TWI617436B - 帶載體超薄銅箔，及其製造方法，銅張積層板及印刷配線板 - Google Patents

帶載體超薄銅箔，及其製造方法，銅張積層板及印刷配線板 Download PDF

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Publication number
TWI617436B
TWI617436B TW105107041A TW105107041A TWI617436B TW I617436 B TWI617436 B TW I617436B TW 105107041 A TW105107041 A TW 105107041A TW 105107041 A TW105107041 A TW 105107041A TW I617436 B TWI617436 B TW I617436B
Authority
TW
Taiwan
Prior art keywords
ultra
copper foil
thin copper
carrier
foil
Prior art date
Application number
TW105107041A
Other languages
English (en)
Chinese (zh)
Other versions
TW201710077A (zh
Inventor
Daisuke Nakajima
中島大輔
Toru Hanada
花田徹
Kazuhiro Yoshikawa
吉川和広
Yoshinori Shimizu
清水良憲
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd., 三井金屬鑛業股份有限公司 filed Critical Mitsui Mining & Smelting Co., Ltd.
Publication of TW201710077A publication Critical patent/TW201710077A/zh
Application granted granted Critical
Publication of TWI617436B publication Critical patent/TWI617436B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW105107041A 2015-03-24 2016-03-08 帶載體超薄銅箔，及其製造方法，銅張積層板及印刷配線板 TWI617436B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015060816 2015-03-24

Publications (2)

Publication Number Publication Date
TW201710077A TW201710077A (zh) 2017-03-16
TWI617436B true TWI617436B (zh) 2018-03-11

Family

ID=56978004

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105107041A TWI617436B (zh) 2015-03-24 2016-03-08 帶載體超薄銅箔，及其製造方法，銅張積層板及印刷配線板

Country Status (6)

Country Link
JP (1) JP6650923B2 (ja)
KR (1) KR102531073B1 (ja)
CN (1) CN107428129B (ja)
MY (1) MY183238A (ja)
TW (1) TWI617436B (ja)
WO (1) WO2016152390A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115038818A (zh) * 2020-02-04 2022-09-09 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
WO2023189566A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔、金属張積層板及びプリント配線板
WO2023189565A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔、金属張積層板及びプリント配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1383705A (zh) * 2000-07-07 2002-12-04 三井金属鉱业株式会社 附有载箔的铜箔电路和用它制造印刷电路板的方法、以及印刷电路板
CN101892499A (zh) * 2010-07-24 2010-11-24 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法
JP2014005545A (ja) * 2013-08-30 2014-01-16 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板

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Publication number Priority date Publication date Assignee Title
JP3340307B2 (ja) 1996-03-11 2002-11-05 三井金属鉱業株式会社 プリント配線板用銅箔の製造方法
JP3142270B2 (ja) 1998-04-01 2001-03-07 三井金属鉱業株式会社 プリント配線板の製造方法
IL145153A (en) * 1999-03-23 2005-05-17 Circuit Foil Luxembourg Trading Sarl Method for manufacturing a multilayer printed circuit board and composite foil for use therein
JP2001068816A (ja) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd 銅張積層板及びその銅張積層板を用いたレーザー加工方法
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP3261119B2 (ja) * 2000-05-16 2002-02-25 三井金属鉱業株式会社 プリント配線板の製造方法
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
KR20080094967A (ko) * 2002-03-05 2008-10-27 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트 배선판 및 그의 제조 방법
JP2004263296A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP5256747B2 (ja) * 2008-01-21 2013-08-07 宇部興産株式会社 セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP5929220B2 (ja) * 2011-01-26 2016-06-01 住友ベークライト株式会社 プリント配線板およびプリント配線板の製造方法
CN103314652A (zh) * 2012-01-17 2013-09-18 松下电器产业株式会社 配线基板及其制造方法
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
JP2014208482A (ja) * 2013-03-29 2014-11-06 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
EP3177117A4 (en) * 2015-01-30 2017-12-20 Fujikura, Ltd. Wiring body, wiring substrate, and touch sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1383705A (zh) * 2000-07-07 2002-12-04 三井金属鉱业株式会社 附有载箔的铜箔电路和用它制造印刷电路板的方法、以及印刷电路板
CN101892499A (zh) * 2010-07-24 2010-11-24 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法
JP2014005545A (ja) * 2013-08-30 2014-01-16 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板

Also Published As

Publication number Publication date
CN107428129A (zh) 2017-12-01
WO2016152390A1 (ja) 2016-09-29
KR20170131832A (ko) 2017-11-30
TW201710077A (zh) 2017-03-16
CN107428129B (zh) 2019-06-18
JP6650923B2 (ja) 2020-02-19
KR102531073B1 (ko) 2023-05-09
JPWO2016152390A1 (ja) 2018-01-11
MY183238A (en) 2021-02-18

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