TWI602253B - 圓盤狀物件之液體處理用設備及用於該設備中之加熱系統 - Google Patents
圓盤狀物件之液體處理用設備及用於該設備中之加熱系統 Download PDFInfo
- Publication number
- TWI602253B TWI602253B TW102136810A TW102136810A TWI602253B TW I602253 B TWI602253 B TW I602253B TW 102136810 A TW102136810 A TW 102136810A TW 102136810 A TW102136810 A TW 102136810A TW I602253 B TWI602253 B TW I602253B
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting portion
- heating elements
- lamp
- arcuate
- heating
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims description 143
- 239000007788 liquid Substances 0.000 title description 14
- 230000005855 radiation Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 33
- 238000000034 method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 238000009826 distribution Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/650,916 US9093482B2 (en) | 2012-10-12 | 2012-10-12 | Method and apparatus for liquid treatment of wafer shaped articles |
| US13/932,926 US9748120B2 (en) | 2013-07-01 | 2013-07-01 | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201434101A TW201434101A (zh) | 2014-09-01 |
| TWI602253B true TWI602253B (zh) | 2017-10-11 |
Family
ID=50654094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102136810A TWI602253B (zh) | 2012-10-12 | 2013-10-11 | 圓盤狀物件之液體處理用設備及用於該設備中之加熱系統 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6351948B2 (enrdf_load_stackoverflow) |
| KR (2) | KR20140047564A (enrdf_load_stackoverflow) |
| TW (1) | TWI602253B (enrdf_load_stackoverflow) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101681183B1 (ko) | 2014-07-11 | 2016-12-02 | 세메스 주식회사 | 기판 처리 장치 |
| KR102069078B1 (ko) * | 2014-08-27 | 2020-01-23 | 주식회사 제우스 | 기판 처리장치 |
| WO2016056748A1 (ko) * | 2014-10-10 | 2016-04-14 | 주식회사 제우스 | 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치 |
| KR102082151B1 (ko) * | 2014-10-10 | 2020-02-27 | 주식회사 제우스 | 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치 |
| KR102123563B1 (ko) * | 2014-10-20 | 2020-06-16 | 주식회사 제우스 | 기판지지장치 및 이를 구비한 기판 액처리 장치 |
| JP6658195B2 (ja) * | 2016-03-28 | 2020-03-04 | 大日本印刷株式会社 | エッチング方法およびエッチング装置 |
| US11056362B2 (en) | 2016-05-26 | 2021-07-06 | Mimasu Semiconductor Industry Co., Ltd. | Wafer heating and holding mechanism and method for rotary table, and wafer rotating and holding device |
| US10720343B2 (en) * | 2016-05-31 | 2020-07-21 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
| IL283621B2 (en) * | 2018-12-21 | 2025-04-01 | Asml Holding Nv | Retinal subfield thermal control |
| KR102263006B1 (ko) | 2019-07-18 | 2021-06-10 | 세메스 주식회사 | 기판 처리 장치 |
| KR102407266B1 (ko) | 2019-10-02 | 2022-06-13 | 세메스 주식회사 | 지지 유닛, 이를 포함하는 기판 처리 장치 및 기판 처리 방법 |
| FR3103629B1 (fr) * | 2019-11-25 | 2021-10-22 | Soitec Silicon On Insulator | Procédé de collage de deux substrats |
| CN111403316A (zh) * | 2020-03-18 | 2020-07-10 | 沈阳拓荆科技有限公司 | 一种提高硅片温度均匀性的加热系统 |
| KR102564838B1 (ko) | 2020-07-24 | 2023-08-10 | 세메스 주식회사 | 지지 유닛, 이를 포함하는 기판 처리 장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW563196B (en) * | 2000-10-30 | 2003-11-21 | Dainippon Screen Mfg | Substrate processing apparatus |
| WO2008059686A1 (fr) * | 2006-11-14 | 2008-05-22 | Tokyo Electron Limited | Procédé de traitement de substrat et système de traitement de substrat |
| TW200830060A (en) * | 2006-11-14 | 2008-07-16 | Tokyo Electron Ltd | Substrate processing method and substrate processing system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164555A (ja) * | 1998-11-30 | 2000-06-16 | Ebara Corp | 基板乾燥装置及び方法 |
| JP3659863B2 (ja) * | 2000-04-06 | 2005-06-15 | 大日本スクリーン製造株式会社 | 熱処理装置 |
| JP2005032933A (ja) * | 2003-07-10 | 2005-02-03 | Hitachi Kokusai Electric Inc | 基板処理装置 |
-
2013
- 2013-10-11 JP JP2013213420A patent/JP6351948B2/ja active Active
- 2013-10-11 TW TW102136810A patent/TWI602253B/zh active
- 2013-10-14 KR KR1020130122274A patent/KR20140047564A/ko not_active Ceased
-
2021
- 2021-04-21 KR KR1020210051917A patent/KR20210049738A/ko not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW563196B (en) * | 2000-10-30 | 2003-11-21 | Dainippon Screen Mfg | Substrate processing apparatus |
| WO2008059686A1 (fr) * | 2006-11-14 | 2008-05-22 | Tokyo Electron Limited | Procédé de traitement de substrat et système de traitement de substrat |
| TW200830060A (en) * | 2006-11-14 | 2008-07-16 | Tokyo Electron Ltd | Substrate processing method and substrate processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014090168A (ja) | 2014-05-15 |
| KR20210049738A (ko) | 2021-05-06 |
| JP6351948B2 (ja) | 2018-07-04 |
| TW201434101A (zh) | 2014-09-01 |
| KR20140047564A (ko) | 2014-04-22 |
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