TWI604470B - Conductive film for touch panel - Google Patents

Description

Conductive film for touch panel

The present invention relates to a conductive film which can suppress the generation of moiré.

Recently, as a conductive film provided on a display device, a conductive film for a touch panel has been attracting attention. The touch panel is mainly used in a small-sized device such as a personal digital assistant (PDA) or a mobile phone, but it is considered to promote the large-size application in a computer display or the like.

In such future trends, since the existing electrodes use Indium Tin Oxide (ITO), the current transfer rate is slower and the response speed is slower as the electric resistance becomes larger and the application size becomes larger. The problem of slowing down from the time of touching the fingertip to detecting the position.

Therefore, it is considered that the surface resistance is lowered by arranging a plurality of lattices made of metal thin wires (metal thin wires) to form electrodes. As a method of forming a thin metal wire, for example, JP-A-2004-221564 can be cited.

When a conductive film in which a plurality of such lattices obtained by thin metal wires are arranged is disposed on a display panel of a display device, moiré is generated by interference with a pixel pattern of the display device. Case. As to reduce this kind of Mo In the method of forming a pattern, it has been proposed to form a moiré suppressing portion at the intersection of the lattice (see Japanese Patent Laid-Open Publication No. 2008-282924), or to form a moiré suppression on the line connecting the intersections in the opening of the lattice. The method of the part (refer to Japanese Patent Laid-Open Publication No. 2008-306177).

For example, as described above, when a thin metal wire is used as the electrode of the touch panel, since the fine metal wires are made of an opaque material, transparency or visibility is a problem. When a conductive film using a metal thin wire as an electrode is placed on a display panel of a display device, it is required to have good visibility in the following two modes.

In the first mode, when the display device is turned on and displayed, it is difficult to visually recognize the thin metal wires, and the visible light transmittance is high, and it is difficult to cause optical interference between the pixel period of the display device (for example, the black matrix pattern of the liquid crystal display) and the conductive pattern. Moiré and other noise generated.

In the second mode, when the display device is turned off to be a black screen and the external light such as a fluorescent lamp, sunlight, or light-emitting diode (LED) light is observed, it is difficult to visually recognize the thin metal wires.

In the configuration described in Japanese Laid-Open Patent Publication No. 2008-282924, since the metal layer is formed at the intersection portion and the area of the intersection portion is increased, the intersection portion of the lattice is likely to be conspicuous, which is disadvantageous in terms of visibility. In the configuration described in Japanese Laid-Open Patent Publication No. 2008-306177, since the metal layer is formed in the opening portion, there is a concern that the aperture ratio is lowered and the transparency is lowered.

The present invention has been completed in consideration of such a problem, and aims to provide an electrical conductivity. In the case of arranging a plurality of electrodes made of thin metal wires to form an electrode such as a touch panel, the film can reduce the occurrence of moiré, and it is difficult to visually recognize the fine metal wires and ensure high transparency.

[1] The conductive film of the present invention has a conductive portion and an opening portion made of a thin metal wire, wherein the conductive portion has an intersection formed by a plurality of the thin metal wires, and the metal thin wire is outside the intersection The part is configured with a protrusion.

As a result, an intersection portion centering on the intersection and a dummy intersection portion centering on the intersection of the thin metal wire and the protruding portion are disposed on the thin metal wire. Therefore, the arrangement of the intersection portion is irregular and does not occur. Focus on specific spatial frequencies. As a result, even if the conductive film is provided on, for example, a display panel of a display device, interference with the pixel array pattern does not occur, and generation of moiré can be reduced.

In other words, when the conductive film is provided on the display panel and the conductive portion made of the thin metal wire is used as an electrode such as a touch panel or when it is used as an electromagnetic wave shielding filter, the moiré can be reduced. Produced, and it is difficult to visualize fine metal wires, and high transparency can be ensured.

[2] In the invention, the combined shape of the conductive portion and the opening portion may be a mesh shape.

[3] In this case, it is preferable that the protruding portion is disposed so as to intersect with the one side at a position where at least one of the plurality of sides constituting the mesh shape overlaps the intersection of the mesh shapes.

[4] Further, the protruding portion is arranged to extend across the one side, and the upper portion is extended The shape of the protruding portion may be a line segment shape, an elliptical shape, a rhombic shape, a parallelogram shape or a polygonal shape in which the extending direction is a long axis.

[5] Further, the protruding portion may have a line segment shape in which the extending direction is a long axis.

[6] In this case, it is preferable that the other side crossing the one side is substantially parallel to the long axis of the protruding part.

[7] When the width of the one side is Wa, the length of the one side is La, and the length of the protruding portion in the extending direction is Lb, Wa<Lb≦La is preferable.

[8] At this time, it is preferable that Lb ≧ 2 × Wa and Lb ≦ La / 2.

[9] Further, in the numerical specification, it is preferably 5 μm ≦ Lb ≦ 100 μm.

[10] Further, when the width of the one side is Wa and the line width of the protruding portion is Wb, it is preferably 0.995 × Wa ≦ Wb ≦ 3 × Wa.

[11] Further, when the distance from the intersection of the mesh shape to the center position of the protruding portion on the one side is Da, and the length of the one side is La, it is preferably 0.1 × La ≦ Da ≦ 0.9 × La.

[12] The line width of the above-mentioned protruding portion is preferably 30 μm or less. The line width is more preferably 10 μm or less, and particularly preferably 7 μm or less.

[13] The length of the one side is preferably 50 μm or more and 900 μm or less. The length is more preferably 50 μm or more and 600 μm or less, and particularly preferably 50 μm or more and 500 μm or less.

[14] Further, it is preferable that the conductive portion has a mesh pattern including a plurality of mesh shapes, and the plurality of protruding portions are randomly arranged with respect to the mesh pattern.

[15] At this time, among the plurality of mesh shapes constituting the mesh pattern, the mesh shape in which the protruding portion is not disposed may be randomly present.

[16] In the plurality of mesh shapes constituting the mesh pattern, the arrangement positions of the protruding portions with respect to one or more mesh shapes in which the protruding portions are arranged may be random.

[17] Among the one or more mesh shapes in which the protruding portions are arranged, in a mesh shape in which the protruding portions are arranged on a plurality of sides, the arrangement positions of the protruding portions on the plurality of sides may be random.

[18] Among the protruding portions respectively disposed on a plurality of sides radially extending from one intersection of the mesh shape, at least one of the protruding portions may have a different distance from the one intersection to the center position .

[19] The above-mentioned protruding portions respectively disposed adjacent to the sides may have different distances from the corresponding intersections.

[20] When the number of the above-mentioned sides is Na, the number of the protruding portions is Nb, and the arrangement ratio of the protruding portions is (Nb/Na) × 100%, the arrangement ratio is higher. Good is 10% or more and 100% or less.

[21] The line width of the above fine metal wires is preferably 30 μm or less. The line width is more preferably 10 μm or less, and particularly preferably 7 μm or less. The lower limit value is 0.1 μm or more.

[22] The aperture ratio is preferably 90% or more.

As described above, in the conductive film of the present invention, when a plurality of electrodes made of thin metal wires are arranged to form an electrode such as a touch panel, the generation of moiré can be reduced, and it is difficult to visually recognize the thin metal wires. It also ensures high transparency.

The above described objects, features, and advantages of the invention will be apparent from the description of the appended claims.

10‧‧‧ Conductive film

10a, 10b, 10c‧‧‧ conductive film

12‧‧‧ base

14‧‧‧Electrical Department

16‧‧‧Metal thin wire

16a‧‧‧1st metal thin line

16b‧‧‧2nd metal wire

18‧‧‧ openings

18a, 18b‧‧‧ openings

20‧‧‧ mesh pattern

22, 32‧‧‧ intersection

24‧‧‧ lattice

26‧‧‧ Moir suppression unit (protrusion)

26a‧‧‧1st protrusion

26b‧‧‧2nd protrusion

28‧‧‧ side

30, 34‧‧‧ intersection

36‧‧‧Brown silver

38‧‧‧ gelatin

40‧‧‧ Silver salt photosensitive layer

42‧‧‧Developing silver

44‧‧‧Metal and Silver Department

46‧‧‧Transparent Department

48‧‧‧ Conductive metal

50‧‧‧ copper foil

52‧‧‧Photoresist film

54‧‧‧resist pattern

56‧‧‧ cream

58‧‧‧metal plating

La, Lb‧‧‧ length

Lb1, Lb2‧‧‧ protruding length

Da‧‧‧Distance

Wa, Wb‧‧‧ line width

Θa, θb, θ1, θ2‧‧‧ corner

FIG. 1 is a plan view showing an example of a conductive film of the present embodiment.

Fig. 2 is a cross-sectional view showing a part of a conductive film omitted.

3 is a plan view showing an enlarged portion of an example of a conductive film.

4 (FIG. 4A to FIG. 4E) is a flowchart showing an example of a method of producing a conductive film according to the present embodiment.

5A and 5B are flowcharts showing another example of the method for producing the conductive film of the embodiment.

6A and 6B are flowcharts showing still another example of the method for producing the conductive film of the embodiment.

FIG. 7 is a flowchart showing still another example of the method for producing the conductive film of the embodiment.

8 is a plan view showing an example of a conductive film according to a first modification.

FIG. 9 is a plan view showing an example of a conductive film according to a second modification.

FIG. 10 is a plan view showing an example of a conductive film according to a third modification.

Hereinafter, an embodiment of the conductive film of the present invention will be described with reference to Figs. 1 to 10 . In addition, the "~" which shows the numerical range in this specification is used with the meaning of the numerical value of the above-mentioned before and after it as a lower-

As shown in FIGS. 1 and 2, the conductive film 10 of the present embodiment has a transparent substrate 12 (see FIG. 2) and a conductive portion 14 formed on one main surface of the substrate 12. The conductive portion 14 has a mesh pattern 20 formed by a metal thin wire (hereinafter referred to as a thin metal wire 16) and an opening portion 18. The metal thin wires 16 are made of, for example, gold (Au), silver (Ag), or copper (Cu).

Specifically, the conductive portion 14 has a mesh pattern 20 as shown in FIG. 1 , and the mesh pattern 20 extends in the first direction (x direction) and is arranged in the second direction (y direction in FIG. 1 ). The strip first metal thin wires 16a are formed so as to intersect with the plurality of second metal thin wires 16b extending in the second direction and arranged in the first direction. The mesh pattern 20 has a plurality of intersections 22 formed by a plurality of first metal thin wires 16a and a plurality of second metal thin wires 16b.

Further, the mesh shape of the mesh pattern 20, that is, the combined shape of one opening 18 and the four thin metal wires 16 surrounding the one opening 18 (hereinafter referred to as a lattice 24) is as shown in FIG. It can be square or rhombus. In addition, it may have a polygonal shape such as a regular hexagon. Further, in addition to the shape of one side of the lattice 24 being linear, it may be a curved shape or an arc shape. When it is formed in an arc shape, for example, the two sides facing each other may have a convex arc shape outward, and the two opposite sides may form a convex arc shape inward. Further, the shape of each side may be formed into a wavy line shape in which an outwardly convex circular arc and an inwardly convex circular arc are continuous. It is of course also possible to form the shape of each side as a sinusoid.

In the present embodiment, as shown in FIG. 1, the moiré suppressing portion 26 (projecting portion) is disposed (formed) on the metal thin wire 16 and at a portion other than the intersection 22 . Specifically, the moiré suppressing portion 26 is disposed so as to extend across the one side 28 at a position where at least one side 28 of the plurality of sides 28 constituting the lattice 24 overlaps with the intersection 22 of the lattice 24 . The shape of the moiré suppressing portion 26 is in the shape of a line segment in which the extending direction is the long axis in FIG. Of course, it may be an elliptical shape, a rhombic shape, a parallelogram shape or a polygonal shape in which the extending direction is a long axis. The moiré suppressing portion 26 may be formed of the same metal material as the metal thin wires 16 or may be formed of other metal materials.

Further, the plurality of moiré suppressing portions 26 are randomly arranged with respect to the mesh pattern 20 . The meaning of "randomly arranged" means at least one of the following (a) to (e).

(a) Among the plurality of lattices 24 constituting the mesh pattern 20, moiré suppression is not disposed The grids 24 of the sections 26 are randomly present.

(b) Among the plurality of lattices 24 constituting the mesh pattern 20, the arrangement positions of the moiré suppressing portions 26 with respect to the one or more lattices 24 in which the moiré suppressing portions 26 are disposed are random.

(c) Among the one or more lattices 24 in which the moiré suppression unit 26 is disposed, the arrangement of the moiré suppression unit 26 on the plurality of sides 28 in the lattice 24 in which the moiré suppression unit 26 is disposed on the plurality of sides 28 The location is random.

(d) When the moiré suppressing portion 26 is disposed on each of the plurality of sides 28 extending radially from the one intersection 22 of the lattice 24, at least one moiré suppressing portion 26 is from one intersection 22 The distance to the center position is different from the others.

(e) When the moiré suppression unit 26 is disposed on each of the adjacent sides 28, the distances from the corresponding intersection points 22 are different.

By arranging the moiré suppressing portions 26 of the line shape on the metal thin wires 16 and at the portions other than the intersection 22, the cross-over intersection centering on the intersection 22 of the lattice 24 is disposed in the mesh pattern 20. In the form of the analog cross-shaped portion 34 centering on the intersection 32 between the side 28 of the lattice 24 and the moiré suppressing portion 26, and the moiré suppressing portion 26 is randomly arranged, the intersecting portion 30 and The arrangement of the intersections 34 becomes irregular and does not concentrate on a particular spatial frequency. As a result, even if the conductive film 10 of the present embodiment is provided on, for example, a display panel of a display device, interference with the pixel array pattern does not occur, and generation of moiré can be reduced.

That is, the conductive film 10 is placed on the display panel to arrange a plurality of borrowings. When the lattice 24 formed of the thin metal wires 16 is used as an electrode such as a touch panel or in the case of being used as an electromagnetic wave shielding filter, the generation of moiré can be reduced, and the thin metal wires 16 are difficult to be visually recognized. It also ensures high transparency.

In addition, as shown in FIG. 3, the width of one side 28 of the lattice 24 is Wa, the length of one side 28 (the length between two intersections 22) is La, and the moiré suppressing portion 26 is provided. When the length in the extending direction is Lb, Wa<Lb≦La is preferable.

In the numerical specification, it is preferably 5 μm ≦ Lb ≦ 100 μm.

The lower limit of the length Lb is preferably 2 × Wa or more, more preferably 3 × Wa or more, and particularly preferably 4 × Wa or more. The upper limit of the length Lb is preferably La or less, more preferably La/2 or less, still more preferably La/3 or less, and particularly preferably La/4 or less.

In addition, the length (protrusion length Lb1) of the first protrusion 26a on one opening 18a of the moiré suppression unit 26 and the length of the second protrusion 26b on the other opening 18b (protrusion length Lb2) , can be the same or different. In this case, the lower limit of each of the protruding length Lb1 and the protruding length Lb2 is preferably Wa or more, more preferably 1.5 × Wa or more, and particularly preferably 2 × Wa or more. The upper limit of each of the protruding length Lb1 and the protruding length Lb2 is preferably La/2 or less, more preferably La/4 or less, still more preferably La/6 or less, and particularly preferably La/8 or less.

