 2007-04-27 2014-05-27 Semiconductor Energy Laboratory Co., Ltd. Film formation method and method for manufacturing light-emitting device
JP5364200B2 (ja) * 2009-03-31 2013-12-11 エスエヌユー プレシジョン カンパニー リミテッド 薄膜蒸着装置と薄膜蒸着方法及び薄膜蒸着システム
US20110052795A1 (en) * 2009-09-01 2011-03-03 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US20120064728A1 (en) * 2010-09-15 2012-03-15 Jeong-Ho Yi Substrate depositing system and depositing method using the same

Also Published As

Publication number Publication date
CN107002223A (zh) 2017-08-01
CN107002223B (zh) 2019-11-05
TW201631185A (zh) 2016-09-01
KR101932943B1 (ko) 2018-12-27
JP6550464B2 (ja) 2019-07-24
KR20170092670A (ko) 2017-08-11
JP2017538039A (ja) 2017-12-21
WO2016087005A1 (en) 2016-06-09

Similar Documents

Publication Publication Date Title
TWI619823B (zh) 真空沈積系統及用以於其中沈積材料之方法
TWI690611B (zh) 真空沉積腔室
TWI619829B (zh) 材料沉積裝置、真空沉積系統及沉積材料的方法
US20190226090A1 (en) Nozzle for a distribution assembly of a material deposition source arrangement, material deposition source arrangement, vacuum deposition system and method for depositing material
TWI625876B (zh) 線性分佈管及使用其之材料沈積配置與真空沈積設備及提供材料沈積配置之方法
WO2017054890A1 (en) Variable shaper shield for evaporators and method for depositing an evaporated source material on a substrate
US20190390322A1 (en) Material deposition arrangement, vacuum deposition system and methods therefor
US20190338412A1 (en) Material deposition arrangement, vacuum deposition system and method therefor
US20170321318A1 (en) Material source arrangment and nozzle for vacuum deposition
JP6543664B2 (ja) 真空堆積チャンバ
US20240247362A1 (en) Nozzle for a distributor of a material deposition source, material deposition source, vacuum deposition system and method for depositing material

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees