TWI618456B - 電漿處理系統及在多個電極間均勻分佈射頻功率之方法 - Google Patents
電漿處理系統及在多個電極間均勻分佈射頻功率之方法 Download PDFInfo
- Publication number
- TWI618456B TWI618456B TW101116058A TW101116058A TWI618456B TW I618456 B TWI618456 B TW I618456B TW 101116058 A TW101116058 A TW 101116058A TW 101116058 A TW101116058 A TW 101116058A TW I618456 B TWI618456 B TW I618456B
- Authority
- TW
- Taiwan
- Prior art keywords
- bus bar
- coupled
- electrode
- electrodes
- electrode bus
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract description 34
- 238000009832 plasma treatment Methods 0.000 title description 4
- 239000003990 capacitor Substances 0.000 claims abstract description 45
- 238000002955 isolation Methods 0.000 claims abstract description 39
- 238000004804 winding Methods 0.000 claims description 41
- 239000002826 coolant Substances 0.000 claims description 40
- 230000008878 coupling Effects 0.000 claims description 38
- 238000010168 coupling process Methods 0.000 claims description 38
- 238000005859 coupling reaction Methods 0.000 claims description 38
- 230000002093 peripheral effect Effects 0.000 claims description 25
- 230000036961 partial effect Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 description 24
- 239000007789 gas Substances 0.000 description 22
- 239000000047 product Substances 0.000 description 21
- 239000000758 substrate Substances 0.000 description 16
- 238000009826 distribution Methods 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000005284 excitation Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000005086 pumping Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000005672 electromagnetic field Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
- H05H1/4652—Radiofrequency discharges using inductive coupling means, e.g. coils
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/100,605 | 2011-05-04 | ||
| US13/100,605 US8333166B2 (en) | 2011-05-04 | 2011-05-04 | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201251520A TW201251520A (en) | 2012-12-16 |
| TWI618456B true TWI618456B (zh) | 2018-03-11 |
Family
ID=47089447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101116058A TWI618456B (zh) | 2011-05-04 | 2012-05-04 | 電漿處理系統及在多個電極間均勻分佈射頻功率之方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8333166B2 (enExample) |
| JP (1) | JP6068825B2 (enExample) |
| KR (1) | KR101935766B1 (enExample) |
| CN (1) | CN102766857B (enExample) |
| TW (1) | TWI618456B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8372238B2 (en) * | 2008-05-20 | 2013-02-12 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
| TWI494030B (zh) * | 2008-07-07 | 2015-07-21 | Lam Res Corp | 供使用於電漿處理腔室中之含真空間隙的面向電漿之探針裝置 |
| KR101606736B1 (ko) | 2008-07-07 | 2016-03-28 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버에서 플라즈마 불안정성을 검출하기 위한 패시브 용량성-결합된 정전식 (cce) 프로브 장치 |
| KR101136728B1 (ko) * | 2010-10-18 | 2012-04-20 | 주성엔지니어링(주) | 기판처리장치와 그의 분해 및 조립방법 |
| US8333166B2 (en) * | 2011-05-04 | 2012-12-18 | Nordson Corporation | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
