TWI579130B - 柱塞，樹脂模塑裝置以及樹脂模塑方法 - Google Patents

柱塞，樹脂模塑裝置以及樹脂模塑方法 Download PDF

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Publication number
TWI579130B
TWI579130B TW102121086A TW102121086A TWI579130B TW I579130 B TWI579130 B TW I579130B TW 102121086 A TW102121086 A TW 102121086A TW 102121086 A TW102121086 A TW 102121086A TW I579130 B TWI579130 B TW I579130B
Authority
TW
Taiwan
Prior art keywords
plunger
resin
ring
outer ring
cylinder
Prior art date
Application number
TW102121086A
Other languages
English (en)
Chinese (zh)
Other versions
TW201416213A (zh
Inventor
齊藤高志
Original Assignee
山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山田尖端科技股份有限公司 filed Critical 山田尖端科技股份有限公司
Publication of TW201416213A publication Critical patent/TW201416213A/zh
Application granted granted Critical
Publication of TWI579130B publication Critical patent/TWI579130B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW102121086A 2012-10-31 2013-06-14 柱塞，樹脂模塑裝置以及樹脂模塑方法 TWI579130B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012240098A JP6078873B2 (ja) 2012-10-31 2012-10-31 プランジャ、樹脂モールド装置および樹脂モールド方法

Publications (2)

Publication Number Publication Date
TW201416213A TW201416213A (zh) 2014-05-01
TWI579130B true TWI579130B (zh) 2017-04-21

Family

ID=50662589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102121086A TWI579130B (zh) 2012-10-31 2013-06-14 柱塞，樹脂模塑裝置以及樹脂模塑方法

Country Status (4)

Country Link
JP (1) JP6078873B2 (ja)
KR (1) KR101972960B1 (ja)
CN (1) CN103786319B (ja)
TW (1) TWI579130B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2018533B1 (en) * 2017-03-16 2018-09-24 Besi Netherlands Bv Plunger for feeding encapsulating material to a mould cavity
KR102545290B1 (ko) 2018-08-29 2023-06-16 삼성전자주식회사 반도체 패키지 몰딩 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6158955U (ja) * 1984-09-21 1986-04-21
JPH06190859A (ja) * 1992-12-25 1994-07-12 Nec Kansai Ltd 樹脂モールド装置
JPH07137082A (ja) * 1993-11-16 1995-05-30 Towa Kk 樹脂成形用金型
JP2007015119A (ja) * 2005-07-05 2007-01-25 Apic Yamada Corp 樹脂モールド装置
CN1997497A (zh) * 2004-04-22 2007-07-11 菲科公司 柱塞,封装装置和用于密封柱塞外壳上的柱塞配合的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54132661A (en) * 1978-04-07 1979-10-15 Hitachi Ltd Transfer molding of thermosetting resin
JPS6056520A (ja) * 1983-09-07 1985-04-02 Mitsubishi Electric Corp トランスフア−モ−ルド装置
JP3296619B2 (ja) * 1993-02-26 2002-07-02 トーワ株式会社 電子部品の樹脂封止成形方法及び成形用金型
JP4425538B2 (ja) 2002-10-11 2010-03-03 新日本無線株式会社 樹脂封止装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6158955U (ja) * 1984-09-21 1986-04-21
JPH06190859A (ja) * 1992-12-25 1994-07-12 Nec Kansai Ltd 樹脂モールド装置
JPH07137082A (ja) * 1993-11-16 1995-05-30 Towa Kk 樹脂成形用金型
CN1997497A (zh) * 2004-04-22 2007-07-11 菲科公司 柱塞,封装装置和用于密封柱塞外壳上的柱塞配合的方法
JP2007015119A (ja) * 2005-07-05 2007-01-25 Apic Yamada Corp 樹脂モールド装置

Also Published As

Publication number Publication date
JP2014087998A (ja) 2014-05-15
JP6078873B2 (ja) 2017-02-15
CN103786319A (zh) 2014-05-14
CN103786319B (zh) 2017-06-23
KR101972960B1 (ko) 2019-04-26
TW201416213A (zh) 2014-05-01
KR20140055955A (ko) 2014-05-09

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