KR20140047564A - 디스크 형상 아티클의 액체 처리를 위한 장치 및 그러한 장치에서 사용하기 위한 가열 시스템 - Google Patents

디스크 형상 아티클의 액체 처리를 위한 장치 및 그러한 장치에서 사용하기 위한 가열 시스템 Download PDF

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KR20140047564A
KR20140047564A KR1020130122274A KR20130122274A KR20140047564A KR 20140047564 A KR20140047564 A KR 20140047564A KR 1020130122274 A KR1020130122274 A KR 1020130122274A KR 20130122274 A KR20130122274 A KR 20130122274A KR 20140047564 A KR20140047564 A KR 20140047564A
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KR
South Korea
Prior art keywords
shaped
arc
heating elements
emitter
infrared
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Ceased
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KR1020130122274A
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English (en)
Korean (ko)
Inventor
마이클 브루거
오토 라흐
올리비에 포스텔
Original Assignee
램 리서치 아게
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Priority claimed from US13/650,916 external-priority patent/US9093482B2/en
Priority claimed from US13/932,926 external-priority patent/US9748120B2/en
Application filed by 램 리서치 아게 filed Critical 램 리서치 아게
Publication of KR20140047564A publication Critical patent/KR20140047564A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Resistance Heating (AREA)
KR1020130122274A 2012-10-12 2013-10-14 디스크 형상 아티클의 액체 처리를 위한 장치 및 그러한 장치에서 사용하기 위한 가열 시스템 Ceased KR20140047564A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/650,916 US9093482B2 (en) 2012-10-12 2012-10-12 Method and apparatus for liquid treatment of wafer shaped articles
US13/650,916 2012-10-12
US13/932,926 2013-07-01
US13/932,926 US9748120B2 (en) 2013-07-01 2013-07-01 Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020210051917A Division KR20210049738A (ko) 2012-10-12 2021-04-21 디스크 형상 아티클의 액체 처리를 위한 장치 및 그러한 장치에서 사용하기 위한 가열 시스템

Publications (1)

Publication Number Publication Date
KR20140047564A true KR20140047564A (ko) 2014-04-22

Family

ID=50654094

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130122274A Ceased KR20140047564A (ko) 2012-10-12 2013-10-14 디스크 형상 아티클의 액체 처리를 위한 장치 및 그러한 장치에서 사용하기 위한 가열 시스템
KR1020210051917A Ceased KR20210049738A (ko) 2012-10-12 2021-04-21 디스크 형상 아티클의 액체 처리를 위한 장치 및 그러한 장치에서 사용하기 위한 가열 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020210051917A Ceased KR20210049738A (ko) 2012-10-12 2021-04-21 디스크 형상 아티클의 액체 처리를 위한 장치 및 그러한 장치에서 사용하기 위한 가열 시스템

Country Status (3)

Country Link
JP (1) JP6351948B2 (enrdf_load_stackoverflow)
KR (2) KR20140047564A (enrdf_load_stackoverflow)
TW (1) TWI602253B (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160008065A (ko) * 2014-07-11 2016-01-21 세메스 주식회사 기판 처리 장치
CN114730725A (zh) * 2019-11-25 2022-07-08 索泰克公司 接合两个基板的方法
US11765793B2 (en) 2019-07-18 2023-09-19 Semes Co., Ltd. Substrate treating apparatus
US11798822B2 (en) 2019-10-02 2023-10-24 Semes Co., Ltd. Support unit, substrate treating apparatus including the same, and substrate treating method
US11961748B2 (en) 2020-07-24 2024-04-16 Semes Co., Ltd. Support unit and substrate treating apparatus including the same

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102069078B1 (ko) * 2014-08-27 2020-01-23 주식회사 제우스 기판 처리장치
WO2016056748A1 (ko) * 2014-10-10 2016-04-14 주식회사 제우스 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치
KR102082151B1 (ko) * 2014-10-10 2020-02-27 주식회사 제우스 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치
KR102123563B1 (ko) * 2014-10-20 2020-06-16 주식회사 제우스 기판지지장치 및 이를 구비한 기판 액처리 장치
JP6658195B2 (ja) * 2016-03-28 2020-03-04 大日本印刷株式会社 エッチング方法およびエッチング装置
US11056362B2 (en) 2016-05-26 2021-07-06 Mimasu Semiconductor Industry Co., Ltd. Wafer heating and holding mechanism and method for rotary table, and wafer rotating and holding device
US10720343B2 (en) * 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
IL283621B2 (en) * 2018-12-21 2025-04-01 Asml Holding Nv Retinal subfield thermal control
CN111403316A (zh) * 2020-03-18 2020-07-10 沈阳拓荆科技有限公司 一种提高硅片温度均匀性的加热系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164555A (ja) * 1998-11-30 2000-06-16 Ebara Corp 基板乾燥装置及び方法
JP3659863B2 (ja) * 2000-04-06 2005-06-15 大日本スクリーン製造株式会社 熱処理装置
TW563196B (en) * 2000-10-30 2003-11-21 Dainippon Screen Mfg Substrate processing apparatus
JP2005032933A (ja) * 2003-07-10 2005-02-03 Hitachi Kokusai Electric Inc 基板処理装置
JP4428717B2 (ja) * 2006-11-14 2010-03-10 東京エレクトロン株式会社 基板処理方法及び基板処理システム
JP4548735B2 (ja) * 2006-11-14 2010-09-22 東京エレクトロン株式会社 基板処理システム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160008065A (ko) * 2014-07-11 2016-01-21 세메스 주식회사 기판 처리 장치
US10490427B2 (en) 2014-07-11 2019-11-26 Semes Co., Ltd. Apparatus for treating substrate
US11765793B2 (en) 2019-07-18 2023-09-19 Semes Co., Ltd. Substrate treating apparatus
US11798822B2 (en) 2019-10-02 2023-10-24 Semes Co., Ltd. Support unit, substrate treating apparatus including the same, and substrate treating method
CN114730725A (zh) * 2019-11-25 2022-07-08 索泰克公司 接合两个基板的方法
US11961748B2 (en) 2020-07-24 2024-04-16 Semes Co., Ltd. Support unit and substrate treating apparatus including the same

Also Published As

Publication number Publication date
TWI602253B (zh) 2017-10-11
JP2014090168A (ja) 2014-05-15
KR20210049738A (ko) 2021-05-06
JP6351948B2 (ja) 2018-07-04
TW201434101A (zh) 2014-09-01

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