TWI614509B - 元件檢查裝置及用於該元件檢查裝置的元件加壓工具 - Google Patents

元件檢查裝置及用於該元件檢查裝置的元件加壓工具 Download PDF

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Publication number
TWI614509B
TWI614509B TW106104908A TW106104908A TWI614509B TW I614509 B TWI614509 B TW I614509B TW 106104908 A TW106104908 A TW 106104908A TW 106104908 A TW106104908 A TW 106104908A TW I614509 B TWI614509 B TW I614509B
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TW
Taiwan
Prior art keywords
component
test
heat exchange
unit
temperature
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TW106104908A
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English (en)
Chinese (zh)
Other versions
TW201734489A (zh
Inventor
柳弘俊
李溶植
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宰體有限公司
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Publication date
Application filed by 宰體有限公司 filed Critical 宰體有限公司
Publication of TW201734489A publication Critical patent/TW201734489A/zh
Application granted granted Critical
Publication of TWI614509B publication Critical patent/TWI614509B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
TW106104908A 2016-02-15 2017-02-15 元件檢查裝置及用於該元件檢查裝置的元件加壓工具 TWI614509B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160017395A KR20170095655A (ko) 2016-02-15 2016-02-15 소자검사장치 및 그에 사용되는 소자가압툴
??10-2016-0017395 2016-02-15

Publications (2)

Publication Number Publication Date
TW201734489A TW201734489A (zh) 2017-10-01
TWI614509B true TWI614509B (zh) 2018-02-11

Family

ID=59625296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104908A TWI614509B (zh) 2016-02-15 2017-02-15 元件檢查裝置及用於該元件檢查裝置的元件加壓工具

Country Status (3)

Country Link
KR (1) KR20170095655A (ko)
TW (1) TWI614509B (ko)
WO (1) WO2017142312A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10514416B2 (en) * 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
KR20190105893A (ko) * 2018-03-06 2019-09-18 (주)제이티 소자핸들러
KR102514009B1 (ko) * 2018-03-09 2023-03-28 (주)테크윙 전자부품 테스트용 핸들러
WO2019177326A1 (ko) * 2018-03-11 2019-09-19 (주)제이티 소자검사장치
KR20190120678A (ko) * 2018-04-16 2019-10-24 (주)제이티 소자핸들러
JP7245639B2 (ja) * 2018-12-14 2023-03-24 株式会社アドバンテスト センサ試験装置
KR102190482B1 (ko) * 2019-05-14 2020-12-15 주식회사 탑 엔지니어링 어레이 테스터
KR102348976B1 (ko) * 2019-12-19 2022-01-07 현대제철 주식회사 시편 이송 장치
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
TWI825981B (zh) * 2022-09-07 2023-12-11 京元電子股份有限公司 測試系統及其測試裝置與測試方法
CN115794526B (zh) * 2023-01-05 2023-10-10 法特迪精密科技（苏州）有限公司 片上芯片高温老化测试插座控制系统及控制方法

Citations (5)

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Publication number Priority date Publication date Assignee Title
CN1512186A (zh) * 2002-10-02 2004-07-14 ��ʽ���������Ƽ� 探针片、探针卡、半导体检查装置及半导体装置的制造方法
CN1576871A (zh) * 2003-07-14 2005-02-09 三星电子株式会社 测试半导体器件的装置和方法
JP2007225526A (ja) * 2006-02-24 2007-09-06 Yamada Denon Kk 電気信号及び電源供給試験基板
US20100313667A1 (en) * 2007-11-08 2010-12-16 Yoshio Terada Pressure-sensitive adhesive sheet for testing
TW201341823A (zh) * 2012-02-29 2013-10-16 Jt Corp 元件檢測裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG98373A1 (en) * 1998-11-25 2003-09-19 Advantest Corp Device testing apparatus
JP4813415B2 (ja) * 2007-04-19 2011-11-09 三菱電機株式会社 電子部品の温度試験装置
KR20140000873U (ko) * 2012-07-27 2014-02-07 세메스 주식회사 반도체 소자들의 온도를 제어하기 위한 장치
KR101396539B1 (ko) * 2012-12-06 2014-05-21 피티씨 주식회사 모바일 메모리 모듈 온도 검사장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1512186A (zh) * 2002-10-02 2004-07-14 ��ʽ���������Ƽ� 探针片、探针卡、半导体检查装置及半导体装置的制造方法
CN1576871A (zh) * 2003-07-14 2005-02-09 三星电子株式会社 测试半导体器件的装置和方法
JP2007225526A (ja) * 2006-02-24 2007-09-06 Yamada Denon Kk 電気信号及び電源供給試験基板
US20100313667A1 (en) * 2007-11-08 2010-12-16 Yoshio Terada Pressure-sensitive adhesive sheet for testing
TW201341823A (zh) * 2012-02-29 2013-10-16 Jt Corp 元件檢測裝置

Also Published As

Publication number Publication date
TW201734489A (zh) 2017-10-01
WO2017142312A1 (ko) 2017-08-24
KR20170095655A (ko) 2017-08-23

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