TWI603160B - Exposure lithography device, exposure lithography system, recording media for storing program, and exposure lithography method - Google Patents

Description

Exposure lithography device, exposure lithography system, storage medium for recording program, and exposure lithography method

The invention relates to an exposure lithography device, an exposure lithography system, a storage medium recording medium and an exposure lithography method, in particular to an exposure lithography device and a micro exposure image on a two-sided lithographic image of an exposed substrate. The image system stores a recording medium of a program executed by the exposure lithography apparatus and the exposure lithography system, and an exposure lithography method of lithographic images on both sides of the substrate to be exposed.

Previously, an exposure lithography apparatus was developed which exposes a light beam modulated based on image information on an exposed substrate as a printed substrate, and lithographically images on the exposed substrate. Moreover, an exposure lithography system has also been developed in which two photographic lithography apparatuses are juxtaposed for lithographic images on both sides of an exposed substrate, one of which is used for the lithography of the first surface, and the other is A lithography for the second surface opposite to the first surface. In the exposure lithography system, after the lithographic image of the first surface of the substrate to be exposed by the exposure lithography apparatus for the first surface, the exposed substrate is moved. It is sent to a predetermined position of the exposure lithography apparatus for the second surface, and the lithographic image is imaged on the second surface of the substrate to be exposed by the exposure lithography apparatus.

As a related art of the exposure lithography system, Patent Document 1 discloses an exposure lithography system which improves the lithographic image on the first surface and the second surface of the substrate to be exposed by using two exposure lithography apparatuses. The yield of the conveyance treatment of the substrate to be exposed at the time.

Each of the exposure lithography apparatuses included in the exposure lithography system includes a lithography unit, the lithography unit includes: a platform moving mechanism for placing the exposed substrate, a platform moving mechanism for linearly moving the platform, and loading on the platform A beam scanning mechanism that scans the light beam on the first surface of the substrate to be exposed. Further, each of the exposure lithography apparatuses includes: an upstream side unit disposed on the upstream side of the lithography unit in the moving direction of the stage; and a downstream side unit disposed on the downstream side of the lithography unit in the moving direction of the stage. Further, each of the exposure lithography apparatuses includes a loading mechanism that carries the substrate to be exposed to the lithography so as to move the substrate to be exposed of the upstream unit and move it in the same direction as the moving direction of the stage. On the platform inside the unit. Further, each of the exposure lithography apparatuses includes a carry-out mechanism that carries the exposed substrate to the downstream side unit so as to move the exposed substrate on the stage in the lithography unit and move it in the transport direction.

In each of the exposure lithography apparatuses, when the light beam is scanned on the first surface of the substrate to be exposed, the stage is moved to the downstream side from the upstream side in the transport direction, and the substrate to be exposed is carried to the platform on the upstream side, and the substrate to be exposed is to be exposed. Move out from the platform on the downstream side.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-341550

In general, when using an exposure lithography apparatus to lithographic images of an exposed substrate, an operator inputs job information to the exposure lithography apparatus, the task information indicating a lithography on the exposed substrate. Processing requirements (tasks) for exposure conditions such as image and lithography. When the same image is continuously lithographically imaged on a plurality of substrates to be exposed under the same exposure conditions, a series of processes are collectively represented in the task information. Moreover, the exposure lithography device performs exposure lithography on the exposed substrate based on the input task information.

In the exposure lithography system disclosed in Patent Document 1, since the one-sided lithography image of each of the two exposed lithography apparatuses is used for each of the exposed substrates, the operator inputs the first surface to one of the exposure lithography apparatuses. Task information, and input the task information of the second side to another exposure lithography device. As described above, since the operator inputs the task information to each of the exposure lithography apparatuses separately, when the operator inputs the erroneously, there is a problem that an image that does not correspond to each other may be slightly shadowed on each surface of the substrate to be exposed.

Moreover, sometimes the exposure lithography process fails in one of the exposure lithography apparatuses, and the exposed substrate which is a defective product is to be removed. In this case, even if the task information is input correctly, there is the following problem: input to another exposure When the task information of the photolithography apparatus is not updated, there is a possibility that the lithography does not correspond to each other on each surface of the substrate to be exposed.

The present invention has been made in view of the above problems, and an object thereof is to provide an exposure lithography apparatus and an exposure lithography system capable of preventing an image that does not correspond to each other on each surface when a lithographic image on both sides of an exposed substrate is prevented. , storage medium recording medium and exposure lithography method.

In order to achieve the above object, an exposure lithography apparatus according to the present invention includes: a first lithography mechanism that exposes a first surface of the substrate to be exposed to the first surface lithographic image; and a memory mechanism for the first mission information The second task information and the corresponding information indicating the correspondence between the first task information and the second task information are stored, and the first task information is an image condition indicating the first image and an exposure condition indicating an exposure condition. Corresponding to the information, the first image is an image of the first surface of the substrate to be exposed, and the second task information is an image condition indicating the second image and an exposure condition indicating an exposure condition. Corresponding to the information, the second image is an image of the second surface opposite to the first surface of the substrate to be exposed; and the second lithography mechanism is formed by the first lithography mechanism. The exposure condition indicated by the first task information is exposed to the first surface of the exposed substrate, and the first image indicated by the first task information is lithographically formed on the first surface, and the exposed substrate is The above second lithography image To the surface of the above-described second exposure based on the exposure conditions corresponding to the information shown in the second object when the first surface information lithography using the first image information corresponding to the task, whereby the above The second image shown in the second task information is lithographically formed on the second surface.

According to the exposure lithography apparatus of the present invention, the first lithography mechanism exposes the first surface of the substrate to be exposed, thereby lithographic images on the first surface.

Here, in the present invention, the first task information, the second task information, and the correspondence information indicating the correspondence relationship between the first task information and the second task information are memorized by the memory mechanism, and the first task information is Corresponding to the image information indicating the first image, the first image is an image of the first surface of the substrate to be exposed, and the second task information is The image information indicating the second image is obtained by correlating the exposure condition information indicating the exposure condition, and the second image is an image of the second surface opposite to the first surface of the substrate to be exposed. Further, in the second lithography mechanism, the first lithography mechanism exposes the first surface of the substrate to be exposed by the exposure conditions indicated by the first task information, and the first surface is exposed. The first image of the first task information is immersed in the surface, and the second surface lithography image is displayed on the first surface based on the corresponding information. The exposure condition indicated by the second task information corresponding to the first task information used in the image is exposed by the second surface, whereby the second image indicated by the second task information is lithographically formed on the second surface. surface.

As described above, according to the exposure lithography apparatus of the present invention, the correspondence information is used, and the first task information used in the first surface lithography image and the second task information used in the second surface lithography image are used. Corresponding information, and using the second task information corresponding to the first task information used in the first lithographic image Since the second lithographic image prevents the lithographic images on both sides of the substrate to be exposed, images that do not correspond to each other are faintly reflected on each surface.

Further, in the exposure lithography apparatus of the present invention, the memory means may include a first memory area in which the first task information is stored and a second memory area in which the second task information is stored, wherein the memory means corresponds to the memory The information is stored in any one of the first memory area and the second memory area. Thereby, the task information corresponding to each other can be simply selected.

On the other hand, in order to achieve the above object, an exposure lithography system according to the present invention includes a first exposure lithography apparatus and a second exposure lithography apparatus, and the first exposure lithography apparatus includes a first memory mechanism and will display the first image. The image information of the image is memorized by the first task information corresponding to the exposure condition information indicating the exposure condition, and the first image is an image of the first surface of the substrate to be exposed; the first lithography mechanism Exposing the first surface by exposure conditions indicated by the first task information, thereby lithographically patterning the first image indicated by the first task information on the first surface; and transmitting means indicating the first surface The information of the task information is transmitted, wherein the first task information is information used by the first lithography mechanism in the first lithography image, and the second exposure lithography device includes a second memory mechanism. The second task information and the correspondence information indicating the correspondence between the first task information and the second task information are stored, and the second task information is an image condition indicating the second image and an exposure condition indicating an exposure condition. Relative information The second image is an image of the second surface opposite to the first surface of the exposed substrate, and the receiving means receives the first task information indicated by the transmitting means. The information determining unit determines a second image and an exposure condition of the lithography on the second surface based on the second task information corresponding to the first task information in the correspondence information, wherein the first task information indicates The information indicating the first task information received by the receiving means; and the second lithography mechanism exposing the second surface by the exposure condition determined by the determining means, thereby using the second image determined by the determining means The lithography is on the second surface.

According to the exposure lithography system of the present invention, the first task information of the first exposure lithography apparatus is used to perform the first task information corresponding to the image information indicating the first image and the exposure condition information indicating the exposure condition. It is remembered that the first image is an image of the lithography on the first surface of the substrate to be exposed. Further, the first lithography mechanism of the first exposure lithography apparatus exposes the first surface by the exposure conditions indicated by the first task information, thereby immersing the image by the first task information On the first side above. Further, the information indicating the first task information is transmitted by the transmitting means of the first exposure lithography apparatus, and the first task information is when the first lithography mechanism is in the first surface lithography image Information used.

On the other hand, in the exposure lithography system of the present invention, the second task information of the second exposure lithography apparatus corresponds to the second task information and the correspondence relationship between the first task information and the second task information. The second task information is obtained by correlating image information indicating the second image with exposure condition information indicating an exposure condition, wherein the second image is a lithography on the exposed substrate and the first The image of the second side opposite to the surface. And receiving, by the receiving means of the second exposure lithography apparatus, the first task information transmitted by the transmitting means Information. Further, the determining means of the second exposure lithography apparatus determines the second image and the exposure of the lithography on the second surface based on the second task information corresponding to the first task information in the correspondence information. The condition that the first task information indicates information indicating the first task information received by the receiving unit. Further, the second lithography mechanism of the second exposure lithography apparatus exposes the second surface under exposure conditions determined by the determining means, thereby lithographically patterning the second image determined by the determining means The second side.

As described above, according to the exposure lithography system of the present invention, the second exposure lithography apparatus previously memorizes the first task information for the first surface lithography image and the second task for the second surface lithography image. Corresponding information corresponding to the information, and using the corresponding information, determining and using the second task information corresponding to the first task information used in the first lithographic image, thereby embossing the image on the second side Therefore, it is possible to prevent an image that does not correspond to each other on each side of the lithographic image on both sides of the substrate to be exposed.

Further, in the exposure lithography system of the present invention, the exposure condition may include: a size of the substrate to be exposed, a number of blocks of the exposed substrate to be exposed, and a lithographic region for determining an image. At least one of the arrangement pattern of the mark in the case where the mark is provided on the exposure substrate, and the type of the photosensitive material of the substrate to be exposed. Thereby, the image can be lithographically exposed under the exposure conditions suitable for the respective faces of the substrate to be exposed.

Further, in the exposure lithography system of the present invention, the correspondence information may be that the identification information for identifying the first task information and the identification of the second task information corresponding to the first task information are recognized. Information corresponding to the income The information indicating the first task information is the identification information of the first task information. Thereby, the amount of information of the information transmitted from the first exposure lithography apparatus to the second exposure lithography apparatus can be reduced as compared with the case of transmitting the first mission information itself.

Further, in the exposure lithography system of the present invention, the transmission means of the first exposure lithography apparatus may transmit the first mission information only when the lithography of the first lithography mechanism is normally completed. News. Thereby, compared with the case where the present invention is not used, it is possible to more reliably prevent an image that does not correspond to each other on each surface when the two-sided lithographic image of the substrate to be exposed is used.

Further, in the exposure lithography system of the present invention, the transmission means of the first exposure lithography apparatus may cause an error indicating that an error has occurred when the lithography of the first lithography mechanism is abnormally completed. Information is sent. Thereby, compared with the case where the present invention is not used, it is possible to more reliably prevent an image that does not correspond to each other on each surface when the two-sided lithographic image of the substrate to be exposed is used.

Furthermore, the exposure lithography system of the present invention may further include a control device, wherein the control device includes: a third memory means for storing the first task information, the second task information, and the corresponding information; and a transmitting means for transmitting the first task information stored by the third memory means to the first exposure lithography apparatus, and transmitting the second task information and the corresponding information to the second exposure lithography apparatus, The first exposure lithography apparatus further includes a second receiving unit that receives the first task information transmitted by the second transmitting unit, and the first lithography mechanism of the first exposure lithography device uses In the first surface lithography image, the second exposure lithography apparatus further includes a third receiving unit, and the third receiving unit receives the second transmitting unit, and the third receiving unit receives the first task information received by the second receiving unit. In the second task information and the correspondence information, the second determining means of the second exposure lithography device determines the second surface on the second surface using the second task information and the corresponding information received by the third receiving means. The second image of the shadow and the exposure conditions. Thereby, the entire system can be managed uniformly by the control device.

Further, in the exposure lithography system of the present invention, the control device may further include an accepting unit that receives the input of the first task information, the second task information, and the corresponding information, and the third of the control device The memory unit memorizes the first task information, the second task information, and the corresponding information accepted by the receiving institution. Thereby, the image corresponding to each other on the respective sides of the substrate to be exposed can be imaged using the task information input by the user.

On the other hand, in order to achieve the above object, an exposure lithography system according to the present invention includes a first exposure lithography apparatus and a second exposure lithography apparatus, and the first exposure lithography apparatus includes: a first memory mechanism, and information on the first task And storing corresponding information indicating a correspondence relationship between the first task information and the second task information, wherein the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition, The first image is an image of a lithography on a first surface of the substrate to be exposed, and the second task information is obtained by associating image information indicating the second image with exposure condition information indicating an exposure condition. The second image is an image in which the lithography is on the second surface opposite to the first surface of the substrate to be exposed; the first lithography machine The first surface is exposed by the exposure condition indicated by the first task information, whereby the first image indicated by the first task information is lithographically formed on the first surface; and the transmitting means transmits the corresponding In the second task information in the information, the second task information corresponds to the first task information used by the first lithography mechanism in the first lithography image, and the second exposure lithography The apparatus includes: a receiving unit that receives the second task information transmitted by the transmitting unit; and a second lithography mechanism that exposes the second surface by an exposure condition indicated by the second task information received by the receiving unit Thereby, the second image indicated by the second task information is lithographically formed on the second surface.

According to the exposure lithography system of the present invention, the first task information of the first exposure lithography apparatus stores the first task information and the corresponding information indicating the correspondence between the first task information and the second task information, wherein The first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition, wherein the first image is an image of the first surface of the substrate to be exposed, The task information is obtained by correlating image information indicating the second image with exposure condition information indicating an exposure condition, and the second image is an image of the first surface of the substrate to be exposed. Further, the first lithography mechanism of the first exposure lithography apparatus exposes the first surface by the exposure conditions indicated by the first task information, thereby the first image indicated by the first task information is micro Shadow on the first side above. Further, the transmitting means for the first exposure lithography apparatus transmits information indicating the second task information in the corresponding information, the second task information and the first lithography by the first lithography mechanism Corresponding to the above-mentioned first task information used in the image.

On the other hand, in the exposure lithography system of the present invention, the second task information transmitted by the transmission means is received by the receiving means of the second exposure lithography apparatus. Further, the second lithography mechanism of the second exposure lithography apparatus exposes the second surface by the exposure conditions indicated by the second task information received by the receiving means, thereby indicating the second task information. The second image is lithographically formed on the second surface.

Thus, according to the exposure lithography system of the present invention, the first exposure lithography device memorizes the corresponding information, and the corresponding information is used for the first task information of the first lithography image and for the second lithography Corresponding to the second task information of the image, and using the corresponding information, the second task information corresponding to the first task information used in the first lithographic image is transmitted to the second exposure lithography device, thereby When the two-sided lithographic image of the substrate to be exposed is prevented, an image that does not correspond to each other is faintly formed on each surface.

Further, in order to achieve the above object, an exposure lithography system according to the present invention includes a first exposure lithography apparatus, a control device, and a second exposure lithography apparatus, and the first exposure lithography apparatus includes: a fourth memory mechanism, for the first task The first task information is obtained by correlating image information indicating the first image with exposure condition information indicating an exposure condition, and the first image is a view of the lithography on the first surface of the substrate to be exposed. The first lithography mechanism exposes the first surface by an exposure condition indicated by the first task information, thereby lithographically representing the first image indicated by the first task information on the first surface; a transmitting unit that transmits information indicating the first task information used in the lithography of the first lithography mechanism, The control device includes: a fifth memory unit that memorizes the first task information, the second task information, and corresponding information indicating a correspondence between the first task information and the second task information, wherein the second task information is The image information indicating the second image is obtained in accordance with exposure condition information indicating an exposure condition, and the second image is an image of the second surface of the substrate to be exposed opposite to the first surface; 4: the receiving means receives the information indicating the first task information transmitted by the third transmitting means; and the fourth transmitting means transmits the second task information corresponding to the first task information in the corresponding information, The first task information indicates information indicating the first task information received by the fourth receiving unit, and the second exposure lithography device includes a fifth receiving unit that indicates the second task transmitted by the fourth transmitting unit. Receiving information of the information; and the second lithography mechanism, the exposure condition indicated by the information indicated by the second task information received by the fifth receiving unit is the second Exposure, thereby the second lithographic image information shown in the second object in the second surface.

According to the exposure lithography system of the present invention, the first task information is memorized by the fourth memory means of the first exposure lithography apparatus, and the first task information is an image information indicating the first image and the exposure Corresponding to the conditional exposure condition information, the first image is an image of the lithography on the first surface of the substrate to be exposed. Further, the first lithography mechanism of the first exposure lithography apparatus exposes the first surface by the exposure conditions indicated by the first task information, thereby the first image indicated by the first task information is micro Shadow on the first side above. Further, the first transmitting means for indicating the lithography of the first lithography means is used by the third transmitting means of the first exposure lithography apparatus Information about the mission information is sent.

On the other hand, in the exposure lithography system of the present invention, the first task information, the second task information, and the correspondence between the first task information and the second task information are described by the fifth memory means of the control device. The second task information is obtained by associating the image information indicating the second image with the exposure condition information indicating the exposure condition, and the second image is the lithography on the exposed substrate and the above The image of the second side opposite to the first side. Further, the fourth receiving means of the control device receives the information indicating the first task information transmitted by the third transmitting means. Further, the fourth task information of the control device transmits the second task information corresponding to the first task information, and the first task information indicates that the fourth receiving device receives the 1 information on mission information.

Further, in the exposure lithography system of the present invention, the information indicating the second task information transmitted by the fourth transmitting means is received by the fifth receiving means of the second exposure lithography apparatus, and the second exposure is performed. The second lithography mechanism of the lithography apparatus exposes the second surface by an exposure condition indicated by the information indicated by the second task information received by the fifth receiving means, thereby transmitting the second task information The second image shown is lithographically on the second surface.

As described above, according to the exposure lithography system of the present invention, the control device memorizes the corresponding information for use in the first task information of the first surface lithography image and the second task image for the second surface lithography image. Corresponding to the task information, and using the corresponding information, the second task information is sent to the second exposure lithography device, the second task information and the self Since the first task information received by the first exposure lithography apparatus in the first surface lithography image corresponds to the first lithography image, it is possible to prevent lithography on both sides of the substrate to be exposed without adding a new function to the exposure lithography apparatus. In the case of an image, images that do not correspond to each other are faintly formed on each side.

