TWI584951B - 封裝電子組件之熱封膜及覆蓋帶 - Google Patents
封裝電子組件之熱封膜及覆蓋帶 Download PDFInfo
- Publication number
- TWI584951B TWI584951B TW100146984A TW100146984A TWI584951B TW I584951 B TWI584951 B TW I584951B TW 100146984 A TW100146984 A TW 100146984A TW 100146984 A TW100146984 A TW 100146984A TW I584951 B TWI584951 B TW I584951B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat seal
- layer
- seal film
- heat
- copolymer
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims description 36
- 238000004806 packaging method and process Methods 0.000 title description 3
- 239000010410 layer Substances 0.000 claims description 164
- 239000011248 coating agent Substances 0.000 claims description 42
- 238000000576 coating method Methods 0.000 claims description 42
- -1 polyethylene Polymers 0.000 claims description 42
- 239000012790 adhesive layer Substances 0.000 claims description 39
- 229920001577 copolymer Polymers 0.000 claims description 26
- 239000004698 Polyethylene Substances 0.000 claims description 21
- 229920000573 polyethylene Polymers 0.000 claims description 21
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000002834 transmittance Methods 0.000 claims description 15
- 239000011231 conductive filler Substances 0.000 claims description 13
- 229920001940 conductive polymer Polymers 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 230000009477 glass transition Effects 0.000 claims description 8
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 4
- 229920001778 nylon Polymers 0.000 claims description 4
- 229920001197 polyacetylene Polymers 0.000 claims description 4
- 229920000767 polyaniline Polymers 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 229920000128 polypyrrole Polymers 0.000 claims description 4
- 229920000123 polythiophene Polymers 0.000 claims description 4
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 claims description 3
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 claims description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229920000193 polymethacrylate Polymers 0.000 claims 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 1
- VDETZMGKOHNVOT-UHFFFAOYSA-N butane;styrene Chemical compound CCCC.C=CC1=CC=CC=C1 VDETZMGKOHNVOT-UHFFFAOYSA-N 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 239000002346 layers by function Substances 0.000 description 70
- 229920000642 polymer Polymers 0.000 description 28
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 238000002360 preparation method Methods 0.000 description 18
- 239000004925 Acrylic resin Substances 0.000 description 15
- 229920000178 Acrylic resin Polymers 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 229920006267 polyester film Polymers 0.000 description 15
- 239000007787 solid Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 239000000956 alloy Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 11
- 229920000058 polyacrylate Polymers 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 230000032683 aging Effects 0.000 description 10
- 239000011118 polyvinyl acetate Substances 0.000 description 10
- 229920002689 polyvinyl acetate Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- 125000002091 cationic group Chemical group 0.000 description 6
- 238000003851 corona treatment Methods 0.000 description 6
- 208000028659 discharge Diseases 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 230000008676 import Effects 0.000 description 6
- 229920000092 linear low density polyethylene Polymers 0.000 description 6
- 239000004707 linear low-density polyethylene Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 230000000717 retained effect Effects 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000003679 aging effect Effects 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/21—Anti-static
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/31—Heat sealable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2553/00—Packaging equipment or accessories not otherwise provided for
Landscapes
- Laminated Bodies (AREA)
- Packaging Frangible Articles (AREA)
- Wrappers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2010/079964 WO2012079258A1 (en) | 2010-12-17 | 2010-12-17 | Heat-sealing film and cover tape for packaging electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201244931A TW201244931A (en) | 2012-11-16 |
| TWI584951B true TWI584951B (zh) | 2017-06-01 |
Family
ID=46244000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100146984A TWI584951B (zh) | 2010-12-17 | 2011-12-16 | 封裝電子組件之熱封膜及覆蓋帶 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5762556B2 (enrdf_load_stackoverflow) |
| CN (1) | CN103260873B (enrdf_load_stackoverflow) |
| MY (1) | MY190586A (enrdf_load_stackoverflow) |
| TW (1) | TWI584951B (enrdf_load_stackoverflow) |
| WO (1) | WO2012079258A1 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI863199B (zh) * | 2022-03-30 | 2024-11-21 | 日商住友電木股份有限公司 | 電子零件包裝用蓋帶及電子零件包裝體 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5762884B2 (ja) * | 2011-08-26 | 2015-08-12 | 昭和電工パッケージング株式会社 | 自動包装適性に優れた無塵包装袋 |
| CN103466195A (zh) * | 2013-03-19 | 2013-12-25 | 上海吉景包装制品有限公司 | 一种防静电上盖带 |
| JP6325859B2 (ja) * | 2014-03-20 | 2018-05-16 | リンテック株式会社 | 導電性樹脂シート |
| JP6429824B2 (ja) * | 2016-03-31 | 2018-11-28 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
| CN110683208A (zh) * | 2018-07-06 | 2020-01-14 | 3M创新有限公司 | 多层盖带构造 |
| US20200017266A1 (en) * | 2018-07-12 | 2020-01-16 | Advantek, Inc. | Carbon nanotubes in carrier tape, cover tape and static shielding bags |
| PH12021552725A1 (en) * | 2019-04-03 | 2022-07-11 | Dainippon Printing Co Ltd | Cover tape for packing electronic component and package |
| JP7164485B2 (ja) * | 2019-04-26 | 2022-11-01 | デンカ株式会社 | カバーフィルムおよびそれを用いた電子部品包装体 |
| JP7672324B2 (ja) * | 2021-03-31 | 2025-05-07 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| WO2022210158A1 (ja) * | 2021-03-31 | 2022-10-06 | 住友ベークライト株式会社 | 電子部品包装用カバーテープおよび電子部品包装体 |
| CN117098710A (zh) * | 2021-03-31 | 2023-11-21 | 住友电木株式会社 | 电子部件包装用盖带及电子部件包装体 |
| CN114801401A (zh) * | 2022-03-23 | 2022-07-29 | 毕玛时软包装（苏州）有限公司 | 一种用于液体包装的洁净易揭封口盖膜 |
| WO2024185677A1 (ja) * | 2023-03-08 | 2024-09-12 | 住友ベークライト株式会社 | カバーテープ、電子部品包装体およびカバーテープの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4302554A (en) * | 1978-06-29 | 1981-11-24 | Denki Kagaku Kogyo Kabushiki Kaisha | Film for heat sealing and process of heat sealing |
| TWI233621B (en) * | 2000-04-03 | 2005-06-01 | Dainippon Printing Co Ltd | Carrier tape lid and carrier tape package |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129075A (en) * | 1978-03-30 | 1979-10-06 | Denki Kagaku Kogyo Kk | Film for heat-seal package |
| JP2609779B2 (ja) * | 1991-02-28 | 1997-05-14 | 住友ベークライト株式会社 | チップ型電子部品包装用カバーテープ |
| JPH0796585A (ja) * | 1993-08-04 | 1995-04-11 | Dainippon Printing Co Ltd | 蓋 材 |
| JPH08295001A (ja) * | 1995-04-27 | 1996-11-12 | Dainippon Printing Co Ltd | 蓋材とキャリアテープおよびこれらを用いたテーピング |
| JPH09111207A (ja) * | 1995-10-19 | 1997-04-28 | Dainippon Printing Co Ltd | キャリアテープ用カバーテープ |
| JPH1095448A (ja) * | 1996-09-18 | 1998-04-14 | Dainippon Printing Co Ltd | キャリアテープ用蓋材 |
| EP1208006B1 (en) * | 1999-08-31 | 2004-02-18 | Denki Kagaku Kogyo Kabushiki Kaisha | Transparent heat-sealing film |
| JP4544563B2 (ja) * | 2001-03-23 | 2010-09-15 | 大日本印刷株式会社 | ヒートシール積層体およびキャリアテープ包装体 |
| EP1270210B1 (en) * | 2001-06-26 | 2006-08-16 | Sumitomo Bakelite Company Limited | Cover tape for packaging electronic components |
| JP2003200990A (ja) * | 2002-01-09 | 2003-07-15 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
| JP2008273602A (ja) * | 2007-05-02 | 2008-11-13 | Denki Kagaku Kogyo Kk | カバーフィルム |
-
2010
- 2010-12-17 WO PCT/CN2010/079964 patent/WO2012079258A1/en active Application Filing
- 2010-12-17 CN CN201080070735.1A patent/CN103260873B/zh active Active
- 2010-12-17 JP JP2013543491A patent/JP5762556B2/ja not_active Expired - Fee Related
- 2010-12-17 MY MYPI2013002143A patent/MY190586A/en unknown
-
2011
- 2011-12-16 TW TW100146984A patent/TWI584951B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4302554A (en) * | 1978-06-29 | 1981-11-24 | Denki Kagaku Kogyo Kabushiki Kaisha | Film for heat sealing and process of heat sealing |
| TWI233621B (en) * | 2000-04-03 | 2005-06-01 | Dainippon Printing Co Ltd | Carrier tape lid and carrier tape package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI863199B (zh) * | 2022-03-30 | 2024-11-21 | 日商住友電木股份有限公司 | 電子零件包裝用蓋帶及電子零件包裝體 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103260873B (zh) | 2015-09-23 |
| CN103260873A (zh) | 2013-08-21 |
| MY190586A (en) | 2022-04-27 |
| TW201244931A (en) | 2012-11-16 |
| JP5762556B2 (ja) | 2015-08-12 |
| WO2012079258A1 (en) | 2012-06-21 |
| JP2014501185A (ja) | 2014-01-20 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |