TWI598698B - 曝光裝置、曝光方法、及元件製造方法 - Google Patents

曝光裝置、曝光方法、及元件製造方法 Download PDF

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Publication number
TWI598698B
TWI598698B TW103145928A TW103145928A TWI598698B TW I598698 B TWI598698 B TW I598698B TW 103145928 A TW103145928 A TW 103145928A TW 103145928 A TW103145928 A TW 103145928A TW I598698 B TWI598698 B TW I598698B
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TW
Taiwan
Prior art keywords
liquid
substrate
space
disposed
exposure
Prior art date
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TW103145928A
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English (en)
Chinese (zh)
Other versions
TW201518877A (zh
Inventor
佐藤真路
Original Assignee
尼康股份有限公司
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Publication of TW201518877A publication Critical patent/TW201518877A/zh
Application granted granted Critical
Publication of TWI598698B publication Critical patent/TWI598698B/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW103145928A 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法 TWI598698B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US19383608P 2008-12-29 2008-12-29
US19383408P 2008-12-29 2008-12-29
US19383508P 2008-12-29 2008-12-29
US19383308P 2008-12-29 2008-12-29
US12/644,703 US8896806B2 (en) 2008-12-29 2009-12-22 Exposure apparatus, exposure method, and device manufacturing method

Publications (2)

Publication Number Publication Date
TW201518877A TW201518877A (zh) 2015-05-16
TWI598698B true TWI598698B (zh) 2017-09-11

Family

ID=42061940

Family Applications (4)

Application Number Title Priority Date Filing Date
TW106117608A TWI644182B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW098145223A TWI479276B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW107138629A TWI709002B (zh) 2008-12-29 2009-12-28 曝光裝置及元件製造方法
TW103145928A TWI598698B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法

Family Applications Before (3)

Application Number Title Priority Date Filing Date
TW106117608A TWI644182B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW098145223A TWI479276B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW107138629A TWI709002B (zh) 2008-12-29 2009-12-28 曝光裝置及元件製造方法

Country Status (5)

Country Link
US (2) US8896806B2 (enExample)
JP (2) JP5408258B2 (enExample)
KR (2) KR102087015B1 (enExample)
TW (4) TWI644182B (enExample)
WO (1) WO2010076894A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884180B2 (ja) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 基板処理装置および基板処理方法
US8896806B2 (en) * 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20110222031A1 (en) * 2010-03-12 2011-09-15 Nikon Corporation Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
NL2009271A (en) 2011-09-15 2013-03-18 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
US9268231B2 (en) 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9823580B2 (en) * 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9494870B2 (en) * 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
JP6212884B2 (ja) * 2013-03-15 2017-10-18 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
EP3057122B1 (en) * 2013-10-08 2018-11-21 Nikon Corporation Immersion member, exposure apparatus, exposure method, and device manufacturing method
CN106662822A (zh) 2014-07-01 2017-05-10 Asml荷兰有限公司 光刻设备和制造光刻设备的方法
CN113156772A (zh) 2016-09-12 2021-07-23 Asml荷兰有限公司 用于光刻设备的流体处理结构及浸没光刻设备
KR102649164B1 (ko) * 2017-12-15 2024-03-20 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 구조체, 리소그래피 장치, 유체 핸들링 구조체를 사용하는 방법 및 리소그래피 장치를 사용하는 방법
JP6610726B2 (ja) * 2018-07-11 2019-11-27 株式会社ニコン 液浸部材、露光装置及び露光方法、並びにデバイス製造方法
KR20220058559A (ko) 2019-09-13 2022-05-09 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 시스템 및 리소그래피 장치

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8004A (en) * 1851-03-25 Francis b
AU5067898A (en) 1996-11-28 1998-06-22 Nikon Corporation Aligner and method for exposure
EP0900412B1 (en) 1997-03-10 2005-04-06 ASML Netherlands B.V. Lithographic apparatus comprising a positioning device having two object holders
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
IL138374A (en) 1998-03-11 2004-07-25 Nikon Corp An ultraviolet laser device and an exposure device that includes such a device
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
US6452292B1 (en) 2000-06-26 2002-09-17 Nikon Corporation Planar motor with linear coil arrays
WO2002069049A2 (en) 2001-02-27 2002-09-06 Asml Us, Inc. Simultaneous imaging of two reticles
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
TWI242691B (en) 2002-08-23 2005-11-01 Nikon Corp Projection optical system and method for photolithography and exposure apparatus and method using same
KR100585476B1 (ko) * 2002-11-12 2006-06-07 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
AU2003289239A1 (en) * 2002-12-10 2004-06-30 Nikon Corporation Exposure system and device producing method
EP1498778A1 (en) * 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2264531B1 (en) 2003-07-09 2013-01-16 Nikon Corporation Exposure apparatus and device manufacturing method
KR101308826B1 (ko) 2003-09-03 2013-09-13 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
EP2267537B1 (en) 2003-10-28 2017-09-13 ASML Netherlands BV Lithographic apparatus
ATE467902T1 (de) * 2004-01-05 2010-05-15 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR20120003511A (ko) 2004-02-04 2012-01-10 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
WO2005104195A1 (ja) 2004-04-19 2005-11-03 Nikon Corporation 露光装置及びデバイス製造方法
US20070216889A1 (en) 2004-06-04 2007-09-20 Yasufumi Nishii Exposure Apparatus, Exposure Method, and Method for Producing Device
SG153813A1 (en) 2004-06-09 2009-07-29 Nikon Corp Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
JP4543767B2 (ja) 2004-06-10 2010-09-15 株式会社ニコン 露光装置及びデバイス製造方法
US7399614B2 (en) * 2004-06-30 2008-07-15 Applera Corporation 5-methylcytosine detection, compositions and methods therefor
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1681597B1 (en) 2005-01-14 2010-03-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007184336A (ja) 2006-01-05 2007-07-19 Canon Inc 露光装置及びデバイス製造方法
EP1995768A4 (en) 2006-03-13 2013-02-06 Nikon Corp EXPOSURE DEVICE, MAINTENANCE METHOD, EXPOSURE METHOD AND DEVICE MANUFACTURING METHOD
US9477158B2 (en) * 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8004651B2 (en) 2007-01-23 2011-08-23 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US8134685B2 (en) 2007-03-23 2012-03-13 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US8300207B2 (en) 2007-05-17 2012-10-30 Nikon Corporation Exposure apparatus, immersion system, exposing method, and device fabricating method
US20090122282A1 (en) 2007-05-21 2009-05-14 Nikon Corporation Exposure apparatus, liquid immersion system, exposing method, and device fabricating method
US8233139B2 (en) 2008-03-27 2012-07-31 Nikon Corporation Immersion system, exposure apparatus, exposing method, and device fabricating method
US8896806B2 (en) * 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method

Also Published As

Publication number Publication date
TWI479276B (zh) 2015-04-01
KR20180021907A (ko) 2018-03-05
WO2010076894A1 (en) 2010-07-08
US9612538B2 (en) 2017-04-04
US8896806B2 (en) 2014-11-25
JP5408258B2 (ja) 2014-02-05
JP2014027320A (ja) 2014-02-06
TW201518877A (zh) 2015-05-16
US20150036112A1 (en) 2015-02-05
KR20110106908A (ko) 2011-09-29
TW201908875A (zh) 2019-03-01
TW201732458A (zh) 2017-09-16
JP2012514315A (ja) 2012-06-21
KR101831984B1 (ko) 2018-02-23
JP5668825B2 (ja) 2015-02-12
TWI709002B (zh) 2020-11-01
TWI644182B (zh) 2018-12-11
US20100304310A1 (en) 2010-12-02
KR102087015B1 (ko) 2020-03-10
TW201030479A (en) 2010-08-16

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