TWI615858B - 導電性粒子、導電材料及連接構造體 - Google Patents

導電性粒子、導電材料及連接構造體 Download PDF

Info

Publication number
TWI615858B
TWI615858B TW101149093A TW101149093A TWI615858B TW I615858 B TWI615858 B TW I615858B TW 101149093 A TW101149093 A TW 101149093A TW 101149093 A TW101149093 A TW 101149093A TW I615858 B TWI615858 B TW I615858B
Authority
TW
Taiwan
Prior art keywords
conductive layer
particles
core material
conductive
substrate
Prior art date
Application number
TW101149093A
Other languages
English (en)
Chinese (zh)
Other versions
TW201333980A (zh
Inventor
Keizo Nishioka
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201333980A publication Critical patent/TW201333980A/zh
Application granted granted Critical
Publication of TWI615858B publication Critical patent/TWI615858B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemically Coating (AREA)
  • Powder Metallurgy (AREA)
TW101149093A 2011-12-21 2012-12-21 導電性粒子、導電材料及連接構造體 TWI615858B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011280084 2011-12-21
JP2011280082 2011-12-21
JP2011280083 2011-12-21

Publications (2)

Publication Number Publication Date
TW201333980A TW201333980A (zh) 2013-08-16
TWI615858B true TWI615858B (zh) 2018-02-21

Family

ID=48668520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101149093A TWI615858B (zh) 2011-12-21 2012-12-21 導電性粒子、導電材料及連接構造體

Country Status (5)

Country Link
JP (2) JP6049461B2 (ja)
KR (1) KR101942602B1 (ja)
CN (2) CN108806824B (ja)
TW (1) TWI615858B (ja)
WO (1) WO2013094636A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6470518B2 (ja) * 2013-07-16 2019-02-13 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6355474B2 (ja) * 2013-08-12 2018-07-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6352103B2 (ja) * 2013-08-12 2018-07-04 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6445833B2 (ja) * 2013-10-21 2018-12-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6453032B2 (ja) * 2013-10-21 2019-01-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6345075B2 (ja) * 2013-10-23 2018-06-20 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6739894B2 (ja) * 2013-11-18 2020-08-12 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015195178A (ja) * 2014-03-26 2015-11-05 デクセリアルズ株式会社 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体
JP6340876B2 (ja) * 2014-03-31 2018-06-13 日立化成株式会社 導電粒子
JP6684052B2 (ja) * 2014-06-11 2020-04-22 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6379761B2 (ja) * 2014-07-09 2018-08-29 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
JP6507551B2 (ja) * 2014-10-03 2019-05-08 日立化成株式会社 導電粒子
JPWO2016063941A1 (ja) * 2014-10-22 2017-08-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
KR102545861B1 (ko) * 2014-10-29 2023-06-21 데쿠세리아루즈 가부시키가이샤 도전 재료
KR20180109832A (ko) * 2016-02-08 2018-10-08 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6737293B2 (ja) * 2016-02-10 2020-08-05 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
CN114951647A (zh) * 2022-05-31 2022-08-30 安徽安坤新材科技有限公司 一种铜铝复合材料的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
JP2011204531A (ja) * 2010-03-26 2011-10-13 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3696429B2 (ja) 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
WO2005073985A1 (ja) * 2004-01-30 2005-08-11 Sekisui Chemical Co., Ltd. 導電性微粒子及び異方性導電材料
JP4563110B2 (ja) * 2004-08-20 2010-10-13 積水化学工業株式会社 導電性微粒子の製造方法
JP4860163B2 (ja) 2005-02-15 2012-01-25 積水化学工業株式会社 導電性微粒子の製造方法
JP2007207665A (ja) * 2006-02-03 2007-08-16 Sekisui Chem Co Ltd 導電性粒子の製造方法、導電性粒子及び異方性導電材料
CN101529574A (zh) * 2006-10-31 2009-09-09 日立化成工业株式会社 电路连接结构体
JP2009032397A (ja) * 2007-07-24 2009-02-12 Sekisui Chem Co Ltd 導電性微粒子
JP2011100605A (ja) * 2009-11-05 2011-05-19 Hitachi Chem Co Ltd 回路接続材料及び、これを用いた回路部材の接続構造
JP5589361B2 (ja) 2009-11-16 2014-09-17 日立化成株式会社 導電粒子及びその製造方法
KR101162890B1 (ko) * 2010-03-17 2012-07-05 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전성 입자의 제조 방법, 이방성 도전 재료 및 접속 구조체
JP5476210B2 (ja) * 2010-05-19 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5940760B2 (ja) * 2010-05-19 2016-06-29 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102089832A (zh) * 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
JP2011204531A (ja) * 2010-03-26 2011-10-13 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体

Also Published As

Publication number Publication date
WO2013094636A1 (ja) 2013-06-27
CN108806824B (zh) 2023-07-25
KR20140106384A (ko) 2014-09-03
TW201333980A (zh) 2013-08-16
JP6247371B2 (ja) 2017-12-13
JPWO2013094636A1 (ja) 2015-04-27
CN108806824A (zh) 2018-11-13
KR101942602B1 (ko) 2019-01-25
JP2017084794A (ja) 2017-05-18
JP6049461B2 (ja) 2016-12-21
CN103748636A (zh) 2014-04-23

Similar Documents

Publication Publication Date Title
TWI615858B (zh) 導電性粒子、導電材料及連接構造體
TWI601158B (zh) Conductive particles, a conductive material, and a connecting structure
TWI607458B (zh) Conductive particle with insulating particle, conductive material and connecting structure
TWI556260B (zh) Conductive particles, anisotropic conductive materials and connecting structures
JP6034177B2 (ja) 導電性粒子、導電材料及び接続構造体
TWI820157B (zh) 導電性粒子、導電材料及連接構造體
TWI604469B (zh) Conductive particles, conductive materials, and connection structures
JP6276351B2 (ja) 導電性粒子、導電材料及び接続構造体
JP6431411B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6478308B2 (ja) 導電性粒子、導電材料及び接続構造体
JP6577723B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6200318B2 (ja) 導電性粒子、導電材料及び接続構造体
JP6441555B2 (ja) 導電性粒子、導電材料及び接続構造体