On the other hand, in order to achieve the above object, the recording medium of the storage program of the present invention functions as a system in which the first lithography mechanism displays the first substrate to be exposed under the exposure conditions indicated by the first task information. The first exposure is the first image indicated by the first task information, and the first task information is an image condition indicating the first image and an exposure condition indicating an exposure condition. Corresponding to the information, the first image is an image of the first surface of the lithography; and the second lithography mechanism exposes the first surface by the exposure condition indicated by the first task information. The first surface has lithographically reflected the first image indicated by the first task information, and corresponds to the first task information and the second task information when the second surface lithography image of the substrate to be exposed is In the correspondence information of the relationship, the second surface is exposed by the exposure condition indicated by the second task information corresponding to the first task information used when the image is drawn on the first surface, thereby the second surface The second image lithography shown in the task information is in the second The second task information is obtained by associating image information indicating the second image with exposure condition information indicating an exposure condition, wherein the second image is opposite to the first surface of the substrate to be exposed. The image of the second lithography.

Therefore, according to the recording medium of the storage program of the present invention, the computer can function in the same manner as the exposure lithography apparatus and the exposure lithography system of the present invention, and thus Similarly to the exposure lithography apparatus and the exposure lithography system, it is possible to prevent images that do not correspond to each other on each surface when the lithographic images on both sides of the substrate to be exposed are prevented.

Further, in order to achieve the above object, the exposure lithography method of the present invention includes: a memory step of composing first task information, second task information, and corresponding information memory indicating a correspondence relationship between the first task information and the second task information In the memory mechanism, the first task information is obtained by correlating image information indicating the first image with exposure condition information indicating an exposure condition, and the first image is exposed by the first lithography mechanism lithography An image of the first surface of the substrate, the first lithography mechanism exposing the first surface to the first surface lithography image, and the second task information is an image information and representation indicating the second image Corresponding to the exposure condition information of the exposure condition, the second image is an image of the second surface of the substrate to be exposed opposite to the first surface; and the second lithography step is performed by using the first The lithography mechanism exposes the first surface of the exposed substrate by exposure conditions indicated by the first task information, and the first image indicated by the first task information is lithographically formed on the first surface, and On the substrate to be exposed above In the second lithographic image, the exposure condition indicated by the second task information corresponding to the first task information used in the first lithographic image based on the correspondence information is the second The surface exposure exposes the second image indicated by the second task information to the second surface.

Therefore, the exposure lithography method according to the present invention functions in the same manner as the exposure lithography apparatus and the exposure lithography system of the present invention, and thus the substrate to be exposed can be prevented in the same manner as the exposure lithography apparatus and the exposure lithography system. Two-sided lithography image An image that does not correspond to each other is lithographically formed on each side.

According to the present invention, it is possible to achieve an effect of preventing an image that does not correspond to each other on each surface when a lithographic image on both sides of the substrate to be exposed is prevented.

1‧‧‧Exposure lithography system

2‧‧‧1st exposure lithography device

3‧‧‧2nd exposure lithography device

4‧‧‧Reversal device

5‧‧‧Control device

6‧‧‧1st transport department

7‧‧‧2nd Transport Department

8a, 8b‧‧‧wired cable

10‧‧‧ platform

11‧‧‧ base

12‧‧‧Abutment

14‧‧‧ rails

15‧‧‧ gate

16‧‧‧Exposure Department

16a‧‧‧Exposure head

17‧‧‧Light source unit

18‧‧‧Fiber

19‧‧‧Image Processing Unit

20‧‧‧Signal cable

23‧‧‧Photography Department

23a‧‧ Track

24‧‧‧Automatic loading palm (AC palm)

25‧‧‧Inhalation hole

26‧‧‧Extrusion Department

30‧‧‧Subframe

31‧‧‧ Move in

33‧‧‧Motor

34‧‧‧Roller pair

40‧‧‧System Control Department

41‧‧‧Mission Memory

42‧‧‧ Platform Drivers

43‧‧‧ display device

44‧‧‧ Input device

46‧‧‧Photography Drive Department

48‧‧‧External input and output

50‧‧‧Control Department

51‧‧‧Memory Department

52‧‧‧Display Department

53‧‧‧ Input Department

54‧‧‧Communication interface

60A‧‧‧1st mission information

60B‧‧‧2nd mission information

61‧‧‧Task identification information

61a‧‧‧Image Information

62‧‧‧Exposure Information

63‧‧‧Object information

70‧‧‧Task input screen

71‧‧‧1st image input field

72‧‧‧2nd image input field

73‧‧‧Substrate type input field

74‧‧‧ lithography block input field

75‧‧‧Enter end button

77‧‧‧Select button

78‧‧‧Non-select button

C‧‧‧ exposed substrate

L‧‧‧ rotating shaft

P1‧‧‧ image area

P2‧‧‧ exposed area

S101~S109, S200~S217, S301~S319, S401~S407, S500~S517, S601~S607, S701~S717, S801~S817, S901~S903‧‧

X, Y, Z‧‧ Direction

Fig. 1 is a schematic plan view showing the overall configuration of an exposure lithography system according to an embodiment.

2 is a perspective view showing a configuration of a first exposure lithography apparatus and a second exposure lithography apparatus according to the embodiment.

Fig. 3A is a schematic plan view showing an arrangement pattern of an exposure region and an exposure head of an exposure head according to an embodiment;

3B is a schematic plan view showing an image region of an image which is lithographically on the substrate to be exposed by the exposure head of the embodiment.

Fig. 4 is a partially broken perspective view showing the configuration of the inverting device of the embodiment.

Fig. 5 is a block diagram showing a configuration of an electric system of a first exposure lithography apparatus and a second exposure lithography apparatus according to the embodiment.

Fig. 6 is a block diagram showing a configuration of an electric system of a control device according to an embodiment.

Fig. 7A is a schematic diagram showing an example of task information in the first embodiment and the second embodiment.

Fig. 7B is a schematic diagram showing an example of task information in the first embodiment and the second embodiment.

8 is a flow chart showing the flow of processing of the task setting processing program of the first embodiment.

FIG. 9 is a configuration diagram showing a configuration example of a task input screen according to the first embodiment.

Fig. 10 is a schematic view for explaining exposure lithography processing of the exposure lithography system of the first embodiment.

FIG. 11 is a flowchart showing the flow of processing of the first task execution processing program in the first embodiment.

FIG. 12 is a flowchart showing the flow of processing of the second task execution processing program in the first embodiment.

Fig. 13 is a flowchart showing the flow of processing of the task setting processing program of the second embodiment.

Fig. 14 is a flowchart showing the flow of processing of the first task execution processing program in the second embodiment.

Fig. 15 is a flowchart showing the flow of processing of the task selection processing program of the second embodiment.

Fig. 16 is a flowchart showing the flow of processing of the second task execution processing program in the second embodiment.

Fig. 17A is a schematic diagram showing an example of task information in the third embodiment.

Fig. 17B is a schematic diagram showing an example of task information in the third embodiment.

Fig. 18 is a flowchart showing the flow of processing of the task setting processing program of the third embodiment.

Figure 19 is a view showing an exposure lithography of an exposure lithography system according to a third embodiment; Schematic diagram.

Fig. 20 is a flowchart showing the flow of processing of the second task execution processing program in the third embodiment.

FIG. 21 is a configuration diagram showing a configuration example of a task selection screen in the third embodiment.

[First Embodiment]

Hereinafter, the exposure lithography apparatus of the embodiment will be described in detail using the drawings. Further, in each of the embodiments, a case where the present invention is applied to an exposure lithography system which exposes a light beam to a substrate to be exposed (the substrate C to be described later) and a lithography display circuit pattern will be described as an example. Image. Further, the substrate C to be exposed is a flat substrate such as a printed wiring substrate or a glass substrate for a flat panel display.

As shown in FIG. 1, the exposure lithography system 1 of the present embodiment includes a first exposure lithography apparatus 2 that exposes a first surface of a substrate C to be exposed, and a substrate opposite to the first surface of the substrate C to be exposed. The second exposure lithography apparatus 3 that performs exposure on the second surface. Further, the exposure lithography system 1 includes an inversion device 4 that is disposed between the first exposure lithography device 2 and the second exposure lithography device 3 and that reverses the front and back of the substrate C to be exposed, and the control pair is exposed. The control device 5 for exposure of the first surface and the second surface of the substrate C.

Further, between the first exposure lithography apparatus 2 and the control device 5, and between the second exposure lithography apparatus 3 and the control apparatus 5, respectively, the connection is made by the cable 8a, and the control apparatus 5 is in the first exposure lithography apparatus 2 and The second exposure lithography apparatus 3 communicates via the cable 8a. Similarly, the first exposure lithography device 2 and the second exposure The photolithography apparatus 3 is connected by a wired cable 8b, and each of the exposure lithography apparatuses communicates via a wired cable 8b.

Next, the configuration of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 of the present embodiment will be described. In addition, since the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 have the same configuration, the first exposure lithography apparatus 2 will be described here, and the description of the second exposure lithography apparatus 3 will be omitted.

As shown in FIG. 2, the first exposure lithography apparatus 2 of the present embodiment includes a flat plate-like platform 10 for fixing the substrate C to be exposed. Further, on the upper surface of the stage 10, a plurality of suction holes (not shown) that take in air are provided. When the exposed substrate C is placed on the upper surface of the stage 10, the air between the exposed substrate C and the stage 10 is sucked through the suction hole, whereby the exposed substrate C is vacuum-adsorbed to the stage 10.

Moreover, the platform 10 is supported on a flat base 12 movably disposed on the upper surface of the table-shaped base body 11. That is, one or a plurality of (two in the present embodiment) guide rails 14 are provided on the upper surface of the base 11. The base 12 is supported so as to be freely movable along the guide rails 14, and is moved by a drive mechanism (a platform drive unit 42 to be described later) including a motor or the like. The platform 10 moves along the guide rails 14 in conjunction with the movement of the base 12.

In the following, the direction in which the stage 10 is moved is defined as the Y direction, the direction orthogonal to the horizontal direction in the horizontal direction is defined as the X direction, and the direction orthogonal to the Y direction in the vertical plane is defined as Z. direction.

On the upper surface of the base 11, a gate-type gate 15 that is erected so as to straddle the two guide rails 14 is provided. Mounted on the exposed substrate C of the platform 10 along The guide rail 14 moves in such a manner as to enter and exit the opening of the gate 15. An exposure portion 16 that exposes a light beam toward the opening is attached to an upper portion of the opening of the gate 15 . When the stage 10 is moved along the guide rail 14 by the exposure portion 16, and the opening portion is located, the light beam is exposed to the upper surface of the substrate C to be exposed placed on the stage 10.

The exposure unit 16 of the present embodiment includes a plurality of (16 in the present embodiment) exposure heads 16a. Each of the exposure heads 16a is arranged in a matrix shape in the exposure portion 16. Further, an optical fiber 18 drawn from a light source unit 17 to be described later and a signal cable 20 extracted from an image processing unit 19 to be described later are connected to the exposure unit 16.

Each of the exposure heads 16a includes a digital micromirror device (DMD) as a reflective spatial light modulation element. The exposure head 16a modulates the light beam from the light source unit 17 by controlling the DMD based on the image information input from the image processing unit 19. The first exposure lithography apparatus 2 exposes the substrate C to be exposed by irradiating the modulated light beam to the substrate C to be exposed. Further, the spatial light modulation element is not limited to a reflection type, and may be a transmissive spatial light modulation element such as a liquid crystal.

As shown in FIG. 3A, the image region P1 which is a region exposed by the exposure head 16a has a rectangular shape in which one side is inclined at a predetermined inclination angle with respect to the moving direction (Y direction) of the stage 10. In addition, only a part of the plurality of exposure heads 16a of the present embodiment is shown in FIG. 3A. Further, if the stage 10 moves the light beam to the exposed substrate C by the exposure head 16a while moving the opening portion of the gate 15, as shown in FIG. 3B, the exposed substrate C is directed to each of the exposure heads with the movement of the stage 10. 16a shape The band-shaped exposed area P2. Each of the exposure heads 16a arranged in a matrix is arranged in the X direction so that the length of the long side of each image region P1 is set to be a natural multiple (one time in the present embodiment). Further, each of the exposed regions P2 is partially overlapped with the adjacent exposed regions P2.

As shown in FIG. 2, a gate type gate 22 which is erected so as to straddle the two guide rails 14 is further provided on the upper surface of the base 11. The exposed substrate C placed on the stage 10 moves so as to enter and exit the opening of the gate 22 along the guide rail 14.

One or a plurality of (three in the present embodiment) imaging units 23 for photographing the opening are attached to the upper portion of the opening of the gate 22 . The photographing unit 23 is a charge coupled device (CCD) camera or the like in which a strobo having a very short lighting time is built in one time. Further, in the upper portion of the opening portion of the gate 22, a rail 23a is provided along a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal plane, and each of the photographing portions 23 is set by the rail 23a is guided and movable. The imaging unit 23 photographs the upper surface of the substrate C to be exposed placed on the stage 10 when the stage 10 moves along the guide rail 14 and is positioned at the opening.

As shown in FIG. 1 and FIG. 2, the first exposure lithography apparatus 2 includes a first transport unit 6 that transports the substrate C to be exposed from the outside to a predetermined position of the first exposure lithography device 2, and a second The transport unit 7 transports the substrate C to be exposed from the first exposure lithography apparatus 2 to a predetermined position of the inverting device 4. Similarly, the second exposure lithography apparatus 3 includes a first transport unit 6 that transports the substrate C to be exposed from the inverting device 4 to a predetermined position of the second exposure lithography device 3, and a second transport unit. The portion 7 transports the substrate C to be exposed to the outside of the second exposure lithography apparatus 3.

The first transport unit 6 and the second transport unit 7 include a plurality of rotating rollers and a drive motor that rotates the rotating rollers. The plurality of rotating rollers are respectively laid in parallel, and a sprocket or a pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a method of transmitting the rotational force of the drive motor that rotates the rotating roller, a method of transmitting a cylindrical magnet may be employed in addition to the conveyor belt or the metal wire.

Further, as shown in FIG. 2, the first exposure lithography apparatus 2 includes an automatic mounting palm (hereinafter, AC palm) 24, and the automatic mounting palm transports the exposed substrate to the predetermined position by the first conveying unit 6. C is transported to the platform 10 from the predetermined position. The AC palm 24 is formed in a flat shape and is provided to be movable in the X direction and the Z direction. A plurality of suction holes 25 for taking in air are provided on the lower surface of the AC palm 24. When the AC palm 24 moves to a position where the lower surface of the AC palm 24 is in contact with the upper surface of the exposed substrate C, the air between the AC palm 24 and the exposed substrate C is sucked by the suction hole 25, thereby causing the exposed substrate C. The vacuum is adsorbed on the lower surface of the AC palm 24 to be adsorbed and held. Further, a pressing portion 26 that is freely movable in the Z direction is provided on the lower surface of the AC palm 24, and the pressing portion 26 moves to the upper surface of the stage 10 while the AC palm 24 is adsorbed and held by the exposed substrate C. At this time, the exposed substrate C is extruded downward and pressed to the stage 10.

The AC palm 24 of the first exposure lithography apparatus 2 adsorbs and holds the unexposed exposed substrate C that has been transported to the first conveyance unit 6 and moves upward, and is placed on the upper surface of the stage 10. Moreover, the AC palm 24 of the first exposure lithography apparatus 2 The substrate C to be exposed which has been exposed on the first surface of the upper surface of the stage 10 is suction-held and moved upward, thereby moving the substrate C to be exposed to the second transfer unit 7. The exposed substrate C that has been exposed on the first surface that has moved to the second transport unit 7 is carried out to the outside of the first exposure lithography apparatus 2 by the second transport unit 7 .

In addition, the AC palm 24 of the second exposure lithography apparatus 3 adsorbs and holds the exposed substrate C that has been exposed on the first surface until being transported to the first transport unit 6 and moves upward, thereby placing the exposed substrate C on the substrate C. The upper surface of the platform 10. Further, the AC palm 24 of the second exposure lithography apparatus 3 adsorbs and holds the exposed substrate C exposed on the first surface and the second surface of the upper surface of the stage 10, and moves upward, thereby The exposure substrate C moves to the second conveyance unit 7. The exposed substrate C that has been exposed on the first surface and the second surface that has moved to the second transfer unit 7 is carried out to the outside of the exposure lithography system 1 by the second transfer unit 7 .

Next, the configuration of the inverting device 4 of the present embodiment will be described.

As shown in FIG. 4, the inverting device 4 includes a flat sub-frame 30 that is rotatably supported by a rotation axis L. The sub-frame 30 rotates 180 degrees in a state in which the substrate C to be exposed is held therein, thereby inverting the front and back of the substrate C to be exposed.

Further, as shown in FIG. 4, the side surface on which the first exposure lithography apparatus 2 is located on the side surface of the sub-frame 30 is provided with the loading of the substrate C to be carried into the sub-frame 30. Mouth 31. Further, a plurality of roller pairs 34 driven by the motor 33 are provided inside the sub-frame 30. The roller pair 34 is conveyed while sandwiching the exposed substrate C housed inside the sub-frame 30. Being exposed The substrate C is conveyed to the inside of the sub-frame 30 via the roller pair 34 via the carry-in port 31, and the front and back are reversed by the rotation of the sub-frame 30, and are conveyed to the sub-via by the roller pair 34 via the carry-in port 31. The exterior of the frame 30. In addition, when the sub-frame 30 is finished to be carried out, the sub-frame 30 is rotated 180 degrees again in order to carry the next exposed substrate C into the inside.

Next, the configuration of the electrical system of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 of the present embodiment will be described. In addition, since the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 have the same electrical system configuration, the first exposure lithography apparatus 2 will be described here, and the second exposure lithography apparatus 3 will be omitted. Description.

As shown in FIG. 5, in the first exposure lithography apparatus 2, a system control unit 40 that is electrically connected to each unit of the apparatus is provided, and the system control unit 40 unifies each part of the first exposure lithography apparatus 2. Ground control. Further, the first exposure lithography apparatus 2 includes a task storage unit 41, a platform drive unit 42, a display device 43, an input device 44, a photographing drive unit 46, and an external input/output unit 48.

The system control unit 40 includes a central processing unit (CPU), a random access memory (Random Access Memory), a read only memory (ROM), and a hard disk drive (HDD). . Further, the system control unit 40 emits a light beam from the light source unit 17 at a timing corresponding to the movement of the stage 10 by the CPU, and outputs corresponding image information by the image processing unit 19. The system control unit 40 controls the exposure of the light beam of the exposed substrate C by the exposure head 16a in this manner.

The task storage unit 41 includes a RAM or a non-volatile memory, and memorizes task information indicating a task to be executed. The task in the present embodiment is an overall exposure processing request in which the same image is exposed under the same conditions on the first surface of one or more exposed substrates C, and on the substrate C to be exposed The second side also exposes the same image of the lithography under the same conditions. In addition, details of the mission information will be described later. In the present embodiment, the task storage unit 41 memorizes the task information of the task to be executed in the form of a list. However, the present invention is not limited thereto, and may be stored in a queue format.

The platform drive unit 42 includes a drive mechanism including a motor or a hydraulic pump, and the stage 10 is driven by the control of the system control unit 40.

The display device 43 is a display unit such as a liquid crystal display that displays various kinds of information under the control of the system control unit 40.

The input device 44 is an input mechanism such as a touch sensor or an operation button that inputs various kinds of information by a user operation.

The photographing drive unit 46 includes a drive mechanism including a motor or a hydraulic pump, and the photographing unit 23 is driven by the control of the system control unit 40.

The external input/output unit 48 performs input and output of various kinds of information between various information processing devices including the second exposure lithography device 3 and the control device 5 connected to the first exposure lithography device 2. Further, the external input/output unit 48 of the second exposure lithography apparatus 3 inputs various kinds of information between various information processing apparatuses including the first exposure lithography apparatus 2 and the control apparatus 5 connected to the second exposure lithography apparatus 3. Output.

Next, the configuration of the electric system of the control device 5 of the present embodiment will be described.

As shown in FIG. 6, the control device 5 includes a control unit 50 that controls exposure lithography processing of the exposure lithography system 1. Further, the control device 5 includes a storage unit 51 having a ROM, an HDD, and the like, and the storage unit 51 memorizes a program or various materials required for exposure lithography by the control unit 50. Further, the storage unit 51 also stores the task information, the task setting processing program, the first task execution processing program, the second task execution processing program, and the task selection processing program of the second embodiment.

Further, the control device 5 includes a display unit 52 such as a liquid crystal display that displays various kinds of information based on the control of the control unit 50, and an input unit 53 such as a keyboard or a mouse that inputs various kinds of information by a user operation. Further, the control device 5 includes a communication interface 54 that transmits and receives various types of information to the first exposure lithography device 2 and the second exposure lithography device 3 based on the control of the control unit 50.

Here, the control device 5 of the present embodiment accepts input of information related to a task performed by a user operation. Further, when receiving the input of the information related to the task, the control device 5 generates and transmits the task information corresponding to each of the first exposure lithography device 2 and the second exposure lithography device 3. When the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 of the present embodiment receive the task information, the received task information is stored in the task storage unit 41, and the pair is executed based on the content of the stored task. Exposure lithography of the substrate C is exposed. At this time, when the plurality of task information is stored, the first exposure lithography apparatus 2 of the present embodiment executes the tasks indicated by the respective task information in the order in which the respective task information is received. In addition, this embodiment The second exposure lithography apparatus 3 of the state sequentially performs tasks corresponding to the tasks performed by the first exposure lithography apparatus 2.

When the task information is generated, the control device 5 generates the task information 60A for causing the first exposure lithography device 2 to image the first surface lithography of the substrate C to be exposed, and the second exposure lithography device 3 for the substrate to be exposed. The task information 60B of the second lithography image of C is stored in the memory unit 51. In other words, even for the tasks related to the same substrate C to be exposed, the first surface and the second surface are subjected to exposure lithography by respective exposure lithography apparatuses, and thus the first surface is separately generated and memorized. Task information 60A for use and task information 60B for the second face.

As an example, the task information 60A and the task information 60B are information obtained by associating the task identification information 61, the image information 61a, the exposure condition information 62, and the object information 63 with respect to each task, as shown in FIG. 7A and FIG. 7B. In addition, the task identification information 61 is information for identifying respective tasks. Further, the image information 61a is information indicating an image as a lithography object. Further, the exposure condition information 62 is information indicating an exposure condition when the light beam is exposed for the image corresponding to the lithography of the substrate C to be exposed. The exposure condition information 62 of the present embodiment includes the substrate size information indicating the substrate size of the substrate C to be exposed (hereinafter referred to as "target substrate") as a lithography target, and the lithography block indicating the number of lithography blocks of the target substrate. Number information. Further, the exposure condition information 62 of the present embodiment includes mark information and information on the type of the photosensitive material indicating the type of the photosensitive material of the target substrate, and the mark information is represented by coordinates to determine an image corresponding to the target substrate. The arrangement pattern of the mark in the case of the mark of the lithography area. In addition, the arrangement pattern of the mark provided on the target substrate The first surface and the second surface are mirror images. However, the information included in the exposure condition information 62 is not limited thereto, and may be information used to perform exposure lithography processing, such as information indicating the intensity of the light beam, information indicating the moving speed of the stage 10, or the like. Any information. Further, the target information 63 is information indicating the task identification information of the other party's task (hereinafter also referred to as "target task") corresponding to the first surface and the second surface.

When the operator wants to perform the tasks by the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3, the information included in the mission information 60A and the mission information 60B is input to the control apparatus 5 via the input unit 53. . Correspondingly, the control device 5 performs task setting processing for generating the task information 60A for the first surface and the task information 60B for the second surface based on the input information, and storing the information in the storage unit 51.

Next, the operation of the exposure lithography system 1 of the present embodiment will be described with reference to Fig. 8 . In addition, FIG. 8 is a flowchart showing a flow of processing of a task setting processing program executed by the control unit 50 of the control device 5 when an execution instruction is input via the input unit 53. This program is stored in advance in a predetermined area of the ROM of the storage unit 51.

First, in step S101, control is performed to display a task input screen on the display unit 52 for assisting input of information related to the task by the user. As shown in FIG. 9, the task input screen 70 of the present embodiment includes a first surface image input field 71 for inputting image recognition information indicating an image of the first surface lithography, and an input indicating that the second surface is slightly The second side view of the image recognition information of the shadow image Like input field 72. The image identification information is a file name of a file containing image information or a Uniform Resource Locator (URL) indicating a storage destination of the image file. Further, the task input screen 70 includes a substrate type input field 73 for inputting the substrate type information indicating the substrate type of the substrate C to be exposed, which is applied to the target task. Further, the task input screen 70 includes a lithography block number input field 74 that inputs lithographic block number information indicating the number of lithographic blocks of the substrate C to be exposed among the target tasks. Further, the task input screen 70 includes an input end button 75 for designating information indicating that the input has ended. Further, when each information is input to each input field, a selection candidate may be displayed by a list display or the like for each input field, and any one of the displayed selection candidates may be selected via the input unit 53. The user inputs the information corresponding to each input field by using the input unit 53, and then specifies the input end button 75.

Therefore, in the next step S103, by waiting until the input end button 75 is designated, the standby is continued until the input of the information related to the task is completed.

In the next step S105, the task information 60A and the task information 60B are generated based on the respective information input to the respective input fields, and the generated task information 60A and task information 60B are stored in the storage unit 51. At this time, the control unit 50 uses the image information of the image indicated by the information input to the first surface image input field 71 as the image information 61a, and the information input to the lithography block number input field 74 as the lithography block. The number information is used as the object information 63 as the information input to the second image input field 72. Further, the control unit 50 generates the task information 60A of the first surface. Moreover, in task information 60A, based on input The information on the substrate type input field 73 is used to determine the substrate size information, the mark information, and the photosensitive material type information. In the exposure lithography system 1 of the present embodiment, the substrate size information, the mark information, and the photographic material type information are respectively stored in the memory unit 51 for each substrate of the substrate C to be exposed. Further, in the exposure lithography system 1 of the present embodiment, the substrate size information, the mark information, and the photosensitive material type information corresponding to the type of the substrate indicated by the information input to the substrate type input field 73 are used as the task information 60A. Substrate size information, mark information, and information on the type of photosensitive material.

Further, the image information of the image indicated by the information input to the second surface image input field 72 is used as the image information 61a, and the information input to the lithography block number input field 74 is used as the lithography block number information, and is input to The information of the first surface image input field 71 is used as the object information 63, and the task information 60B of the second surface is generated. Further, even for the task information 60B, the substrate size information, the mark information, and the photosensitive material type information are determined and used in the same manner as the task information 60A.

In the next step S107, the task information 60A of the first surface generated by the processing of the above-described step S105 is transmitted to the first exposure lithography apparatus 2 via the cable 8a. On the other hand, the first exposure lithography apparatus 2 memorizes the received mission information 60A in its own task storage unit 41.

In the next step S109, the task information 60B of the second surface generated by the processing of the above-described step S105 is transmitted to the second exposure lithography apparatus 3 via the cable 8a, and the task setting processing program is terminated. On the other hand, the second exposure lithography apparatus 3 memorizes the received task information 60B in its own task storage unit 41.

As described above, in the exposure lithography system 1 of the present embodiment, as shown in FIG. 10, the control device 5 generates the task information 60A of the first surface and the task information 60B of the second surface based on the information input by the user. Further, in the task information 60A of the first surface corresponding to the first surface and the task information 60B of the second surface, the task information 60A is given to the task identification information given to the corresponding task information, and the corresponding task information 60A is given. The task information 60B corresponds to each other. Further, the task identification information 61 and the object information 63 in each of the task information 60A and the task information 60B correspond to correspondence information indicating the correspondence relationship between the task information 60A of the first surface and the task information 60B of the second surface.

When the first exposure lithography apparatus 2 receives and memorizes the task information 60A from the control device 5, the immersion image of the first surface of the substrate C to be exposed is performed based on the stored task information 60A based on a predetermined user operation. The first task performs processing.

Next, the operation of the first exposure lithography apparatus 2 when the first task execution processing of the present embodiment is executed will be described with reference to Fig. 11 . In addition, FIG. 11 is a flowchart showing the flow of processing of the first task execution processing program executed by the system control unit 40 of the first exposure lithography apparatus 2 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. In addition, the timing at which the program is executed is not limited to the timing according to a predetermined user operation, and may be the timing at which the task information 60A is received.

First, in step S200, control for displaying the task information 60A stored in the task storage unit 41 on the display device 43 is performed. At this time, when the plurality of task information 60A is stored, the system control unit 40 displays the respective contents in the form of a list. Information 60A control. The number of the exposed substrates C indicated by the number of pieces of the lithography of the task information 60A to be executed is placed on the upstream side of the first transport unit 6 of the first exposure lithography apparatus 2. Further, the user selects the designated task information 60A via the input device 44, thereby inputting an execution instruction of the task indicated by the specified task information 60A.

In the next step S201, the operation waits until the execution instruction of the task is input, and in the next step S203, the image information is acquired from the task information 60A corresponding to the task instructed to execute (hereinafter referred to as "execution of the first surface task"). . Further, in the present embodiment, when the image information of the image of the lithography is acquired, the image information (the image information of the task information 60A) stored in the task storage unit 41 of the own image is acquired, but the present invention is not limited thereto. That is, the image recognition information may be pre-stored in the task information 60A, and image information of the image of the lithography may be acquired from the control device 5 or an external memory device based on the image recognition information.

In the next step S205, the exposure condition at the time of the lithographic image of the substrate C to be exposed is determined by executing the execution of the first surface task. At this time, the system control unit 40 determines the exposure conditions based on the substrate size information, the lithography number information, the mark information, and the photosensitive material type information in the task information 60A of the first surface task. In the first embodiment, in the system control unit 40, the image pickup unit 23 photographs the mark provided on the substrate C to be exposed, and measures the position of the mark based on the image obtained by the image pickup. Further, the system control unit 40 determines the lithography area of the lithographic image based on the position of the measured mark. Further, the system control unit 40 deforms the image as the lithography object based on the size or shape of the determined lithography region. Moreover, the system The control unit 40 determines the intensity of the light beam to be exposed, the moving speed of the stage 10 (or the exposure time of the light beam), and the like based on the type of the photosensitive material indicated by the photosensitive material type information.

In the next step S207, based on the determined exposure conditions, exposure lithography processing of exposing the light beam to the exposed substrate C to the lithographic image is started. In the exposure lithography process of the present embodiment, the system control unit 40 exposes the light beam modulated based on the deformed image by the exposure head 16a, thereby lithographically morphing the deformed image on the substrate C to be exposed.

In the next step S209, it is determined whether or not a predetermined error has occurred. At this time, the system control unit 40 exposes the lithography due to a failure or the like of a portion used when the exposure of the light-emitting unit 17 or the image processing unit 19 or the exposure unit 16 is performed due to deformation or poor positioning of the substrate C to be exposed. When the processing is stopped in the middle, it is determined that an error has occurred. If the determination in step S209 is affirmative, the process proceeds to step S211, and an error message indicating that an error has occurred is transmitted to the control device 5, thereby ending the first task execution processing program. On the other hand, the control device 5 that has received the error information performs control for displaying the error information on the display unit 52. Further, the system control unit 40 can also transmit error information to the second exposure lithography apparatus 3. On the other hand, the second exposure lithography apparatus 3 that has received the error information performs the control for displaying the error information on the display device 43 or the task information 60B from the task corresponding to the execution of the erroneous execution of the first surface task. Subtract 1 from the number of shadow blocks.

On the other hand, if the determination is negative in step S209, the process proceeds to step S213.

In step S213, it is determined whether or not the exposure lithography process for one of the exposed substrates C is completed. In the case of a negative determination in step S213, the process returns to the above-described step S209, and on the other hand, in the case of affirmative determination, the process proceeds to step S215.

In step S215, information indicating that the first surface task is executed is transmitted to the second exposure lithography apparatus 3. At this time, the system control unit 40 transmits the task identification information 61 in the task information 60A that executes the first surface task to the second exposure lithography apparatus 3. Further, in the present embodiment, the task identification information 61 is transmitted from the first exposure lithography apparatus 2 to the second exposure lithography apparatus 3, but the present invention is not limited thereto. In other words, the transmitted information may be information that the second exposure lithography apparatus 3 can determine the execution of the first surface task, and thus may be, for example, the task information 60A itself.

In the next step S217, it is determined whether or not all the processes included in the execution of the first face task are completed. At this time, when the exposure lithography process of the exposed substrate C indicating the number of lithography blocks indicated by the lithographic block number information of the exposure condition information 62 is completed, the system control unit 40 determines that the first surface is to be executed. mission completed.

If the determination is negative in step S217, the process returns to step S209. On the other hand, if the determination is affirmative, the first task execution processing program is ended.

When the second exposure lithography apparatus 3 of the present embodiment receives the task identification information for executing the first surface task from the first exposure lithography apparatus 2, the second exposure lithography apparatus 3 performs the task identification information and the task information 60B received from the control device 5 based on the task identification information. The second task of the second surface lithography image of the substrate C to be exposed is subjected to processing.

Next, with reference to Fig. 12, the execution of the second task of the present embodiment is performed. The operation of the second exposure lithography apparatus 3 will be described. In addition, FIG. 12 is a flowchart showing the flow of processing of the second task execution processing program executed by the system control unit 40 of the second exposure lithography apparatus 3 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. Further, the timing at which the program is executed is not limited to the timing at which the task identification information is received, and may be a sequence in which a predetermined execution instruction is input by the user via the input device 44.

Initially, in step S301, it is determined whether or not there is task information 60B indicating a task of the second surface corresponding to the task indicated by the received task identification information for executing the first surface task (hereinafter referred to as "Executing the second task"). At this time, the system control unit 40 determines whether or not the following task information 60B exists in the task information 60B stored in the task storage unit 41, that is, includes the task identification information 61 as the target information 63 for executing the first surface task.

If the determination is affirmative in step S301, the process proceeds to step S303. On the other hand, if the determination is negative in step S301, the process proceeds to step S311, which will be described later, and the error information indicating that there is no task to be executed is transmitted to the control device 5, thereby ending the first task execution processing. Program.

In step S303, the image information of the image lithographically on the substrate C to be exposed is acquired in the task information 60B of the second surface task. At this time, the system control unit 40 acquires image information of an image represented by the image information 61a in the task information 60B that executes the second surface task. Further, in the present embodiment, the image information is stored in the storage unit 51 of the control device 5, and the second exposure lithography device 3 acquires image information from the control device 5, but the present invention is not limited thereto, and the second exposure may be performed. The lithography device 3 has Memory image information in the memory mechanism.

In the next step S305, the exposure condition when the lithographic image of the substrate C to be exposed is set in the second surface task which is the task to be executed is set. At this time, the system control unit 40 determines the exposure conditions based on the substrate size information, the lithography number information, the mark information, and the photosensitive material type information in the task information 60B of the second surface task.

As an example, as shown in FIG. 10, in the first exposure lithography apparatus 2, it is assumed that the task information 60A, the task information 60B, and the like are stored, and the task information 60A and the task information 60B indicate the lithography and the first surface and the second surface. On both sides of the two-sided task of the image corresponding to both sides of the face, the two-sided task A and the two-sided task B of the first face. Further, in the second exposure lithography apparatus 3, the task information 60A indicating the two-sided task A indicating the second surface corresponding to the two-sided task A of the first surface is stored, and the two-sided task B indicating the first surface is displayed. The task information 60B of the two-sided task B of the corresponding second side. When the two-sided task B of the first surface is executed in the first exposure lithography apparatus 2 in this state, the second exposure lithography apparatus 3 has the second surface corresponding to the two-sided task B of the first surface. Two-sided task B is the execution object.

In the next step S307, exposure lithography processing of exposing the light beam to the exposed substrate C to the lithographic image is started in accordance with the set exposure conditions.

In the next step S309, it is determined whether an error has occurred in the execution of the second surface task. At this time, the system control unit 40 is exposed to a failure of a portion used when exposure lithography of the light source unit 17 or the image processing unit 19 or the exposure unit 16 is performed due to deformation or poor positioning of the substrate C to be exposed. When the shadow processing stops in the middle, etc. It is determined that an error has occurred. If the determination is affirmative in step S309, the process proceeds to step S311, and the error information indicating that an error has occurred in the task being executed is transmitted to the control device 5, thereby ending the second task execution processing program. On the other hand, if the determination is negative in step S309, the process proceeds to step S313.

In step S313, it is determined whether or not the exposure lithography processing on the substrate C to be exposed has been completed. If the determination is negative in step S313, the process returns to step S309 described above. On the other hand, if the determination is affirmative, the process proceeds to step S315.

In the next step S315, it is determined whether or not the execution of the second surface task has been completed. At this time, when the exposure lithography process of the exposed substrate C indicating the number of lithography blocks indicated by the lithographic block number information of the exposure condition information 62 is completed, the system control unit 40 determines that the execution of the second surface task has been completed. carry out. In the case of a negative determination in step S314, the process proceeds to step S317.

In step S317, it waits until the task identification information 61 for performing the lithography of the image on the next exposed substrate C in the second surface task is received.

In the next step S319, it is determined whether or not the received task identification information 61 is the same as the task identification information 61 for executing the second surface task.

In the case of affirmative determination in step S319, the process proceeds to step S309 described above. On the other hand, if the determination is negative in step S319, the process proceeds to step S311, and error information indicating that the task identification information 61 different from the task identification information 61 for executing the second surface task is received is transmitted to the control device. 5, thus ending the first task execution processing program.

On the other hand, in the case of affirmative determination in step S315, the process ends. This first task executes the processing program.

In the first embodiment, in the step S215 of the first task execution processing program, the first exposure lithography device 2 transmits the task identification information 61 for executing the first surface task to the second exposure lithography device 3. However, the present invention is not limited thereto. this. In other words, in the step S215, the first exposure lithography apparatus 2 can transmit the target information 63 of the task information 60A for executing the first surface task to the second exposure lithography apparatus 3. In this case, in step S301 of the second task execution processing program, the task indicated by the task information 60B is executed as the second face task, and the task information 60B has the received image information 63 as the task identification information 61. .

[Second Embodiment]

Hereinafter, the exposure lithography system 1 of the second embodiment will be described in detail using the drawings.

In the first embodiment, the first exposure lithography apparatus 2 transmits information indicating that the first surface task is performed to the second exposure lithography apparatus 3, and the second exposure lithography apparatus 3 selects and executes the corresponding task. On the other hand, in the second embodiment, information indicating that the first surface task is executed is transmitted from the first exposure lithography apparatus 2 to the control device 5, and the corresponding task is selected by the control device 5, and the selected task is transmitted to The second exposure lithography apparatus 3.

The configuration of the exposure lithography system 1 of the second embodiment is the same as that of the exposure lithography system 1 of the first embodiment, and thus the description thereof is omitted here.

Next, the operation of the exposure lithography system 1 of the present embodiment will be described with reference to Fig. 13 . In addition, FIG. 13 shows that the execution is performed via the input unit 53. A flowchart of the flow of processing of the task setting processing program executed by the control unit 50 of the control device 5 of the exposure lithography system 1 at the time of instruction. This program is stored in advance in a predetermined area of the ROM of the storage unit 51.

First, in steps S401 to S405, the same processing as steps S101 to S105 of the first embodiment is performed.

In the next step S407, the generated task information 60A of the first surface is transmitted to the first exposure lithography apparatus 2 via the cable 8a, and the task setting processing program is ended. The first exposure lithography apparatus 2 memorizes the received task information 60A of the first surface in the task storage unit 41.

When the first exposure lithography apparatus 2 memorizes the task information 60A, the first task execution processing of the first surface lithography image on the substrate C to be exposed is performed based on the task information 60A.

Next, the operation of the first exposure lithography apparatus 2 when the first task execution processing of the present embodiment is executed will be described with reference to FIG. In addition, FIG. 14 is a flowchart showing the flow of processing of the first task execution processing program executed by the system control unit 40 of the first exposure lithography apparatus 2 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. Further, the timing at which the program is executed is not limited to the timing of receiving and memorizing the task information 60A, and may be a timing at which a predetermined execution instruction is input by the user via the input device 44.

In steps S500 to S513, the same processing as steps S201 to S213 of the first embodiment is performed.

In step S515, the task identification information of the task in execution is sent to Control device 5. At this time, the system control unit 40 transmits the task identification information 61 in the task information 60A that executes the first surface task to the control device 5.

In step S517, the same processing as that of step S217 of the first embodiment is performed, and the first task execution processing program is ended.

When the control device 5 of the present embodiment receives the task identification information 61 from the first exposure lithography device 2, the task selection processing is performed based on the task identification information 61 and the task information 60B stored in the storage unit 51. The task of the second side corresponding to the execution of the first task.

Next, the operation of the control device 5 when the task selection processing of the present embodiment is executed will be described with reference to Fig. 15 . In addition, FIG. 15 is a flowchart showing the flow of processing of the task selection processing program executed by the control unit 50 of the control device 5 at this time. This program is stored in advance in a predetermined area of the ROM of the storage unit 51. Further, the timing at which the program is executed is not limited to the timing at which the task identification information 61 for executing the first surface task is received, and the timing at which the predetermined execution instruction is input by the user via the input unit 53 or the like may be used.

First, in step S601, the following second task information 60B stored in the task information 60B of the second surface of the storage unit 51, that is, the task identification information having the received first face task is searched for. The task information 60A of the first side corresponds. At this time, the control unit 50 searches for the task information 60B including the task identification information 61 for executing the first surface task as the target information 63 from the task information 60B stored in the storage unit 51.

In the next step S603, it is determined whether or not the result of the search is present. The task information 60B of the second face corresponding to the task information 60A of the first face having the received task identification information of the first face task.

In the case of affirmative determination in step S603, the process proceeds to step S605. On the other hand, if the determination is negative in step S603, the process proceeds to step S607, and the error information indicating that the task information 60B of the corresponding second surface does not exist is displayed on the display unit 52.

In step S605, the task information 60B obtained as a result of the above-described search is transmitted to the second exposure lithography apparatus 3 via the cable 8a. On the other hand, the second exposure lithography apparatus 3 memorizes the received task information 60B of the second surface in the task storage unit 41. Further, in the process of step S605, when the task information 60B obtained as a result of the above-described search has been transmitted to the second exposure lithography apparatus 3, only the task identification information 61 of the task information 60B may be transmitted. In this case, when the second exposure lithography apparatus 3 executes step S701 of the second task execution processing program to be described later, the image information of the image included as the image information 61a in the task information 60B is acquired, wherein the task information is acquired. The 60B includes the received task identification information 61 as the task identification information 661.

When the second exposure lithography apparatus 3 of the present embodiment receives the task information 60B of the second surface from the control device 5, the second surface lithography image on the substrate C to be exposed is performed based on the received task information 60B. The second task performs processing.

Next, the operation of the second exposure lithography apparatus 3 when the second task execution processing of the present embodiment is executed will be described with reference to FIG. In addition, FIG. 16 shows the second task executed by the system control unit 40 of the second exposure lithography apparatus 3 at this time. Flowchart of the flow of processing of the line handler. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. Further, the timing at which the program is executed is not limited to the timing of receiving the task identification information of the task to be executed, and may be a sequence in which a predetermined execution instruction is input by the user via the input device 44.

Initially, in step S701, image information of an image included as the image information 61a in the received task information 60B is acquired.

In the next step S703 to step S717, the same processing as step S305 to step S319 of the first embodiment is performed.

[Third embodiment]

Hereinafter, the exposure lithography system 1 of the third embodiment will be described in detail using the drawings.

In the first embodiment and the second embodiment, the image information corresponding to the first surface and the second surface of the substrate C to be exposed is used for the task information 60A and the task information 60B indicating the two-sided task. On the other hand, in the third embodiment, even when the one-sided task and the two-sided task in which the task of the first surface and the second surface are mixed are mixed, the first substrate to be exposed C can be used. The image corresponding to the surface and the second lithography.

Similarly to the first embodiment, the control device 5 causes the first exposure lithography apparatus 2 to expose the task information 60A of the first surface lithographic image of the substrate C to be exposed, and the second exposure lithography apparatus 3 to be exposed. The task information 60B of the second surface lithography image of the substrate C is stored in the memory unit 51.

As shown in FIG. 17A and FIG. 17B, task information 60A, task information 60B The information obtained by correspondingly identifying the task identification information 61, the exposure condition information 62, and the object information 63 for each task. However, when the task to be set is the one-sided task described above, the object information 63 is set to a blank field. In the example shown in FIGS. 17A and 17B, the tasks of the task identification information C000001 and C000002 are respectively single-sided tasks, and the object information 63 of the tasks of the task identification information C000001 and C000002 is blank.

When the operator wants to perform the tasks by the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3, the operator inputs the information included in the mission information 60A and the mission information 60B to the control apparatus 5 via the input unit 53. in.

The control device 5 performs task setting processing for setting the task by storing the input information as the task information 60A for the first surface and the task information 60B for the second surface in the storage unit 51.

Next, the operation of the exposure lithography system 1 of the present embodiment will be described with reference to Fig. 18 . In addition, FIG. 18 is a flowchart showing a flow of processing of a task setting processing program executed by the control unit 50 of the control device 5 of the exposure lithography system 1 when an execution instruction is input via the input unit 53. This program is stored in advance in a predetermined area of the ROM of the storage unit 51.

First, in steps S801 to S803, the same processing as steps S101 to S103 of the first embodiment is performed.

In step S805, at least one of the task information 60A and the task information 60B is generated for each piece of information input to each input field, and at least one of the generated task information 60A and task information 60B is stored in the storage unit 51. At this time, in the first side view When both the input field 71 and the second image input field 72 are input information, the task to be set is used as a two-sided task, and the task information 60A of the first surface is generated and stored in the same manner as step S105 of the first embodiment. And the second task information 60B. Further, when information is input only to the first surface image input field 71 in the first surface image input field 71 and the second surface image input field 72, the task to be set is used as a one-sided task, and only the information is generated. And remember the first task information 60A. Further, when information is input only to the second surface image input field 72 in the first surface image input field 71 and the second surface image input field 72, the task to be set is used as a one-sided task, and only the information is generated. And remember the second task information 60B.

In the next step S807, it is determined whether or not the task of the setting object is a two-sided task. If the determination is affirmative in step S807, the process proceeds to step S809. On the other hand, if the determination is negative, the task of the setting target is assumed to be a one-sided task, and the process proceeds to step S813, which will be described later.

In steps S809 and S811, the same processing as steps S107 and S109 of the first embodiment is performed, and the task setting processing program is ended.

In step S813, it is determined whether or not the task to be set is the one-sided task of the first surface. If the determination is affirmative in step S813, the process proceeds to step S815, and the same processing as that of step S107 of the first embodiment is performed, thereby ending the task setting processing program.

On the other hand, if the determination is negative in step S813, the process proceeds to step S817, and the same processing as that of step S109 of the first embodiment is performed, thereby ending the task setting processing program.

As shown in FIG. 19, the task information 60A for the first surface is transmitted to the first exposure lithography apparatus 2, and is stored in the task storage unit 41 of the first exposure lithography apparatus 2. Similarly, the task information 60B for the second surface is transmitted to the second exposure lithography apparatus 3, and is stored in the task storage unit 41 of the second exposure lithography apparatus 3. At this time, the memory is performed in a state in which the one-sided task and the two-sided task are mixed.

When the first exposure lithography apparatus 2 memorizes the task information 60A, the first task execution processing of the first surface lithography image on the substrate C to be exposed is performed based on the task information 60A.

The first exposure lithography apparatus 2 of the third embodiment performs the same first task execution processing as that of the first embodiment.

When receiving the task identification information 61 transmitted by the first task execution processing, the second exposure lithography device 3 performs the exposure on the substrate C based on the task identification information 61 and the task information 60B received from the control device 5. The second task of the second lithography image performs processing.

Next, the operation of the second exposure lithography apparatus 3 when the second task execution processing of the present embodiment is executed will be described with reference to FIG. In addition, FIG. 20 is a flowchart showing the flow of processing of the second task execution processing program executed by the system control unit 40 of the second exposure lithography apparatus 3 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. Further, the timing at which the program is executed is not limited to the task identification information sequence at which the task of the execution target is received, or the task identification information is received, and the timing of the predetermined execution instruction is input by the user via the input device 44. Wait.

First, in steps S301 to S319, the same processing as steps S301 to S319 of the first embodiment is performed.

However, in the third embodiment, if the determination is negative in step S301, the process proceeds to step S901.

In step S901, when there is a task corresponding to the two-sided task and there is a task corresponding to the one-sided task, control for displaying the task selection screen on the display device 43 for assisting the user is performed. The selection of the task of the execution object.

As shown in FIG. 21, the task selection screen 76 includes a selection button 77 for selecting one of the one-sided tasks stored in the task storage unit 41, and a non-selection button 78 for not selecting any one-sided task. The user uses input device 44 to select either select button 77 or non-select button 78.

In the next step S903, it is determined whether or not any task is selected. At this time, when any of the selection buttons 77 is selected, the system control unit 40 determines that any of the tasks has been selected, and when the non-selection button 78 is selected, determines that no task has been selected.

In the case of affirmative determination in step S903, the process proceeds to step S303 described above, and an image as a lithography object is determined based on the task information 60B of the selected task, and image information of the image is acquired. On the other hand, if the determination is negative in step S903, the process proceeds to step S311 described above, and the error information indicating that there is no corresponding task is transmitted to the control device 5, thereby ending the second task execution processing program.

2‧‧‧1st exposure lithography device

3‧‧‧2nd exposure lithography device

5‧‧‧Control device

41‧‧‧Mission Memory

51‧‧‧Memory Department

60A‧‧‧1st mission information

60B‧‧‧2nd mission information

Claims (13)

An exposure lithography apparatus comprising: a first lithography mechanism that exposes a first surface lithographic image by exposing a first surface of an exposed substrate; and a memory mechanism for first task information, second task information, and Corresponding information indicating a correspondence relationship between the first task information and the second task information, wherein the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition. The first image is an image of the first surface of the substrate to be exposed, and the second task information is obtained by associating image information indicating the second image with exposure condition information indicating an exposure condition. The second image is an image in which the lithography is on the second surface opposite to the first surface of the exposed substrate, and the second lithography mechanism is configured by the first lithography mechanism by the first task information. The exposure condition is exposed to the first surface of the substrate to be exposed, and the first image indicated by the first task information is lithographically formed on the first surface, and is on the second surface of the substrate to be exposed Vignetting image based on the above pair Exposing an exposure condition indicated by the second task information corresponding to the first task information used in the first lithographic image to expose the second surface, thereby displaying the second task information The second image is lithographically formed on the second surface. The exposure lithography apparatus according to claim 1, wherein the memory means includes a first memory area in which the first task information is stored and has a memory In the second memory area of the second task information, the memory means stores the corresponding information in one of the first memory area and the second memory area. An exposure lithography system comprising: a first exposure lithography apparatus and a second exposure lithography apparatus, wherein the first exposure lithography apparatus includes: a first memory means for displaying image information of the first image and indicating exposure conditions The exposure condition information is stored in correspondence with the obtained first task information, wherein the first image is an image of the first surface of the substrate to be exposed; and the first lithography mechanism is exposed by the first task information. Conditioning the first surface to expose the first image indicated by the first task information to the first surface; and the transmitting means transmitting the information indicating the first task information, the first The task information is information used by the first lithography mechanism in the first lithographic image, and the second exposure lithography apparatus includes: a second memory mechanism, and the second task information and the first The corresponding information of the correspondence between the task information and the second task information is stored, and the second task information is obtained by associating the image information indicating the second image with the exposure condition information indicating the exposure condition, the second image Is lithography in the above The first surface and the second surface opposite to the substrate of the image exposure; receiving means receives the transmission means represented by the first transmission task 1 Information information; the determining means determines a second image and an exposure condition of the second image on the second surface based on the second task information corresponding to the first task information in the correspondence information, the first task information And indicating the information indicating the first task information received by the receiving unit; and the second lithography mechanism exposing the second surface by the exposure condition determined by the determining unit, thereby determining the second image determined by the determining unit Like lithography on the second side above. The exposure lithography system according to claim 3, wherein the exposure condition includes a size of the exposed substrate, a number of blocks of the exposed substrate to be exposed, and a lithographic region for determining an image. At least one of the arrangement pattern of the mark when the mark is provided on the exposed substrate and the type of the photosensitive material of the substrate to be exposed. The exposure lithography system according to claim 3, wherein the corresponding information is identification information for identifying the first task information and the second task information for identifying the first task information. The identification information corresponds to the obtained information, and the information indicating the first task information is the identification information of the first task information. The exposure lithography system according to claim 3, wherein the transmitting means of the first exposure lithography apparatus transmits the indication only when the lithography of the first lithography mechanism is normally completed. Information on the above first mission information. The exposure lithography system according to claim 3, wherein the transmitting means of the first exposure lithography apparatus indicates that the lithography of the first lithography mechanism is abnormally completed. The error message of the error occurred is sent. The exposure lithography system according to claim 3 or 5, further comprising a control device, wherein the control device includes: a third memory mechanism, the first task information, the second task information, and the corresponding information And transmitting, by the second transmitting means, the first task information stored in the third memory means to the first exposure lithography apparatus, and transmitting the second task information and the corresponding information to the second exposure micro The first exposure lithography apparatus further includes a second receiving unit, wherein the second receiving unit receives the first task information transmitted by the second transmitting unit, and the first lithography of the first exposure lithography device The mechanism uses the first task information received by the second receiving means in the first surface lithography image, the second exposure lithography device further includes a third receiving means, and the third receiving means receives the second receiving means The second task information transmitted by the transmitting means and the corresponding information, the second determining means of the second exposure lithography apparatus using the second task received by the third receiving means And the correspondence information in the second image to determine the exposure conditions and the second surface of the lithography. The exposure lithography system of claim 8, wherein The control device further includes an accepting unit that receives the input of the first task information, the second task information, and the corresponding information, and the third memory unit of the control device pairs the first task information received by the receiving unit The second task information and the corresponding information are memorized. An exposure lithography system comprising: a first exposure lithography device and a second exposure lithography device, wherein the first exposure lithography device includes: a first memory mechanism, the first task information and the first task information and the second task information The corresponding information of the correspondence information of the task information is obtained, wherein the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition, and the first image is a lithography An image of the first surface of the exposure substrate, wherein the second task information is obtained by associating image information indicating the second image with exposure condition information indicating an exposure condition, wherein the second image is lithographically exposed An image of the second surface of the substrate opposite to the first surface; the first lithography mechanism exposes the first surface by exposure conditions indicated by the first task information, thereby displaying the first task information The first image is lithographically on the first surface; and the transmitting means transmits the second task information in the corresponding information, the second task information and the first lithography by the first lithography mechanism The first one used in the image Information corresponding to the second exposure lithography apparatus comprising: receiving means for receiving the second task information transmitted by the transmitting means; And the second lithography mechanism illuminates the second surface by the exposure condition indicated by the second task information received by the receiving means, thereby puncturing the second image indicated by the second task information 2 sides. An exposure lithography system comprising: a first exposure lithography device, a control device, and a second exposure lithography device, wherein the first exposure lithography device includes: a fourth memory mechanism that memorizes the first task information, the first task The information is obtained by correlating image information indicating the first image with exposure condition information indicating an exposure condition, wherein the first image is an image of the first surface of the substrate to be exposed; the first lithography mechanism Exposing the first surface by the exposure condition indicated by the first task information, thereby puncturing the first image indicated by the first task information on the first surface; and the third transmitting means The information of the first task information used in the lithography of the lithography mechanism is transmitted, and the control device includes: a fifth memory mechanism, the first task information, the second task information, and the first task information and The corresponding information of the correspondence relationship of the second task information is stored, and the second task information is obtained by correspondingly displaying image information indicating the second image with exposure condition information indicating an exposure condition, and the second image is a lithography Above The first surface and the second surface opposite to the substrate of the image exposure; a fourth receiving means receives the transmission by the first transmission means 3 showing the first And information of the task information; and the fourth transmitting unit transmits the second task information corresponding to the first task information in the correspondence information, wherein the first task information indicates that the first receiving information is received by the fourth receiving unit The information of the task information, the second exposure lithography apparatus includes: a fifth receiving unit that receives information indicating the second task information transmitted by the fourth transmitting unit; and a second lithography mechanism The exposure condition indicated by the information indicated by the second task information received by the receiving means exposes the second surface, and the second image indicated by the second task information is lithographically formed on the second surface. A recording medium storing a program for causing a computer to function as a first lithography mechanism that exposes a first surface of an exposed substrate by an exposure condition indicated by a first task information, thereby The first lithography is the first image indicated by the first task information, and the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition. 1 is an image in which the lithography is on the first surface; and the second lithography mechanism exposes the first surface under exposure conditions indicated by the first task information, and the lithography is performed on the first surface When the first image indicated by the first task information is on the second surface lithography image of the substrate to be exposed, in the correspondence information indicating the correspondence relationship between the first task information and the second task information, The second item corresponding to the first task information used when the image is drawn on the first surface The exposure condition indicated by the task information exposes the second surface, whereby the second image indicated by the second task information is lithographically formed on the second surface, wherein the second task information indicates the second image The image information of the image is obtained in accordance with exposure condition information indicating an exposure condition, and the second image is an image of the second surface lithography opposite to the first surface of the substrate to be exposed. An exposure lithography method includes: a memory step of storing first task information, second task information, and correspondence information indicating a correspondence relationship between the first task information and the second task information in a memory mechanism, wherein the first The task information is obtained by correlating image information indicating the first image with exposure condition information indicating an exposure condition, and the first image is an image of the first surface of the substrate to be exposed by the first lithography mechanism. The first lithography mechanism exposes the first surface to the first surface lithography image, and the second task information corresponds to image information indicating the second image and exposure condition information indicating an exposure condition. Obtained, the second image is an image of a second surface opposite to the first surface of the substrate to be exposed; and a second lithography step, wherein the first lithography mechanism is used for the first task The exposure condition indicated by the information is exposed to the first surface of the exposed substrate, and the first image indicated by the first task information is lithographically formed on the first surface, and the first image of the exposed substrate is 2-sided lithography image based on The exposure condition indicated by the second task information corresponding to the first task information used in the first lithographic image is exposed by the second information, thereby displaying the second task information The second image shown is lithographically on the second surface.