TWI570864B - 具有焊線通孔的微電子封裝、其之製造方法以及用於其之硬化層 - Google Patents

具有焊線通孔的微電子封裝、其之製造方法以及用於其之硬化層 Download PDF

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TWI570864B
TWI570864B TW103103350A TW103103350A TWI570864B TW I570864 B TWI570864 B TW I570864B TW 103103350 A TW103103350 A TW 103103350A TW 103103350 A TW103103350 A TW 103103350A TW I570864 B TWI570864 B TW I570864B
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Prior art keywords
wire
welding
forming
microelectronic
substrate
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TW103103350A
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English (en)
Chinese (zh)
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TW201448151A (zh
Inventor
菲立普 丹柏格
趙之忠
艾里斯 查
羅西安 阿拉托勒
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英帆薩斯公司
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Priority claimed from US13/757,673 external-priority patent/US8940630B2/en
Priority claimed from US13/757,677 external-priority patent/US9136254B2/en
Application filed by 英帆薩斯公司 filed Critical 英帆薩斯公司
Publication of TW201448151A publication Critical patent/TW201448151A/zh
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Publication of TWI570864B publication Critical patent/TWI570864B/zh

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    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
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    • H01L2225/06568Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
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    • H01L2225/1058Bump or bump-like electrical connections, e.g. balls, pillars, posts
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
TW103103350A 2013-02-01 2014-01-29 具有焊線通孔的微電子封裝、其之製造方法以及用於其之硬化層 TWI570864B (zh)

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US13/757,673 US8940630B2 (en) 2013-02-01 2013-02-01 Method of making wire bond vias and microelectronic package having wire bond vias
US13/757,677 US9136254B2 (en) 2013-02-01 2013-02-01 Microelectronic package having wire bond vias and stiffening layer

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