TWI597341B - Thermal Release Adhesive Sheet - Google Patents

Thermal Release Adhesive Sheet Download PDF

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Publication number
TWI597341B
TWI597341B TW097120368A TW97120368A TWI597341B TW I597341 B TWI597341 B TW I597341B TW 097120368 A TW097120368 A TW 097120368A TW 97120368 A TW97120368 A TW 97120368A TW I597341 B TWI597341 B TW I597341B
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Taiwan
Prior art keywords
heat
expandable
adhesive layer
adhesive sheet
thickness
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TW097120368A
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English (en)
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TW200911952A (en
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Yukio Arimitsu
Daisuke Shimokawa
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Nitto Denko Corp
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Publication of TW200911952A publication Critical patent/TW200911952A/zh
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
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Description

熱剝離型黏著片材
本發明係關於一種熱剝離型黏著片材以及使用該黏著片材的電子零件之製造方法等，上述熱剝離型黏著片材之黏著性優異，且可於任意時候藉由加熱處理而自被著體上輕易剝離。
作為於半導體基板的切割步驟等中所使用之半導體基板加工用黏著片材，已知使用硬化型黏著片材之技術，該硬化型黏著片材係於黏貼於半導體基板後，於拾取時藉由紫外線及/或輻射而引發黏著劑聚合硬化，使黏著力降低(參照專利文獻1)。另一方面，作為半導體基板加工用黏著片材，亦研究使用熱剝離型黏著片材之技術，該熱剝離型黏著片材之黏著層由包含熱膨脹性微小球之熱膨脹性黏著層構成，藉由加熱而使黏著力消失後加以剝離。此種熱剝離型黏著片材，於使用時不需要紫外線等照射設備、或抑制剝離耐電方面而言，比硬化型黏著片材優異，但由於含有熱膨脹性微小球等，故而導致黏著層較硬，對被著體之吻合性較差。
近年來，成為黏著片材貼附面之密封樹脂面上具有0.4~15 μm左右粗糙面之半導體基板，或藉由雷射照射而印有深度為25~40 μm的標記之半導體基板增多。於切割此種表面具有凹凸之半導體基板時，由於先前之熱剝離型黏著片材對凹凸之吻合性並不充分，因此無法獲得充分的黏 著力，切割基板時會產生以下問題：被著體剝離之晶片發生飛散而導致良率降低，或飛散之晶片碰撞切刀而損壞切刀。
【專利文獻1】日本專利特開平6－49420號公報
本發明之目的在於提供一種熱剝離型黏著片材，對凹凸面之吻合性優異，因此即使被著體之被著面為粗糙面，亦展現充分的接著力，於用作具有密封樹脂等之粗糙面之半導體基板的切割用黏著片材時，亦不易發生晶片飛散，且加工結束後，藉由加熱即可輕易剝離，而不會施加應力於被著體。
本發明之其他目的在於提供一種被著體之加工方法，係使用上述對凹凸面之吻合性以及熱剝離性優異之熱剝離型黏著片材者。
本發明者等人為解決上述課題而努力研究，結果發現藉由於支持基材與熱膨脹性黏著層之間設置橡膠狀有機彈性層，且使該熱膨脹性黏著層之厚度與橡膠狀有機彈性層之厚度成一定的比率，即可解決上述課題，從而完成本發明。
即，本發明提供一種熱剝離型黏著片材，其特徵在於：其係於基材之至少一面上經由橡膠狀有機彈性層而積層有含有熱膨脹性微小球之熱膨脹性黏著層者；且橡膠狀有機 彈性層之厚度為熱膨脹性黏著層之厚度的1.5~42倍。
本發明又提供一種被著體之加工方法，其特徵在於：其係使用熱剝離型黏著片材加工被著體者，該熱剝離型黏著片材係於基材之至少一面上經由橡膠狀有機彈性層而積層有含有熱膨脹性微小球之熱膨脹性黏著層者；橡膠狀有機彈性層之厚度為熱膨脹性黏著層之厚度的1.5~42倍，且被著體之表面粗糙度大於熱膨脹性黏著層之表面粗糙度。
本發明進而又提供一種電子零件之製造方法，其特徵在於：其係使用熱剝離型黏著片材加工半導體基板而製造電子零件者，該熱剝離型黏著片材係於基材之至少一面上經由橡膠狀有機彈性層而積層有含有熱膨脹性微小球之熱膨脹性黏著層者；且半導體基板之表面粗糙度大於熱膨脹性黏著層之表面粗糙度。
本發明之熱剝離型黏著片材對表面具有凹凸之被著體亦展現優異之吻合性及接著力，可牢固地固定被著體。而且，接著目的達成後，藉由加熱而輕易地使接著力降低或消失，因此可輕易剝離而不會施加應力於被著體。
藉由本發明之被著體之加工方法，亦可牢固地固定表面具有凹凸之微小的被著體，因此可輕易地對被著體實施正確的加工。而且，加工結束後藉由加熱可輕易地使黏著片材的黏著力降低或消失，因此可輕易地剝離回收被著體。
進而，藉由本發明之方法，亦可牢固固定表面具有密封樹脂所產生粗糙面，或具有雷射印字等凹凸之半導體基 板，減少切割時的晶片飛散或晶片缺損等問題，可舒適地進行切割等加工。加工步驟結束後，藉由加熱可輕易地將電子零件自黏著片材上剝離。
[熱剝離型黏著片材]
參照圖式說明本發明之熱剝離型黏著片材。圖1係表示本發明之熱剝離型黏著片材之一例的概略剖面圖。圖1中，11表示基材、12表示橡膠狀有機彈性層、13表示熱膨脹性黏著層、14表示隔層。橡膠狀有機彈性層12係設置於基材11與熱膨脹性黏著層13之間的層，其包含以下之功能：將黏著片材接著於被著體時其表面良好地與黏附體之表面形狀吻合而提供較大之接著面積；為了將黏著片材自被著體上剝離而加熱熱膨脹性黏著層13以使其發泡及/或膨脹時，減少於黏著片材之面方向上發泡及/或膨脹的束縛而使熱膨脹性黏著層13進行立體之結構變化，藉此助其形成彎曲起伏結構。隔層14係為了保護熱膨脹性黏著層表面而視需要設置之層，其係由平滑且可剝離之薄膜構成。隔層14可有可無。
本發明之熱剝離型黏著片材，橡膠狀有機彈性層12之厚度為熱膨脹性黏著層13之厚度的1.5~42倍，較好的是2~18，更好的是3~12倍，特別好的是4~8倍之範圍內。如後所述，橡膠狀有機彈性層12係比較柔軟且易變形之構成。因此，使橡膠狀有機彈性層12之厚度大於比較硬且不易變形之熱膨脹性黏著層13之厚度，特別是使兩者之比處於於上 述範圍內，藉此橡膠狀有機彈性層12吸收被著體表面之凹凸，貼附於被著體時熱膨脹性黏著層13較好地與被著體表面之凹凸吻合，從而預防被著體與黏著片材之間產生浮動或氣泡等。藉此被著體表面與黏著層表面之接著面積增加，表現充分的接著力。若橡膠狀有機彈性層12之厚度小於熱膨脹性黏著層13之厚度的1.5倍，則會有以下之情況：無法獲得對被著體之凹凸面之充分的吻合性，產生浮動或氣泡，接著力降低。於橡膠狀有機彈性層12之厚度明顯大於熱膨脹性黏著層13之厚度之情形時，特別是超過42倍之情形時，有無法獲得充分的加熱剝離性之情況。
