TWI606307B - Exposure lithography device, exposure lithography system, recording media for storing program, and exposure lithography method - Google Patents

Description

Exposure lithography device, exposure lithography system, storage medium for storage programs Body and exposure lithography

The invention relates to an exposure lithography device, an exposure lithography system, a storage medium recording medium and an exposure lithography method, in particular to an exposure lithography device and a micro exposure image on a two-sided lithographic image of an exposed substrate. The image system stores a recording medium of a program executed by the exposure lithography apparatus and the exposure lithography system, and an exposure lithography method of lithographic images on both sides of the substrate to be exposed.

Previously, an exposure lithography apparatus was developed which exposes a light beam modulated based on image information on an exposed substrate as a printed substrate, and lithographically images on the exposed substrate. Moreover, an exposure lithography system has also been developed in which two photographic lithography apparatuses are juxtaposed for lithographic images on both sides of an exposed substrate, one of which is used for the lithography of the first surface, and the other is A lithography for the second surface opposite to the first surface. In the exposure lithography system, after the lithographic image of the first surface of the substrate to be exposed by the exposure lithography apparatus for the first surface, the exposure substrate is transported to the exposure lithography apparatus for the second surface The specified position, and by the exposure The shadow device is a lithographic image on the second surface of the substrate to be exposed.

As a related art of the exposure lithography system, Patent Document 1 discloses an exposure lithography system which improves the lithographic image on the first surface and the second surface of the substrate to be exposed by using two exposure lithography apparatuses. The yield of the conveyance treatment of the substrate to be exposed at the time.

Each of the exposure lithography apparatuses included in the exposure lithography system includes a lithography unit, the lithography unit includes: a platform moving mechanism for placing the exposed substrate, a platform moving mechanism for linearly moving the platform, and loading on the platform A beam scanning mechanism that scans the light beam on the first surface of the substrate to be exposed. Further, each of the exposure lithography apparatuses includes: an upstream side unit disposed on the upstream side of the lithography unit in the moving direction of the stage; and a downstream side unit disposed on the downstream side of the lithography unit in the moving direction of the stage. Further, each of the exposure lithography apparatuses includes a loading mechanism that carries the substrate to be exposed to the lithography so as to move the substrate to be exposed of the upstream unit and move it in the same direction as the moving direction of the stage. On the platform inside the unit. Further, each of the exposure lithography apparatuses includes a carry-out mechanism that carries the exposed substrate to the downstream side unit so as to move the exposed substrate on the stage in the lithography unit and move it in the transport direction.

In each of the exposure lithography apparatuses, when the light beam is scanned on the first surface of the substrate to be exposed, the stage is moved to the downstream side from the upstream side in the transport direction, and the substrate to be exposed is carried to the platform on the upstream side, and the substrate to be exposed is to be exposed. Move out from the platform on the downstream side.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-341550

In general, when using an exposure lithography apparatus to lithographic images of an exposed substrate, an operator inputs job information to the exposure lithography apparatus, the task information indicating a lithography on the exposed substrate. Processing requirements (tasks) for exposure conditions such as image and lithography. When the same image is continuously lithographically imaged on a plurality of substrates to be exposed under the same exposure conditions, a series of processes are collectively represented in the task information. Moreover, the exposure lithography device performs exposure lithography on the exposed substrate based on the input task information.

In the exposure lithography system disclosed in Patent Document 1, since the one-sided lithography image of each of the two exposed lithography apparatuses is used for each of the exposed substrates, the operator inputs the first surface to one of the exposure lithography apparatuses. Task information, and input the task information of the second side to another exposure lithography device. As described above, since the operator inputs the task information to each of the exposure lithography apparatuses separately, when the operator inputs the erroneously, there is a problem that an image that does not correspond to each other may be slightly shadowed on each surface of the substrate to be exposed.

Moreover, sometimes the exposure lithography process fails in one of the exposure lithography apparatuses, and the exposed substrate which is a defective product is to be removed. In this case, even in the case of correctly inputting the task information, there is a problem that, in the case where the task information input to the other exposure lithography apparatus is not updated, it is possible to be exposed. An image in which the lithography of each side of the board does not correspond to each other.

The present invention has been made in view of the above problems, and an object thereof is to provide an exposure lithography apparatus and an exposure lithography system capable of preventing an image that does not correspond to each other on each surface when a lithographic image on both sides of an exposed substrate is prevented. , storage medium recording medium and exposure lithography method.

In order to achieve the above object, an exposure lithography apparatus according to the present invention includes: a first lithography mechanism that exposes a first surface of an exposed substrate based on first task information, thereby displaying the first image indicated by the first task information The lithography is on the first surface, wherein the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition, and the first image is a lithography exposed in the above An image of the first surface of the substrate; a memory mechanism for storing a plurality of second task information, wherein the plurality of second task information respectively respectively display image information indicating the second image and exposure condition information indicating an exposure condition Correspondingly, the second image is an image of the second surface opposite to the first surface of the substrate to be exposed; and the second lithography mechanism is based on the plurality of memories memorized by the memory mechanism The second task information includes the second exposure condition information similar to the exposure condition information indicated by the first task information used by the first lithography mechanism to the first lithography image of the substrate to be exposed. Mission information, right The second surface of the exposed substrate on which the first surface has a lithographic image is exposed, and the second image indicated by the second task information is lithographically formed on the second surface.

The exposure lithography apparatus according to the present invention is based on the first lithography mechanism The first task information exposes the first surface, whereby the first image indicated by the first task information is lithographically formed on the first surface, and the first task information is an image indicating the first image The information is obtained in accordance with exposure condition information indicating an exposure condition, and the first image is an image of the first surface of the substrate to be exposed.

Here, in the present invention, the plurality of second task information is stored by the memory means, and the plurality of second task information is that the image information indicating the second image and the exposure condition information indicating the exposure condition are respectively Correspondingly, the second image is an image in which the lithography is on the second surface of the substrate to be exposed opposite to the first surface. Further, in the second lithography mechanism, the plurality of second task information stored by the memory means includes the first surface of the substrate to be exposed by the first lithography mechanism. The second task information of the exposure condition information having the same exposure condition information as indicated by the first task information used in the image capture is exposed to the second surface of the exposed substrate on the first surface lithographic image The second image shown by the second task information is lithographically formed on the second surface.

As described above, according to the exposure lithography apparatus of the present invention, the second task information having the same exposure condition information as the exposure condition information of the first task information used in the first lithographic image is used. Since the image is imaged, it is possible to prevent an image that does not correspond to each other on each surface when the two-sided lithographic image of the substrate to be exposed is formed.

Further, in the exposure lithography apparatus of the present invention, the exposure condition may include: a size of the substrate to be exposed, and a number of blocks of the exposed substrate to be exposed, in order to determine a lithographic region of the image. An arrangement pattern of the mark when the mark is provided on the exposure substrate, and a photosensitive material type of the exposed substrate At least one of the classes. Thereby, the image can be immersed on each side of the substrate to be exposed under suitable exposure conditions.

On the other hand, in order to achieve the above object, an exposure lithography system according to the present invention includes a first exposure lithography apparatus and a second exposure lithography apparatus, and the first exposure lithography apparatus includes: a first lithography mechanism, based on The image information of one image is exposed to the first task information corresponding to the exposure condition information indicating the exposure condition, and the first surface of the exposed substrate is exposed, whereby the first image indicated by the first task information is micro In the first surface, the first image is an image of the first surface of the substrate to be exposed; and a transmitting means for the first surface of the substrate to be exposed by the first lithography mechanism The exposure condition information of the first task information used in the lithography image is transmitted; the second exposure lithography device includes: a memory mechanism that memorizes the plurality of second task information, wherein the plurality of second task information is Corresponding to the image information indicating the second image and the exposure condition information indicating the exposure condition, the second image is an image of the second surface opposite to the first surface of the substrate to be exposed Receiving institution The exposure condition information transmitted by the transmission unit; and the second lithography mechanism, based on the exposure condition information that is the same as the exposure condition information received by the reception unit, among the plurality of second task information stored in the memory unit a second task information for exposing the second surface of the exposed substrate on the first surface lithographic image by the first lithography mechanism to display the second image indicated by the second task information Like lithography on the second side above.

According to the exposure lithography system of the present invention, the first lithography mechanism of the first exposure lithography apparatus is based on the image information indicating the first image and the exposure condition The exposure information corresponds to the obtained first task information, and the first surface is exposed, whereby the first image indicated by the first task information is lithographically formed on the first surface, and the first image is a lithography An image of the first surface of the substrate to be exposed. Further, the transmission unit of the first exposure lithography apparatus transmits the exposure condition information of the first task information used by the first lithography mechanism to the first surface lithography image of the substrate to be exposed. .

On the other hand, in the exposure lithography system of the present invention, the plurality of second task information is stored by the memory means of the second exposure lithography apparatus, and the plurality of second task information is the second image. The image information is obtained corresponding to the exposure condition information indicating the exposure condition, and the second image is an image of the second surface opposite to the first surface of the substrate to be exposed. Further, the exposure condition information transmitted by the transmission means is received by the receiving means of the second exposure lithography apparatus. Further, the second lithography mechanism of the second exposure lithography apparatus has the same exposure condition information as the exposure condition information received by the receiving means among the plurality of second task information stored in the memory means a task information for exposing the second surface of the exposed substrate on the first surface lithographic image by the first lithography mechanism to display the second image indicated by the second task information The lithography is on the second surface.

As described above, according to the exposure lithography system of the present invention, the second exposure lithography apparatus uses the second task information on the second surface lithography image, thereby preventing lithography on each side of the lithographic image on both sides of the substrate to be exposed. An image that does not correspond to each other, the second task information has an exposure of the first task information used in the first lithographic image The same exposure condition information as the condition information.

Further, in the exposure lithography system of the present invention, the transmission unit of the first exposure lithography apparatus may transmit the exposure condition information when the lithography of the first lithography mechanism is normally completed. Thereby, compared with the case where the present invention is not used, it is possible to more reliably prevent an image that does not correspond to each other on each surface when the two-sided lithographic image of the substrate to be exposed is used.

Further, in the exposure lithography system of the present invention, the exposure condition may include: a size of the substrate to be exposed, and a number of blocks of the exposed substrate to be exposed, in order to determine a lithographic region of the image. At least one of the arrangement pattern of the marks at the time of marking and the type of the photosensitive material of the substrate to be exposed is provided on the exposure substrate. Thereby, the image can be immersed on each side of the substrate to be exposed under suitable exposure conditions.

Further, in the exposure lithography system of the present invention, the transmission means of the first exposure lithography apparatus may cause an error indicating that an error has occurred when the lithography of the first lithography mechanism is abnormally terminated. Information is sent. Thereby, compared with the case where the present invention is not used, it is possible to more reliably prevent an image that does not correspond to each other on each surface when the two-sided lithographic image of the substrate to be exposed is used.

Further, in the exposure lithography system of the present invention, the second exposure lithography apparatus may further include an accepting mechanism, wherein the accepting means has the plurality of second task information stored by the memory means When there are a plurality of second task information of the exposure condition information having the same exposure condition information received by the receiving means, the second task information of any one of the plurality of existing second task information is present In the second lithography apparatus of the second exposure lithography apparatus, the second lithography image is received by the receiving means based on the second task information selected by the receiving means. Thereby, even if there are a plurality of second task information having the same exposure condition information as the exposure condition information of the first task information used in the first surface lithographic image, it is possible to prevent the two sides of the substrate to be exposed from being microscopically When the image is imaged, images that do not correspond to each other are faintly formed on each side.

Furthermore, the exposure lithography system of the present invention may further include a control device, the control device including: a second memory means for storing the first task information and the second task information; and the second transmitting means The first task information stored in the second memory means is transmitted to the first exposure lithography apparatus, and the second task information is transmitted to the second exposure lithography apparatus, and the first exposure lithography apparatus further includes a second a receiving means, wherein the second receiving means receives the first task information transmitted by the second transmitting means, and the first lithography means of the first exposure lithography apparatus uses the above-mentioned second receiving means The first task information pulverizes the first image indicated by the first task information on the first surface, and the second exposure lithography apparatus further includes a third receiving unit, and the third receiving unit receives the (2) The second task information transmitted by the transmitting means, wherein the memory means of the second exposure lithography apparatus memorizes the plurality of second task information received by the third receiving means. Thereby, the entire system can be managed uniformly by the control device.

In particular, in the exposure lithography system of the present invention, the control device may further include a second receiving unit, and the second receiving unit may access the first task information and The input of the second task information is accepted, and the second memory unit of the control device memorizes the first task information and the second task information accepted by the second receiving unit. Thereby, the image corresponding to each other on the respective sides of the substrate to be exposed can be imaged using the task information input by the user.

On the other hand, in order to achieve the above object, an exposure lithography system according to the present invention includes a first exposure lithography apparatus, a control device, and a second exposure lithography apparatus, and the first exposure lithography apparatus includes: a first lithography mechanism based on The first task information exposes the first surface of the exposed substrate, and the first image indicated by the first task information is lithographically formed on the first surface, wherein the first task information indicates the first image The image information of the image corresponds to the exposure condition information indicating the exposure condition, and the first image is an image of the first surface of the substrate to be exposed; and the first transmission means uses the first The lithography mechanism transmits the exposure condition information of the first task information used in the first surface lithography image of the substrate to be exposed, and the control device includes a memory mechanism that memorizes the plurality of second task information. The plurality of second task information is obtained by respectively corresponding to the image information indicating the second image and the exposure condition information indicating the exposure condition, wherein the second image is opposite to the first surface of the substrate to be exposed First a second lithography image; a first receiving unit receives exposure condition information transmitted by the first transmitting unit; and a second transmitting unit that reads the plurality of second task information stored by the memory unit The second task information having the same exposure condition information as the exposure condition information received by the first receiving unit is transmitted, and the second exposure lithography device includes a second receiving unit that receives the second transmitting unit and transmits the second task information. The above second task And the second lithography mechanism, based on the second task information received by the second receiving means, by the first lithography mechanism on the exposed substrate of the first surface lithographic image The second surface is exposed, whereby the second image indicated by the second task information is lithographically formed on the second surface.

According to the exposure lithography system of the present invention, the first lithography mechanism of the first exposure lithography apparatus exposes the first surface of the substrate to be exposed based on the first task information, thereby indicating the first task information. The first image is lithographically formed on the first surface, wherein the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition, and the first image is a lithography An image of the first surface of the substrate to be exposed. Further, the first transmission means of the first exposure lithography apparatus exposes exposure conditions of the first task information used by the first lithography mechanism to the first surface lithographic image of the substrate to be exposed. Information is sent.

On the other hand, in the exposure lithography system of the present invention, a plurality of second task information is stored by a memory mechanism of the control device, and the plurality of second task information indicates image information and representation of the second image. The exposure condition information of the exposure condition is obtained correspondingly, and the second image is an image of the second surface lithography opposite to the first surface of the substrate to be exposed. Further, the exposure condition information transmitted by the first transmission means is received by the first receiving means of the control device. Further, the second transmission means of the control device has the same exposure condition information as the exposure condition information received by the first receiving means among the plurality of second task information memorized by the memory means 2 task information is sent.

Further, in the exposure lithography system of the present invention, the second receiving means of the second exposure lithography apparatus receives the second task information transmitted by the second transmitting means, and the second exposure lithography apparatus The second lithography mechanism sets the second surface of the exposed substrate on the first surface lithographic image by the first lithography mechanism based on the second task information received by the second receiving means Exposure, whereby the second image indicated by the second task information is lithographically formed on the second surface.

As described above, according to the exposure lithography system of the present invention, the control device receives the same exposure condition as the exposure condition information of the first task information used in the first lithographic image from the first exposure lithography apparatus. The second task information of the information is sent to the second exposure lithography device, so that it is not necessary to add a new function to the exposure lithography device, thereby preventing the lithographic images on both sides of the exposed substrate from being eclipsed on each side. Corresponding image.

On the other hand, in order to achieve the above object, the recording medium of the storage program of the present invention functions as a system in which the first control unit causes the first lithography mechanism to display the first substrate to be exposed based on the first task information. Surface exposure, whereby the first image indicated by the first task information is lithographically formed on the first surface, and the first task information is an image condition indicating the first image and an exposure condition indicating an exposure condition Corresponding to the information, the first image is an image of the first surface of the substrate to be exposed; and the second control unit causes the second lithography mechanism to be used and utilized based on the plurality of second task information. The second task information of the exposure condition information having the same exposure condition information of the first task information used by the first lithography mechanism on the first surface lithography image of the substrate to be exposed is on the first surface Micrograph Exposing the second surface of the exposed substrate to image the second image indicated by the second task information on the second surface, and the plurality of second task information indicating the second image The image information of the image is obtained corresponding to the exposure condition information indicating the exposure condition, and the second image is an image of the second surface opposite to the first surface of the substrate to be exposed. .

Therefore, according to the recording medium of the storage program of the present invention, the computer can function in the same manner as the exposure lithography apparatus of the present invention, so that the lithographic image on both sides of the substrate to be exposed can be prevented similarly to the exposure lithography apparatus. At the time, images that do not correspond to each other are lithographically formed on each side.

Further, in order to achieve the above object, the exposure lithography method of the present invention includes the first control step of causing the first lithography mechanism to expose the first surface of the substrate to be exposed based on the first task information, thereby transmitting the first task information. The first image is lithographically formed on the first surface, and the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition, and the first image is An image of the first surface lithography on the substrate to be exposed; and a second control step for causing the second lithography mechanism to have a substrate to be exposed by the first lithography mechanism based on the plurality of second task information The second task information of the exposure condition information having the same exposure condition information of the first task information used in the first lithography image, and the second task information of the exposed substrate on the first surface lithographic image Exposing the two sides to illuminate the second image indicated by the second task information on the second surface, and the plurality of second task information is to display image information and display exposure of the second image. The conditions of the exposure conditions are correspondingly obtained, The second image is lithography on An image of the second surface opposite to the first surface of the substrate to be exposed is described.

Therefore, the exposure lithography method according to the present invention functions in the same manner as the exposure lithography apparatus of the present invention, and therefore, in the same manner as the exposure lithography apparatus, it is possible to prevent the lithographic image on both sides of the substrate to be exposed from being on the respective sides. Microimages of images that do not correspond to each other.

According to the present invention, it is possible to achieve an effect of preventing an image that does not correspond to each other on each surface when a lithographic image on both sides of the substrate to be exposed is prevented.

1‧‧‧Exposure lithography system

2‧‧‧1st exposure lithography device

3‧‧‧2nd exposure lithography device

4‧‧‧Reversal device

5‧‧‧Control device

6‧‧‧1st transport department

7‧‧‧2nd Transport Department

8a, 8b‧‧‧wired cable

10‧‧‧ platform

11‧‧‧ base

12‧‧‧Abutment

14‧‧‧ rails

15‧‧‧ gate

16‧‧‧Exposure Department

16a‧‧‧Exposure head

17‧‧‧Light source unit

18‧‧‧Fiber

19‧‧‧Image Processing Unit

20‧‧‧Signal cable

23‧‧‧Photography Department

23a‧‧ Track

24‧‧‧Automatic loading palm (AC palm)

25‧‧‧Inhalation hole

26‧‧‧Extrusion Department

30‧‧‧Subframe

31‧‧‧ Move in

33‧‧‧Motor

34‧‧‧Roller pair

40‧‧‧System Control Department

41‧‧‧Mission Memory

42‧‧‧ Platform Drivers

43‧‧‧ display device

44‧‧‧ Input device

46‧‧‧Photography Drive Department

48‧‧‧External input and output

50‧‧‧Control Department

51‧‧‧Memory Department

52‧‧‧Display Department

53‧‧‧ Input Department

54‧‧‧Communication interface

60A‧‧‧1st mission information

60B‧‧‧2nd mission information

61‧‧‧Task identification information

62‧‧‧Image Information

63‧‧‧Exposure Information

70‧‧‧Task input screen

71‧‧‧ lithography object selection bar

72‧‧‧Image input field

73‧‧‧Substrate type input field

74‧‧‧ lithography block input field

75‧‧‧Enter end button

76‧‧‧Task selection screen

77‧‧‧Select button

78‧‧‧Non-select button

C‧‧‧ exposed substrate

L‧‧‧ rotating shaft

P1‧‧‧ image area

P2‧‧‧ exposed area

S101~S111, S200~S217, S301~S325, S401~S407, S500~S517, S601~S605, S701~S723‧‧

X, Y, Z‧‧ Direction

Fig. 1 is a schematic plan view showing the overall configuration of an exposure lithography system according to an embodiment.

2 is a perspective view showing a configuration of a first exposure lithography apparatus and a second exposure lithography apparatus according to the embodiment.

Fig. 3A is a schematic plan view showing an arrangement pattern of an exposure region and an exposure head of an exposure head according to an embodiment;

3B is a schematic plan view showing an image region of an image which is lithographically on the substrate to be exposed by the exposure head of the embodiment.

Fig. 4 is a partially broken perspective view showing the configuration of the inverting device of the embodiment.

Fig. 5 is a block diagram showing a configuration of an electric system of a first exposure lithography apparatus and a second exposure lithography apparatus according to the embodiment.

Fig. 6 is a block diagram showing a configuration of an electric system of a control device according to an embodiment.

Fig. 7A is a schematic diagram showing an example of task information in the embodiment.

Fig. 7B is a schematic diagram showing an example of task information in the embodiment.

8 is a flow chart showing the flow of processing of the task setting processing program of the first embodiment.

FIG. 9 is a configuration diagram showing a configuration example of a task input screen according to the first embodiment.

Fig. 10 is a schematic view for explaining exposure lithography processing of the exposure lithography system of the first embodiment.

FIG. 11 is a flowchart showing the flow of processing of the first task execution processing program in the first embodiment.

FIG. 12 is a flowchart showing the flow of processing of the second task execution processing program in the first embodiment.

FIG. 13 is a configuration diagram showing a configuration example of a task selection screen in the first embodiment.

Fig. 14 is a flowchart showing the flow of processing of the task setting processing program of the second embodiment.

Fig. 15 is a flowchart showing the flow of processing of the first task execution processing program in the second embodiment.

Fig. 16 is a flowchart showing the flow of processing of the task selection processing program of the second embodiment.

Fig. 17 is a flowchart showing the flow of processing of the second task execution processing program in the second embodiment.

[First Embodiment]

Hereinafter, the exposure lithography apparatus of the embodiment will be described in detail using the drawings. Further, in each of the embodiments, a case where the present invention is applied to an exposure lithography system which exposes a light beam to a substrate to be exposed (the substrate C to be described later) and a lithography display circuit pattern will be described as an example. Image. Further, the substrate C to be exposed is a flat substrate such as a printed wiring substrate or a glass substrate for a flat panel display.

As shown in FIG. 1, the exposure lithography system 1 of the present embodiment includes a first exposure lithography apparatus 2 that exposes a first surface of a substrate C to be exposed, and a substrate opposite to the first surface of the substrate C to be exposed. The second exposure lithography apparatus 3 that performs exposure on the second surface. Further, the exposure lithography system 1 includes an inversion device 4 that is disposed between the first exposure lithography device 2 and the second exposure lithography device 3 and that reverses the front and back of the substrate C to be exposed, and the control pair is exposed. The control device 5 for exposure of the first surface and the second surface of the substrate C.

Further, between the first exposure lithography apparatus 2 and the control device 5, and between the second exposure lithography apparatus 3 and the control apparatus 5, respectively, the connection is made by the cable 8a, and the control apparatus 5 is in the first exposure lithography apparatus 2 and The second exposure lithography apparatus 3 communicates via the cable 8a. Similarly, the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 are connected by a wired cable 8b, and the respective exposure lithography apparatuses communicate via the wired cable 8b.

Next, the configuration of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 of the present embodiment will be described. In addition, since the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 have the same configuration, the first exposure lithography apparatus 2 will be described here, and the description of the second exposure lithography apparatus 3 will be omitted.

As shown in FIG. 2, the first exposure lithography apparatus 2 of the present embodiment includes a flat plate-like platform 10 for fixing the substrate C to be exposed. Further, on the upper surface of the stage 10, a plurality of suction holes (not shown) that take in air are provided. When the exposed substrate C is placed on the upper surface of the stage 10, the air between the exposed substrate C and the stage 10 is sucked through the suction hole, whereby the exposed substrate C is vacuum-adsorbed to the stage 10.

Moreover, the platform 10 is supported on a flat base 12 movably disposed on the upper surface of the table-shaped base body 11. That is, one or a plurality of (two in the present embodiment) guide rails 14 are provided on the upper surface of the base 11. The base 12 is supported so as to be freely movable along the guide rails 14, and is moved by a drive mechanism (a platform drive unit 42 to be described later) including a motor or the like. The platform 10 moves along the guide rails 14 in conjunction with the movement of the base 12.

In the following, the direction in which the stage 10 is moved is defined as the Y direction, the direction orthogonal to the horizontal direction in the horizontal direction is defined as the X direction, and the direction orthogonal to the Y direction in the vertical plane is defined as Z. direction.

On the upper surface of the base 11, a gate-type gate 15 that is erected so as to straddle the two guide rails 14 is provided. The substrate C to be exposed placed on the stage 10 moves so as to enter and exit the opening of the gate 15 along the guide rail 14. An exposure portion 16 that exposes a light beam toward the opening is attached to an upper portion of the opening of the gate 15 . When the stage 10 is moved along the guide rail 14 by the exposure portion 16, and the opening portion is located, the light beam is exposed to the upper surface of the substrate C to be exposed placed on the stage 10.

The exposure unit 16 of the present embodiment includes a plurality of (16 in the present embodiment) exposure heads 16a. Each of the exposure heads 16a is matrixed in the exposure portion 16. (matrix) arrangement. Further, an optical fiber 18 drawn from a light source unit 17 to be described later and a signal cable 20 extracted from an image processing unit 19 to be described later are connected to the exposure unit 16.

Each of the exposure heads 16a includes a digital micromirror device (DMD) as a reflective spatial light modulation element. The exposure head 16a modulates the light beam from the light source unit 17 by controlling the DMD based on the image information input from the image processing unit 19. The first exposure lithography apparatus 2 exposes the substrate C to be exposed by irradiating the modulated light beam to the substrate C to be exposed. Further, the spatial light modulation element is not limited to a reflection type, and may be a transmissive spatial light modulation element such as a liquid crystal.

As shown in FIG. 3A, the image region P1 which is a region exposed by the exposure head 16a has a rectangular shape in which one side is inclined at a predetermined inclination angle with respect to the moving direction (Y direction) of the stage 10. In addition, only a part of the plurality of exposure heads 16a of the present embodiment is shown in FIG. 3A. Further, if the stage 10 moves the light beam to the exposed substrate C by the exposure head 16a while moving the opening portion of the gate 15, as shown in FIG. 3B, the exposed substrate C is directed to each of the exposure heads with the movement of the stage 10. 16a forms a strip-shaped exposed area P2. Each of the exposure heads 16a arranged in a matrix is arranged in the X direction so that the length of the long side of each image region P1 is set to be a natural multiple (one time in the present embodiment). Further, each of the exposed regions P2 is partially overlapped with the adjacent exposed regions P2.

As shown in FIG. 2, a gate type gate 22 which is erected so as to straddle the two guide rails 14 is further provided on the upper surface of the base 11. The exposure placed on the platform 10 is exposed The optical substrate C moves so as to enter and exit the opening of the gate 22 along the guide rails 14.

One or a plurality of (three in the present embodiment) imaging units 23 for photographing the opening are attached to the upper portion of the opening of the gate 22 . The photographing unit 23 is a charge coupled device (CCD) camera or the like in which a strobo having a very short lighting time is built in one time. Further, in the upper portion of the opening portion of the gate 22, a rail 23a is provided along a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal plane, and each of the photographing portions 23 is set by the rail 23a is guided and movable. The imaging unit 23 photographs the upper surface of the substrate C to be exposed placed on the stage 10 when the stage 10 moves along the guide rail 14 and is positioned at the opening.

As shown in FIG. 1 and FIG. 2, the first exposure lithography apparatus 2 includes a first transport unit 6 that transports the substrate C to be exposed from the outside to a predetermined position of the first exposure lithography device 2, and a second The transport unit 7 transports the substrate C to be exposed from the first exposure lithography apparatus 2 to a predetermined position of the inverting device 4. Similarly, the second exposure lithography apparatus 3 includes a first transport unit 6 that transports the substrate C to be exposed from the inverting device 4 to a predetermined position of the second exposure lithography device 3, and the second transport unit 7 The exposed substrate C is transported to the outside of the second exposure lithography apparatus 3.

The first transport unit 6 and the second transport unit 7 include a plurality of rotating rollers and a drive motor that rotates the rotating rollers. The plurality of rotating rollers are respectively laid in parallel, and a sprocket or a pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a method of transmitting the rotational force of the drive motor that rotates the rotating roller, a cylinder can be used in addition to the conveyor belt or the wire A method of transferring a magnet.

Further, as shown in FIG. 2, the first exposure lithography apparatus 2 includes an automatic mounting palm (hereinafter, AC palm) 24, and the automatic mounting palm transports the exposed substrate to the predetermined position by the first conveying unit 6. C is transported to the platform 10 from the predetermined position. The AC palm 24 is formed in a flat shape and is provided to be movable in the X direction and the Z direction. A plurality of suction holes 25 for taking in air are provided on the lower surface of the AC palm 24. When the AC palm 24 moves to a position where the lower surface of the AC palm 24 is in contact with the upper surface of the exposed substrate C, the air between the AC palm 24 and the exposed substrate C is sucked by the suction hole 25, thereby causing the exposed substrate C. The vacuum is adsorbed on the lower surface of the AC palm 24 to be adsorbed and held. Further, a pressing portion 26 that is freely movable in the Z direction is provided on the lower surface of the AC palm 24, and the pressing portion 26 moves to the upper surface of the stage 10 while the AC palm 24 is adsorbed and held by the exposed substrate C. At this time, the exposed substrate C is extruded downward and pressed to the stage 10.

The AC palm 24 of the first exposure lithography apparatus 2 adsorbs and holds the unexposed exposed substrate C that has been transported to the first conveyance unit 6 and moves upward, and is placed on the upper surface of the stage 10. Further, the AC palm 24 of the first exposure lithography apparatus 2 adsorbs and holds the exposed substrate C exposed on the first surface of the upper surface of the stage 10 and moves upward, thereby moving the substrate C to be exposed. Until the second transport unit 7. The exposed substrate C that has been exposed on the first surface that has moved to the second transport unit 7 is carried out to the outside of the first exposure lithography apparatus 2 by the second transport unit 7 .

The AC palm 24 of the second exposure lithography apparatus 3 adsorbs and holds the exposed substrate C that has been exposed on the first surface until being transported to the first transport unit 6 and The upper side is moved to place the exposed substrate C on the upper surface of the stage 10. Further, the AC palm 24 of the second exposure lithography apparatus 3 adsorbs and holds the exposed substrate C exposed on the first surface and the second surface of the upper surface of the stage 10, and moves upward, thereby The exposure substrate C moves to the second conveyance unit 7. The exposed substrate C that has been exposed on the first surface and the second surface that has moved to the second transfer unit 7 is carried out to the outside of the exposure lithography system 1 by the second transfer unit 7 .

Next, the configuration of the inverting device 4 of the present embodiment will be described.

As shown in FIG. 4, the inverting device 4 includes a flat sub-frame 30 that is rotatably supported by a rotation axis L. The sub-frame 30 rotates 180 degrees in a state in which the substrate C to be exposed is held therein, thereby inverting the front and back of the substrate C to be exposed.

Further, as shown in FIG. 4, the side surface on which the first exposure lithography apparatus 2 is located on the side surface of the sub-frame 30 is provided with the loading of the substrate C to be carried into the sub-frame 30. Mouth 31. Further, a plurality of roller pairs 34 driven by the motor 33 are provided inside the sub-frame 30. The roller pair 34 is conveyed while sandwiching the exposed substrate C housed inside the sub-frame 30. The exposed substrate C is transported to the inside of the sub-frame 30 via the roller pair 34 via the carry-in port 31, and the front and back are reversed by the rotation of the sub-frame 30, and are transported by the roller pair 34 via the carry-in port 31. To the outside of the sub-frame 30. In addition, when the sub-frame 30 is finished to be carried out, the sub-frame 30 is rotated 180 degrees again in order to carry the next exposed substrate C into the inside.

Next, the first exposure lithography apparatus 2 and the second exposure of this embodiment The configuration of the electrical system of the lithography apparatus 3 will be described. In addition, since the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 have the same electrical system configuration, the first exposure lithography apparatus 2 will be described here, and the second exposure lithography apparatus 3 will be omitted. Description.

As shown in FIG. 5, in the first exposure lithography apparatus 2, a system control unit 40 that is electrically connected to each unit of the apparatus is provided, and the system control unit 40 unifies each part of the first exposure lithography apparatus 2. Ground control. Further, the first exposure lithography apparatus 2 includes a task storage unit 41, a platform drive unit 42, a display device 43, an input device 44, a photographing drive unit 46, and an external input/output unit 48.

The system control unit 40 includes a central processing unit (CPU), a random access memory (Random Access Memory), a read only memory (ROM), and a hard disk drive (HDD). . Further, the system control unit 40 emits a light beam from the light source unit 17 at a timing corresponding to the movement of the stage 10 by the CPU, and outputs corresponding image information by the image processing unit 19. The system control unit 40 controls the exposure of the light beam of the exposed substrate C by the exposure head 16a in this manner.

The task storage unit 41 includes a RAM or a non-volatile memory, and memorizes task information indicating a task to be executed. The task in the present embodiment is an overall exposure processing request in which the same image is exposed under the same conditions on the first surface of the exposed substrate C of one or more blocks of the same type, and is in the second image. The same image is also exposed to the lithography under the same conditions. In addition, details of the mission information will be described later. In the present embodiment, the task storage unit 41 memorizes in the form of a list. The task information of the task to be executed is not limited thereto, and may be memorized in a queue form.

The platform drive unit 42 includes a drive mechanism including a motor or a hydraulic pump, and the stage 10 is driven by the control of the system control unit 40.