When the length Lb of the Moiré suppression portion 26 in the extending direction is too short, the pseudo cross-shaped portion 34 cannot be formed, and the generation of moiré can not be obtained. effect. If the length Lb is too long, the aperture ratio is lowered, and high transparency cannot be ensured. This is also the same for each of the protruding length Lb1 and the protruding length Lb2.

The line width Wb of the moiré suppressing portion 26 is preferably 30 μm or less. The line width is more preferably 10 μm or less, and particularly preferably 7 μm or less. At this time, the relationship between the width Wa of one side 28 of the lattice 24 and the line width Wb of the moiré suppressing portion 26 is preferably 0.995 × Wa ≦ Wb ≦ 3.000 × Wa.

The relationship between the width Wa of one side 28 of the lattice 24 and the line width Wb of the moiré suppressing portion 26 is preferably 0.995 × Wa ≦ Wb ≦ 2.500 × Wa, and particularly preferably 0.995 × Wa ≦ Wb ≦ 1.500 × Wa.

The relationship between the width Wa of one side 28 of the lattice 24 and the line width Wb of the moiré suppressing portion 26 is particularly preferably Wb = Wa.

When the line width Wb of the Moiré suppressing portion 26 is too small, the pseudo cross-shaped portion 34 is not substantially formed, and the effect of reducing the occurrence of moiré cannot be obtained. If the line width Wb is too large, the aperture ratio is lowered, and high transparency cannot be ensured.

Further, it is preferable that the other side intersecting with one side 28 on which the moiré suppressing portion 26 is disposed is substantially parallel to the extending direction (long axis) of the moiré suppressing portion 26. In the substantially parallel direction, an angle formed by the extending direction of the one side 28 and the extending direction of the moiré suppressing portion 26 is θ1, and an angle between the extending direction of the one side 28 and the other side is set to When θ2, it is 0°≦| θ1-θ2 |≦5°. When the shape of the lattice 24 is a square or a rectangle, it is preferable that the one side 28 is substantially perpendicular to the extending direction of the moiré suppressing portion 26. Thereby, the moiré suppressing portion 26 and the one side 28 constitute the pseudo cross-shaped portion 34.

Needless to say, the angle | θa | formed by the extending direction of the side 28 and the extending direction of the first protruding portion 26a, and the angle | θb | formed by the extending direction of the side 28 and the extending direction of the second protruding portion 26b may be different. At this time, it is preferably 0° ≦ | θa - θ2 | ≦ 5 °, 0 ° ≦ | θb - θ2 | ≦ 5 °.

Further, when the distance from the center point of the moiré suppressing portion 26 on the intersection 22 to the one side 28 of the lattice 24 is Da, and the length of one side 28 is La, it is preferably 0.1 × La ≦. Da≦0.9×La.

If the distance Da is too small, or is approximately the same as the length La of one side 28, Then, the moiré suppressing portion 26 is disposed close to the intersection 22 of the lattice 24, and as a result, the line width of the cross-shaped intersecting portion 30 centering on the intersection 22 of the lattice 24 is thick, and is easily visually recognized by a so-called thick line. On the other hand, if the range of the distance Da is made narrower than the above range, the degree of freedom of random arrangement becomes small. Therefore, it is preferable that the range of the distance Da is within the above range.

In addition, the number of the sides 28 of the mesh pattern 20 is Na, the number of the moiré suppressing portions 26 is Nb, and the arrangement ratio of the moiré suppressing portions 26 is (Nb/Na) × At 100%, the arrangement rate is preferably 10% or more and 100% or less. The arrangement rate of 100% indicates that one moiré suppressing portion 26 is disposed on each side 28, respectively.

If the arrangement rate is too small, the following problem occurs: in the mesh pattern 20, the region where the dummy cross-shaped portion 34 is not formed is widened, and in this region, the moiré becomes conspicuous. If the arrangement rate is too large, the aperture ratio is lowered, and high transparency cannot be ensured. On the other hand, if the range of the arrangement ratio is made narrower than the above range, the degree of freedom of random arrangement becomes small. Therefore, it is preferable that the range of the arrangement rate is in the above range.

Here, the length La of one side 28 of the lattice 24 may be selected from 50 μm or more and 900 μm or less. The length La is preferably 50 μm or more and 600 μm or less, and more preferably 50 μm or more and 500 μm or less. Further, the line width Wa of the metal thin wires 16 may be selected from 30 μm or less. The line width Wa is preferably 10 μm or less, more preferably 7 μm or less. The lower limit of the line width Wa is 0.1 μm or more. Further, the aperture ratio of the conductive film 10 is preferably 90% or more. This ensures high transparency.

Next, several examples of the method of manufacturing the conductive film 10 of the present embodiment will be described with reference to FIGS. 4A to 7 .

First, a method of exposing a silver salt photosensitive layer provided on the substrate 12 to development and fixing, thereby conducting electricity by the formed metallic silver portion or metallic silver portion and the metallic silver portion may be mentioned. The metal forms the mesh pattern 20 and the moiré suppressing portion 26.

Specifically, as shown in FIG. 4A, a silver salt obtained by mixing silver halide 36 (for example, silver bromide particles, silver chlorobromide particles or silver iodobromide particles) in gelatin 38 is applied to the substrate 12. Photosensitive layer 40. In addition, in FIGS. 4A to 4C, the silver halide 36 is referred to as "particles", but it is exaggerated to fully understand the present invention, and does not indicate size, concentration, or the like.

Then, as shown in FIG. 4B, the silver salt photosensitive layer 40 is subjected to exposure required to form the mesh pattern 20. When silver halide 36 receives light energy, it generates light and generates a minute silver core which is called a "latent image" and cannot be observed with the naked eye.

Then, in order to enlarge the latent image to the visible image which can be observed with the naked eye, development processing is performed as shown in Fig. 4C. Specifically, the silver salt photosensitive layer 40 on which the latent image is formed is subjected to development treatment by a developing treatment liquid (both an alkaline solution and an acidic solution, but usually an alkaline solution). In the development treatment, the silver ions supplied from the silver halide particles or the self-developing solution are reduced to metal silver by using the latent image silver core as a catalyst core by a reducing agent called a cardinal remedy in the developing solution. As a result, the latent image silver core is enlarged to form a visible silver image (developed silver 42).

After the development processing is finished, silver halide 36 which can sensitize light remains in the silver salt photosensitive layer 40, and therefore, in order to remove the silver halide 36, a fixing treatment liquid (acid solution and alkaline) is used as shown in FIG. 4D. All of the solutions, but usually mostly acid The solution is fixed.

By performing this fixing process, the metallic silver portion 44 is formed at the exposed portion, and only the gelatin 38 remains in the unexposed portion, and the translucent portion 46 is formed. In other words, the mesh pattern 20 and the moiré suppressing portion 26 of the combination of the metal thin wires 16 of the metallic silver portion 44 and the opening portions 18 of the light transmitting portion 46 are formed on the base 12.

The reaction formula of the fixing treatment when silver bromide is used as the silver halide 36 and the fixing treatment by the thiosulfate is as follows.

AgBr (solid) + 2 S ₂ O ₃ ions → Ag(S ₂ O ₃ ) ₂ (easy water-soluble complex)

That is, two thiosulfate ions S ₂ O ₃ and silver ions (silver ions derived from AgBr) in gelatin 38 form a silver thiosulfate complex. The silver thiosulfate complex is eluted from gelatin 38 because of its high water solubility. As a result, the developed silver 42 is fixed to the metallic silver portion 44 and remains.

