TWI609072B - 安定可濃縮化學機械研磨組成物及其相關方法 - Google Patents
安定可濃縮化學機械研磨組成物及其相關方法 Download PDFInfo
- Publication number
- TWI609072B TWI609072B TW101106931A TW101106931A TWI609072B TW I609072 B TWI609072 B TW I609072B TW 101106931 A TW101106931 A TW 101106931A TW 101106931 A TW101106931 A TW 101106931A TW I609072 B TWI609072 B TW I609072B
- Authority
- TW
- Taiwan
- Prior art keywords
- mechanical polishing
- chemical mechanical
- water
- polishing composition
- soluble
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H10P52/403—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
-
- H10P52/00—
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/039,723 US8435896B2 (en) | 2011-03-03 | 2011-03-03 | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201249973A TW201249973A (en) | 2012-12-16 |
| TWI609072B true TWI609072B (zh) | 2017-12-21 |
Family
ID=46671508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101106931A TWI609072B (zh) | 2011-03-03 | 2012-03-02 | 安定可濃縮化學機械研磨組成物及其相關方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8435896B2 (enExample) |
| JP (1) | JP6118502B2 (enExample) |
| KR (1) | KR101829635B1 (enExample) |
| CN (1) | CN102702979B (enExample) |
| DE (1) | DE102012004220A1 (enExample) |
| FR (1) | FR2972196B1 (enExample) |
| TW (1) | TWI609072B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI419218B (zh) * | 2007-07-05 | 2013-12-11 | 日立化成工業股份有限公司 | 金屬膜用研磨液以及研磨方法 |
| KR101389235B1 (ko) * | 2010-12-24 | 2014-04-24 | 히타치가세이가부시끼가이샤 | 연마액 및 이 연마액을 이용한 기판의 연마 방법 |
| JP6198740B2 (ja) * | 2012-09-18 | 2017-09-20 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6549927B2 (ja) * | 2015-07-24 | 2019-07-24 | 株式会社ディスコ | ホウ素化合物を添加した切削砥石 |
| WO2018168206A1 (ja) * | 2017-03-14 | 2018-09-20 | 株式会社フジミインコーポレーテッド | 研磨用組成物、その製造方法ならびにこれを用いた研磨方法および基板の製造方法 |
| KR102611598B1 (ko) * | 2017-04-27 | 2023-12-08 | 주식회사 동진쎄미켐 | 화학-기계적 연마용 슬러리 조성물 |
| WO2018217628A1 (en) * | 2017-05-25 | 2018-11-29 | Fujifilm Planar Solutions, LLC | Chemical mechanical polishing slurry for cobalt applications |
| WO2020091242A1 (ko) * | 2018-10-31 | 2020-05-07 | 영창케미칼 주식회사 | 구리 배리어층 연마용 슬러리 조성물 |
| CN113242890A (zh) * | 2018-12-12 | 2021-08-10 | 巴斯夫欧洲公司 | 含有铜和钌的基材的化学机械抛光 |
| CN114686116A (zh) * | 2020-12-30 | 2022-07-01 | 安集微电子科技(上海)股份有限公司 | 化学机械抛光液及其使用方法 |
| CN112920716A (zh) * | 2021-01-26 | 2021-06-08 | 中国科学院上海微系统与信息技术研究所 | 一种用于氮化钛化学机械抛光的组合物及其使用方法 |
| CN115926629B (zh) * | 2022-12-30 | 2023-12-05 | 昂士特科技(深圳)有限公司 | 具有改进再循环性能的化学机械抛光组合物 |
| LU103163B1 (en) * | 2023-06-30 | 2024-12-30 | Sampochem Gmbh | High-density, sub-zero stable clear liquid composition and the method for producing thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
| TW200938603A (en) * | 2008-02-22 | 2009-09-16 | Rohm & Haas Elect Mat | Low-stain polishing composition |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2531431C3 (de) * | 1975-07-14 | 1979-03-01 | Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen | Poliermittel zur Herstellung schleierfreier Halbleiteroberflächen |
| SG99289A1 (en) | 1998-10-23 | 2003-10-27 | Ibm | Chemical-mechanical planarization of metallurgy |
| US6375693B1 (en) | 1999-05-07 | 2002-04-23 | International Business Machines Corporation | Chemical-mechanical planarization of barriers or liners for copper metallurgy |
| JP3551238B2 (ja) * | 1999-09-07 | 2004-08-04 | 三菱住友シリコン株式会社 | シリコンウェーハの研磨液及びこれを用いた研磨方法 |
| JP3525824B2 (ja) * | 1999-09-17 | 2004-05-10 | 日立化成工業株式会社 | Cmp研磨液 |
| WO2002083804A1 (en) | 2001-04-12 | 2002-10-24 | Rodel Holdings, Inc. | Polishing composition having a surfactant |
| US6632259B2 (en) | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
| US6776810B1 (en) * | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
| US7427361B2 (en) * | 2003-10-10 | 2008-09-23 | Dupont Air Products Nanomaterials Llc | Particulate or particle-bound chelating agents |
| KR100599327B1 (ko) * | 2004-03-12 | 2006-07-19 | 주식회사 케이씨텍 | Cmp용 슬러리 및 그의 제조법 |
| TWI334882B (en) * | 2004-03-12 | 2010-12-21 | K C Tech Co Ltd | Polishing slurry and method of producing same |
| JP2005285944A (ja) * | 2004-03-29 | 2005-10-13 | Hitachi Chem Co Ltd | 金属用研磨液及び研磨方法 |
| JP4641155B2 (ja) * | 2004-06-03 | 2011-03-02 | 株式会社日本触媒 | 化学機械研磨用の研磨剤 |
| US7384871B2 (en) | 2004-07-01 | 2008-06-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US7303993B2 (en) | 2004-07-01 | 2007-12-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US7086935B2 (en) | 2004-11-24 | 2006-08-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cellulose-containing polishing compositions and methods relating thereto |
| JP4390757B2 (ja) * | 2005-08-30 | 2009-12-24 | 花王株式会社 | 研磨液組成物 |
| US7824568B2 (en) | 2006-08-17 | 2010-11-02 | International Business Machines Corporation | Solution for forming polishing slurry, polishing slurry and related methods |
| JP2008091411A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| US20090215266A1 (en) * | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| JP4521058B2 (ja) * | 2008-03-24 | 2010-08-11 | 株式会社Adeka | 表面改質コロイダルシリカおよびこれを含有するcmp用研磨組成物 |
| US8540893B2 (en) | 2008-08-04 | 2013-09-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| US8440097B2 (en) * | 2011-03-03 | 2013-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
-
2011
- 2011-03-03 US US13/039,723 patent/US8435896B2/en not_active Expired - Fee Related
-
2012
- 2012-03-01 DE DE102012004220A patent/DE102012004220A1/de not_active Withdrawn
- 2012-03-02 KR KR1020120022020A patent/KR101829635B1/ko not_active Expired - Fee Related
- 2012-03-02 JP JP2012046433A patent/JP6118502B2/ja active Active
- 2012-03-02 TW TW101106931A patent/TWI609072B/zh not_active IP Right Cessation
- 2012-03-02 CN CN201210126850.7A patent/CN102702979B/zh not_active Expired - Fee Related
- 2012-03-05 FR FR1251978A patent/FR2972196B1/fr not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
| TW200938603A (en) * | 2008-02-22 | 2009-09-16 | Rohm & Haas Elect Mat | Low-stain polishing composition |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101829635B1 (ko) | 2018-03-29 |
| US8435896B2 (en) | 2013-05-07 |
| FR2972196A1 (fr) | 2012-09-07 |
| CN102702979A (zh) | 2012-10-03 |
| US20120225555A1 (en) | 2012-09-06 |
| CN102702979B (zh) | 2014-12-03 |
| KR20120101308A (ko) | 2012-09-13 |
| FR2972196B1 (fr) | 2017-05-19 |
| JP2012199532A (ja) | 2012-10-18 |
| JP6118502B2 (ja) | 2017-04-19 |
| DE102012004220A1 (de) | 2012-09-06 |
| TW201249973A (en) | 2012-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |