TWI605948B - Cutting apparatus - Google Patents

Cutting apparatus Download PDF

Info

Publication number
TWI605948B
TWI605948B TW102105292A TW102105292A TWI605948B TW I605948 B TWI605948 B TW I605948B TW 102105292 A TW102105292 A TW 102105292A TW 102105292 A TW102105292 A TW 102105292A TW I605948 B TWI605948 B TW I605948B
Authority
TW
Taiwan
Prior art keywords
cutting apparatus
cutting
apparatus
Prior art date
Application number
TW102105292A
Other versions
TW201343403A (en
Inventor
Anatoli Anatolyevich Abramov
Robert Alan Bellman
Dana Craig Bookbinder
Ta Ko Chuang
Jeffrey John Domey
Darwin Gene Enicks
Linda Gaskill
Kiat Chyai Kang
Marvin William Kemmerer
Jen Chieh Lin
Kuan Ting Kuo
Robert George Manley
John Christopher Thomas
Pei Lien Tseng
Jian-Zhi Jay Zhang
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201261596727P priority Critical
Application filed by Corning Inc filed Critical Corning Inc
Publication of TW201343403A publication Critical patent/TW201343403A/en
Application granted granted Critical
Publication of TWI605948B publication Critical patent/TWI605948B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06Joining glass to glass by processes other than fusing
    • C03C27/10Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02Controlled or contamination-free environments or clean space conditions
TW102105292A 2012-02-08 2013-02-08 Cutting apparatus TWI605948B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US201261596727P true 2012-02-08 2012-02-08

Publications (2)

Publication Number Publication Date
TW201343403A TW201343403A (en) 2013-11-01
TWI605948B true TWI605948B (en) 2017-11-21

Family

ID=47741305

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106105024A TW201725125A (en) 2012-02-08 2013-02-08 Flexible glass with a carrier and method and apparatus for processing the same
TW102105292A TWI605948B (en) 2012-02-08 2013-02-08 Cutting apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW106105024A TW201725125A (en) 2012-02-08 2013-02-08 Flexible glass with a carrier and method and apparatus for processing the same

Country Status (5)

Country Link
JP (2) JP2015515431A (en)
KR (1) KR20140129153A (en)
CN (2) CN104541365B (en)
TW (2) TW201725125A (en)
WO (1) WO2013119737A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170182744A1 (en) * 2012-02-08 2017-06-29 Corning Incorporated Device modified substrate article and methods for making
KR101758709B1 (en) 2012-06-09 2017-07-18 존슨 콘트롤즈 오토모티브 일렉트로닉스 게엠베하 Capacitive sensor arrangement and touch-sensitive screen having a capacitive sensor arrangement
TWI617437B (en) 2012-12-13 2018-03-11 Corning Inc Facilitated processing for controlling bonding between sheet and carrier
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US20150059411A1 (en) * 2013-08-29 2015-03-05 Corning Incorporated Method of separating a glass sheet from a carrier
KR20150054305A (en) * 2013-11-11 2015-05-20 삼성디스플레이 주식회사 Method of manufacturing flexible display panel and method of manufacturing flexible display apparatus
CN103606535B (en) * 2013-11-26 2016-01-06 深圳市华星光电技术有限公司 The method of making flexible display assembly and the manufacturing of the flexible display assembly
TWI523218B (en) 2013-11-28 2016-02-21 Innolux Corp Organic light emitting diode display panel and method for manufacturing the same
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
WO2015113020A1 (en) * 2014-01-27 2015-07-30 Corning Incorporated Articles and methods for controlled bonding of polymer surfaces with carriers
WO2015112958A1 (en) * 2014-01-27 2015-07-30 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
JP2017518954A (en) * 2014-04-09 2017-07-13 コーニング インコーポレイテッド Process for preparing modified substrate article, and it in the device
WO2016007695A1 (en) * 2014-07-09 2016-01-14 Corning Incorporated Methods for separating a glass sheet
FR3038128B1 (en) 2015-06-26 2018-09-07 Commissariat Energie Atomique Method of manufacturing an electronic device
KR20170096242A (en) * 2015-12-29 2017-08-24 주식회사 이오테크닉스 Laser processing apparatus and laser processing method
CN108431288A (en) * 2015-12-30 2018-08-21 康宁股份有限公司 Methods and apparatuses to clamp cover substrates in vacuum coating process with van der waals forces

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6814833B2 (en) 2001-10-26 2004-11-09 Corning Incorporated Direct bonding of articles containing silicon
DE102005027800A1 (en) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh A device for multiple separation of a flat workpiece of a brittle material by means of laser
JP2007251080A (en) * 2006-03-20 2007-09-27 Fujifilm Corp Fixing method for plastic substrate, circuit substrate, and manufacturing method therefor
CN101497150B (en) * 2008-02-01 2012-10-10 鸿富锦精密工业(深圳)有限公司 Laser device for cutting
CN101327536A (en) * 2008-07-29 2008-12-24 扬州大学 Composite synchronous superaudio vibrating micro electrolytic machining method
TWI354854B (en) * 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
DE102008037404A1 (en) * 2008-09-30 2010-04-01 Schott Solar Ag A process for the chemical treatment of a substrate
TWI377646B (en) * 2009-08-03 2012-11-21 Substrate structures applied in flexible electrical devices and fabrication method thereof
US8357974B2 (en) 2010-06-30 2013-01-22 Corning Incorporated Semiconductor on glass substrate with stiffening layer and process of making the same
TWI486259B (en) * 2010-12-27 2015-06-01 Au Optronics Corp Flexible substrate structure and method of making the same

Also Published As

Publication number Publication date
WO2013119737A3 (en) 2014-02-27
KR20140129153A (en) 2014-11-06
JP2015515431A (en) 2015-05-28
CN104541365B (en) 2018-02-02
CN104541365A (en) 2015-04-22
CN107097004A (en) 2017-08-29
TW201343403A (en) 2013-11-01
TW201725125A (en) 2017-07-16
WO2013119737A2 (en) 2013-08-15
JP2018020957A (en) 2018-02-08

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