| TWI473382B (zh) * | 2012-09-28 | 2015-02-11 | Au Optronics Corp | 無線電力傳輸裝置 |
| JP6068667B2 (ja) | 2013-10-04 | 2017-01-25 | 東芝三菱電機産業システム株式会社 | 電源装置 |
| JP5857207B2 (ja) * | 2013-11-18 | 2016-02-10 | パナソニックIpマネジメント株式会社 | プラズマ処理装置及び方法 |
| JP6726865B2 (ja) * | 2015-06-05 | 2020-07-22 | パナソニックIpマネジメント株式会社 | プラズマ生成装置 |
| CN105142324A (zh) * | 2015-08-17 | 2015-12-09 | 深圳市华鼎星科技有限公司 | 一种线性等离子发生器 |
| KR101881536B1 (ko) * | 2017-02-24 | 2018-07-24 | 주식회사 뉴파워 프라즈마 | 출력전류 제어가 가능한 전력공급장치 및 이를 이용한 전력공급방법 |
| KR101881535B1 (ko) * | 2017-02-24 | 2018-07-24 | 주식회사 뉴파워 프라즈마 | 수동소자를 구비한 전력공급장치 및 이를 이용한 플라즈마 점화를 위한 전력제공방법 |
| HUE047152T2 (hu) * | 2017-02-28 | 2020-04-28 | Meyer Burger Germany Gmbh | Elektródegység belsõ villamos hálózattal nagyfrekvenciás feszültség hozzávezetésére és tartószerkezet plazmakezelõ berendezéshez |
| KR102038276B1 (ko) * | 2017-04-12 | 2019-10-30 | (주)아이작리서치 | 배치 타입의 플라즈마 원자층 증착 장치 |
| US11143618B2 (en) * | 2018-04-09 | 2021-10-12 | Roche Sequencing Solutions, Inc. | Fabrication of tunneling junctions with nanopores for molecular recognition |
| CN108787634A (zh) * | 2018-07-19 | 2018-11-13 | 深圳市神州天柱科技有限公司 | 一种等离子清洗机 |
| CN110042348A (zh) * | 2019-03-12 | 2019-07-23 | 深圳奥拦科技有限责任公司 | 等离子表面处理装置及方法 |
| CN110911262B (zh) * | 2019-11-12 | 2022-07-22 | 北京北方华创微电子装备有限公司 | 电感耦合等离子体系统 |
| WO2022011581A1 (en) * | 2020-07-15 | 2022-01-20 | Nordson Corporation | Plasma treatment with isolated cooling paths |
| KR102405333B1 (ko) * | 2020-11-25 | 2022-06-07 | (주)이노플라즈텍 | 평판형 필터 전극을 이용한 분말 표면처리용 플라즈마 장치 |
| US11621587B1 (en) | 2022-07-18 | 2023-04-04 | Caps Medical Ltd. | Configurable plasma generating system |
| IL318434A (en) * | 2022-07-18 | 2025-03-01 | Caps Medical Ltd | Plasma production system |
| US12389521B2 (en) | 2022-07-18 | 2025-08-12 | Caps Medical Ltd. | Plasma generating system |
| US20240170254A1 (en) * | 2022-11-21 | 2024-05-23 | Applied Materials, Inc. | Batch processing chambers for plasma-enhanced deposition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495963B1 (en) * | 1998-12-17 | 2002-12-17 | Trikon Holdings Limited | Inductive coil assembly having multiple coil segments for plasma processing apparatus |
| US20060219363A1 (en) * | 2005-03-31 | 2006-10-05 | Naoki Matsumoto | Capacitive coupling plasma processing apparatus and method for using the same |
| TW200920192A (en) * | 2007-10-22 | 2009-05-01 | New Power Plasma Co Ltd | Capacitively coupled plasma reactor |
| US20090288773A1 (en) * | 2008-05-20 | 2009-11-26 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2961103B1 (ja) * | 1998-04-28 | 1999-10-12 | 三菱重工業株式会社 | プラズマ化学蒸着装置 |
| KR20060115734A (ko) | 2003-10-28 | 2006-11-09 | 노드슨 코포레이션 | 플라즈마 프로세싱 시스템 및 플라즈마 처리 방법 |
| WO2006118161A1 (ja) * | 2005-04-28 | 2006-11-09 | Hitachi Kokusai Electric Inc. | 基板処理装置および電極部材 |
| JP5168907B2 (ja) * | 2007-01-15 | 2013-03-27 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法及び記憶媒体 |
| KR100979186B1 (ko) * | 2007-10-22 | 2010-08-31 | 다이나믹솔라디자인 주식회사 | 용량 결합 플라즈마 반응기 |
| KR101528528B1 (ko) * | 2008-05-14 | 2015-06-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Rf 전력 전달을 위한 시간 분해된 조정 방식을 이용하는 펄스화된 플라즈마 처리를 위한 방법 및 장치 |