(基材)
於本發明之熱剝離型黏著片材中，基材11係作為黏著片材之支持母體，通常使用塑膠薄膜或片材，可使用例如：紙、布、不織布、金屬箔或該等之塑膠層壓體、塑膠類之積層體等適當的薄片體，並無特別限制。基材之厚度並無特別限制，例如可自5~250 μm之範圍選擇。
(熱膨脹性黏著層)
熱膨脹性黏著層13可藉由於黏著劑中調配熱膨脹性微小球而形成。作為黏著劑，可使用眾所周知之適當的感壓接著劑，並無特別限制，較好的是使用加熱時容許且不束縛熱膨脹性微小球之發泡及/或膨脹之將橡膠系材料或樹脂等作為基礎的感壓接著劑。
作為此種感壓接著劑，可列舉：將天然橡膠、各種合感橡膠、丙烯酸系、乙烯基烷基醚系或聚矽氧系、聚酯系或 聚醯胺系、胺基甲酸酯系或苯乙烯－二烯嵌段共聚物系等聚合物作為基礎聚合物之感壓接著劑。又，亦可將於該等聚合物中調配熔點約為200℃以下之熱熔融性樹脂而改良潛變(creep)特性者用作基礎聚合物。
該等之中，特別適合使用丙烯酸系共聚物。作為丙烯酸系共聚物之主單體成分，較好的是使用具有碳數為20以下之烷基的(甲基)丙烯酸烷基酯。作為碳數為20以下之烷基，例如可列舉：甲基、乙基、丙基、丁基、戊基、己基、庚基、2－乙基己基、異辛基、異癸基、十二烷基、月桂基、十三烷基、十五烷基、十六烷基、十七烷基、十八烷基、十九烷基、二十烷基等。(甲基)丙烯酸烷基酯可選擇1種或2種以上作為主單體成分使用。再者，該等(甲基)丙烯酸烷基酯於黏著劑之基礎聚合物中通常含有50重量%以上。
丙烯酸系共聚物除上述(甲基)丙烯酸烷基酯以外，視需要亦可以凝聚力或耐熱性等之改質等為目的而包含適當之共聚性單體。作為上述共聚性單體，例如可列舉：丙烯酸、甲基丙烯酸、丙烯酸羧乙酯、丙烯酸羧戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等含有羧基之單體；順丁烯二酸酐、伊康酸酐等酸酐；(甲基)丙烯酸羥乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸羥丁酯、(甲基)丙烯酸羥己酯、(甲基)丙烯酸羥辛酯、(甲基)丙烯酸羥癸酯、(甲基)丙烯酸羥月桂酯、(甲基)丙烯酸(4－羥基甲基環己基)甲酯等含有羥基之單體；苯乙烯磺酸、烯丙基磺 酸、2－(甲基)丙烯醯胺－2－甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含有磺酸基之單體；(甲基)丙烯醯胺或N,N－二甲基(甲基)丙烯醯胺、N－丁基(甲基)丙烯醯胺、N－羥甲基(甲基)丙烯醯胺、N－羥甲基丙烷(甲基)丙烯醯胺等(N－取代)醯胺系單體；(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N－二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸烷基胺基系單體；(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基系單體；N－環己基馬來醯亞胺、N－異丙基馬來醯亞胺、N－月桂基馬來醯亞胺、N－苯基馬來醯亞胺等馬來醯亞胺系單體；N－甲基伊康醯亞胺、N－乙基伊康醯亞胺、N－丁基伊康醯亞胺、N－辛基伊康醯亞胺、N－2－乙基己基伊康醯亞胺、N－環己基伊康醯亞胺、N－月桂基伊康醯亞胺等伊康醯亞胺系單體；N－(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N－(甲基)丙烯醯基－6－氧基六亞甲基琥珀醯亞胺、N－(甲基)丙烯醯基－8－氧基八亞甲基