Therefore, the developing step is a step of reacting the reducing agent with the latent image to precipitate the developed silver 42, and the fixing step is a step of eluting the silver halide 36 which is not the developed silver 42 into the water. For details, see TH James, Photographic Process Theory, Fourth Edition, Macmillan Publishing Company, New York, Chapter 15, page 438-page 442, 1997 (THJames, The Theory of the Photographic Process, 4th ed ., Macmillan Publishing Co., Inc, NY, Chapter 15, pp. 438-442.1977).

Further, as shown in FIG. 4E, for example, a plating treatment (either electroless plating or electrolytic plating alone or in combination) may be performed, and the conductive metal 48 may be carried only on the metallic silver portion 44 to form metal silver. The portion 44 and the conductive metal 48 The mesh pattern 20 and the moiré suppressing portion 26.

Further, the mask used for exposing the silver salt photosensitive layer 40 may have a pattern corresponding to the mesh pattern 20 and the pattern in which the moiré suppressing portion 26 is formed in the opening portion 18 of the mesh pattern 20. Mask pattern.

Alternatively, the screen pattern 20 of the silver salt photosensitive layer 40 may be exposed by digitally writing and exposing the silver salt photosensitive layer 40, and the moiré suppressing portion 26 may be formed in the opening portion 18 of the mesh pattern 20. pattern.

As another manufacturing method, as shown in FIG. 5A, for example, a photoresist film 52 formed on the copper foil 50 on the substrate 12 is exposed and developed to form a resist pattern 54, as shown in FIG. 5B. As shown, the mesh pattern 50 and the moiré suppressing portion 26 can be formed by etching the copper foil 50 exposed from the resist pattern 54. At this time, the mask used for exposing the photoresist film 52 may have a mask pattern corresponding to the mesh pattern 20 and the pattern in which the moiré suppressing portion 26 is formed.

Alternatively, the mesh pattern 20 and the pattern in which the moiré suppressing portion 26 is formed may be exposed to the photoresist film 52 by digitally writing and exposing the photoresist film 52.

Further, as shown in FIG. 6A, a paste 56 containing metal fine particles is printed on the substrate 12, and as shown in FIG. 6B, metal plating 58 is performed on the paste 56, whereby the mesh pattern 20 can be formed, and The opening portion 18 of the mesh pattern 20 is formed with a pattern of the moiré suppressing portion 26.

Alternatively, as shown in FIG. 7, a mesh pattern 20 may be formed on the substrate 12 by a screen printing plate or a gravure printing plate, and a moiré suppressing portion may be formed in the opening portion 18 of the mesh pattern 20. 26 patterns.

Alternatively, although not shown, a photosensitive plating layer may be formed on the substrate 12 by using a plating pretreatment material, and then subjected to a plating treatment after exposure and development treatment, whereby the exposed portion and the unexposed portion are respectively The mesh portion and the light transmissive portion are formed to form the mesh pattern 20 and the moiré suppressing portion 26. Further, by further performing physical development and/or plating treatment on the metal portion, the metal portion can carry the conductive metal.

As a more preferable aspect of the method of using a plating pretreatment material, the following two forms are mentioned. In addition, the following more specific contents are disclosed in Japanese Laid-Open Patent Publication No. 2003-213437, Japanese Patent Laid-Open No. Hei. No. 2006-64923, Japanese Patent Laid-Open No. Hei. No. 2006-58797, and Japanese Patent Laid-Open No. Hei. No. 2006-135271. Wait.

(a) coating a coated layer containing a functional group that interacts with a plating catalyst or a precursor thereof on the substrate 12, followed by exposure, development, and plating treatment to form a metal on the material to be plated. The form of the ministry.

(b) sequentially depositing a base layer containing a polymer and a metal oxide on the substrate 12, and a plated layer containing a functional group that interacts with the plating catalyst or its precursor, and then performing exposure and development. The plating treatment is performed to form a metal portion on the material to be plated.

Alternatively, the mesh pattern 20 and the moiré suppressing portion 26 may be formed on the substrate 12 by inkjet.

Next, in the conductive film 10 of the present embodiment, a method of using a silver halide photographic light-sensitive material as a particularly preferable embodiment will be mainly described.

The method for producing the conductive film 10 of the present embodiment is based on a photosensitive material and The form of the development treatment includes the following three forms.

(1) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.

(2) A photosensitive silver halide black-and-white photosensitive material containing a physical development nucleus in a silver halide emulsion layer is subjected to dissolution physical development to form a metallic silver portion on the photosensitive material.

(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development core is superimposed on a photoreceptor having a non-photosensitive layer containing a physical development nucleus to perform diffusion transfer development, and a metallic silver portion is formed on the non-photosensitive image-receiving sheet. Shape.

The form of the above (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or thermally developed silver, which is a filament having a high specific surface area, which is highly active during subsequent plating or physical development.

In the form of the above (2), the silver halide particles which are close to the physical development nucleus are dissolved in the exposed portion and deposited on the developing nucleus, whereby a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. It is also an integrated black and white developing type. The developing action is high activity because it is precipitated on the physical developing core, but the developing silver is a spherical shape having a small specific surface area.

In the form of the above (3), the silver halide particles are dissolved and diffused in the unexposed portion to be deposited on the developing core on the image receiving sheet, whereby a light-transmitting conductive film such as a light-transmitting conductive film is formed on the image receiving sheet. The separation type is a form used to peel off the photoreceptor from the photosensitive material.

In either case, either of the negative development processing and the reverse development processing can be selected (in the case of the diffusion transfer method, negative development processing can be performed by using an automatic positive photosensitive material as a photosensitive material).

Here, chemical development, thermal development, dissolved physical development, and diffusion transfer development refer to the terms commonly used in the industry, and in general textbooks of photographic chemistry, such as Kikuchi, "Photography Chemistry" (Kyoritsu Press, 1955) Released, CEK Mees, "The Theory of The Photographic Processes, 4th ed." (Macmillan, issued in 1977) has explanations. This case relates to the invention of liquid treatment, but it is also possible to refer to the technique of applying the thermal development method as another development method. For example, Japanese Laid-Open Patent Publication No. 2004-184693, Japanese Patent Laid-Open No. 2004-334077, Japanese Patent Laid-Open No. Hei No. 2005-010752, Japanese Patent Application No. 2004-244080, and Japanese Patent Application No. 2004- The technique described in each specification of No. 085655.

In the above-described example, as shown in FIG. 1, the other side intersecting with one side 28 on which the moiré suppressing portion 26 is disposed is substantially parallel to the extending direction (long axis) of the moiré suppressing portion 26, and The following form can be preferably employed.

In other words, as in the conductive film 10a of the first modification shown in FIG. 8, the direction in which the moiré suppressing portion 26 extends (long axis) can be inclined with respect to one side 28 on which the moiré suppressing portion 26 is disposed ( Not orthogonal). In addition, as in the conductive film 10b of the second modification shown in FIG. 9 and the conductive film 10c of the third modification shown in FIG. 10, only the moiré suppressing portion 26 having the first protruding portion 26a has only The moiré suppressing portion 26 of the second protruding portion 26b can be randomly arranged. Figure 9 shows the moiré suppression relative to the configuration. One side 28 of the portion 26, and the extending direction of the moiré suppressing portion 26 is an example in which the (long axis) is orthogonal, and FIG. 10 shows the extending direction of the moiré suppressing portion 26 with respect to one side 28 (long axis) ) is an example of tilt (not orthogonal).

Here, the configuration of each layer of the conductive film 10 of the present embodiment will be described in detail below.

[Base 12]

Examples of the substrate 12 include a plastic film, a plastic plate, and a glass plate.

As the raw material of the plastic film and the plastic sheet, for example, polyester such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN); polyethylene ( Polyethylene (PE), polypropylene (PP), polystyrene, ethylene vinyl acetate/cyclo olefin polymer/cyclic olefin copolymer (EVA/COP/COC) Polyolefins, vinyl resins, and polycarbonate (polycarbonate, PC), polyamidiamine, acrylic resin, triacetyl cellulose (TAC), and the like.

As the substrate 12, preferably PET (melting point: 258 ° C), PEN (melting point: 269 ° C), PE (melting point: 135 ° C), PP (melting point: 163 ° C), polystyrene (melting point: 230 ° C), poly a plastic film or a plastic plate having a melting point of about 290 ° C or lower, such as vinyl chloride (melting point: 180 ° C), polyvinylidene chloride (melting point: 212 ° C) or TAC (melting point: 290 ° C), especially in terms of light transmittance or From the viewpoint of workability and the like, PET is preferred. Since the conductive film 10 for a touch panel or an electromagnetic wave shielding film or the like requires transparency, Therefore, it is preferred that the substrate 12 has a high transparency.

[Silver Salt Photosensitive Layer 40]

The silver salt photosensitive layer 40 (see FIG. 4A) which becomes the conductive layer (the mesh pattern 20 and the moiré suppressing portion 26) of the conductive film 10 contains an additive such as a solvent or a dye in addition to the silver salt and the binder.

The silver salt used in the present embodiment may, for example, be an inorganic silver salt such as silver halide or an organic silver salt such as silver acetate. In the present embodiment, it is preferable to use silver halide which is excellent in characteristics as a light sensor.

The amount of silver applied (the amount of coating of the silver salt) of the silver salt photosensitive layer 40 is preferably 1 g/m ² to 30 g/m ² , more preferably 1 g/m ² to 25 g/m ² , and particularly preferably 5g/m ² ~ 20g/m ² . By setting the amount of coated silver to the above range, a desired surface resistance can be obtained when the conductive film 10 is formed.

Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), polysaccharides such as starch, cellulose and derivatives thereof, and polyepoxy. Ethane, polyvinylamine, chitosan, polylysine, polyacrylic acid, polyalginic acid, polyhyaluronic acid, carboxy cellulose, and the like. These have the properties of neutral, anionic, and cationic depending on the ionicity of the functional group.

The content of the binder contained in the silver salt photosensitive layer 40 of the present embodiment is not particularly limited, and can be appropriately determined within a range in which dispersibility and adhesion can be exhibited. The content of the binder in the silver salt photosensitive layer 40 is preferably 1/4 or more, more preferably 1/2 or more, in terms of a silver/binder volume ratio. Silver / binder volume is better than 100/1, more Good for 50/1 or less. In addition, the silver/binder volume ratio is preferably from 1/1 to 4/1. The silver/binder volume ratio is preferably from 1/1 to 3/1. By setting the silver/binder volume ratio in the silver salt photosensitive layer 40 to this range, even when the amount of coated silver is adjusted, unevenness in suppressing the resistance value can be obtained, and uniform surface resistance can be obtained. Conductive film 10. In addition, the silver/binder volume ratio can be obtained by converting the amount of silver halide/binder (weight ratio) of the raw material into a silver amount/binder amount (weight ratio), followed by a silver amount/binder amount (weight). The ratio is converted to the amount of silver/binder (volume ratio).

<solvent>

The solvent to be used for the formation of the silver salt photosensitive layer 40 is not particularly limited, and examples thereof include water and an organic solvent (for example, an alcohol such as methanol, a ketone such as acetone, a guanamine such as formamide, or a dimethyl hydrazine. An anthraquinone, an ester such as ethyl acetate, an ether or the like, an ionic liquid, and a mixed solvent of these.

The content of the solvent used in the silver salt photosensitive layer 40 of the present embodiment is in the range of 30% by mass to 90% by mass, preferably 50%, based on the total mass of the silver salt, the binder, and the like contained in the silver salt photosensitive layer 40. The range of mass % to 80% by mass.

<Other additives>

The various additives used in the present embodiment are not particularly limited, and those known to use are preferably used.

[other layer composition]

A protective layer (not shown) may be provided on the silver salt photosensitive layer 40. In the present embodiment, the term "protective layer" means a layer containing a binder such as gelatin or a polymer, and is formed to have a feeling in order to exhibit an effect of preventing scratches or improving mechanical properties. The photosensitive silver salt is on the photosensitive layer 40. The thickness thereof is preferably 0.5 μm or less. The coating method and the formation method of the protective layer are not particularly limited, and a known coating method and formation method can be appropriately selected. Further, for example, an undercoat layer may be provided below the silver salt photosensitive layer 40.

Next, each step of the method of producing the conductive film 10 will be described.

[exposure]

In the present embodiment, the case where the conductive portion 14 is implemented by printing is included, but the conductive portion 14 may be formed by exposure, development, or the like in addition to the printing method. That is, the photosensitive material having the silver salt photosensitive layer 40 provided on the substrate 12 or the photosensitive material coated with the photopolymer for photolithography is exposed. Exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-ray. Moreover, the exposure may utilize a light source having a wavelength distribution, or a light source of a specific wavelength may be used.

[development processing]

In the present embodiment, after the silver salt photosensitive layer 40 is exposed, development processing is subsequently performed. For the development treatment, a technique of usual development treatment used in a silver salt photo film or a photographic paper, a film for printing plate, an emulsion mask for a photomask, or the like can be used. The developer is not particularly limited, and a phenidone quinol (PQ) developer, a metol quinol (MQ) developer, and metor-ascorbic acid may also be used. Metol ascorbic acid, MAA) developer, etc., commercially available, for example, Fujifilm (Fuji Film) formula CN-16, CR-56, CP45X, FD-3, PAPITOL, Kodak (KODAK) formula C-41, E-6, RA-4, D-19, D-72, etc. Developer solution, or a developer contained in a kit. Alternatively, a Lith developer solution can be used.

The development treatment in the present invention may include a fixing treatment performed in order to remove the silver salt of the unexposed portion to stabilize it. The fixing treatment in the present invention can be carried out using a fixing treatment technique used in a silver salt photographic film or a printing paper, a film for printing plate making, an emulsion mask for a photomask, and the like.

The fixing temperature in the above fixing step is preferably from about 20 ° C to about 50 ° C, more preferably from 25 ° C to 45 ° C. Further, the fixing time is preferably from 5 seconds to 1 minute, more preferably from 7 seconds to 50 seconds. The amount of the fixing solution to be replenished is preferably 600 ml/m ² or less, more preferably 500 ml/m ² or less, and particularly preferably 300 ml/m ² or less, relative to the amount of the photosensitive material.

The photosensitive material subjected to the development and fixing treatment is preferably subjected to a water washing treatment or a stabilization treatment. In the water washing treatment or the stabilization treatment, it is usually carried out using a water washing amount of 20 liters or less per 1 m ² of the photosensitive material, or may be carried out using a supplementary amount of 3 liters or less (including 0, that is, washing with water).

The mass of the metallic silver contained in the exposed portion after the development treatment is preferably 50% by mass or more, and more preferably 80% by mass or more, based on the mass of the silver contained in the exposed portion before the exposure. When the mass of the silver contained in the exposed portion is 50% by mass or more based on the mass of the silver contained in the exposed portion before the exposure, high conductivity can be obtained, which is preferable.

The gray scale after the development treatment in the present embodiment is not particularly limited, but is preferably more than 4.0. If the gray scale after development treatment exceeds 4.0, it can be kept high. In the light transmissive state of the optical portion, the conductivity of the conductive metal portion (metal thin wire 16) is improved. Examples of the means for setting the gradation to 4.0 or more include the above-mentioned dopants of cerium ions and cerium ions.

The conductive film 10 can be obtained through the above steps, but the surface resistance of the obtained conductive film 10 is preferably in the range of 0.1 Ω/sq. to 100 Ω/sq. The lower limit is preferably 1 Ω/sq. or more, 3 Ω/sq. or more, 5 Ω/sq. or more, and 10 Ω/sq. or more. The upper limit is preferably 70 Ω/sq. or less and 50 Ω/sq. or less. By adjusting the surface resistance within such a range, position detection can be performed even for a large touch panel having an area of 10 cm × 10 cm or more. Further, the conductive sheet after the development treatment can be further subjected to calendering treatment, and can be adjusted to a desired surface resistance by calendering treatment.

[Physical development and plating treatment]

In the present embodiment, in order to improve the conductivity of the metallic silver portion 44 formed by the above-described exposure and development processing, the metallic silver portion 44 may be subjected to physical development and/or plating treatment for carrying the conductive metal particles. In the present invention, the conductive metal particles may be supported on the metallic silver portion 44 by any of physical development or plating treatment, or the physical development and plating treatment may be combined to carry the conductive metal particles on the metallic silver. Part 44. Further, a person who performs physical development and/or plating treatment on the metal silver portion 44 is referred to as a "conductive metal portion".

In the present embodiment, the term "physical development" means that metal particles such as silver ions are reduced by a reducing agent on a core of a metal or a metal compound to precipitate metal particles. The physical development can be used for an instant B film and a single imaging W film, a single imaging slide film, or a printing plate manufacturing, etc., in the present invention. This technique can be used in it.

Further, the physical development may be performed simultaneously with the development processing after the exposure, or may be additionally performed after the development processing.

In the present embodiment, the plating treatment may be performed by electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. A known electroless plating technique can be used for the electroless plating in the present embodiment. For example, an electroless plating technique used in a printed wiring board or the like can be used, and electroless plating is preferably electroless copper plating.

[Oxidation treatment]

In the present embodiment, it is preferable that the metal silver portion 44 after the development treatment and the conductive metal portion formed by the physical development and/or the plating treatment are subjected to an oxidation treatment. By performing an oxidation treatment, for example, when a small amount of metal is deposited on the light-transmitting portion 46, the metal can be removed, and the transmittance of the light-transmitting portion 46 is substantially 100%.

[Electrically conductive metal part]

The line width of the conductive metal portion (metal thin wire 16) of the present embodiment may be selected from 30 μm or less as described above. When the conductive film 10 is used as the electromagnetic wave shielding film, the line width of the fine metal wires 16 is preferably 1 μm or more and 20 μm or less, more preferably 1 μm or more and 9 μm or less, and particularly preferably 2 μm or more and 7 μm or less, and particularly preferably 2 μm or more. , 5 μm or less. When the conductive film 10 is used as the conductive sheet of the touch panel, the lower limit of the line width is preferably 0.1 μm or more, 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit of the line width is preferably 15 μm or less and 10 μm or less. 9 μm or less, 8 μm or less, and 7 μm or less. When the line width is less than the above lower limit, The conductivity may become insufficient, so when used for a touch panel, the detection sensitivity may become insufficient. On the other hand, when the line width exceeds the above upper limit value, the moiré caused by the conductive metal portion becomes conspicuous, or the visibility is deteriorated when used for a touch panel. Further, by having the above range, the moiré of the conductive metal portion can be improved, and the visibility is particularly excellent.

The length of one side of the lattice is preferably 50 μm or more and 900 μm or less, more preferably 50 μm or more and 600 μm or less, and particularly preferably 50 μm or more and 500 μm or less. Further, for the ground connection or the like, the line width of the conductive metal portion may have a portion wider than 200 μm.

The aperture ratio of the conductive metal portion in the present embodiment is preferably 90% or more in terms of visible light transmittance. The aperture ratio is a ratio of the light-transmissive portion 46 from which the metal thin wires 16 and the moiré suppression portion 26 are removed as a whole.

[Translucent part]

The "translucent portion" in the present embodiment is a portion that guides the light-transmitting property other than the conductive metal portion in the electric film 10. As described above, the transmittance of the light transmissive portion 46 is 90% or more, preferably 90% or more, in addition to the transmittance in the wavelength region of 380 nm to 780 nm which contributes to light absorption and reflection of the substrate 12. 95% or more, more preferably 97% or more, particularly preferably 98% or more, and most preferably 99% or more.

As for the exposure method, a method of interposing a glass mask or a pattern exposure by laser drawing is preferred.

[Electrically conductive film 10]

The thickness of the substrate 12 in the conductive film 10 of the present embodiment is preferably 75μm~350μm. When the thickness is in the range of 75 μm to 350 μm, the desired transmittance of visible light can be obtained, and the operation is also easy. In addition, when two conductive films are laminated to form a conductive sheet for a touch panel, the parasitic capacitance between the conductive films 10 can be reduced.

The thickness of the metallic silver portion 44 provided on the substrate 12 can be appropriately determined depending on the coating thickness of the coating material for the silver salt photosensitive layer applied to the substrate 12. The thickness of the metal silver portion 44 may be selected from 0.001 mm to 0.2 mm, preferably 30 μm or less, more preferably 20 μm or less, still more preferably 0.01 μm to 9 μm, and most preferably 0.05 μm to 5 μm. Further, the metal silver portion 44 is preferably in the form of a pattern. The metal silver portion 44 may be one layer or a multilayer structure of two or more layers. When the metal silver portion 44 has a pattern shape and has a multilayer structure of two or more layers, different color sensitivities can be imparted in order to be sensitive to different wavelengths. Thereby, if the exposure wavelength is changed and exposure is performed, a different pattern can be formed in each layer.

As a use of the touch panel, the thinner the thickness of the conductive metal portion is, the wider the viewing angle of the display panel is. Therefore, it is preferable to increase the visibility, and also to improve the visibility. From such a viewpoint, the thickness of the layer containing the conductive metal carried by the conductive metal portion is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and particularly preferably 0.1 μm or more and less than 3 μm.

In the present embodiment, the metal silver portion 44 having a desired thickness is formed by controlling the coating thickness of the silver salt photosensitive layer 40, and the conductivity can be freely controlled by physical development and/or plating treatment. The thickness of the layer of the metal particles, and therefore even the conductive film 10 having a thickness of less than 5 μm, preferably less than 3 μm, It can also be easily formed.

Further, in the method for producing the conductive film 10 of the present embodiment, the steps of plating or the like are not necessarily required. The reason is that in the method for producing the conductive film 10 of the present embodiment, the desired surface resistance can be obtained by adjusting the amount of coated silver and the silver/binder volume ratio of the silver salt photosensitive layer 40. Further, calendering treatment or the like can be performed as needed.

Preferably, after the silver salt photosensitive layer 40 is subjected to development treatment, it is immersed in a hard coating agent to perform a hard film treatment. Examples of the hard coat agent include dialdehydes such as glutaraldehyde, adipaldehyde, and 2,3-dihydroxy-1,4-dioxane, and those described in Japanese Patent Laid-Open No. Hei 2-141279. By.

A functional layer such as an antireflection layer or a hard coat layer may be added to the conductive film 10.

Further, the present invention can be used in appropriate combination with the techniques disclosed in Tables 1 and 2 below and the techniques of the International Publications. Further, the expressions such as "Japanese Patent Special Open", "No. Bulletin", and "No. Manual" are omitted.

[Table 1]

<Example>

Hereinafter, the present invention will be more specifically described by way of examples of the invention. In addition, the materials, the amounts, the ratios, the processing contents, the processing order, and the like shown in the following examples can be appropriately changed without departing from the gist of the invention. Therefore, the scope of the invention should not be construed as being limited by the specific examples shown below.

[First Embodiment]

In the first embodiment, in the first to the eleventh examples, the line width of the fine metal wires and the length of one side of the lattice were different, and the visibility, the aperture ratio, and the moiré of the conductive film were evaluated. Details of the examples 1 to 11 and evaluation results This is described in Table 3 below.

(Example 1)

(silver halide photosensitive material)

Iodine iodobromochloride particles containing 10.0 g of gelatin and having an average spherical-equivalent diameter of 0.1 μm with respect to 150 g of Ag in an aqueous medium were prepared (I=0.2 mol%, Br=40) Mol%) emulsion.

Further, in the emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ are added at a concentration of 10 ^-7 (mol/mole silver), and Rh ions and Ir ions are doped in the silver bromide particles. . Na ₂ PdCl ₄ was added to the emulsion, followed by gold sulphur sensitization using chloroauric acid and sodium thiosulfate, and the coating amount of silver was 10 g/m ² together with the gelatin hardener. It is applied to a transparent substrate (here, both of polyethylene terephthalate (PET)). At this time, the Ag/gelatin volume ratio was set to 2/1.

20 m of a PET support having a width of 30 cm was coated with a width of 25 cm, and both ends were cut by 3 cm so that the center portion of the coating was 24 cm, thereby obtaining a rolled silver halide photosensitive material.

(exposure)

As shown in FIG. 1, the pattern of the moiré suppressing portion 26 is randomly arranged on each side 28 of the lattice 24 constituting the mesh pattern 20, and the substrate 12 of A4 size (210 mm × 297 mm) is subjected to the pattern. exposure. Exposure is a mask that is interspersed with the above pattern and is exposed using parallel light using a high pressure mercury lamp as a light source.

(development processing)

. Developer 1L formula

. Fixer 1L formula

Using the above-mentioned treating agent, the exposed sensing material was subjected to an automatic developing machine FG-710PTS manufactured by Fujifilm Co., Ltd. under the processing conditions: development at 35 ° C for 30 seconds, fixing at 34 ° C for 23 seconds, and washing with running water (5 L / minute) for 20 seconds. Process it.

By performing exposure and development processing as described above, the line width Wa of the metal thin wires 16 is 10 μm, and the length La of one side of the lattice 24 (in this example, a square shape) is 500 μm, and the line width of the moiré suppressing portion 26 is obtained. The conductive film of Example 1 having a Wb of 10 μm and a length Lb of the Moiré suppressing portion 26 of 125.0 μm.

(Example 2)

In the second embodiment, the second embodiment was produced in the same manner as in the above-described first embodiment, except that the length La of one side of the lattice 24 was 400 μm and the length Lb of the moiré suppressing portion 26 was 100.0 μm. Conductive film.

(Example 3)

In the third embodiment, the line width Wa of the metal thin wires 16 is set to 9 μm, the length La of one side of the lattice 24 is set to 400 μm, and the line width Wb of the moiré suppressing portion 26 is set to 9 μm, and the moiré suppressing portion is provided. A conductive film of Example 3 was produced in the same manner as in Example 1 except that the length Lb of 26 was set to 100.0 μm.

(Example 4 to Example 6)

In the fourth embodiment, the fifth embodiment and the sixth embodiment, the line widths Wa of the metal thin wires 16 are set to 8 μm, 7 μm, and 6 μm, respectively, and the length La of one side of the lattice 24 is set to 300 μm, respectively, and the moiré suppression unit 26 is provided. In the same manner as in the above-described first embodiment, the fourth embodiment and the examples were produced except that the line widths Wb were set to 8 μm, 7 μm, and 6 μm, respectively, and the length Lb of the moiré suppression unit 26 was set to 75.0 μm. 5 and the conductive film of Example 6.

(Examples 7 to 9)

In the seventh embodiment, the eighth embodiment and the ninth embodiment, the line widths Wa of the metal thin wires 16 are set to 5 μm, 4 μm, and 3 μm, respectively, and the length La of one side of the lattice 24 is set to 200 μm, and the moiré suppression unit 26 is provided. The line widths Wb are set to 5 μm, 4 μm, and 3 μm, respectively, and the length Lb of the moiré suppression unit 26 is set to 50.0 μm, respectively. A conductive film of Example 7, Example 8, and Example 9 was produced in the same manner as in Example 1 except the above.

(Embodiment 10)

In the tenth embodiment, the line width Wa of the metal thin wire 16 is set to 2 μm, the length La of one side of the lattice 24 is set to 100 μm, and the line width Wb of the moiré suppressing portion 26 is set to 2 μm, and the moiré suppressing portion is provided. A conductive film of Example 10 was produced in the same manner as in Example 1 except that the length Lb of 26 was 25.0 μm.

(Example 11)

In the eleventh embodiment, the line width Wa of the metal thin wires 16 is 1 μm, the length La of one side of the lattice 24 is 50 μm, and the line width Wb of the moiré suppressing portion 26 is 1 μm, and the moiré suppressing portion is provided. A conductive film of Example 11 was produced in the same manner as in Example 1 except that the length Lb of 26 was set to 12.5 μm.

(evaluation of visibility)

<Visual difficulty of metal thin wires>

In the first to eleventh embodiments, the conductive film was attached to the display panel of the display device to form a touch panel. When the touch panel is placed on the rotating disk and the display device is driven to display white, it is visually confirmed whether there are thick lines or black spots, and whether the conductive pattern (mesh pattern or moiré suppressing portion) of the touch panel is conspicuous.

In addition, the case where the boundary between the thick line and the black spot and the conductive pattern is inconspicuous is "◎", and the case where any one of the boundary of the thick line, the black spot, and the conductive pattern is conspicuous is "○", and the thick line is set. Any two of the boundaries of black spots and conductive patterns In the case of conspicuousness, it is set to "△", and the case where all the boundaries of the thick line, the black spot, and the conductive pattern are conspicuous is set to "x".

(Evaluation of Moire)

In each of the first to eleventh embodiments, after the conductive film was attached to the display panel of the display device, the display device was placed on the rotary disk, and the display device was driven to display white. In this state, the rotating disk was rotated at a bias angle of -20 ° to +20 °, and the moiré was visually observed and evaluated.

The moiré was evaluated by the observation screen from the display device at an observation distance of 0.5 m, the case where the moiré was not noticeable was set to ○, and the case where a little moiré was observed at the level of no problem was set to Δ. The case where the moiré is clearly present is set to x. In addition, the case where the angle range of ○ is 10° or more is A, and the case where the angle range of ○ is less than 10° is B, and the angle range which becomes ○ is not the angle of ×. In the case where the range is less than 30°, it is assumed to be C, and the case where there is no angular range of ○ and the angular range of × is 30° or more is assumed to be D.

[table 3]

According to Table 3, in Examples 1 to 11, the visibility was good, and the aperture ratio was also 90% or more, and the Moiré was also evaluated as B or more. In particular, in Examples 2 to 11, the visibility was ◎, the aperture ratio was 90% or more, and the Moiré was evaluated as A.

Therefore, the line width Wa of the metal thin wires 16 can be selected from 30 μm or less, but preferably 10 μm or less, and the length La of one side of the lattice 24 can be selected from 50 μm or more and 900 μm or less, and preferably 50 μm or more and 500 μm or less.

[Second Embodiment]

In the second embodiment, in the above-described representative example 9, the visibility, the aperture ratio, and the moiré when the length Lb of the moiré suppressing portion is changed are evaluated.

(sample 1 to sample 3)

In Sample 1, Sample 2, and Sample 3, the length of the moiré suppressing portion 26 is Conductive films of Sample 1, Sample 2, and Sample 3 were produced in the same manner as in Example 9 except that Lb was set to 6 μm, 9 μm, and 12 μm.

