CN114253091B - Full-automatic double-sided digital photoetching method - Google Patents
Full-automatic double-sided digital photoetching method Download PDFInfo
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- CN114253091B CN114253091B CN202210115530.5A CN202210115530A CN114253091B CN 114253091 B CN114253091 B CN 114253091B CN 202210115530 A CN202210115530 A CN 202210115530A CN 114253091 B CN114253091 B CN 114253091B
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- circuit board
- photoetching
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2032—Simultaneous exposure of the front side and the backside
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
Abstract
The invention discloses a full-automatic double-sided digital photoetching method, which comprises the following steps: transferring the circuit board from the feeding station to a first conveying line, and conveying the circuit board to a first clapper station through the first conveying line; after the circuit board is positioned in the shooting process, transferring the circuit board to a first photoetching platform, and controlling the first photoetching platform to be transferred to the lower part of a photoetching machine; controlling the photoetching machine to start, and controlling the photoetching machine to stop after photoetching is finished; transferring the circuit board on the first photoetching platform to a second conveying line, and conveying the circuit board to a turnover station through the second conveying line; after the circuit board is turned over, the circuit board is conveyed to a shunting station; the circuit board is conveyed to a second clapper station through a third conveying line; after the circuit board is positioned in the shooting process, transferring the circuit board to a second photoetching platform, and controlling the second photoetching platform to be transferred to the lower part of the photoetching machine; controlling the photoetching machine to start, and after photoetching is finished, controlling the photoetching machine to stop; and transferring the circuit board on the second photoetching platform to a second conveying line.
Description
Technical Field
The invention relates to the field of photoetching machines, in particular to a full-automatic double-sided digital photoetching method for a PCB (printed circuit board).
Background
The lithography machine, also known as a mask alignment exposure machine, an exposure system, a lithography system, etc., uses a technology similar to photo printing to print a fine pattern on a mask plate on a silicon wafer by light exposure.
In order to adapt to the development of the intellectualization and miniaturization of electronic products, the electronic circuit is not exposed on only one side of the base material, but the exposure of the electronic circuit is generally required to be performed on both sides of the base material.
However, at present, when a base material is subjected to double-sided processing, two exposure machines are generally required, and although the double-sided exposure mode realizes automation of double-sided exposure, the whole automation system occupies a large space and requires two exposure systems to respectively expose.
Disclosure of Invention
The present invention is directed to a full-automatic double-sided digital photolithography method, which is used to solve the technical problems in the background art.
In order to achieve the above object, the present invention provides a full-automatic double-sided digital lithography method, including:
transferring the circuit board from a feeding station to a first conveying line, and conveying the circuit board to a first clapper station through the first conveying line, wherein the circuit board is positioned on the first clapper station;
after the circuit board is positioned, transferring the circuit board from a first board-shooting station to a first photoetching platform, and controlling the first photoetching platform to be transferred to the lower part of a photoetching machine;
after the first photoetching platform moves below the photoetching machine, controlling the photoetching machine to start to carry out digital photoetching on a circuit board on the first photoetching platform, and after photoetching is finished, controlling the photoetching machine to stop and controlling the first photoetching platform to move out of the position below the photoetching machine;
after the first photoetching platform is moved out, transferring the circuit board on the first photoetching platform to a second conveying line, conveying the circuit board to a turnover station through the second conveying line, and turning the circuit board at the turnover station;
after the circuit board is turned over, the circuit board is conveyed to a shunting station through the second conveying line, and the circuit board is shunted on the shunting station so that the circuit board is transferred to a third conveying line;
the circuit board is conveyed to a second clapper station through the third conveying line, and the circuit board is positioned on the second clapper station;
after the circuit board is positioned, transferring the circuit board from a second board-shooting station to a second photoetching platform, and controlling the second photoetching platform to be transferred to the lower part of the photoetching machine;
after the second photoetching platform moves below the photoetching machine, controlling the photoetching machine to start to carry out digital photoetching on a circuit board on the second photoetching platform, and after photoetching is finished, controlling the photoetching machine to stop and controlling the second photoetching platform to move out of the position below the photoetching machine;
and after the second photoetching platform is moved out, transferring the circuit board on the second photoetching platform to a second conveying line, and transferring the circuit board to a material receiving station through the second conveying line.
In some embodiments, the positioning of the wiring board at the first clapper station comprises:
and controlling the two oppositely arranged first clamping mechanisms to move towards the circuit board respectively so that the circuit board is clamped by the two first clamping mechanisms and moves to the middle position.
In some embodiments, the positioning of the wiring board at the first clapper station further comprises:
before the two first clamping mechanisms are controlled to move towards the circuit board respectively, the first lifting mechanism is controlled to move towards the circuit board, so that the circuit board moves upwards.
In some embodiments, the circuit board is transferred from the first pick station to the first lithography stage by a first infeed transfer mechanism, and the circuit board is transferred from the first lithography stage to the second conveyor line by a first outfeed transfer mechanism.
In some embodiments, the circuit board is transferred from the second pick station to the second lithography stage by a second infeed transfer mechanism, and the circuit board is transferred from the second lithography stage to the second conveyor by a second outfeed transfer mechanism.
In some embodiments, positioning the wiring board at the second clapper station comprises:
and controlling the two oppositely arranged second clamping mechanisms to move towards the circuit board respectively so that the circuit board is clamped by the two second clamping mechanisms and moves to the middle position.
In some embodiments, positioning the wiring board at the second clapper station further comprises:
before the two second clamping mechanisms are controlled to move towards the circuit board respectively, the second lifting mechanism is controlled to move towards the circuit board, so that the circuit board moves upwards.
In some embodiments, the shunting the circuit board at the shunting station comprises:
and controlling the stopping mechanism to move upwards to enable the circuit board to be stopped at a preset position before the circuit board is transferred from the second conveying line to the third conveying line.
According to the technical scheme provided by the invention, the two sides of the circuit board can be subjected to digital photoetching through one exposure machine, and compared with the existing method of carrying out double-side digital photoetching on the circuit board by adopting two exposure machines, the size of the full-automatic double-side digital photoetching machine can be greatly reduced, and the space occupation and the manufacturing cost of the full-automatic double-side digital photoetching machine are reduced.
Drawings
FIG. 1 is a flow chart of a first embodiment of a fully automatic double-sided digital lithography method according to the present invention;
FIG. 2 is a control schematic diagram of the full-automatic double-sided digital photolithography method according to the present invention;
FIG. 3 is a flow chart of a second embodiment of the fully automated double-sided digital lithography method according to the present invention;
FIG. 4 is a flow chart of a third embodiment of the fully automatic double-sided digital lithography method according to the present invention;
FIG. 5 is a flowchart of a fourth embodiment of a fully automatic double-sided digital photolithography method according to the present invention;
FIG. 6 is a flow chart of a fifth embodiment of the fully automatic double-sided digital photolithography method according to the present invention;
FIG. 7 is a flowchart of a sixth embodiment of the fully automatic double-sided digital photolithography method according to the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and back \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicators are changed accordingly.
It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a full-automatic double-sided digital lithography method, which is applied to the lithography of a PCB; which comprises the following steps:
s10, transferring the circuit board from the feeding station to a first conveying line, conveying the circuit board to a first clapper station through the first conveying line, and positioning the circuit board on the first clapper station;
s20, after the circuit board is positioned, transferring the circuit board from the first board shooting station to a first photoetching platform, and controlling the first photoetching platform to be transferred to the lower part of a photoetching machine;
s30, after the first photoetching platform moves to the position below the photoetching machine, the photoetching machine is controlled to be started to carry out digital photoetching on the circuit board on the first photoetching platform, and after photoetching is finished, the photoetching machine is controlled to be stopped and the first photoetching platform is controlled to move out of the position below the photoetching machine;
s40, after the first photoetching platform is moved out, transferring the circuit board on the first photoetching platform to a second conveying line, conveying the circuit board to a turnover station through the second conveying line, and turning over the circuit board at the turnover station;
s50, after the circuit board is turned over, the circuit board is conveyed to a shunting station through a second conveying line, and shunting is carried out on the circuit board on the shunting station so that the circuit board is transferred to a third conveying line;
s60, conveying the circuit board to a second clapper station through a third conveying line, and positioning the circuit board on the second clapper station;
s70, after the circuit board is positioned, transferring the circuit board from a second board shooting station to a second photoetching platform, and controlling the second photoetching platform to be transferred to the position below a photoetching machine;
s80, after the second photoetching platform moves to the position below the photoetching machine, controlling the photoetching machine to start to carry out digital photoetching on the circuit board on the second photoetching platform, and after photoetching is finished, controlling the photoetching machine to stop and controlling the second photoetching platform to move out of the position below the photoetching machine;
and S90, after the second photoetching platform is moved out, transferring the circuit board on the second photoetching platform to a second conveying line, and transferring the circuit board to a material receiving station through the second conveying line.
The full-automatic double-sided digital photoetching method provided by the embodiment is applied to a full-automatic double-sided digital photoetching machine, and the full-automatic double-sided digital photoetching machine comprises a first conveying line, a second conveying line, a third conveying line, a first photoetching platform, a second photoetching platform and a photoetching machine. Specifically, the first conveying line and the third conveying line are respectively arranged at two ends of the second conveying line and are intersected with the second conveying line, the first photoetching platform and the second photoetching platform are respectively arranged between the first conveying line and the third conveying line, and the photoetching machine is arranged between the first photoetching platform and the second photoetching platform.
The circuit board to be processed is placed at the feeding station, the circuit board is transferred onto the first conveying line from the feeding station during processing, and after the circuit board is transferred onto the first conveying line, the circuit board is conveyed through the first conveying line, so that the circuit board is conveyed to the first clapper station. After the circuit board is transferred to the first clapper station, the circuit board is positioned through a mechanism arranged at the first clapper station, so that the circuit board is located at a preset position. And then, transferring the positioned circuit board from the first board beating station to a first photoetching platform, and moving the circuit board carried by the first photoetching platform to the position below the photoetching machine. And after the first photoetching platform moves to the position below the photoetching machine, controlling the photoetching machine to start so as to carry out digital photoetching on the circuit board on the first photoetching platform. And after the photoetching is finished, controlling the photoetching machine to stop, and controlling the first photoetching platform to move out of the position below the photoetching machine. And after the circuit board is moved out, the circuit board is transferred from the first photoetching platform to a second conveying line and is conveyed to a turnover station through the second conveying line.
After the circuit board reaches the turnover station, the circuit board is turned over through a turnover mechanism at the turnover station, so that the circuit board is turned over for 180 degrees. And then the circuit board is conveyed to a shunting station through a second conveying line, a board distributing mechanism is arranged at the shunting station, and the circuit board is transferred to a third conveying line through the board distributing mechanism. And after the circuit board reaches the third conveying line, the circuit board is conveyed to the second clapping station through the third conveying line, so that the circuit board is clapped at the second clapping station. And after the circuit board beating is finished, transferring the circuit board from the second beating station to a second photoetching platform, and controlling the second photoetching platform to move to the position below the photoetching machine after the second photoetching platform bears the circuit board. And after the second photoetching platform moves to the position below the photoetching machine, controlling the photoetching machine to start to carry out digital photoetching on the circuit board on the second photoetching platform, and after photoetching is finished, controlling the second photoetching platform to move out of the position below the photoetching machine. And after the circuit board is moved out, the circuit board is transferred from the second photoetching platform to a second conveying line so as to be conveyed to a material receiving station by the second conveying line, and the steps are repeated in a circulating mode.
In some embodiments, referring to fig. 3, the positioning of the circuit board at the first clapper station comprises:
s11, the two oppositely arranged first clamping mechanisms are controlled to move towards the circuit board respectively, so that the circuit board is clamped by the two first clamping mechanisms and moves to the middle position.
In this embodiment, two first clamping mechanisms are arranged at the first clapper station, and the two first clamping mechanisms are arranged oppositely and can be close to or far away from each other. When the two first clamping mechanisms are close to each other, the first clamping mechanisms are gradually close to the circuit board and abut against the circuit board, and then the circuit board is clamped to move to the middle position, so that the circuit board is positioned. After the workpiece is positioned, the two first clamping mechanisms are controlled to be away from each other to reset, so that the two first clamping mechanisms are separated from the two opposite sides of the circuit board respectively.
In some embodiments, referring to fig. 4, positioning the circuit board at the first clapper station further comprises:
and S12, before the two first clamping mechanisms are controlled to move towards the circuit board respectively, the first lifting mechanism is controlled to move towards the circuit board, so that the circuit board moves upwards.
In this embodiment, the mode that first transfer chain adopted dwang and running roller realizes being provided with a plurality of interval distribution's running roller on the dwang to the transport of circuit board, and the circuit board is placed and is carried on the running roller. Because the roller is in point contact with the circuit board, the surface of the circuit board is easily damaged, and therefore the first lifting mechanism is arranged at the first clapper station in the embodiment. Specifically, before controlling two first fixture and moving towards the circuit board respectively, control first elevating system and move towards the circuit board to make the circuit board rebound, thus circuit board and running roller break away from, just also can not take place because of the damage that the point contact between running roller and the circuit board leads to.
In some embodiments, the circuit board provided by the invention is transferred from the first board shooting station to the first photoetching platform through the first feeding transfer mechanism, and the circuit board is transferred from the first photoetching platform to the second conveying line through the first discharging transfer mechanism.
In this embodiment, a first feeding transfer mechanism and a first discharging transfer mechanism are respectively disposed between the first clapper station and the first photolithography platform and between the first clapper station and the second conveyor line, and feeding and discharging of the workpiece are respectively completed by the first feeding transfer mechanism and the first discharging transfer mechanism. Specifically, when the workpiece is located at the first clapper station, the first feeding transfer mechanism is controlled to transfer the workpiece located at the first clapper station to the first photoetching platform, and after the workpiece is machined, the first discharging transfer mechanism is controlled to transfer the workpiece from the first photoetching platform to the second conveying line.
In some embodiments, the circuit board provided by the present invention is transferred from the second pick-up station to the second lithography stage by the second feeding transfer mechanism, and the circuit board is transferred from the second lithography stage to the second conveyor line by the second discharging transfer mechanism.
In this embodiment, a second feeding transfer mechanism and a second discharging transfer mechanism are respectively disposed between the second clapper station and the second photolithography platform and the second conveyor line, and feeding and discharging of the workpiece are respectively completed by the second feeding transfer mechanism and the second discharging transfer mechanism. Specifically, when the workpiece is located at the second clapper station, the second feeding transfer mechanism is controlled to transfer the workpiece located at the first clapper station to the second photoetching platform, and after the workpiece is machined, the second discharging transfer mechanism is controlled to transfer the workpiece from the second photoetching platform to the second conveying line.
In some embodiments, referring to fig. 5, positioning the circuit board at the second clapper station comprises:
and S61, controlling the two oppositely arranged second clamping mechanisms to move towards the circuit board respectively, so that the circuit board is clamped by the two second clamping mechanisms and moves to the middle position.
In this embodiment, two second clamping mechanisms are arranged at the second clapper station, and the two second clamping mechanisms are arranged oppositely and can be close to or far away from each other. When the two second clamping mechanisms are close to each other, the second clamping mechanisms are gradually close to the circuit board and abut against the circuit board, and then the circuit board is clamped and moved to the middle position, so that the circuit board is positioned. After the workpiece is positioned, the two second clamping mechanisms are controlled to be away from each other to reset, so that the two second clamping mechanisms are separated from the two opposite sides of the circuit board respectively.
In some embodiments, referring to fig. 6, the positioning of the circuit board at the second clapping station further comprises:
and S62, before controlling the two second clamping mechanisms to respectively move towards the circuit board, controlling the second lifting mechanism to move towards the circuit board so as to enable the circuit board to move upwards.
In this embodiment, the mode that third transfer chain adopted dwang and running roller realizes being provided with a plurality of interval distribution's running roller on the dwang to the transport of circuit board, and the circuit board is placed and is carried on the running roller. Because the roller is in point contact with the circuit board, the surface of the circuit board is easily damaged, and therefore the second lifting mechanism is arranged at the second clapper station in the embodiment. Specifically, before controlling two second fixture and moving towards the circuit board respectively, control second elevating system and move towards the circuit board to make the circuit board rebound, thus circuit board and running roller break away from, just also can not take place because of the damage that the point contact between running roller and the circuit board leads to.
In some embodiments, referring to fig. 7, the shunting the circuit board at the shunting station includes:
and S51, controlling the stopping mechanism to move upwards to stop the circuit board at a preset position before transferring the circuit board from the second conveying line to the third conveying line.
In this embodiment, be provided with backstop mechanism in reposition of redundant personnel station department, stop the work piece in default position through this backstop mechanism, avoid the work piece to be carried to the region outside the reposition of redundant personnel station. Specifically, when the workpiece is conveyed by the second conveying line, the stopping mechanism moves upwards to the preset position, and after the workpiece moves to the preset position, the workpiece is stopped by the stopping mechanism, so that the purpose of limiting is achieved.
The above is only a part or preferred embodiment of the present invention, and neither the text nor the drawings should limit the scope of the present invention, and all equivalent structural changes made by the present specification and the contents of the drawings or the related technical fields directly/indirectly using the present specification and the drawings are included in the scope of the present invention.
Claims (8)
1. A full-automatic double-sided digital photoetching method is characterized by comprising the following steps:
transferring the circuit board from a feeding station to a first conveying line, and conveying the circuit board to a first clapper station through the first conveying line, wherein the circuit board is positioned on the first clapper station;
after the circuit board is positioned, transferring the circuit board from a first board-shooting station to a first photoetching platform, and controlling the first photoetching platform to be transferred to the position below a photoetching machine;
after the first photoetching platform moves below the photoetching machine, controlling the photoetching machine to start to carry out digital photoetching on a circuit board on the first photoetching platform, and after photoetching is finished, controlling the photoetching machine to stop and controlling the first photoetching platform to move out of the position below the photoetching machine;
after the first photoetching platform is moved out, transferring the circuit board on the first photoetching platform onto a second conveying line, conveying the circuit board to a turnover station through the second conveying line, and turning over the circuit board at the turnover station;
after the circuit board is turned over, the circuit board is conveyed to a shunting station through the second conveying line, and the circuit board is shunted on the shunting station so that the circuit board is transferred to a third conveying line;
the circuit board is conveyed to a second clapper station through the third conveying line, and the circuit board is positioned on the second clapper station;
after the circuit board is positioned, transferring the circuit board from a second board-shooting station to a second photoetching platform, and controlling the second photoetching platform to be transferred to the lower part of the photoetching machine, wherein the first photoetching platform, the second photoetching platform and the photoetching machine are all positioned at the same side of the second conveying line along the front-back direction and are all arranged between the first conveying line and the third conveying line along the left-right direction, and the photoetching machine is arranged between the first photoetching platform and the second photoetching platform along the left-right direction;
after the second photoetching platform moves below the photoetching machine, controlling the photoetching machine to start to carry out digital photoetching on a circuit board on the second photoetching platform, and after photoetching is finished, controlling the photoetching machine to stop and controlling the second photoetching platform to move out of the position below the photoetching machine;
and after the second photoetching platform is moved out, transferring the circuit board on the second photoetching platform to a second conveying line, and transferring the circuit board to a material receiving station through the second conveying line.
2. The method of claim 1, wherein positioning the circuit board at the first clapper station comprises:
and controlling the two oppositely arranged first clamping mechanisms to move towards the circuit board respectively so that the circuit board is clamped by the two first clamping mechanisms and moves to the middle position.
3. The method of claim 2, wherein positioning the circuit board at the first clapper station further comprises:
before the two first clamping mechanisms are controlled to move towards the circuit board respectively, the first lifting mechanism is controlled to move towards the circuit board, so that the circuit board moves upwards.
4. The method according to claim 1, wherein the circuit board is transferred from the first pick station to the first lithography stage by a first in-feed transfer mechanism, and the circuit board is transferred from the first lithography stage to the second conveyor line by a first out-feed transfer mechanism.
5. The method according to claim 1, wherein the circuit board is transferred from the second pick-up station to the second lithography stage by a second infeed transfer mechanism, and the circuit board is transferred from the second lithography stage to the second conveyor line by a second outfeed transfer mechanism.
6. The method according to claim 1, wherein positioning the circuit board at the second substrate-taking station comprises:
and controlling the two oppositely arranged second clamping mechanisms to respectively move towards the circuit board, so that the circuit board is clamped by the two second clamping mechanisms and moves to the middle position.
7. The method of claim 6, wherein positioning the circuit board at the second clapper station further comprises:
before the two second clamping mechanisms are controlled to move towards the circuit board respectively, the second lifting mechanism is controlled to move towards the circuit board, so that the circuit board moves upwards.
8. The method according to claim 1, wherein shunting the circuit board at the shunting station comprises:
and controlling the stopping mechanism to move upwards to enable the circuit board to be stopped at a preset position before the circuit board is transferred from the second conveying line to the third conveying line.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210115530.5A CN114253091B (en) | 2022-02-07 | 2022-02-07 | Full-automatic double-sided digital photoetching method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210115530.5A CN114253091B (en) | 2022-02-07 | 2022-02-07 | Full-automatic double-sided digital photoetching method |
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| CN114253091A CN114253091A (en) | 2022-03-29 |
| CN114253091B true CN114253091B (en) | 2022-11-15 |
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| CN116022541B (en) * | 2023-03-30 | 2023-06-06 | 广东科视光学技术股份有限公司 | Digital photoetching system of circuit board and photoetching method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6781674B1 (en) * | 2003-05-29 | 2004-08-24 | Asml Holding N.V. | System and method to increase throughput in a dual substrate stage double exposure lithography system |
| CN106547174A (en) * | 2016-12-19 | 2017-03-29 | 浙江欧视达科技有限公司 | Full-automatic double-side exposure machine |
| CN107039321A (en) * | 2015-11-13 | 2017-08-11 | 台湾积体电路制造股份有限公司 | Handling system for semiconductor workpiece |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101551598B (en) * | 2009-04-03 | 2010-12-01 | 清华大学 | Double-stage switching system of photoetching machine wafer stage |
| CN212623568U (en) * | 2020-06-23 | 2021-02-26 | 苏州源卓光电科技有限公司 | Full-automatic double-sided exposure machine |
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- 2022-02-07 CN CN202210115530.5A patent/CN114253091B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6781674B1 (en) * | 2003-05-29 | 2004-08-24 | Asml Holding N.V. | System and method to increase throughput in a dual substrate stage double exposure lithography system |
| CN107039321A (en) * | 2015-11-13 | 2017-08-11 | 台湾积体电路制造股份有限公司 | Handling system for semiconductor workpiece |
| CN106547174A (en) * | 2016-12-19 | 2017-03-29 | 浙江欧视达科技有限公司 | Full-automatic double-side exposure machine |
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