琥珀醯亞胺等琥珀醯亞胺系單體；乙酸乙烯酯、丙酸乙烯酯、N－乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌嗪、乙烯基吡嗪、乙烯基吡咯、乙烯基咪唑、乙烯基噁唑、乙烯基嗎啉、N－乙烯基羧酸醯胺類、苯乙烯、α－甲基苯乙烯、N－乙烯基己內醯胺等乙烯基系單體；丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體；(甲基)丙烯酸環氧丙酯等含有環氧基之丙烯酸系單體；(甲基)丙烯酸聚乙二醇或(甲基)丙烯 酸聚丙二醇、(甲基)丙烯酸甲氧基乙二醇、(甲基)丙烯酸甲氧基聚丙二醇等二醇系丙烯酸酯單體；(甲基)丙烯酸四氫糠酯、氟(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯、丙烯酸2－甲氧基乙酯等丙烯酸酯系單體；己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等多官能單體；異戊二烯、丁二烯、異丁烯、乙烯基醚等。該等共聚性單體，可選擇1種或2種以上使用。
藉由將上述單體加以聚合，可製造構成熱膨脹性黏著層13之基礎聚合物。聚合方法並無特別限制，可自添加聚合起始劑之溶液聚合方法、塊狀聚合方法、乳化聚合方法等通常所用之眾所周知的聚合方法中適當選擇。
構成熱膨脹性黏著層13之黏著劑，視需要亦可添加各種添加劑。作為此種添加劑，例如可列舉：眾所周知或慣用之增黏樹脂(例如，松香系樹脂、萜烯系樹脂、石油樹脂、苯并呋喃－茚樹脂、苯乙烯系樹脂等)、交聯劑(例如，環氧系交聯劑、異氰酸酯系交聯劑、多官能丙烯酸酯系交聯劑等)、填充劑、著色劑(顏料或染料等)、抗氧化劑、紫外線吸收劑、界面活性劑等眾所周知的各種添加劑。該等添加劑之使用量均為適用於黏著劑之通常量。
作為上述熱膨脹性微小球，例如可使用將異丁烷、丙 烷、戊烷等容易氣化而顯示膨脹性的適宜物質藉由凝聚法或界面聚合法等而內包於殼形成物質內的熱膨脹性微小球。作為殼形成物質，可使用顯示熱熔融性的物質或藉由熱膨脹而破壊的物質，例如可列舉：偏二氯乙烯－丙烯腈共聚物、聚乙烯醇、聚乙烯丁醛、聚甲基丙烯酸甲酯、聚丙烯腈、聚偏二氯乙烯、聚碸等。熱膨脹性微小球，為了表現良好之熱剝離性而使用體積膨脹倍率為例如5倍以上，較好的是7倍以上，特別好的是10倍以上者。
熱膨脹性微小球之調配量可根據使熱剝離性黏著劑層13膨脹(發泡)之程度或使接著力降低之程度而適當選擇，並無特別限制。例如，相對於構成後述之熱剝離性黏著劑層的基礎聚合物100重量份，可自1~150重量份，較好的是25~100重量份之範圍選擇。
熱膨脹性黏著層13之厚度可自例如5~30 μm，較好的是5~20 μm，更好的是5~15 μm之範圍選擇。若熱膨脹性黏著層13過厚則對凹凸面之吻合性較差，將本發明之熱剝離型黏著片材用作半導體基板切割時的固定用黏著片材時容易發生晶片飛散或缺損。厚度不足時，由於每單位面積之熱膨脹性微小球的量變少，故會有加熱剝離性較差的情況。
(橡膠狀有機彈性層)
橡膠狀有機彈性層12可藉由基於ASTM D－2240之D型肖氏(shore)D型硬度而為50以下或者40以下的天然橡膠或合成橡膠，或具有橡膠彈性之合成樹脂而形成。
作為上述合成橡膠或合成樹脂，例如可列舉：腈系、二 烯系、丙烯酸系等的合成橡膠，聚烯烴系樹脂、聚酯系樹脂、熱可塑性彈性物、乙烯－醋酸乙烯酯共聚物、聚胺基甲酸酯、聚丁二烯、軟質聚氯乙烯等具有橡膠彈性的合成樹脂。再者，即使是聚氯乙烯等本質上為硬質系之聚合物，亦可藉由與塑化劑或軟化劑等調配劑組合而賦予其橡膠彈性後加以使用。
又，作為構成橡膠狀有機彈性層12之材料，可使用與上述感壓接著劑相同者。例如，將丙烯酸系共聚物作為基礎聚合物之丙烯酸系感壓接著劑適合作為構成橡膠狀有機彈性層12之材料。
