HUE047152T2 - Elektródegység belsõ villamos hálózattal nagyfrekvenciás feszültség hozzávezetésére és tartószerkezet plazmakezelõ berendezéshez - Google Patents

Elektródegység belsõ villamos hálózattal nagyfrekvenciás feszültség hozzávezetésére és tartószerkezet plazmakezelõ berendezéshez

Info

Publication number
HUE047152T2
HUE047152T2 HUE17158448A HUE17158448A HUE047152T2 HU E047152 T2 HUE047152 T2 HU E047152T2 HU E17158448 A HUE17158448 A HU E17158448A HU E17158448 A HUE17158448 A HU E17158448A HU E047152 T2 HUE047152 T2 HU E047152T2
Authority
HU
Hungary
Prior art keywords
processing system
high frequency
plasma processing
electrode unit
frequency voltage
Prior art date
Application number
HUE17158448A
Other languages
English (en)
Inventor
Hermann Schlemm
Mirko Kehr
Erik Ansorge
Original Assignee
Meyer Burger Germany Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meyer Burger Germany Gmbh filed Critical Meyer Burger Germany Gmbh
Publication of HUE047152T2 publication Critical patent/HUE047152T2/hu

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32577Electrical connecting means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32091Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348Dielectric barrier discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32568Relative arrangement or disposition of electrodes; moving means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
HUE17158448A 2017-02-28 2017-02-28 Elektródegység belsõ villamos hálózattal nagyfrekvenciás feszültség hozzávezetésére és tartószerkezet plazmakezelõ berendezéshez HUE047152T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP17158448.5A EP3367419B1 (de) 2017-02-28 2017-02-28 Elektrodeneinheit mit einem internen elektrischen netzwerk zur zuführung von hochfrequenter spannung und trägeranordnung für eine plasmabehandlungsanlage

Publications (1)

Publication Number Publication Date
HUE047152T2 true HUE047152T2 (hu) 2020-04-28

Family

ID=58266365

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE17158448A HUE047152T2 (hu) 2017-02-28 2017-02-28 Elektródegység belsõ villamos hálózattal nagyfrekvenciás feszültség hozzávezetésére és tartószerkezet plazmakezelõ berendezéshez

Country Status (8)

Country Link
US (1) US20200006041A1 (hu)
EP (1) EP3367419B1 (hu)
JP (1) JP6703198B2 (hu)
KR (1) KR102124434B1 (hu)
CN (1) CN110462782B (hu)
ES (1) ES2758273T3 (hu)
HU (1) HUE047152T2 (hu)
WO (1) WO2018158013A1 (hu)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8303602A (nl) 1983-10-19 1985-05-17 Johannes Hendrikus Leonardus H Plasma-gestimuleerde chemische opdampinrichting en in het bijzonder een substratenondersteunings- en elektrodeopstelling daarvoor en de betreffende onderdelen.
US4887005A (en) 1987-09-15 1989-12-12 Rough J Kirkwood H Multiple electrode plasma reactor power distribution system
AU2003195A (en) 1994-06-21 1996-01-04 Boc Group, Inc., The Improved power distribution for multiple electrode plasma systems using quarter wavelength transmission lines
JP2003031504A (ja) * 2001-07-13 2003-01-31 Sharp Corp プラズマ処理装置及びプラズマ処理方法、それらを用いて作製した半導体装置
WO2009147993A1 (ja) * 2008-06-02 2009-12-10 シャープ株式会社 プラズマ処理装置、それを用いた成膜方法およびエッチング方法
WO2013046286A1 (ja) * 2011-09-26 2013-04-04 株式会社島津製作所 プラズマ成膜装置
JP6218650B2 (ja) * 2014-03-11 2017-10-25 東京エレクトロン株式会社 プラズマ処理装置
DE102015004352A1 (de) 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und Behandlungsvorrichtung für Wafer

Also Published As

Publication number Publication date
US20200006041A1 (en) 2020-01-02
CN110462782B (zh) 2021-09-17
KR20190114015A (ko) 2019-10-08
JP2020510964A (ja) 2020-04-09
JP6703198B2 (ja) 2020-06-03
WO2018158013A1 (de) 2018-09-07
EP3367419A1 (de) 2018-08-29
KR102124434B1 (ko) 2020-06-18
ES2758273T3 (es) 2020-05-04
EP3367419B1 (de) 2019-08-14
CN110462782A (zh) 2019-11-15

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