The display device 43 is a display unit such as a liquid crystal display that displays various kinds of information under the control of the system control unit 40.

The input device 44 is an input mechanism such as a touch sensor or an operation button that inputs various kinds of information by a user operation.

The photographing drive unit 46 includes a drive mechanism including a motor or a hydraulic pump, and the photographing unit 23 is driven by the control of the system control unit 40.

The external input/output unit 48 performs input and output of various kinds of information between various information processing devices including the second exposure lithography device 3 and the control device 5 connected to the first exposure lithography device 2. Further, the external input/output unit 48 of the second exposure lithography apparatus 3 inputs various kinds of information between various information processing apparatuses including the first exposure lithography apparatus 2 and the control apparatus 5 connected to the second exposure lithography apparatus 3. Output.

Next, the configuration of the electric system of the control device 5 of the present embodiment will be described.

As shown in FIG. 6, the control device 5 includes a control unit 50 that controls exposure lithography processing of the exposure lithography system 1. Further, the control device 5 includes a storage unit 51 having a ROM, an HDD, and the like, and the storage unit 51 memorizes a program or various materials required for exposure lithography by the control unit 50. In addition, the memory unit 51 also remembers The task information, the task setting processing program, the first task execution processing program, the second task execution processing program, and the task selection processing program of the second embodiment.

Further, the control device 5 includes a display unit 52 such as a liquid crystal display that displays various kinds of information based on the control of the control unit 50, and an input unit 53 such as a keyboard or a mouse that inputs various kinds of information by a user operation. Further, the control device 5 includes a communication interface 54 that transmits and receives various types of information to the first exposure lithography device 2 and the second exposure lithography device 3 based on the control of the control unit 50.

Here, the control device 5 of the present embodiment accepts input of information related to a task performed by a user operation. Further, when receiving the input of the information related to the task, the control device 5 generates task information corresponding to each of the first exposure lithography device 2 and the second exposure lithography device 3, and transmits the generated task information to the respective correspondences. Exposure lithography device. When the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3 of the present embodiment receive the task information, the received task information is stored in the task storage unit 41, and the pair is executed based on the content of the stored task. Exposure lithography of the substrate C is exposed. At this time, when the plurality of task information is stored, the first exposure lithography apparatus 2 of the present embodiment executes the tasks indicated by the respective task information in the order in which the respective task information is received. Further, the second exposure lithography apparatus 3 of the present embodiment sequentially performs tasks corresponding to the tasks performed by the first exposure lithography apparatus 2.

When generating the task information, the control device 5 generates task information 60A for causing the first exposure lithography device 2 to be on the first surface lithographic image of the substrate C to be exposed, and for causing the second exposure lithography device 3 The second surface lithography image of the substrate C to be exposed Task information 60B. In other words, even for the tasks related to the same substrate C to be exposed, the first surface and the second surface are subjected to exposure lithography by respective exposure lithography apparatuses, and thus the first surface is separately generated. Task information 60A and task information 60B for the second side.

As an example, the task information 60A and the task information 60B are information obtained by associating the task identification information 61, the image information 62, and the exposure condition information 63 with respect to each task, as shown in FIG. 7A and FIG. 7B. In addition, the task identification information 61 is information for identifying respective tasks. Moreover, the image information 62 is information indicating an image as a lithography object. Further, the exposure condition information 63 is information indicating an exposure condition when the light beam is exposed for the image corresponding to the lithography of the substrate C to be exposed. The exposure condition information 63 of the present embodiment includes substrate size information indicating the substrate size of the substrate C to be exposed (hereinafter referred to as "target substrate") as a lithography target, and a microblock indicating the number of lithography blocks of the target substrate. Number information. Further, the exposure condition information 63 of the present embodiment includes mark information and information on the type of the photosensitive material indicating the type of the photosensitive material of the target substrate, and the mark information is represented by coordinates to determine an image corresponding to the target substrate. The arrangement pattern of the mark in the case of the mark of the lithography area. However, the information included in the exposure condition information 63 is not limited thereto, and may be information used to perform exposure lithography processing, such as information indicating the intensity of the light beam, information indicating the moving speed of the stage 10, or the like. Any information.

When the operator wants to perform the tasks by the first exposure lithography apparatus 2 and the second exposure lithography apparatus 3, the information included in the mission information 60A and the mission information 60B is input to the control apparatus 5 via the input unit 53. . Correspondingly, control The device 5 performs task setting processing for generating the task information 60A for the first surface and the task information 60B for the second surface based on the input information, and storing the information in the storage unit 51.

Next, the operation of the exposure lithography system 1 of the present embodiment will be described with reference to Fig. 8 . In addition, FIG. 8 is a flowchart showing a flow of processing of a task setting processing program executed by the control unit 50 of the control device 5 when an execution instruction is input via the input unit 53. This program is stored in advance in a predetermined area of the ROM of the storage unit 51.

First, in step S101, control is performed to display a task input screen on the display unit 52 for assisting input of information related to the task by the user. As shown in FIG. 9, the task input screen 70 of the present embodiment includes a lithography target surface selection field 71 that selects an input related to the task of the first surface or a task related to the second surface. Input. Moreover, the task input screen 70 includes an image input field 72 for inputting image recognition information indicating an image of the lithography. The image identification information is a file name of a file containing image information or a Uniform Resource Locator (URL) indicating a storage destination of the image file. Further, the task input screen 70 includes a substrate type input field 73 for inputting the substrate type information indicating the substrate type of the substrate C to be exposed, which is applied to the target task. Further, the task input screen 70 includes a lithography block number input field 74 that inputs lithographic block number information indicating the number of lithographic blocks of the substrate C to be exposed among the target tasks. Further, the task input screen 70 includes an input end button 75 for designating information indicating that the input has ended. In addition, when entering information for each input field, The display selection candidate is displayed by a list display or the like for each input field, and any one of the displayed selection candidates is selected via the input unit 53. The user uses the input unit 53 to select a surface to be a lithography object by using the lithography target surface selection field 71, and inputs an input corresponding button 75 after inputting information corresponding to each input field.

Therefore, in the next step S103, by waiting until the input end button 75 is designated, the standby is continued until the input of the information related to the task is completed.

In the next step S105, the task information 60A and the task information 60B are generated based on the surface of the lithography object selected by the lithography target surface selection field 71 and the information input to each input field, and the generated task information 60A, The task information 60B is stored in the memory unit 51. At this time, when the first surface is selected by the lithography target surface selection field 71, the control unit 50 sets the image information of the image indicated by the information input to the image input field 72 as the image information 62. The information input to the lithography block number input field 74 is used as the lithography block number information, thereby generating the task information 60A of the first surface. Further, in the task information 60A, the substrate size information, the mark information, and the photosensitive material type information are determined based on the information input to the substrate type input field 73. In the exposure lithography system 1 of the present embodiment, the substrate size information, the mark information, and the photographic material type information are respectively stored in the memory unit 51 for each of the substrates to be exposed C. Further, in the exposure lithography system 1 of the present embodiment, the substrate size information, the mark information, and the photosensitive material type information corresponding to the type of the substrate indicated by the information input to the substrate type input field 73 are used as the task information 60A. Substrate size information, mark information, and information on the type of photosensitive material.

Further, the control unit 50 has selected the first item from the lithography target surface selection field 71. In the case of two sides, the image information of the image indicated by the information input to the image input field 72 is used as the image information 62, and the information input to the lithography block number input field 74 is used as the lithographic block number information. Thereby, the task information 60B of the second side is generated. Further, the control unit 50 determines and uses the substrate size information, the marker information, and the photosensitive material type information in the same manner as the task information 60A for the task information 60B.

In the next step S107, it is determined whether or not the task information generated in the processing of the above step S105 is the task information 60A of the first surface. If the determination is affirmative in step S107, the process proceeds to step S109, and the generated task information 60A is transmitted to the first exposure lithography apparatus 2 via the cable 8a. On the other hand, the first exposure lithography apparatus 2 memorizes the received mission information 60A in its own task storage unit 41.

On the other hand, if the determination is negative in step S107, the task information generated by the processing of step S105 described above is regarded as the task information 60B of the second surface, and the process proceeds to step S111.

In step S111, after the generated task information 60B is transmitted to the second exposure lithography apparatus 3 via the cable 8a, the task setting processing program is terminated. On the other hand, the second exposure lithography apparatus 3 memorizes the received task information 60B in its own task storage unit 41.

As described above, in the exposure lithography system 1 of the present embodiment, as shown in FIG. 10, the control device 5 generates the task information 60A of the first surface and the task information 60B of the second surface based on the information input by the user. Further, the task information 60A of the first surface generated by the control device 5 is stored in the first exposure lithography device 2 in the order received. The task storage unit 41 stores the task information 60B of the second surface in the task storage unit 41 of the second exposure lithography apparatus 3 in the order received.

When the first exposure lithography apparatus 2 receives and memorizes the task information 60A from the control device 5, the first exposure lithography image on the exposed substrate C is performed using the stored task information 60A based on a predetermined user operation. The first task performs processing.

Next, the operation of the first exposure lithography apparatus 2 when the first task execution processing of the present embodiment is executed will be described with reference to Fig. 11 . In addition, FIG. 11 is a flowchart showing the flow of processing of the first task execution processing program executed by the system control unit 40 of the first exposure lithography apparatus 2 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. In addition, the timing at which the program is executed is not limited to the timing according to a predetermined user operation, and may be the timing at which the task information 60A is received.

First, in step S200, control for displaying the task information 60A stored in the task storage unit 41 on the display device 43 is performed. At this time, when the plurality of task information 60A is stored, the system control unit 40 performs control for displaying each task information 60A in a list form. The user is placed on the upstream side of the first transport unit 6 of the first exposure lithography apparatus 2 by the number of the exposed substrates C indicated by the number of pieces of the lithography of the task information 60A to be executed. Further, the user selects the designated task information 60A via the input device 44, thereby inputting an execution instruction of the task indicated by the specified task information 60A.

In the next step S201, until the execution instruction of the task is input, the task executed by the instruction (hereinafter referred to as "execution" is performed in the next step S203. The first task "" corresponding task information 60A acquires image information 62. Further, in the present embodiment, when the image information 62 of the image of the lithography is acquired, the image information (the image information 62 of the task information 60A) stored in the task storage unit 41 of the image is acquired, but the image information is not limited thereto. this. That is, the image recognition information may be previously given in the task information 60A, and the image information of the image of the lithography may be acquired from the control device 5 or an external memory device based on the image recognition information.

In the next step S205, the exposure condition at the time of the lithographic image of the substrate C to be exposed is determined by executing the execution of the first surface task. At this time, the system control unit 40 determines the exposure conditions based on the substrate size information, the lithography number information, the mark information, and the photosensitive material type information in the task information 60A of the first surface task. In the first embodiment, in the system control unit 40, the image pickup unit 23 photographs the mark provided on the substrate C to be exposed, and measures the position of the mark based on the image obtained by the image pickup. Further, the system control unit 40 determines the lithography area of the lithographic image based on the position of the measured mark. Further, the system control unit 40 deforms the image as the lithography object based on the size or shape of the determined lithography region. Further, the system control unit 40 determines the intensity of the light beam to be exposed, the moving speed of the stage 10 (or the exposure time of the light beam), and the like based on the type of the photosensitive material indicated by the photosensitive material type information.

In the next step S207, based on the determined exposure conditions, exposure lithography processing of exposing the light beam to the exposed substrate C to the lithographic image is started. In the exposure lithography process of the present embodiment, the system control unit 40 exposes the light beam modulated based on the deformed image by the exposure head 16a, thereby lithographically morphing the deformed image onto the exposed image. Substrate C.

In the next step S209, it is determined whether or not a predetermined error has occurred. At this time, the system control unit 40 exposes the lithography due to a failure or the like of a portion used when the exposure of the light-emitting unit 17 or the image processing unit 19 or the exposure unit 16 is performed due to deformation or poor positioning of the substrate C to be exposed. When the processing is stopped in the middle, it is determined that an error has occurred. If the determination in step S209 is affirmative, the process proceeds to step S211, and an error message indicating that an error has occurred is transmitted to the control device 5, thereby ending the first task execution processing program. On the other hand, the control device 5 that has received the error information performs control for displaying the error information on the display unit 52. Further, the system control unit 40 can also transmit error information to the second exposure lithography apparatus 3. On the other hand, the second exposure lithography apparatus 3 that has received the error information performs control for displaying the error information on the display device 43, or deletes the task information 60B of the task corresponding to the execution of the first face task in which the error has occurred.

On the other hand, if the determination is negative in step S209, the process proceeds to step S213.

In step S213, it is determined whether or not the exposure lithography process for one of the exposed substrates C is completed. If the determination is negative in step S213, the process returns to step S209. On the other hand, if the determination is affirmative in step S213, the process proceeds to step S215.

In step S215, the exposure condition information 63 for executing the first surface task is transmitted to the second exposure lithography apparatus 3. Further, in the present embodiment, the exposure condition for executing the first surface task is transmitted from the first exposure lithography apparatus 2 to the second exposure lithography apparatus 3 News 63, but is not limited to this. In other words, the information to be transmitted may be the exposure condition information 63 for executing the first surface task in the second exposure lithography apparatus 3, and thus may be, for example, the task information 60A itself. Further, the transmitted information may be predetermined information (for example, only substrate size information, substrate size, and mark information, etc.) included in the exposure condition information 63 for performing the first task.

In the next step S217, it is determined whether or not the execution of the first surface task has been completed. At this time, when the exposure lithography process of the exposed substrate C indicating the number of lithography blocks indicated by the lithographic block number information of the exposure condition information 63 is completed, the system control unit 40 determines that the execution of the first surface task has been completed. carry out.

If the determination is negative in step S217, the process returns to step S209. On the other hand, if the determination is affirmative, the first task execution processing program is ended.

When the second exposure lithography apparatus 3 of the present embodiment receives the exposure condition information 63 for executing the first surface task from the first exposure lithography apparatus 2, the exposure condition information 63 and the task information 60B received from the control device 5 are used. The second task execution processing of the second surface lithography image on the substrate C to be exposed is performed.

Next, the operation of the second exposure lithography apparatus 3 when the second task execution processing of the present embodiment is executed will be described with reference to FIG. In addition, FIG. 12 is a flowchart showing the flow of processing of the second task execution processing program executed by the system control unit 40 of the second exposure lithography apparatus 3 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. In addition, the timing of executing the program is not limited to the timing of receiving the task identification information of the task of the execution object, and may also be used by The user inputs a predetermined sequence of execution instructions and the like via the input device 44.

First, in step S301, it is determined whether or not there is a plurality of task information having the same exposure condition information 63 as the received exposure condition information 63 for executing the first face task in the task information 60B stored in the task storage unit 41. 60B.

In the case of affirmative determination in step S301, the process proceeds to step S303, and control for causing the task selection screen 76 to be displayed on the display device 43 for assisting the selection of the task by the user is performed. As shown in FIG. 13, the task selection screen 76 of the present embodiment includes a selection button 77 for selecting one of the task information 60B stored in the task storage unit 41, and a non-selection button 78 for not selecting any one of the tasks. The user uses the input device 44 to designate any of the selection buttons 77 or non-selection buttons 78.

In the next step S304, it stands by until any of the selection button 77 or the non-selection button 78 is selected.

In the next step S305, it is determined whether or not any task is selected. At this time, when any of the selection buttons 77 is selected, the system control unit 40 determines (positive determination) that any of the tasks has been selected, and if the non-selection button 78 is selected, the determination (negative determination) is not selected. Any task.

In the case of affirmative determination in step S305, the selected task is the task to be executed (hereinafter referred to as "execution of the second surface task"), and the process proceeds to step S309, which will be described later. On the other hand, if the determination is negative in step S305, the process proceeds to step S317, and error information indicating that the task is not selected is transmitted to the control device 5, thereby ending the second task execution processing program. In contrast, control The device 5 performs control for displaying the received error information on the display unit 52.

On the other hand, if the determination is negative in step S301, the process proceeds to step S307.

In step S307, it is determined whether or not only one of the task information 60B stored in the task storage unit 41 has the same task information 60B as the exposure condition information 63 of the received first face task. The exposure condition information 63 indicates the task of the second side.

If the determination is negative in step S307, the process proceeds to step S317, which will be described later, and the error information indicating that there is no task to be executed is transmitted to the control device 5, thereby ending the second task execution processing program. On the other hand, the control device 5 performs control for displaying the received error information on the display unit 52.

On the other hand, in the case of affirmative determination in step S307, the task information 60B determined to be present by the processing of the above-described step S307 is executed as the second surface task, and the process proceeds to step S309. In addition, at this time, the task information 60B determined to be present by the processing of the above-described step S307 may be displayed on the display device 43, and the input of the execution instruction of the task indicated by the task information 60B may be accepted. In this case, after the input of the execution instruction is accepted, the process proceeds to step S309.

In step S309, the image information 62 of the image of the second surface lithography on the substrate C to be exposed is acquired from the task information 60B of the second surface task. Further, in the present embodiment, when the image information 62 is acquired, the image information (the image information 62 of the task information 60B) stored in the task storage unit 41 of the user is acquired, but the present invention is not limited thereto. That is, the image recognition information may be previously given in the task information 60B, based on The image recognition information acquires image information of the image of the lithography from the control device 5 or an external memory device.

In the next step S311, in the execution of the second surface task, which is the task to be executed, the exposure conditions at the time of the lithographic image of the substrate C to be exposed are determined. At this time, the system control unit 40 determines the exposure conditions based on the substrate size information, the lithography number information, the mark information, and the photosensitive material type information in the task information 60B of the second surface task, by the same method as the above-described step S205.

As an example, as shown in Figs. 7A and 7B, it is assumed that the task A and the task A' have the same exposure condition information 63, and the task B has the same exposure condition information 63 as the task B'. Further, as an example, as shown in FIG. 10, in the first exposure lithography apparatus 2, the task information 60A of the task A of the image corresponding to the first surface lithography, the task information 60A of the task B, and the like are stored. Further, in the second exposure lithography apparatus 3, the task information 60B of the task A' of the image corresponding to the second surface lithography and the task information 60B of the task B' are memorized. When the task A is executed in the first exposure lithography apparatus 2 in this state, the task A' having the same exposure condition information 63 as the task A is used as the execution target in the second exposure lithography apparatus 3.

In the next step S313, similarly to the processing of step S207 of the first task execution processing program, the exposure lithography process of exposing the light beam to the exposed substrate C and the lithographic image is started based on the determined exposure conditions.

In the next step S315, it is determined whether or not a predetermined error has occurred. At this time, the system control unit 40 uses the exposure lithography of the light source unit 17, the image processing unit 19, the exposure unit 16, and the like due to deformation or poor positioning of the substrate C to be exposed. When the exposure lithography process is stopped in the middle of the lithography process, etc., it is determined that an error has occurred. If the determination is affirmative in step S315, the process proceeds to step S317, and the error information indicating that the error has occurred is transmitted to the control device 5, thereby ending the second task execution processing program. On the other hand, the control device 5 performs control for displaying the received error information on the display unit 52.

On the other hand, in the case of affirmative determination in step S315, the process proceeds to step S319.

In step S319, it is determined whether or not the exposure lithography processing on the substrate C to be exposed has been completed. If the determination is negative in step S319, the process returns to step S315 described above. On the other hand, if the determination is affirmative, the process proceeds to step S321.

In the next step S321, it is determined whether or not the execution of the second surface task has been completed. At this time, when the exposure lithography process of the exposure target substrate C of the number of lithography blocks indicated by the lithography block number information of the exposure condition information 63 is completed, the system control unit 40 determines that the execution of the second surface task has been completed. carry out. In the case of a negative determination in step S321, the process proceeds to step S323.

In step S323, it waits until the exposure condition information for performing the lithography of the image on the next exposed substrate C in the second surface task is received.

In the next step S325, it is determined whether or not the received exposure condition information is the same as the exposure condition information of the task information 60B for executing the second surface task. In the case of affirmative determination in step S325, execution of the second surface task is continued, and the process proceeds to step S315 described above. On the other hand, if the determination is negative in step S325, the process proceeds to step S317, and the task of receiving and executing the second face task is indicated. The exposure information of the information 60B is sent to the control device 5 for the error information of the different exposure condition information, thereby ending the first task execution processing program.

On the other hand, if the determination is affirmative in step S321, the first task execution processing program is ended.

[Second Embodiment]

Hereinafter, the exposure lithography system 1 of the second embodiment will be described in detail using the drawings.

In the first embodiment, the first exposure lithography apparatus 2 transmits information indicating that the first surface task is performed to the second exposure lithography apparatus 3, and the second exposure lithography apparatus 3 selects and executes the corresponding task. On the other hand, in the second embodiment, information indicating that the first surface task is executed is transmitted from the first exposure lithography apparatus 2 to the control device 5, and the corresponding task is selected by the control device 5, and the selected task is transmitted to The second exposure lithography apparatus 3.

The configuration of the exposure lithography system 1 of the second embodiment is the same as that of the exposure lithography system 1 of the first embodiment, and thus the description thereof is omitted here.

Next, the operation of the control device 5 when the task setting processing of the present embodiment is executed will be described with reference to Fig. 14 . In addition, FIG. 14 is a flowchart showing the flow of processing of the task setting processing program executed by the control unit 50 of the control device 5 at this time. This program is stored in advance in a predetermined area of the ROM of the storage unit 51.

First, in steps S401 to S405, the same processing as steps S101 to S105 of the first embodiment is performed.

In the next step S407, the generated task information 60A of the first side is performed. The transmission to the first exposure lithography apparatus 2 via the cable 8a ends the task setting processing program. The first exposure lithography apparatus 2 memorizes the received mission information 60A in the task storage unit 41.

When the first exposure lithography apparatus 2 memorizes the task information 60A, the first task execution processing of the first surface lithography image on the substrate C to be exposed is performed based on the task information 60A in accordance with a predetermined user operation.

Next, the operation of the first exposure lithography apparatus 2 when the first task execution processing of the present embodiment is executed will be described with reference to Fig. 15 . In addition, FIG. 15 is a flowchart showing the flow of processing of the first task execution processing program executed by the system control unit 40 of the first exposure lithography apparatus 2 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. In addition, the timing at which the program is executed is not limited to the timing according to a predetermined user operation, and may be the timing at which the task information 60A is received.

In steps S500 to S513, the same processing as steps S201 to S213 of the first embodiment is performed.

In step S515, the exposure condition information 63 in the task information 60A on which the first surface task is executed is transmitted to the control device 5.

In the next step S517, the same processing as that of step S217 of the first embodiment is performed, and the first task execution processing program is ended.

When the control device 5 of the present embodiment receives the exposure condition information of the task information 60A from the first exposure lithography device 2, the task selection process is performed, that is, the task information 60B stored in the memory unit 51 is selected and received. Exposure conditions Task information 60B for the same exposure condition information.

Next, the operation of the control device 5 when the task selection processing of the present embodiment is executed will be described with reference to Fig. 16 . In addition, FIG. 16 is a flowchart showing the flow of processing of the task selection processing program executed by the control unit 50 of the control device 5 at this time. This program is stored in advance in a predetermined area of the ROM of the storage unit 51. Further, the timing at which the program is executed is not limited to the timing at which the exposure condition information is received, and may be a timing at which a predetermined execution instruction is input by the user via the input unit 53.

First, in step S601, it is determined whether or not the second exposure task information 60B stored in the storage unit 51 has the same exposure condition information 63 as the received exposure condition information 63 for executing the first surface task. Task information 60B.

If the determination is affirmative in step S601, the process proceeds to step S605, and the task information 60B of the second surface having the same exposure condition information 63 as the exposure condition information 63 for executing the first surface task is transmitted to the first via the cable 8a. 2 Exposure of the lithography apparatus 3. The second exposure lithography apparatus 3 memorizes the received task information 60B of the second surface in the task storage unit 41.

On the other hand, if the determination is negative in step S601, the process proceeds to step S605, and the error information indicating the absence of the task information 60B of the second surface is displayed on the display unit 52, and the task of the second surface is performed. The information 60B has the same exposure condition information 63 as the exposure condition information 63 for executing the first task.

When the second exposure lithography apparatus 3 of the present embodiment receives the task information 60B of the second surface from the control device 5, the second exposure lithography apparatus 3 advances based on the received mission information 60B. The second task execution processing of the second surface lithography image of the substrate C to be exposed is performed.

Next, the operation of the second exposure lithography apparatus 3 when the second task execution processing of the present embodiment is executed will be described with reference to FIG. In addition, FIG. 17 is a flowchart showing the flow of processing of the second task execution processing program executed by the system control unit 40 of the second exposure lithography apparatus 3 at this time. This program is stored in advance in a predetermined area of the ROM included in the system control unit 40. Further, the timing at which the program is executed is not limited to the timing at which the task information 60B is received, and may be a sequence in which a predetermined execution instruction is input by the user via the input device 44.

First, in steps S701 to S705, the same processing as steps S301 to S305 of the first embodiment is performed.

In steps S707 to S723, the same processing as steps S309 to S325 of the first embodiment is performed, and the second task execution processing program is ended.

2‧‧‧1st exposure lithography device

3‧‧‧2nd exposure lithography device

5‧‧‧Control device

41‧‧‧Mission Memory

51‧‧‧Memory Department

60A‧‧‧1st mission information

60B‧‧‧2nd mission information

Claims (11)

An exposure lithography apparatus comprising: a first lithography mechanism that exposes a first surface of an exposed substrate based on first task information, thereby lithographically displaying the first image indicated by the first task information to the first The first task information is obtained by correlating image information indicating the first image with exposure condition information indicating an exposure condition, wherein the first image is a lithography on the first surface of the exposed substrate And a memory mechanism that memorizes the plurality of second task information, wherein the plurality of second task information is obtained by respectively matching the image information indicating the second image with the exposure condition information indicating the exposure condition. The second image is an image of the second surface opposite to the first surface of the substrate to be exposed; the receiving means receives the first surface lithographic image of the first lithography mechanism on the exposed substrate The exposure condition information of the first task information used at the time; the receiving means has the same exposure condition information as the exposure condition information received by the receiving means among the plurality of second task information memorized by the memory means When there are a plurality of second task information, the selection of the second task information of any one of the plurality of existing second task information is accepted; and the second lithography mechanism is based on the plurality of memories stored by the memory mechanism The exposure condition indicated by the first task information used when the first lithography image of the substrate to be exposed is used by the first lithography mechanism is included in the second task information The second task information of the exposure condition information having the same information is exposed to the second surface of the exposed substrate on the first surface lithographic image to display the second image indicated by the second task information The lithography is on the second surface, wherein the second lithography mechanism receives the second task information selected by the receiving means based on the second task image on the second surface. The exposure lithography apparatus according to claim 1, wherein the exposure condition includes a size of the substrate to be exposed, a number of blocks of the exposed substrate to be exposed, and a substrate for determining the image to be exposed. At least one of the arrangement pattern of the mark at the time of marking of the lithography area of the image and the type of the photosensitive material of the substrate to be exposed. An exposure lithography system comprising: a first exposure lithography apparatus and a second exposure lithography apparatus, wherein the first exposure lithography apparatus includes: a first lithography mechanism, based on image information and display exposure indicating the first image The conditional exposure condition information is corresponding to the obtained first task information, and the first surface of the exposed substrate is exposed, whereby the first image indicated by the first task information is lithographically formed on the first surface, the first The image is a lithography image on the first surface of the substrate to be exposed; and a transmitting means for using the first lithography mechanism on the first surface lithographic image of the substrate to be exposed The exposure condition information of the first task information is transmitted; the second exposure lithography device includes: The memory means stores a plurality of second task information, wherein the plurality of second task information is obtained by respectively matching image information indicating the second image with exposure condition information indicating an exposure condition, wherein the second image is a lithography image on a second surface of the substrate to be exposed opposite to the first surface; a receiving means receiving the exposure condition information transmitted by the transmitting means; and receiving means for storing the plurality of memories stored in the memory means In the second task information, when there are a plurality of second task information having the same exposure condition information as the exposure condition information received by the receiving means, the second task is present for any one of the plurality of second task information that exists. And selecting, by the second lithography mechanism, the second task information having the same exposure condition information as the exposure condition information received by the receiving means among the plurality of second task information memorized by the memory means Exposing the second surface of the exposed substrate on the first surface lithographic image by the first lithography mechanism to perform the second task The second image lithography shown on the second surface of the second exposure lithography apparatus is based on the second task information received by the receiving means; The second lithographic image described above. The exposure lithography system according to claim 3, wherein the transmission means of the first exposure lithography apparatus transmits exposure condition information when the lithography of the first lithography mechanism is normally completed. The exposure lithography system according to Item 3 or 4, wherein the exposure condition includes: a size of the exposed substrate, and an exposure target The number of the substrates to be exposed, at least one of the arrangement pattern of the marks when the substrate to be exposed is used to determine the mark of the lithographic region of the image, and the type of the photosensitive material of the substrate to be exposed. The exposure lithography system according to claim 3, wherein the transmitting means of the first exposure lithography apparatus indicates that the lithography of the first lithography mechanism is abnormally completed. The error message of the error occurred is sent. The exposure lithography system of claim 3 or 4, further comprising: a control device, wherein the control device includes: a second memory mechanism that memorizes the first task information and the second task information; The second transmitting means transmits the first task information stored in the second memory means to the first exposure lithography apparatus, and transmits the second task information to the second exposure lithography apparatus, the first exposure micro The image device further includes a second receiving unit that receives the first task information transmitted by the second transmitting unit, and the first lithography mechanism of the first exposure lithography device uses the second receiving unit The received first task information pulverizes the first image indicated by the first task information on the first surface, and the second exposure lithography device further includes a third receiving unit, and the third receiving unit receives the The second task information transmitted by the second transmitting means, the memory means of the second exposure lithography apparatus, and the plurality of third receiving The second task information received by the organization is memorized. The exposure lithography system according to claim 7, wherein the control device further includes a second receiving unit, wherein the second receiving unit accepts input of the first task information and the second task information, and the control The second memory unit of the device memorizes the first task information and the second task information accepted by the second receiving unit. An exposure lithography system comprising: a first exposure lithography device, a control device, and a second exposure lithography device, wherein the first exposure lithography device includes: a first lithography mechanism, and a first substrate information to be exposed based on the first task information One-side exposure, whereby the first image indicated by the first task information is lithographically formed on the first surface, wherein the first task information is image information indicating the first image and indicating exposure conditions Corresponding to the exposure condition information, the first image is an image of the first surface of the substrate to be exposed; and the first transmission means is configured to the exposed substrate by the first lithography mechanism. The exposure condition information of the first task information used in the first lithography image is transmitted, and the control device includes: a memory mechanism that memorizes the plurality of second task information, wherein the plurality of second task information is The image information indicating the second image is obtained corresponding to the exposure condition information indicating the exposure condition, and the second image is an image of the second surface lithography opposite to the first surface of the exposed substrate; The first receiving means receives the exposure condition information transmitted by the first transmitting means; and the receiving means has the exposure condition information received by the first receiving means in the plurality of second task information stored in the memory means When there are a plurality of second task information of the same exposure condition information, the selection of the second task information of any one of the plurality of existing second task information is accepted; and the second transmitting means is for the memory mechanism The second plurality of task information stored in the memory includes the second task information having the same exposure condition information as the exposure condition information received by the first receiving unit, and the second exposure lithography device includes: the second receiving mechanism Receiving the second task information transmitted by the second transmitting unit; and the second lithography mechanism, based on the second task information received by the second receiving unit, by the first lithography mechanism The second surface of the exposed substrate is exposed by the first surface of the immersed image, whereby the second image indicated by the second task information is lithographically formed on the second surface. A recording medium storing a program for causing a computer to function as a first control unit that causes the first lithography mechanism to expose the first surface of the substrate to be exposed based on the first task information, thereby The first image tilogram indicated by the first task information is on the first surface, and the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition. 1 image is a lithography on the image of the first surface of the substrate to be exposed; and a receiving means for receiving the first task information used by the first lithography mechanism to the first surface lithography image of the substrate to be exposed The exposure condition information; the receiving means, when there are a plurality of second task information having the same exposure condition information as the exposure condition information received by the receiving means in the plurality of second task information memories, The selection of the second task information in any one of the second task information is accepted; and the second control means causes the second lithography mechanism to use the first micro-image based on the plurality of second task information The second task information of the exposure condition information having the same exposure condition information of the first task information used by the shadow mechanism for the first surface lithographic image of the substrate to be exposed is lithographically imaged on the first surface Exposing the second surface of the exposed substrate to the image, whereby the second image indicated by the second task information is lithographically formed on the second surface, wherein the plurality of second task information indicates the second Image of The image information is obtained corresponding to the exposure condition information indicating the exposure condition, and the second image is an image of the second surface opposite to the first surface of the exposed substrate, wherein the second image is The shadowing means receives the second task information on the second surface based on the second task information selected by the receiving means. An exposure lithography method comprising: a first control step of causing a first lithography mechanism to expose a first surface of an exposed substrate based on first task information, thereby using the first image indicated by the first task information On the first surface, the first task information is obtained by associating image information indicating the first image with exposure condition information indicating an exposure condition, wherein the first image is the first of the exposed substrates An image of one surface lithography; a receiving step of receiving the exposure condition information of the first task information used by the first lithography mechanism on the first surface lithography image of the substrate to be exposed; And when there are a plurality of second task information having the same exposure condition information as the exposure condition information received by the receiving means, the plurality of second task information that is stored in the second task information And selecting, in the second control step, the second lithography mechanism, based on the plurality of second task information, and the first lithography mechanism The second task information of the exposure condition information having the same exposure condition information of the first task information used in the one-finished image is applied to the second surface of the exposed substrate on the first surface lithographic image Row exposure, whereby the second image indicated by the second task information is lithographically formed on the second surface, wherein the plurality of second task information is image information indicating the second image and indicating exposure conditions Corresponding to the exposure information, the second image is an image of the second surface opposite to the first surface of the substrate to be exposed, wherein the second lithography mechanism is based on the acceptance In the step, the second task information having the above selection is received, and the second surface lithography image is received.