TWI586900B - 電漿處理系統中用以供應處理氣體之共用氣體面板、設備、及方法 - Google Patents

電漿處理系統中用以供應處理氣體之共用氣體面板、設備、及方法 Download PDF

Info

Publication number
TWI586900B
TWI586900B TW102110938A TW102110938A TWI586900B TW I586900 B TWI586900 B TW I586900B TW 102110938 A TW102110938 A TW 102110938A TW 102110938 A TW102110938 A TW 102110938A TW I586900 B TWI586900 B TW I586900B
Authority
TW
Taiwan
Prior art keywords
mixing
gas
valves
manifold
output
Prior art date
Application number
TW102110938A
Other languages
English (en)
Chinese (zh)
Other versions
TW201402958A (zh
Inventor
馬克 塔斯卡
艾克柏 沙瑞夫
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201402958A publication Critical patent/TW201402958A/zh
Application granted granted Critical
Publication of TWI586900B publication Critical patent/TWI586900B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/10—Mixing gases with gases
    • B01F23/19—Mixing systems, i.e. flow charts or diagrams; Arrangements, e.g. comprising controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87249—Multiple inlet with multiple outlet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87265—Dividing into parallel flow paths with recombining
    • Y10T137/87281—System having plural inlets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87652—With means to promote mixing or combining of plural fluids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87885—Sectional block structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Semiconductors (AREA)
  • Valve Housings (AREA)
  • Chemical Vapour Deposition (AREA)
TW102110938A 2012-03-27 2013-03-27 電漿處理系統中用以供應處理氣體之共用氣體面板、設備、及方法 TWI586900B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/431,946 US8851113B2 (en) 2012-03-27 2012-03-27 Shared gas panels in plasma processing systems

Publications (2)

Publication Number Publication Date
TW201402958A TW201402958A (zh) 2014-01-16
TWI586900B true TWI586900B (zh) 2017-06-11

Family

ID=49233257

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102110938A TWI586900B (zh) 2012-03-27 2013-03-27 電漿處理系統中用以供應處理氣體之共用氣體面板、設備、及方法

Country Status (5)

Country Link
US (1) US8851113B2 (https=)
JP (1) JP6211584B2 (https=)
KR (1) KR102023794B1 (https=)
TW (1) TWI586900B (https=)
WO (1) WO2013148474A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8851113B2 (en) 2012-03-27 2014-10-07 Lam Research Coporation Shared gas panels in plasma processing systems
US9091397B2 (en) 2012-03-27 2015-07-28 Lam Research Corporation Shared gas panels in plasma processing chambers employing multi-zone gas feeds
JP6278723B2 (ja) * 2014-01-31 2018-02-14 ポリプラスチックス株式会社 レンズ用組成物及びレンズ
JP6278722B2 (ja) * 2014-01-31 2018-02-14 ポリプラスチックス株式会社 レンズ用組成物及びレンズ
US10128087B2 (en) 2014-04-07 2018-11-13 Lam Research Corporation Configuration independent gas delivery system
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US9879795B2 (en) 2016-01-15 2018-01-30 Lam Research Corporation Additively manufactured gas distribution manifold
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
JP6589254B2 (ja) * 2016-09-28 2019-10-16 日立建機株式会社 作業車両
CN117467977A (zh) * 2023-11-06 2024-01-30 拓荆科技(上海)有限公司 一种歧管和一种薄膜沉积设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605179A (en) * 1995-03-17 1997-02-25 Insync Systems, Inc. Integrated gas panel
US5992463A (en) * 1996-10-30 1999-11-30 Unit Instruments, Inc. Gas panel
US20100200071A1 (en) * 2007-07-20 2010-08-12 Parker-Hannifin Corporation Flow splitter
US20110265951A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Twin chamber processing system

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2225153A (en) * 1939-04-21 1940-12-17 Brodie Ralph N Co Manifolding apparatus
IT1267915B1 (it) 1994-03-31 1997-02-18 Gianni Valerio Collettore doppio di distribuzione per centrali termo-idriche di tipo standardizzato
US6293310B1 (en) * 1996-10-30 2001-09-25 Unit Instruments, Inc. Gas panel
US6302141B1 (en) * 1996-12-03 2001-10-16 Insync Systems, Inc. Building blocks for integrated gas panel
US7294563B2 (en) 2000-08-10 2007-11-13 Applied Materials, Inc. Semiconductor on insulator vertical transistor fabrication and doping process
JP2002089798A (ja) * 2000-09-11 2002-03-27 Ulvac Japan Ltd 流体制御装置およびこれを用いたガス処理装置
JP2005539375A (ja) * 2002-08-27 2005-12-22 セレリティ・インコーポレイテッド 共通の平面にマニホルド接続を有するモジュール式基板ガスパネル
US6864174B2 (en) 2003-03-20 2005-03-08 Taiwan Semiconductor Manufacturing Co., Ltd Iteratively selective gas flow control and dynamic database to achieve CD uniformity
US7018448B2 (en) 2003-10-28 2006-03-28 Advanced Technology Materials, Inc. Gas cabinet including integrated effluent scrubber
US7048008B2 (en) * 2004-04-13 2006-05-23 Ultra Clean Holdings, Inc. Gas-panel assembly
JP2006319190A (ja) * 2005-05-13 2006-11-24 Ckd Corp ガス供給集積ユニット、ガスユニット及びモジュールユニット
US7320339B2 (en) * 2005-06-02 2008-01-22 Ultra Clean Holdings, Inc. Gas-panel assembly
US7299825B2 (en) 2005-06-02 2007-11-27 Ultra Clean Holdings, Inc. Gas-panel assembly
US20090114295A1 (en) 2007-11-06 2009-05-07 Ultra Clean Holdings, Inc. Gas-panel assembly
US8017526B2 (en) 2007-11-30 2011-09-13 Applied Materials, Inc. Gate profile control through effective frequency of dual HF/VHF sources in a plasma etch process
US20100224322A1 (en) 2009-03-03 2010-09-09 Applied Materials, Inc. Endpoint detection for a reactor chamber using a remote plasma chamber
US20110269314A1 (en) 2010-04-30 2011-11-03 Applied Materials, Inc. Process chambers having shared resources and methods of use thereof
US8707754B2 (en) 2010-04-30 2014-04-29 Applied Materials, Inc. Methods and apparatus for calibrating flow controllers in substrate processing systems
US8905074B2 (en) 2010-10-22 2014-12-09 Applied Materials, Inc. Apparatus for controlling gas distribution using orifice ratio conductance control
US9091397B2 (en) 2012-03-27 2015-07-28 Lam Research Corporation Shared gas panels in plasma processing chambers employing multi-zone gas feeds
US8851113B2 (en) 2012-03-27 2014-10-07 Lam Research Coporation Shared gas panels in plasma processing systems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605179A (en) * 1995-03-17 1997-02-25 Insync Systems, Inc. Integrated gas panel
US5992463A (en) * 1996-10-30 1999-11-30 Unit Instruments, Inc. Gas panel
US20100200071A1 (en) * 2007-07-20 2010-08-12 Parker-Hannifin Corporation Flow splitter
US20110265951A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Twin chamber processing system

Also Published As

Publication number Publication date
TW201402958A (zh) 2014-01-16
JP6211584B2 (ja) 2017-10-11
US20130255781A1 (en) 2013-10-03
KR102023794B1 (ko) 2019-09-20
WO2013148474A1 (en) 2013-10-03
US8851113B2 (en) 2014-10-07
KR20140148434A (ko) 2014-12-31
JP2015519724A (ja) 2015-07-09

Similar Documents

Publication Publication Date Title
TWI586900B (zh) 電漿處理系統中用以供應處理氣體之共用氣體面板、設備、及方法
TWI589726B (zh) 使用多區域氣體進料器之電漿處理室中的共用氣體面板
TWI734023B (zh) 真空設備及其操作方法
TWI598455B (zh) 傳送腔室氣體淨化裝置、電子設備處理系統及淨化方法
KR101438705B1 (ko) 기판 처리 샤워헤드용의 재구성 가능한 복수-구역 가스 전달 하드웨어
US8985152B2 (en) Point of use valve manifold for semiconductor fabrication equipment
TWI611498B (zh) 具有共享幫浦之真空腔室
CN104769702B (zh) 模块化化学输送系统
KR102436438B1 (ko) 방위각 믹서
TW202004957A (zh) 用於基板處理的混合平台式裝置、系統，以及方法
KR102900426B1 (ko) 쿼드 스테이션 프로세스 모듈을 위한 포어라인 어셈블리
JP2015519724A5 (https=)
TWI769711B (zh) 基板處理裝置
US20070160447A1 (en) Semiconductor treating device
JP5097627B2 (ja) 真空処理装置
US6634385B2 (en) Apparatus for conveying fluids and base plate
US11940819B1 (en) Mass flow controller based fast gas exchange
US20090214399A1 (en) Vacuum processing apparatus
US20230238253A1 (en) Gas box with cross-flow exhaust system
CN104681385A (zh) 一种进气装置、反应腔室及等离子体加工设备
IL308720A (en) Mounting arrangement for interconnecting fluid control devices