TWI609072B - 安定可濃縮化學機械研磨組成物及其相關方法 - Google Patents

安定可濃縮化學機械研磨組成物及其相關方法 Download PDF

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Publication number
TWI609072B
TWI609072B TW101106931A TW101106931A TWI609072B TW I609072 B TWI609072 B TW I609072B TW 101106931 A TW101106931 A TW 101106931A TW 101106931 A TW101106931 A TW 101106931A TW I609072 B TWI609072 B TW I609072B
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TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
water
polishing composition
soluble
Prior art date
Application number
TW101106931A
Other languages
English (en)
Chinese (zh)
Other versions
TW201249973A (en
Inventor
哈麥德 拉羅特
石進杰
約瑟 雷特亞
林巫
湯瑪士H 卡安塔
法蘭絲 凱莉
J 凱曲 海瑞斯
克里斯多佛J 塔克
Original Assignee
羅門哈斯電子材料Cmp控股公司
陶氏全球科技責任有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料Cmp控股公司, 陶氏全球科技責任有限公司 filed Critical 羅門哈斯電子材料Cmp控股公司
Publication of TW201249973A publication Critical patent/TW201249973A/zh
Application granted granted Critical
Publication of TWI609072B publication Critical patent/TWI609072B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • H10P52/403
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/06Other polishing compositions
    • C09G1/14Other polishing compositions based on non-waxy substances
    • C09G1/16Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • H10P52/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW101106931A 2011-03-03 2012-03-02 安定可濃縮化學機械研磨組成物及其相關方法 TWI609072B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/039,723 US8435896B2 (en) 2011-03-03 2011-03-03 Stable, concentratable chemical mechanical polishing composition and methods relating thereto

Publications (2)

Publication Number Publication Date
TW201249973A TW201249973A (en) 2012-12-16
TWI609072B true TWI609072B (zh) 2017-12-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW101106931A TWI609072B (zh) 2011-03-03 2012-03-02 安定可濃縮化學機械研磨組成物及其相關方法

Country Status (7)

Country Link
US (1) US8435896B2 (enExample)
JP (1) JP6118502B2 (enExample)
KR (1) KR101829635B1 (enExample)
CN (1) CN102702979B (enExample)
DE (1) DE102012004220A1 (enExample)
FR (1) FR2972196B1 (enExample)
TW (1) TWI609072B (enExample)

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TWI419218B (zh) * 2007-07-05 2013-12-11 日立化成工業股份有限公司 金屬膜用研磨液以及研磨方法
KR101389235B1 (ko) * 2010-12-24 2014-04-24 히타치가세이가부시끼가이샤 연마액 및 이 연마액을 이용한 기판의 연마 방법
JP6198740B2 (ja) * 2012-09-18 2017-09-20 株式会社フジミインコーポレーテッド 研磨用組成物
JP6549927B2 (ja) * 2015-07-24 2019-07-24 株式会社ディスコ ホウ素化合物を添加した切削砥石
WO2018168206A1 (ja) * 2017-03-14 2018-09-20 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法ならびにこれを用いた研磨方法および基板の製造方法
KR102611598B1 (ko) * 2017-04-27 2023-12-08 주식회사 동진쎄미켐 화학-기계적 연마용 슬러리 조성물
WO2018217628A1 (en) * 2017-05-25 2018-11-29 Fujifilm Planar Solutions, LLC Chemical mechanical polishing slurry for cobalt applications
WO2020091242A1 (ko) * 2018-10-31 2020-05-07 영창케미칼 주식회사 구리 배리어층 연마용 슬러리 조성물
CN113242890A (zh) * 2018-12-12 2021-08-10 巴斯夫欧洲公司 含有铜和钌的基材的化学机械抛光
CN114686116A (zh) * 2020-12-30 2022-07-01 安集微电子科技(上海)股份有限公司 化学机械抛光液及其使用方法
CN112920716A (zh) * 2021-01-26 2021-06-08 中国科学院上海微系统与信息技术研究所 一种用于氮化钛化学机械抛光的组合物及其使用方法
CN115926629B (zh) * 2022-12-30 2023-12-05 昂士特科技(深圳)有限公司 具有改进再循环性能的化学机械抛光组合物
LU103163B1 (en) * 2023-06-30 2024-12-30 Sampochem Gmbh High-density, sub-zero stable clear liquid composition and the method for producing thereof

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TW200938603A (en) * 2008-02-22 2009-09-16 Rohm & Haas Elect Mat Low-stain polishing composition

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US20060000808A1 (en) * 2004-07-01 2006-01-05 Fuji Photo Film Co., Ltd. Polishing solution of metal and chemical mechanical polishing method
TW200938603A (en) * 2008-02-22 2009-09-16 Rohm & Haas Elect Mat Low-stain polishing composition

Also Published As

Publication number Publication date
KR101829635B1 (ko) 2018-03-29
US8435896B2 (en) 2013-05-07
FR2972196A1 (fr) 2012-09-07
CN102702979A (zh) 2012-10-03
US20120225555A1 (en) 2012-09-06
CN102702979B (zh) 2014-12-03
KR20120101308A (ko) 2012-09-13
FR2972196B1 (fr) 2017-05-19
JP2012199532A (ja) 2012-10-18
JP6118502B2 (ja) 2017-04-19
DE102012004220A1 (de) 2012-09-06
TW201249973A (en) 2012-12-16

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