橡膠狀有機彈性層12之厚度例如為20~200 μm，較好的是30~180 μm，更好的是40~150 μm，可以使其與熱膨脹性黏著層13之厚度比在上述範圍內之方式進行選擇。若橡膠狀有機彈性層12較薄則會有對凹凸之吻合性較差而無法獲得充分的接著力之情況，於將本發明之熱剝離型黏著片材用作半導體基板切割時的固定用黏著片材時容易發生晶片飛散或缺損。又，若過厚則由於黏著片材太柔軟，會發生晶片缺損之情況。
[被著體之加工方法]
本發明之熱剝離型黏著片材貼附於被著體時，對具有凹凸之被著面亦可較好地吻合，且貼附時不產生浮動或氣泡，可牢固固定被著體。尤其，於被著體之表面粗糙度大於熱膨脹性黏著層12的表面(黏著面)之表面粗糙度時，可明顯表現此種對凹凸面之吻合性。再者，表面粗糙度可利 用例如中心線平均粗糙度(算術平均粗糙度)等評價。因此，使用本發明之熱剝離型黏著片材，即，於基材11之至少一面上經由橡膠狀有機彈性層12而積層有含有熱膨脹性微小球之熱膨脹性黏著層13而成，且橡膠狀有機彈性層12之厚度為熱膨脹性黏著層13之厚度的1.5~42倍的熱剝離型黏著片材，固定被著面之表面粗糙度大於熱膨脹性黏著層13之表面粗糙度的被著體，從而可對該被著體實施各種加工。本發明之熱剝離型黏著片材可牢固固定且保持被著體，因此可準確進行微細且精密的加工。又，即使於加工時對被著體(被加工體)施加負荷，亦難以產生偏移或剝落，可牢固固定被著體直至加工結束為止。再者，上述加工例如包含印刷、刻印、積層壓製、切割、研磨、清洗等，但並不限定於該等。
加工結束後，可藉由加熱使熱膨脹性黏著層13之黏著力降低或消失，自被加工體(被著體)上輕易剝離。此時的加熱處理條件可根據以下條件決定：由被著體之表面狀態或熱膨脹性微小球之種類等所造成的接著面積之減少性、基材11或被著體之耐熱性或加熱方法等，例如，加熱處理條件為100~250℃、1~90秒(加熱板等)或5~15分鐘(熱風乾燥器等)。
[電子零件之製造方法]
作為表面粗糙度大於本發明之黏著片材之熱膨脹性黏著層13之表面粗糙度，且可使用本發明之熱剝離型黏著片材進行加工的被加工體(被著體)，例如可列舉：矽晶圓等半 導體基板或由陶瓷、玻璃、樹脂等構成之基板，於該等基板上形成電路圖案之電子零件集合體，或用環氧樹脂等密封樹脂密封此種電子零件集合體之密封樹脂封裝等。可將該等被加工體黏合於黏著片材上並固定，切割成規定的尺寸而使之個片化，從而製成電子零件。
藉由本發明之電子零件之製造方法，例如可準確進行晶片大小之封裝等超小型、輕量電子零件集合體之切割，而不會產生晶片飛散或晶片破損等異常情況，可高效地製造高品質的電子零件。
[實施例]
以下列舉實施例對本發明加以更詳細之說明，但本發明不受該等實施例的任何限制。
(實施例1)
<橡膠狀有機彈性層>
使丙烯酸系共聚物(丙烯酸丁酯：丙烯酸乙烯酯：丙烯酸＝100重量份：10重量份：5重量份)100重量份、異氰酸酯系交聯劑(日本聚胺酯工業股份有限公司製造(NIPPON POLYURETHANE INDUSTRY CO.,LTD.)：商品名「CORONET L」)2重量份、松香酚系樹脂(住友電木(Sumitomo Bakelite)股份有限公司製造：商品名「Sumiliteresin」)30重量份混合溶解於甲苯中，製備塗佈液。將該塗佈液以乾燥後厚度達到70 μm之方式塗佈於厚度為50 μm之聚酯薄膜上，從而形成橡膠狀有機彈性層。
<熱膨脹性黏著層>
使丙烯酸系共聚物(丙烯酸丁酯：丙烯酸乙烯酯：丙烯酸＝100重量份：10重量份：5重量份)100重量份、異氰酸酯系交聯劑(日本聚胺酯工業股份有限公司製造：商品名「CORONET L」)5重量份、熱膨脹性微小球(松本油脂製藥公司製造：商品名「Microsphere F30D」)70重量份均勻地溶解分散於甲苯中，製備塗佈液。將該塗佈液以乾燥後厚度達到10 μm之方式塗佈於隔層上，從而形成熱膨脹性黏著層。
<熱剝離型黏著片材>
黏合上述橡膠狀有機彈性層與熱膨脹性黏著層，獲得熱剝離型黏著片材。
