JP2010181519A - Exposure device - Google Patents

Exposure device Download PDF

Info

Publication number
JP2010181519A
JP2010181519A JP2009023300A JP2009023300A JP2010181519A JP 2010181519 A JP2010181519 A JP 2010181519A JP 2009023300 A JP2009023300 A JP 2009023300A JP 2009023300 A JP2009023300 A JP 2009023300A JP 2010181519 A JP2010181519 A JP 2010181519A
Authority
JP
Japan
Prior art keywords
machine
exposure
printed wiring
wiring board
downstream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009023300A
Other languages
Japanese (ja)
Inventor
Takehiko Matsunaga
永 岳 彦 松
Jun Nagoya
古 屋 淳 名
Kazunori Hashimoto
本 一 範 橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adtec Engineering Co Ltd
Original Assignee
Adtec Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adtec Engineering Co Ltd filed Critical Adtec Engineering Co Ltd
Priority to JP2009023300A priority Critical patent/JP2010181519A/en
Publication of JP2010181519A publication Critical patent/JP2010181519A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device that efficiently exposes one surface or both the surfaces of a printed wiring board efficiently. <P>SOLUTION: An upstream exposing machine 1 is provided with a platen 15 for mounting the printed wiring board, to expose a pattern of a photomask on the printed wiring board by exposed light 16. A downstream-side exposing machine 3 also exposes a pattern of the photomask by exposed light 36 in the same way. An inverting/conveying machine 2 has a function of an inverting machine and a function of merely conveying machine and is constituted to switch between inverting machine mode and conveying machine mode by control of the controller 5. In the inversion machine mode, a surface and a rear surface of the printed wiring board are turned upside-down in the inverting/conveying machine 2, to feed into the downstream side exposing machine 3, by placing and using a rear-surface side of the printed wiring board as a surface side. When the one surface exposure of the printed wiring board, the inverting/conveying machine 2 is operated in the conveying machine 2 mode, to feed into the downstream exposing machine 3, as it is without, inverting the printed wiring board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、露光装置に関する。   The present invention relates to an exposure apparatus.

プリント配線用基板の生産では、通常基板の表裏両面に対して露光処理を行っている。そのため、プリント配線用基板の露光装置は、上流露光機と反転機及び下流露光機を有しており、上流露光機にて表面を露光処理した後、反転機においてプリント配線用基板を反転し、下流露光機において裏面を露光処理する構成になっている。   In the production of printed wiring boards, exposure processing is usually performed on both the front and back sides of the board. Therefore, the exposure apparatus for a printed wiring board has an upstream exposure machine, a reversing machine, and a downstream exposure machine, and after exposing the surface in the upstream exposure machine, the reversing machine reverses the printed wiring board, In the downstream exposure machine, the back surface is exposed.

特開２００６ー２５１０１６号公報JP 2006-251016 A 特開平１１ー１０９６４３号公報Japanese Patent Application Laid-Open No. 11-109643 特許第４１５８１４号公報Japanese Patent No. 415814

しかし、プリント配線用基板は常に両面を露光処理するわけではなく、片面のみしか露光処理しない場合もあり、片面処理の場合には、例えば上流露光機でプリント配線用基板を露光処理し、反転機と下流露光機ではプリント配線用基板を搬送させるのみとなり、生産性が悪い問題があった。
そのため片面露光専用の露光装置を設備することも行われているが、設備コストが大きくなる問題があった。
本発明は上記従来技術の問題を解決することを目的とする。 However, the printed wiring board is not always exposed on both sides, and may be exposed only on one side. In the case of single-sided processing, for example, the printed wiring board is exposed by an upstream exposure machine, and a reversing machine is used. However, the downstream exposure machine only transports the printed wiring board, which has a problem of poor productivity.
For this reason, installation of an exposure apparatus dedicated to single-sided exposure has also been performed, but there has been a problem that the equipment cost is increased.
The object of the present invention is to solve the problems of the prior art.

上記目的を達成するために、本発明は、プリント配線用基板の両面に回路パターンなどを露光可能な露光装置において、前工程から送られてくるプリント配線用基板の露光を行う上流露光機と、該上流露光機から送られてくるプリント配線用基板を反転させるか或は反転させずに送る反転／搬送機と、該反転／搬送機２から送られてくるプリント配線用基板の露光を行う下流露光機と、前記プリント配線用基板を反転させて下流露光機に送るか或はプリント配線用基板を反転させずに下流露光機に送るように、反転／搬送機を制御する制御装置と、を有することを特徴とする。
上記構成において、反転／搬送機は反転機としても搬送機としても使用できるから、片面露光の場合には、反転／搬送機を搬送機として使用することにより、プリント配線用基板を反転させずに下流露光機に送ることができ、上流露光機と下流露光機の両方を有効に使用することが可能になる。
またプリント配線用基板の片面を露光する場合、１のプリント配線用基板を上流露光機で露光させず、反転／搬送機において該１のプリント配線用基板を反転させずに下流露光機に送り、次のプリント配線用基板を上流露光機に送り、前記上流露光機と下流露光機において、１のプリント配線用基板と次のプリント配線用基板とを露光させる、ように制御する制御装置を、設けることが可能であり、この構成により上流露光機と下流露光機による露光を並行的に行うことができ、効率の良い片面露光を実現できる。
更に、 上流露光機においてプリント配線用基板の露光を行わなかった時、該プリント配線用基板を反転／搬送機において反転せずに下流露光機に送り、下流露光機において再度露光を行わせる、ように制御する制御装置を、更に備えることも可能である。上流露光機において、位置合わせ等が十分に行われない場合、未露光のまま反転／搬送機から下流露光機に送って、下流露光機で再度露光を行わせることが可能である。この構成により歩留まりの向上が可能になる。 To achieve the above object, the present invention provides an exposure apparatus capable of exposing a circuit pattern or the like on both sides of a printed wiring board, and an upstream exposure machine that performs exposure of the printed wiring board sent from the previous process; A reversing / conveying device for reversing or not reversing the printed wiring board sent from the upstream exposure machine, and a downstream for performing exposure of the printed wiring board sent from the reversing / conveying machine 2 An exposure machine, and a control device for controlling the reversing / conveying machine so as to invert the printed wiring board and send it to the downstream exposure machine or to send the printed wiring board to the downstream exposure machine without being reversed. It is characterized by having.
In the above configuration, the reversing / conveying machine can be used as both a reversing machine and a conveying machine. Therefore, in the case of single-sided exposure, the reversing / conveying machine can be used as a conveying machine without reversing the printed wiring board. It can be sent to the downstream exposure machine, and both the upstream exposure machine and the downstream exposure machine can be used effectively.
When one side of the printed wiring board is exposed, the one printed wiring board is not exposed by the upstream exposure machine, and the reversing / conveying machine sends the printed wiring board to the downstream exposure machine without being reversed. A control device is provided that controls to send the next printed wiring board to the upstream exposure machine and expose the first printed wiring board and the next printed wiring board in the upstream exposure machine and the downstream exposure machine. With this configuration, it is possible to perform exposure by the upstream exposure device and the downstream exposure device in parallel, and to realize efficient single-sided exposure.
Further, when the printed wiring board is not exposed in the upstream exposure machine, the printed wiring board is sent to the downstream exposure machine without being reversed in the reversing / conveying machine, and is again exposed in the downstream exposing machine. It is also possible to further include a control device for controlling the above. If the alignment or the like is not sufficiently performed in the upstream exposure machine, it can be sent from the reversing / conveying machine to the downstream exposure machine without being exposed, and the downstream exposure machine can perform the exposure again. With this configuration, the yield can be improved.

本発明の露光装置によれば、プリント配線用基板の両面を露光する場合も、プリント配線用基板の片面を露光する場合も、適切に対処可能であり、片面露光の場合であっても効率的に露光処理を行える効果がある。   According to the exposure apparatus of the present invention, it is possible to appropriately cope with both cases of exposing both sides of a printed wiring board and exposing one side of a printed wiring board, and efficient even in the case of single-sided exposure. There is an effect that exposure processing can be performed.

本発明の一実施形態を示す概略図。Schematic which shows one Embodiment of this invention. 本発明の一実施形態の動作を示す説明図。Explanatory drawing which shows operation | movement of one Embodiment of this invention. 本発明の一実施形態の動作を示す説明図。Explanatory drawing which shows operation | movement of one Embodiment of this invention. 本発明の一実施形態の動作を示すフローチャート図。The flowchart figure which shows operation | movement of one Embodiment of this invention.

以下本発明の実施の形態を図面に基づいて説明する。
図１において、図面上左（上流）から右（下流）へプリント配線用基板が移動して、処理を受ける構成になっている。この露光装置Ａは、左から順に上流露光機１と反転／搬送機２及び下流露光機３とを備えている。上流露光機１の出口側と入口側にはそれぞれ入口搬送装置１０と出口搬送装置１１が設けられており、また同様に下流露光機３の出口側と入口側にはそれぞれ入口搬送装置３０と出口搬送装置３１が設けられている。 Embodiments of the present invention will be described below with reference to the drawings.
In FIG. 1, the printed wiring board is moved from the left (upstream) to the right (downstream) in the drawing and is subjected to processing. The exposure apparatus A includes an upstream exposure device 1, a reversing / conveying device 2, and a downstream exposure device 3 in order from the left. An entrance transport device 10 and an exit transport device 11 are provided on the exit side and the entrance side of the upstream exposure device 1, respectively. Similarly, an entrance transport device 30 and an exit are provided on the exit side and the entrance side of the downstream exposure device 3, respectively. A transport device 31 is provided.

この露光装置Ａ全体は、制御装置５により制御されており、該制御装置５に操作装置６を介して操作者が種々の指令を送ることができるように構成されている。
反転／搬送機２は、通常はプリント配線用基板を反転させる反転機として機能し、制御装置５からの切り替え指令により、プリント配線用基板を反転させずに、単に上流露光機１から下流露光機３へプリント配線用基板を搬送する搬送機として機能することが可能になっている。 The entire exposure apparatus A is controlled by a control device 5, and is configured such that an operator can send various commands to the control device 5 via an operation device 6.
The reversing / conveying device 2 normally functions as a reversing device for reversing the printed wiring board. In response to a switching command from the control device 5, the reversing / transporting machine 2 is simply turned from the upstream exposure machine 1 to the downstream exposing machine without reversing the printed wiring board. It is possible to function as a transporter that transports the printed wiring board to 3.

上流露光機１は、プリント配線用基板を載置するプラテン１５を備えており、このプラテン１５をｘｙ及びθ方向に移動させて、フォトマスク（図示せず）とプリント配線用基板との位置合わせを行い、露光光源（図示せず）からの露光光１６により、プリント配線用基板にフォトマスクのパターンを露光するように構成されている。
下流露光機３も同様にプラテン３５、フォトマスク、露光光源を備え、同様にプリント配線用基板とフォトマスクとの位置合わせを行った上、露光光３６により露光を行うように構成されている。 The upstream exposure apparatus 1 includes a platen 15 on which a printed wiring board is placed. The platen 15 is moved in the xy and θ directions to align the photomask (not shown) with the printed wiring board. The pattern of the photomask is exposed to the printed wiring board by the exposure light 16 from the exposure light source (not shown).
Similarly, the downstream exposure machine 3 includes a platen 35, a photomask, and an exposure light source, and is configured to perform exposure using exposure light 36 after aligning the printed wiring board and the photomask.

反転／搬送機２は反転機の機能と、単なる搬送機の機能の両方を備えており、制御装置５から制御により、反転機モードと搬送機モードに切り換るように構成されている。反転機モードの場合には、反転／搬送機２においてプリント配線用基板を表裏反転させ、プリント配線用基板の裏面側を表にして下流露光機３に送るようになっている。この構成により、プリント配線用基板の両面の露光が行われる。   The reversing / conveying machine 2 has both a function of a reversing machine and a function of a simple conveying machine, and is configured to switch between a reversing machine mode and a transporting machine mode under the control of the control device 5. In the reversing machine mode, the printed wiring board is turned upside down in the reversing / conveying machine 2 and sent to the downstream exposure machine 3 with the back side of the printed wiring board turned upside down. With this configuration, both sides of the printed wiring board are exposed.

プリント配線用基板の片面露光の時は、反転／搬送機２を搬送機モードとし、この搬送機モードでは反転／搬送機２はプリント配線用基板を反転せず、そのまま下流露光機３に送るように構成されている。
以上の構成により、プリント配線用基板の両面露光の時も、プリント配線用基板の片面露光の時も、同一の露光装置を用いて、制御装置５から切り換え指令を送るだけで、効率的な露光が行われる。
また、片面露光の場合、上流露光機１で位置合わせができず、露光不能となった場合、下流露光機３において再度露光を試みるなどの使用方法や、下記するように並行露光などが可能になる。 At the time of single-sided exposure of the printed circuit board, the reversing / conveying device 2 is set to the transporting device mode. In this transporting device mode, the reversing / conveying device 2 does not reverse the printed wiring substrate and sends it directly to the downstream exposure device 3. It is configured.
With the above configuration, both the double-sided exposure of the printed wiring board and the single-sided exposure of the printed wiring board allow efficient exposure by simply sending a switching command from the control device 5 using the same exposure apparatus. Is done.
In addition, in the case of single-sided exposure, if it is impossible to align with the upstream exposure machine 1 and exposure becomes impossible, the downstream exposure machine 3 can be used for re-exposure or parallel exposure as described below. Become.

制御装置５は、片面露光の際に、反転／搬送機２と下流露光機３の両方で並行的に露光を行う並行露光モードのプログラミングを備えており、上流露光機１と下流露光機３とで２つのプリント配線用基板を並行的に露光処理することができるように構成されている。
これを図２乃至図４により説明する。 The control device 5 includes parallel exposure mode programming in which exposure is performed in parallel by both the reversing / conveying device 2 and the downstream exposure device 3 during single-sided exposure, and the upstream exposure device 1, the downstream exposure device 3, and the like. The two printed wiring boards can be exposed in parallel.
This will be described with reference to FIGS.

図４に示すように、制御装置５は最初に片面露光とするか否か判断する（ステップＳ１）。この判断は操作装置６からの指令或は他の信号に基づいて行う。片面露光ではない場合には、両面露光モードとして、両面露光処理を行う（ステップＳ２）。
片面露光の場合には、片面露光モードとし、反転／搬送機２を搬送機モードに切り換える（ステップＳ３）。 As shown in FIG. 4, the controller 5 first determines whether or not single-sided exposure is to be performed (step S1). This determination is made based on a command from the operation device 6 or other signals. If it is not single-sided exposure, double-sided exposure processing is performed as a double-sided exposure mode (step S2).
In the case of single-sided exposure, the single-sided exposure mode is set, and the reversing / conveying machine 2 is switched to the conveying machine mode (step S3).

そして、図２Ａに示すように、１枚目の基板５１を上流露光機１と反転／搬送機２を通過して下流露光機３に送り、プラテン３５上に載置する。２枚目の基板５２は上流露光機１に送り、プラテン１５に載置する（ステップＳ４）。
そして、図２Ｂに示すように上流露光機１と下流露光機３において基板５１と基板５２を並行的に露光処理する（ステップＳ５）。露光処理後、図２ｃに示すように基板５２及び基板５１を次の工程に送る（ステップＳ９）。
なお上流露光機１において、位置合わせ不良などにより基板５２の露光を行わなかった場合（ステップＳ６）、図３に示すように基板５２を下流露光機３に送って（ステップＳ７）、再露光を試みる（ステップＳ８）。
露光作業が終了しない場合は（ステップＳ１０）、ステップＳ４に戻り図２Ｄに示すように次の基板５３、５４をプラテン３５、プラテン１５上に載置して同じ動作を繰り返す。 Then, as shown in FIG. 2A, the first substrate 51 passes through the upstream exposure machine 1 and the reversing / conveying machine 2 and is sent to the downstream exposure machine 3 to be placed on the platen 35. The second substrate 52 is sent to the upstream exposure machine 1 and placed on the platen 15 (step S4).
Then, as shown in FIG. 2B, the upstream exposure machine 1 and the downstream exposure machine 3 expose the substrate 51 and the substrate 52 in parallel (step S5). After the exposure process, as shown in FIG. 2c, the substrate 52 and the substrate 51 are sent to the next process (step S9).
If the exposure of the substrate 52 is not performed in the upstream exposure machine 1 due to misalignment or the like (step S6), the substrate 52 is sent to the downstream exposure machine 3 as shown in FIG. 3 (step S7) and re-exposure is performed. Try (step S8).
If the exposure operation is not completed (step S10), the process returns to step S4 and the next substrates 53 and 54 are placed on the platen 35 and platen 15 as shown in FIG.

以上のように、上記実施形態においては、片面露光に際して上流露光機１と下流露光機３により並行的な処理を行うことができ、効率の良い露光処理が行える。また、未露光が生じたときに、再露光を行うことができるなどの効果がある。   As described above, in the above-described embodiment, parallel processing can be performed by the upstream exposure device 1 and the downstream exposure device 3 in single-sided exposure, and efficient exposure processing can be performed. Further, there is an effect that re-exposure can be performed when unexposed occurs.

１：上流露光機、２：反転／搬送機、３：下流露光機、５：制御装置、６：操作装置、１０：入口搬送装置、１１：出口搬送装置、１５：プラテン、１６：露光光、３０：入口搬送装置、３１：出口搬送装置、３５：プラテン、３６：露光光、５１：基板、５２：基板、５３：基板、５４：基板。 1: upstream exposure machine, 2: reversal / conveyance machine, 3: downstream exposure machine, 5: control device, 6: operation device, 10: inlet conveyance device, 11: outlet conveyance device, 15: platen, 16: exposure light, 30: Entrance transport device, 31: Exit transport device, 35: Platen, 36: Exposure light, 51: Substrate, 52: Substrate, 53: Substrate, 54: Substrate.

Claims (3)

プリント配線用基板の両面に回路パターンなどを露光可能な露光装置において、
前工程から送られてくるプリント配線用基板の露光を行う上流露光機と、
該上流露光機から送られてくるプリント配線用基板を反転させるか或は反転させずに送る反転／搬送機と、
該反転／搬送機から送られてくるプリント配線用基板の露光を行う下流露光機と、
前記プリント配線用基板を反転させて下流露光機に送るか或はプリント配線用基板を反転させずに下流露光機に送るように、反転／搬送機を制御する制御装置と、
を有することを特徴とする露光装置。 In an exposure apparatus that can expose circuit patterns on both sides of a printed wiring board,
An upstream exposure machine that performs exposure of the printed wiring board sent from the previous process;
A reversing / conveying device for reversing or not reversing the printed wiring board sent from the upstream exposure device;
A downstream exposure machine that performs exposure of a printed wiring board sent from the reversing / conveying machine;
A control device for controlling the reversing / conveying machine so as to invert the printed wiring board and send it to the downstream exposure machine or to send the printed wiring board to the downstream exposure machine without reversing;
An exposure apparatus comprising: プリント配線用基板の片面を露光する場合、１のプリント配線用基板を上流露光機で露光させず、反転／搬送機において該１のプリント配線用基板を反転させずに下流露光機に送り、次のプリント配線用基板を上流露光機に送り、前記上流露光機と下流露光機において、１のプリント配線用基板と次のプリント配線用基板とを露光させる、ように制御する制御装置を、
更に備えた請求項１の露光装置。 When one side of the printed wiring board is exposed, the first printed wiring board is not exposed by the upstream exposure machine, and the reversing / conveying machine sends the printed wiring board to the downstream exposure machine without being reversed. A control device for controlling the printed wiring board to be sent to the upstream exposure machine and exposing the first printed wiring board and the next printed wiring board in the upstream exposure machine and the downstream exposure machine,
The exposure apparatus according to claim 1, further comprising: 上流露光機においてプリント配線用基板の露光を行わなかった時、該プリント配線用基板を反転／搬送機において反転せずに下流露光機に送り、下流露光機において再度露光を行わせる、ように制御する制御装置を、
更に備えた請求項１又は２の露光装置。 Control that the printed wiring board is not exposed in the upstream exposure machine and sent to the downstream exposure machine without being reversed in the reversing / conveying machine, and the downstream exposure machine is exposed again. Control device to
The exposure apparatus according to claim 1 or 2, further comprising:
JP2009023300A 2009-02-04 2009-02-04 Exposure device Pending JP2010181519A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009023300A JP2010181519A (en) 2009-02-04 2009-02-04 Exposure device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009023300A JP2010181519A (en) 2009-02-04 2009-02-04 Exposure device

Publications (1)

Publication Number Publication Date
JP2010181519A true JP2010181519A (en) 2010-08-19

Family

ID=42763113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009023300A Pending JP2010181519A (en) 2009-02-04 2009-02-04 Exposure device

Country Status (1)

Country Link
JP (1) JP2010181519A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031235A1 (en) * 2011-09-02 2013-03-07 株式会社ニコン Aligning method, exposure method, device manufacturing method, and method for manufacturing flat panel display
KR101247253B1 (en) 2010-10-28 2013-03-25 주식회사 엔에스티 Apparatus and method for double-sided exposure using liquid crystal mask
JP2014071157A (en) * 2012-09-27 2014-04-21 Fujifilm Corp Exposure drawing apparatus, exposure drawing system, program, and exposure drawing method
WO2020119863A1 (en) 2018-12-12 2020-06-18 Laser Imaging Systems Gmbh Device for exposing planar workpieces at a high throughput rate
DE102020127981B3 (en) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Turning device for handling sensitive substrates when exposing two-dimensional structures on both substrate surfaces
DE102020124006B3 (en) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh EXPOSURE CONTROL IN PHOTOLITHOGRAPHIC DIRECT EXPOSURE METHODS FOR CREATING CIRCUIT BOARDS OR CIRCUITS

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101247253B1 (en) 2010-10-28 2013-03-25 주식회사 엔에스티 Apparatus and method for double-sided exposure using liquid crystal mask
WO2013031235A1 (en) * 2011-09-02 2013-03-07 株式会社ニコン Aligning method, exposure method, device manufacturing method, and method for manufacturing flat panel display
JP2014071157A (en) * 2012-09-27 2014-04-21 Fujifilm Corp Exposure drawing apparatus, exposure drawing system, program, and exposure drawing method
WO2020119863A1 (en) 2018-12-12 2020-06-18 Laser Imaging Systems Gmbh Device for exposing planar workpieces at a high throughput rate
DE102018132001A1 (en) 2018-12-12 2020-06-18 Laser Imaging Systems Gmbh Device for exposing plate-shaped workpieces with high throughput
US11656556B2 (en) 2018-12-12 2023-05-23 Laser Imaging Systems Gmbh Apparatus for the exposure of plate-shaped workpieces with high throughput
DE102020124006B3 (en) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh EXPOSURE CONTROL IN PHOTOLITHOGRAPHIC DIRECT EXPOSURE METHODS FOR CREATING CIRCUIT BOARDS OR CIRCUITS
WO2022057981A1 (en) 2020-09-15 2022-03-24 Laser Imaging Systems Gmbh Exposure control in photolithographic direct exposure methods for manufacturing circuit boards or circuits
DE102020127981B3 (en) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Turning device for handling sensitive substrates when exposing two-dimensional structures on both substrate surfaces

Similar Documents

Publication Publication Date Title
JP2010181519A (en) Exposure device
JP4777682B2 (en) Scan exposure equipment
WO2014141422A1 (en) Production management system for component mounting device
JP2011143640A (en) Screen printing apparatus
JP2012044001A (en) Shuttle conveyer and work machine for circuit board
JP2011048239A (en) Double-sided exposure apparatus
JP2004142299A (en) Screen printing system and screen printing method
JP4386396B2 (en) Board transfer method and board transfer apparatus in component mounting system
JP2005072317A (en) Packaging method and apparatus
CN114253091B (en) Full-automatic double-sided digital photoetching method
JP2008307830A (en) Printing apparatus
JP2012023114A (en) Component mounting system and method for conveying boards in the same
JP5752088B2 (en) Exposure equipment
JP5617471B2 (en) Electronic component mounting apparatus and electronic component mounting work execution method
KR101700036B1 (en) LDI In-Line double-sided drum-type exposure apparatus
JP2014092790A (en) Panel exposure apparatus of printed circuit board
KR100806843B1 (en) Apparatus and method for exposuring board material
JP5365274B2 (en) Exposure equipment
WO2017130341A1 (en) Power management system for production line
JP2011228466A (en) Substrate manufacturing device
JP6084241B2 (en) Board transfer system for electronic component mounting equipment
JP2011131489A (en) Screen printing apparatus
JP2002158499A (en) Electronic component assembling line
CN114265287A (en) Single-side digital photoetching system
JP3469053B2 (en) LCD substrate manufacturing equipment