TWI592980B - Plasma processing apparatus and plasma processing apparatus operating method - Google Patents

Plasma processing apparatus and plasma processing apparatus operating method Download PDF

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Publication number
TWI592980B
TWI592980B TW104142478A TW104142478A TWI592980B TW I592980 B TWI592980 B TW I592980B TW 104142478 A TW104142478 A TW 104142478A TW 104142478 A TW104142478 A TW 104142478A TW I592980 B TWI592980 B TW I592980B
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TW
Taiwan
Prior art keywords
light
plasma
processing chamber
processing
wall
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TW104142478A
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English (en)
Chinese (zh)
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TW201624528A (zh
Inventor
大森健史
佐藤大祐
臼井建人
井上智己
前田賢治
Original Assignee
日立全球先端科技股份有限公司
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Publication of TW201624528A publication Critical patent/TW201624528A/zh
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    • H10P50/242—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H10P14/6514—
    • H10P14/6532—
    • H10P50/267—

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
TW104142478A 2014-12-19 2015-12-17 Plasma processing apparatus and plasma processing apparatus operating method TWI592980B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014256786 2014-12-19

Publications (2)

Publication Number Publication Date
TW201624528A TW201624528A (zh) 2016-07-01
TWI592980B true TWI592980B (zh) 2017-07-21

Family

ID=56128761

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142478A TWI592980B (zh) 2014-12-19 2015-12-17 Plasma processing apparatus and plasma processing apparatus operating method

Country Status (4)

Country Link
US (2) US10008370B2 (enExample)
JP (2) JP6650259B2 (enExample)
KR (2) KR101877862B1 (enExample)
TW (1) TWI592980B (enExample)

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KR102833948B1 (ko) 2018-11-22 2025-07-15 삼성전자주식회사 기판 처리 장치, 기판 처리 방법 및 이를 이용한 반도체 소자의 제조 방법
KR102687949B1 (ko) 2018-12-27 2024-07-25 삼성전자주식회사 기판 처리 장치, 기판 처리 모듈 및 반도체 소자 제조 방법
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US10871396B2 (en) 2019-04-05 2020-12-22 Samsung Electronics Co., Ltd. Optical emission spectroscopy calibration device and system including the same
KR102728521B1 (ko) * 2019-04-05 2024-11-13 삼성전자주식회사 광학 방출 분석 캘리브레이션 장치 및 시스템
US11114286B2 (en) * 2019-04-08 2021-09-07 Applied Materials, Inc. In-situ optical chamber surface and process sensor
US12002665B2 (en) * 2019-07-01 2024-06-04 Applied Materials, Inc. Real-time detection of particulate matter during deposition chamber manufacturing
JP7095029B2 (ja) * 2019-09-09 2022-07-04 芝浦メカトロニクス株式会社 プラズマ処理装置
CN113130280B (zh) * 2019-12-31 2024-03-12 中微半导体设备(上海)股份有限公司 光强度监测调节机构、调节方法及等离子体处理装置
JP2021163949A (ja) * 2020-04-03 2021-10-11 東京エレクトロン株式会社 測定方法及びプラズマ処理装置
US12009191B2 (en) 2020-06-12 2024-06-11 Applied Materials, Inc. Thin film, in-situ measurement through transparent crystal and transparent substrate within processing chamber wall
US11708635B2 (en) 2020-06-12 2023-07-25 Applied Materials, Inc. Processing chamber condition and process state monitoring using optical reflector attached to processing chamber liner
US12062530B2 (en) * 2020-06-25 2024-08-13 Hitachi High-Tech Corporation Vacuum processing apparatus and vacuum processing method
WO2022054072A1 (en) * 2020-09-13 2022-03-17 Sigma Carbon Technologies System for growth of crystalline material(s)
KR102872758B1 (ko) * 2020-12-08 2025-10-21 삼성전자주식회사 플라즈마 처리 장치, 이를 이용한 반도체 소자 제조 공정의 모니터링 방법 및 모니터링 방법을 포함하는 반도체 소자의 제조 방법
CN114643234A (zh) * 2020-12-18 2022-06-21 日月光半导体制造股份有限公司 电浆检测器、电浆清洗系统及清洗器件的方法
US20220333236A1 (en) * 2021-04-16 2022-10-20 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor manufacturing apparatus with improved production yield
CN117813679A (zh) * 2021-08-17 2024-04-02 东京毅力科创株式会社 用于测量半导体等离子体加工室中的可消耗部件的特性的光学传感器
US12031910B2 (en) 2021-09-15 2024-07-09 Applied Materials, Inc. Transmission corrected plasma emission using in-situ optical reflectometry
JP2023080674A (ja) * 2021-11-30 2023-06-09 パナソニックＩｐマネジメント株式会社 プラズマ処理装置およびプラズマ処理装置の使用方法
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Also Published As

Publication number Publication date
JP2020065081A (ja) 2020-04-23
US20180269042A1 (en) 2018-09-20
US10008370B2 (en) 2018-06-26
KR20180081693A (ko) 2018-07-17
JP6650259B2 (ja) 2020-02-19
US20160177449A1 (en) 2016-06-23
US10672595B2 (en) 2020-06-02
JP2016119473A (ja) 2016-06-30
KR101877862B1 (ko) 2018-07-12
KR101960826B1 (ko) 2019-07-17
JP6877601B2 (ja) 2021-05-26
KR20160075350A (ko) 2016-06-29
TW201624528A (zh) 2016-07-01

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