TWI595015B - 光硬化與熱硬化樹脂組成物及乾膜式防焊劑 - Google Patents

光硬化與熱硬化樹脂組成物及乾膜式防焊劑 Download PDF

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Publication number
TWI595015B
TWI595015B TW105109374A TW105109374A TWI595015B TW I595015 B TWI595015 B TW I595015B TW 105109374 A TW105109374 A TW 105109374A TW 105109374 A TW105109374 A TW 105109374A TW I595015 B TWI595015 B TW I595015B
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TW
Taiwan
Prior art keywords
group
compound
acid
resin composition
thermosetting resin
Prior art date
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TW105109374A
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English (en)
Chinese (zh)
Other versions
TW201634511A (zh
Inventor
慶有眞
崔炳柱
鄭遇載
崔寶允
李光珠
鄭珉壽
Original Assignee
Ｌｇ化學股份有限公司
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Publication of TW201634511A publication Critical patent/TW201634511A/zh
Application granted granted Critical
Publication of TWI595015B publication Critical patent/TWI595015B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/04—Aromatic polycarbonates
    • C08G64/06—Aromatic polycarbonates not containing aliphatic unsaturation
    • C08G64/14—Aromatic polycarbonates not containing aliphatic unsaturation containing a chain-terminating or -crosslinking agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
TW105109374A 2015-03-27 2016-03-25 光硬化與熱硬化樹脂組成物及乾膜式防焊劑 TWI595015B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20150043210 2015-03-27

Publications (2)

Publication Number Publication Date
TW201634511A TW201634511A (zh) 2016-10-01
TWI595015B true TWI595015B (zh) 2017-08-11

Family

ID=57080987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105109374A TWI595015B (zh) 2015-03-27 2016-03-25 光硬化與熱硬化樹脂組成物及乾膜式防焊劑

Country Status (3)

Country Link
KR (1) KR101799094B1 (ko)
CN (1) CN106019829B (ko)
TW (1) TWI595015B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6702617B2 (ja) 2016-02-05 2020-06-03 エルジー・ケム・リミテッド 光硬化性および熱硬化性を有する樹脂組成物およびドライフィルムソルダーレジスト
CN110121537B (zh) * 2016-12-30 2022-12-23 株式会社东进世美肯 能够实现低卷曲的涂料组合物和由其制备的薄膜
CN108459465B (zh) * 2017-01-17 2021-12-14 太阳油墨制造株式会社 感光性膜、感光性膜层积体和使用它们形成的固化物
JP6486571B1 (ja) * 2017-06-06 2019-03-20 日本化薬株式会社 電子部品用接着剤
GB201819195D0 (en) * 2018-11-26 2019-01-09 Electra Polymers Ltd Jettable composition
EP3702387B1 (en) * 2019-02-28 2023-05-10 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition, and method for etching glass substrate
CN114015393A (zh) * 2021-11-25 2022-02-08 盐城东山精密制造有限公司 一种提升气密性胶水结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200933298A (en) * 2007-09-21 2009-08-01 Taiyo Ink Mfg Co Ltd Photosetting-thermosetting resin composition and its cured material
TW201348872A (zh) * 2012-02-20 2013-12-01 Lg Chemical Ltd 光硬化與熱硬化樹脂組成物、以及防焊乾膜

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100188181B1 (ko) * 1996-12-20 1999-06-01 서영배 내부식성이 향상된 감광성 솔더 레지스트 조성물
KR101114257B1 (ko) 2009-02-25 2012-03-05 주식회사 케이씨씨 알칼리 가용성 변성 아크릴 공중합체를 포함하는 솔더 레지스트 조성물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200933298A (en) * 2007-09-21 2009-08-01 Taiyo Ink Mfg Co Ltd Photosetting-thermosetting resin composition and its cured material
TW201348872A (zh) * 2012-02-20 2013-12-01 Lg Chemical Ltd 光硬化與熱硬化樹脂組成物、以及防焊乾膜

Also Published As

Publication number Publication date
CN106019829A (zh) 2016-10-12
KR20160115841A (ko) 2016-10-06
TW201634511A (zh) 2016-10-01
KR101799094B1 (ko) 2017-11-17
CN106019829B (zh) 2019-10-29

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