| US8333166B2 (en) * | 2011-05-04 | 2012-12-18 | Nordson Corporation | Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes |
-
2011
- 2011-05-04 US US13/100,605 patent/US8333166B2/en not_active Expired - Fee Related
-
2012
- 2012-05-02 JP JP2012105137A patent/JP6068825B2/ja not_active Expired - Fee Related
- 2012-05-03 KR KR1020120046880A patent/KR101935766B1/ko not_active Expired - Fee Related
- 2012-05-04 CN CN201210137245.XA patent/CN102766857B/zh not_active Expired - Fee Related
- 2012-05-04 TW TW101116058A patent/TWI618456B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495963B1 (en) * | 1998-12-17 | 2002-12-17 | Trikon Holdings Limited | Inductive coil assembly having multiple coil segments for plasma processing apparatus |
| US20060219363A1 (en) * | 2005-03-31 | 2006-10-05 | Naoki Matsumoto | Capacitive coupling plasma processing apparatus and method for using the same |
| TW200920192A (en) * | 2007-10-22 | 2009-05-01 | New Power Plasma Co Ltd | Capacitively coupled plasma reactor |
| US20090288773A1 (en) * | 2008-05-20 | 2009-11-26 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120125177A (ko) | 2012-11-14 |
| US8333166B2 (en) | 2012-12-18 |
| TW201251520A (en) | 2012-12-16 |
| JP6068825B2 (ja) | 2017-01-25 |
| JP2012238593A (ja) | 2012-12-06 |
| CN102766857A (zh) | 2012-11-07 |
| US20120279658A1 (en) | 2012-11-08 |
| CN102766857B (zh) | 2016-04-13 |
| KR101935766B1 (ko) | 2019-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI618456B (zh) | 電漿處理系統及在多個電極間均勻分佈射頻功率之方法 | |
| JP5747231B2 (ja) | プラズマ生成装置およびプラズマ処理装置 | |
| US5464476A (en) | Plasma processing device comprising plural RF inductive coils | |
| US6422172B1 (en) | Plasma processing apparatus and plasma processing method | |
| US7994724B2 (en) | Inductive plasma applicator | |
| US8372238B2 (en) | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes | |
| US20100074807A1 (en) | Apparatus for generating a plasma | |
| TW200911040A (en) | Plasma processing system, antenna, and use plasma processing system | |
| US20130043128A1 (en) | Sputtering system | |
| WO1995015672A1 (en) | Method and apparatus for planar plasma processing | |
| CN104183451A (zh) | 实现快速散热的法拉第屏蔽装置及等离子体处理装置 | |
| JP4426632B2 (ja) | プラズマ処理装置 | |
| US20030010453A1 (en) | Plasma processing apparatus and plasma processing method | |
| WO2018200409A1 (en) | Applying power to electrodes of plasma reactor | |
| JP5551635B2 (ja) | 薄膜形成装置 | |
| KR101577272B1 (ko) | 롤투롤 공정을 위한 플라즈마 처리장치 | |
| KR100798352B1 (ko) | 다중 배열된 방전실을 갖는 플라즈마 반응기 및 이를이용한 플라즈마 처리 시스템 | |
| JP2012177174A (ja) | 薄膜形成装置 | |
| CN102534524B (zh) | 用于pvd工艺的反应腔室和pvd系统 | |
| KR20110036932A (ko) | 기판 상에 처리되는 물질의 균일성 개선을 위한 증착 장치 및 그 사용 방법 | |
| KR20070112990A (ko) | 다중 배열된 방전실을 갖는 플라즈마 반응기 및 이를이용한 플라즈마 처리 시스템 | |
| US20240404801A1 (en) | Plasma treatment apparatus | |
| KR100845903B1 (ko) | 다중 코어 플라즈마 발생기를 갖는 플라즈마 반응기 | |
| JP4554712B2 (ja) | プラズマ処理装置 | |
| JP2012188684A (ja) | 薄膜形成装置及び薄膜形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |