TWI597472B - Method and device for measuring the height of protrusions and even protrusions on the surface of articles - Google Patents

Method and device for measuring the height of protrusions and even protrusions on the surface of articles Download PDF

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Publication number
TWI597472B
TWI597472B TW102103978A TW102103978A TWI597472B TW I597472 B TWI597472 B TW I597472B TW 102103978 A TW102103978 A TW 102103978A TW 102103978 A TW102103978 A TW 102103978A TW I597472 B TWI597472 B TW I597472B
Authority
TW
Taiwan
Prior art keywords
protrusion
height
image
measuring
protrusions
Prior art date
Application number
TW102103978A
Other languages
English (en)
Chinese (zh)
Other versions
TW201337207A (zh
Inventor
Toshihiro Kamohara
Kazuhiro Nonaka
Keita Tosaka
Original Assignee
Aist
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aist filed Critical Aist
Publication of TW201337207A publication Critical patent/TW201337207A/zh
Application granted granted Critical
Publication of TWI597472B publication Critical patent/TWI597472B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW102103978A 2012-02-03 2013-02-01 Method and device for measuring the height of protrusions and even protrusions on the surface of articles TWI597472B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012021787 2012-02-03

Publications (2)

Publication Number Publication Date
TW201337207A TW201337207A (zh) 2013-09-16
TWI597472B true TWI597472B (zh) 2017-09-01

Family

ID=48905413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103978A TWI597472B (zh) 2012-02-03 2013-02-01 Method and device for measuring the height of protrusions and even protrusions on the surface of articles

Country Status (4)

Country Link
JP (1) JP5979387B2 (ja)
CN (1) CN104136881B (ja)
TW (1) TWI597472B (ja)
WO (1) WO2013115386A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9859139B2 (en) 2015-07-14 2018-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. 3D IC bump height metrology APC
JP6273594B1 (ja) * 2017-05-12 2018-02-07 三菱重工機械システム株式会社 段ボールシートの不良検出装置及び段ボールシートの不良除去装置並びに段ボールシートの製造装置
JP7083695B2 (ja) * 2018-05-11 2022-06-13 株式会社荏原製作所 バンプ高さ検査装置、基板処理装置、バンプ高さ検査方法、記憶媒体
JP7530763B2 (ja) * 2020-08-06 2024-08-08 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0996611A (ja) * 1995-09-29 1997-04-08 Nec Corp はんだ付外観検査装置および外観検査方法
JP3551188B2 (ja) * 2002-01-10 2004-08-04 オムロン株式会社 表面状態検査方法および基板検査装置
CN1318839C (zh) * 2002-11-28 2007-05-30 威光机械工程股份有限公司 印刷电路板上瑕疵组件的自动光学检测方法
JP4053951B2 (ja) * 2003-08-11 2008-02-27 大日本印刷株式会社 突起の高さ測定方法および測定装置
JP4147169B2 (ja) * 2003-10-17 2008-09-10 日立ビアメカニクス株式会社 バンプ形状計測装置及びその方法
JP4061265B2 (ja) * 2003-12-19 2008-03-12 大日本印刷株式会社 突起の高さ測定方法および測定装置
JP5581563B2 (ja) * 2007-03-08 2014-09-03 株式会社日立製作所 照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法
CN101354236B (zh) * 2008-08-05 2010-06-02 上海新傲科技股份有限公司 对衬底的多层膜表面的颗粒几何尺寸进行无损检测的方法
JP5570179B2 (ja) * 2009-10-22 2014-08-13 京セラ株式会社 段差測定方法および段差測定装置

Also Published As

Publication number Publication date
TW201337207A (zh) 2013-09-16
JP5979387B2 (ja) 2016-08-24
CN104136881B (zh) 2017-08-29
JPWO2013115386A1 (ja) 2015-05-11
CN104136881A (zh) 2014-11-05
WO2013115386A1 (ja) 2013-08-08

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