(sample 4)

In the sample 4, a conductive film was produced in the same manner as in the above-described Example 9.

(sample 5 to sample 7)

In the sample 5, the sample 6 and the sample 7, the sample 5, the sample 6, and the sample were produced in the same manner as in the above-described Example 9 except that the length Lb of the moiré suppressing portion 26 was 67 μm, 100 μm, and 200 μm. 7 conductive film.

The evaluation results of Samples 1 to 7 are shown in Table 4.

According to Table 4, in the samples 1 to 7, the visibility was good, the aperture ratio was also 94% or more, and the Moiré was also evaluated as B or more. In the sample 2, the Moire pattern was evaluated as B, but the visibility was evaluated as ◎. In the sample 6, the visibility was evaluated by ○, but the moiré was evaluated as A. Especially in samples 3 to 5, the visibility is ◎, the aperture ratio was 97% or more, and the Moire pattern was evaluated by A.

Therefore, the lower limit of the length Lb is preferably 2 × Wa or more, more preferably 3 × Wa or more, and particularly preferably 4 × Wa or more; and the upper limit of the length Lb is preferably La or less, more preferably La / 2 or less. It is especially good for La/3 or less, and particularly preferably La/4 or less.

[Third embodiment]

In the third embodiment, in the above-described representative embodiment 9, the visibility, the aperture ratio, and the moiré when the line width Wb of the moiré suppressing portion 26 is changed are evaluated.

(Sample 8, Sample 9)

In the sample 8 and the sample 9, the conductive film of the sample 8 and the sample 9 was produced in the same manner as in the above-described Example 9 except that the line width Wb of the moiré suppressing portion 26 was 1.5 μm and 2.7 μm. .

(sample 10)

In the sample 10, a conductive film was produced in the same manner as in the above-described Example 9.

(sample 11 to sample 15)

In the sample 11, the sample 12, the sample 13, the sample 14, and the sample 15, the line width Wb of the moiré suppressing portion 26 is 4.5 μm, 6.0 μm, 7.5 μm, 9.0 μm, and 12.0 μm, respectively. In the same manner as in the above-described Example 9, the conductive films of Sample 11, Sample 12, Sample 13, Sample 14, and Sample 15 were produced.

The evaluation results of Samples 8 to 15 are shown in Table 5.

[table 5]

According to Table 5, in Samples 8 to 15, the Moire pattern of Sample 8 was evaluated as C, and the visibility of Sample 15 was evaluated as Δ. In the other samples 9 to 14, the visibility was good, the aperture ratio was also 95% or more, and the Moiré was also evaluated as B or more. In particular, in Samples 9 to 12, the visibility was ◎, the aperture ratio was 96% or more, and the Moire pattern was evaluated by A.

Therefore, the ratio (Wb/Wa) of the line width Wa of the metal thin wire to the line width Wb of the moiré suppressing portion 26 is preferably 0.9 or more and 3.0 or less, more preferably 0.9 or more and 2.5 or less, and particularly preferably 0.9 or more. It is 2.0 or less, and it is especially preferably 0.9 or more and 1.5 or less.

Further, the conductive film of the present invention is not limited to the above embodiment, and various configurations may of course be employed without departing from the gist of the invention.

10‧‧‧ Conductive film

14‧‧‧Electrical Department

16‧‧‧Metal thin wire

16a‧‧‧1st metal thin line

16b‧‧‧2nd metal wire

18‧‧‧ openings

20‧‧‧ mesh pattern

22, 32‧‧‧ intersection

24‧‧‧ lattice

26‧‧‧ Moir suppression unit (protrusion)

28‧‧‧ side

30, 34‧‧‧ intersection

Claims (18)

A conductive film for a touch panel, which is a conductive film (10) having a conductive portion (14) and an opening portion (18) made of a thin metal wire (16), wherein the conductive film is characterized in that the conductive portion (14) having an intersection (22) of the plurality of metal thin wires (16), and a protruding portion (26) is disposed on the metal thin wire (16) and at a portion other than the intersection (22), and the conductive portion (14) The combination with the opening portion (18) has a mesh shape, and the protruding portion (26) is at least one side (28) of the plurality of sides (28) constituting the mesh shape, and is not shaped like the mesh. The position where the intersection point (22) overlaps is disposed so as to intersect with the one side (28), and the width of the one side (28) is Wa, the length of the one side (28) is La, and the protrusion is provided. When the length of the extending direction of (26) is Lb, it is Lb ≧ 2 × Wa and Lb ≦ La / 2, and the mesh shape is a square or a diamond. The conductive film for a touch panel according to claim 1, wherein the protruding portion (26) extends and intersects with the one side (28), and the protruding portion (26) has a shape extending in the extending direction It is a line segment shape, an elliptical shape, a rhombic shape, a parallelogram shape, or a polygonal shape of a long axis. The conductive film for a touch panel according to claim 2, wherein The protruding portion (26) has a line segment shape in which the extending direction is a long axis. The conductive film for a touch panel according to claim 3, wherein the other side crossing the one side (28) is substantially parallel to the long axis of the protruding portion (26). The conductive film for a touch panel according to claim 1, wherein 5 μm ≦ Lb ≦ 100 μm. The conductive film for a touch panel according to claim 3, wherein when the width of the one side (28) is Wa and the line width of the protruding portion (26) is Wb, it is 0.995. ×Wa≦Wb≦3×Wa. The conductive film for a touch panel according to the first aspect of the invention, wherein the intersection (22) from the mesh shape to the center of the protruding portion (26) on the one side (28) When the distance is Da and the length of the one side (28) is La, it is 0.1 × La ≦ Da ≦ 0.9 × La. The conductive film for a touch panel according to the third aspect of the invention, wherein the protruding portion (26) has a line width (Wb) of 30 μm or less. The conductive film for a touch panel according to claim 3, wherein The length (La) of the one side (28) is 50 μm or more and 900 μm or less. The conductive film for a touch panel according to claim 1, wherein the conductive portion (14) has a mesh pattern (20) including a plurality of mesh shapes, and the plurality of protruding portions (26) are opposed to each other. The mesh pattern (20) is randomly arranged. The conductive film for a touch panel according to claim 10, wherein among the plurality of mesh shapes constituting the mesh pattern (20), the mesh in which the protruding portion (26) is not disposed is randomly present Hole shape. The conductive film for a touch panel according to claim 10, wherein the protruding portion (26) is disposed with respect to the protruding portion in the plurality of mesh shapes constituting the mesh pattern (20) The arrangement position of one or more kinds of mesh shapes of (26) is random. The conductive film for a touch panel according to claim 10, wherein the protruding portion is disposed on the plurality of sides (28) of the one or more mesh shapes in which the protruding portion (26) is disposed In the mesh shape of (26), the arrangement position of the protruding portion (26) on the plurality of sides (28) is random. The conductive film for a touch panel according to the first aspect of the invention, wherein the protruding portion is disposed on a plurality of sides (28) radially extending from one intersection (22) of the mesh shape ( In 26), the distance between at least one of the protruding portions (26) from the one intersection point (22) to the center position is different from the others. The conductive film for a touch panel according to the first aspect of the invention, wherein the protruding portions (26) of the adjacent sides (28) are respectively disposed corresponding to each other The distance of point (22) is different. The conductive film for a touch panel according to the first aspect of the invention, wherein the number of the sides (28) is Na, the number of the protruding portions (26) is Nb, and the protrusion is When the arrangement ratio of the portion (26) is (Nb/Na) × 100%, the above-described arrangement ratio is 10% or more and 100% or less. The conductive film for a touch panel according to the first aspect of the invention, wherein the metal thin wires (16) have a line width of 30 μm or less. The conductive film for a touch panel according to the first aspect of the invention, wherein the aperture ratio is 90% or more.