TWI605948B - 切割設備 - Google Patents

切割設備 Download PDF

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Publication number
TWI605948B
TWI605948B TW102105292A TW102105292A TWI605948B TW I605948 B TWI605948 B TW I605948B TW 102105292 A TW102105292 A TW 102105292A TW 102105292 A TW102105292 A TW 102105292A TW I605948 B TWI605948 B TW I605948B
Authority
TW
Taiwan
Prior art keywords
carrier
sheet
bonding
glass
bonded
Prior art date
Application number
TW102105292A
Other languages
English (en)
Chinese (zh)
Other versions
TW201343403A (zh
Inventor
艾拉莫菲艾那托力艾那托耶菲奇
貝爾曼羅伯特艾倫
布克拜得答納克雷
莊大可
朵美傑佛瑞約翰
艾尼克達溫吉恩
加斯基爾琳達
康嘉才
凱美樂馬維威廉
郭冠廷
林仁傑
曼利羅伯喬治
湯瑪斯約翰克里斯多佛
曾珮璉
張江紀杰
Original Assignee
康寧公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 康寧公司 filed Critical 康寧公司
Publication of TW201343403A publication Critical patent/TW201343403A/zh
Application granted granted Critical
Publication of TWI605948B publication Critical patent/TWI605948B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102105292A 2012-02-08 2013-02-08 切割設備 TWI605948B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261596727P 2012-02-08 2012-02-08

Publications (2)

Publication Number Publication Date
TW201343403A TW201343403A (zh) 2013-11-01
TWI605948B true TWI605948B (zh) 2017-11-21

Family

ID=47741305

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102105292A TWI605948B (zh) 2012-02-08 2013-02-08 切割設備
TW106105024A TW201725125A (zh) 2012-02-08 2013-02-08 具有載體之可撓性玻璃與處理其之方法及設備

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106105024A TW201725125A (zh) 2012-02-08 2013-02-08 具有載體之可撓性玻璃與處理其之方法及設備

Country Status (5)

Country Link
JP (2) JP2015515431A (ko)
KR (1) KR20140129153A (ko)
CN (2) CN104541365B (ko)
TW (2) TWI605948B (ko)
WO (1) WO2013119737A2 (ko)

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US10543662B2 (en) * 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
CN104620209B (zh) 2012-06-09 2018-04-24 约翰逊控制器汽车电子有限责任公司 电容式传感器装置和具有电容式传感器装置的触敏屏
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US20150059411A1 (en) * 2013-08-29 2015-03-05 Corning Incorporated Method of separating a glass sheet from a carrier
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
KR102151247B1 (ko) * 2013-11-11 2020-09-03 삼성디스플레이 주식회사 플렉서블 표시 패널의 제조 방법 및 플렉서블 표시 장치의 제조 방법
CN103606535B (zh) * 2013-11-26 2016-01-06 深圳市华星光电技术有限公司 软性显示器组件的制作方法及其制作的软性显示器组件
TWI523218B (zh) 2013-11-28 2016-02-21 群創光電股份有限公司 有機發光二極體顯示面板及其製作方法
US9260337B2 (en) * 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
EP3099483B1 (en) * 2014-01-27 2022-06-01 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
CN106104778A (zh) * 2014-01-27 2016-11-09 康宁股份有限公司 用于聚合物表面与载体的受控粘结的制品和方法
EP3129221A1 (en) * 2014-04-09 2017-02-15 Corning Incorporated Device modified substrate article and methods for making
WO2016007695A1 (en) * 2014-07-09 2016-01-14 Corning Incorporated Methods for separating a glass sheet
JP2018524201A (ja) 2015-05-19 2018-08-30 コーニング インコーポレイテッド シートをキャリアと結合するための物品および方法
FR3038128B1 (fr) 2015-06-26 2018-09-07 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de fabrication d'un dispositif electronique
KR102524620B1 (ko) 2015-06-26 2023-04-21 코닝 인코포레이티드 시트 및 캐리어를 포함하는 방법들 및 물품들
KR20170096242A (ko) * 2015-12-29 2017-08-24 주식회사 이오테크닉스 레이저 가공장치 및 레이저 가공방법
KR20180099761A (ko) * 2015-12-30 2018-09-05 코닝 인코포레이티드 진공 코팅 공정에서 커버 기판을 반 데르 발스 힘으로 클램핑하는 방법 및 장치
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
CN115925234A (zh) * 2017-08-10 2023-04-07 Ａｇｃ株式会社 Tft用玻璃基板
JP7431160B2 (ja) 2017-12-15 2024-02-14 コーニング インコーポレイテッド 基板を処理するための方法および結合されたシートを含む物品を製造するための方法
CN109592892A (zh) * 2018-11-26 2019-04-09 武汉华工激光工程有限责任公司 一种玻璃的激光加工方法
JP7298161B2 (ja) * 2019-01-18 2023-06-27 Ａｇｃ株式会社 機能層付き基体およびその製造方法
KR20200106755A (ko) * 2019-03-05 2020-09-15 코닝 인코포레이티드 유리 라미네이트 기판의 가공 장치, 이를 이용한 가공 방법 및 절단 방법
CN113910709A (zh) * 2020-07-07 2022-01-11 海南大学 一种真空玻璃及其制作方法
KR20220062192A (ko) * 2020-11-06 2022-05-16 삼성디스플레이 주식회사 기판 적층 구조 및 기판 절단 방법

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Publication number Priority date Publication date Assignee Title
US6814833B2 (en) 2001-10-26 2004-11-09 Corning Incorporated Direct bonding of articles containing silicon
DE102005027800A1 (de) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser
JP2007251080A (ja) * 2006-03-20 2007-09-27 Fujifilm Corp プラスチック基板の固定方法、回路基板およびその製造方法
CN101497150B (zh) * 2008-02-01 2012-10-10 鸿富锦精密工业（深圳）有限公司 激光切割装置
CN101327536A (zh) * 2008-07-29 2008-12-24 扬州大学 复合同步超声频振动微细电解加工方法
TWI354854B (en) * 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
DE102008037404A1 (de) * 2008-09-30 2010-04-01 Schott Solar Ag Verfahren zur chemischen Behandlung eines Substrats
TWI377646B (en) * 2009-08-03 2012-11-21 Substrate structures applied in flexible electrical devices and fabrication method thereof
US8357974B2 (en) 2010-06-30 2013-01-22 Corning Incorporated Semiconductor on glass substrate with stiffening layer and process of making the same
TWI486259B (zh) * 2010-12-27 2015-06-01 Au Optronics Corp 可撓式基板結構及其製作方法

Also Published As

Publication number Publication date
CN104541365B (zh) 2018-02-02
JP2018020957A (ja) 2018-02-08
CN104541365A (zh) 2015-04-22
TW201343403A (zh) 2013-11-01
JP2015515431A (ja) 2015-05-28
WO2013119737A3 (en) 2014-02-27
KR20140129153A (ko) 2014-11-06
WO2013119737A2 (en) 2013-08-15
CN107097004A (zh) 2017-08-29
TW201725125A (zh) 2017-07-16

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