(比較例1)
除使熱膨脹性黏著層之厚度達到70 μm以外，進行與實施例1相同之操作，獲得熱剝離型黏著片材。
(比較例2)
除使橡膠狀有機彈性層之厚度達到13 μm、熱膨脹性黏著層之厚度達到10 μm以外，進行與實施例1相同之操作，獲得熱剝離型黏著片材。
(驗證)
對由實施例以及比較例所獲得之熱剝離型黏著片材進行以下試驗。結果示於表1。
[黏著力]
於不鏽鋼板(SUS304BA)表面上黏合各熱剝離型黏著片材，於拉伸速度為300 mm/min、剝離角度為180°之條件下 測定剝下黏著片材時的黏著力。
[加熱剝離性]
於不鏽鋼板(SUS304BA304BA)表面上黏合各熱剝離型黏著片材而製作樣品，將該樣品於100℃×1分鐘之條件下加熱後目視確認剝離狀況。將剝離之情況評價為○，未剝離之情況評價為×。
[凹凸黏合性]
參照圖2說明凹凸黏合性之試驗方法。圖2係表示凹凸黏合性試驗之樣品的概略剖面圖。再者，圖2中，21表示不鏽鋼板(SUS304BA)，22表示切割成寬度為20 mm的由實施例或比較例所獲得之熱剝離型黏著片材，23表示厚度為23 μm之PET(聚對苯二甲酸乙二酯)薄膜。於不鏽鋼板上放置PET薄膜，使用層壓機於壓力為0.3 Mpa、貼附速度為1 m/min之條件下黏合各熱剝離型黏著片材。再者，圖2係黏著片材之寬度方向的剖面圖，薄膜之黏合係沿著黏著片材之長度方向藉由層壓而進行。PET薄膜之寬度a為20 mm。黏合後，測定作為浮動(非黏著部分)之b以及c之最大長度，算出b與c之平均值。將平均值小於200 μm之情況評價為○，200 μ以上之情況評價為×。
[產業上之利用可能性]
本發明之熱剝離型黏著片材，對表面具有凹凸之被著體亦表現優異之吻合性以及接著力，可牢固固定被著體。而且，接著目的達成後，藉由加熱而輕易地使接著力降低或消失，因此可不對被著體施加應力而輕易剝離。
若將具有上述優異特性之本發明之黏著片材用作加工時的固定用黏著片材，則可容易地對被著體實施正確的加工。例如，於電子零件之製造中，即使是表面具有密封樹脂所產生粗糙面，或具有雷射印字等凹凸之半導體基板，亦可牢固固定，減少切割時的晶片飛散或晶片缺損等問題，可舒適地進行切割等加工。
11‧‧‧基材
12‧‧‧橡膠狀有機彈性層
13‧‧‧熱膨脹性黏著層
14‧‧‧隔層
21‧‧‧不鏽鋼板
22‧‧‧黏著片材
23‧‧‧厚度為23 μm之聚對苯二甲酸乙二酯薄膜
圖1係本發明之熱剝離型黏著片材之一例的概略剖面圖。
圖2係說明於實施例中所進行之凹凸黏合性之評價方法的圖。
11‧‧‧基材
12‧‧‧橡膠狀有機彈性層
13‧‧‧熱膨脹性黏著層
14‧‧‧隔層

Claims (3)

  1. 一種熱剝離型黏著片材，其特徵在於：其係於基材之至少一面上介由橡膠狀有機彈性層而積層有含有熱膨脹性微小球之熱膨脹性黏著層者；橡膠狀有機彈性層之厚度為熱膨脹性黏著層之厚度的1.5~42倍，且熱膨脹性黏著層之厚度為5~15μm。
  2. 一種被著體之加工方法，其特徵在於：其係使用熱剝離型黏著片材加工被著體者，該熱剝離型黏著片材係於基材之至少一面上介由橡膠狀有機彈性層而積層有含有熱膨脹性微小球之熱膨脹性黏著層者；橡膠狀有機彈性層之厚度為熱膨脹性黏著層之厚度的1.5~42倍，熱膨脹性黏著層之厚度為5~15μm，且被著體之表面粗糙度大於熱膨脹性黏著層之表面粗糙度。
  3. 一種電子零件之製造方法，其特徵在於：其係使用熱剝離型黏著片材加工半導體基板而製造電子零件者，該熱剝離型黏著片材係於基材之至少一面上介由橡膠狀有機彈性層而積層有含有熱膨脹性微小球之熱膨脹性黏著層者；橡膠狀有機彈性層之厚度為熱膨脹性黏著層之厚度的1.5~42倍，熱膨脹性黏著層之厚度為5~15μm，且半導體基板之表面粗糙度大於熱膨脹性黏著層之表面粗糙度。
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